Independent graphics card heat dissipation structure

Abstract

The utility model provides an independent graphics card heat dissipation structure, which belongs to the technical field of computers and comprises a heat dissipation positioning frame, an adjusting groove is formed in the middle of the heat dissipation positioning frame, and two heat dissipation mechanisms are movably arranged on the inner side of the adjusting groove along the middle in an axial symmetry mode. The heat dissipation mechanism comprises a movable adjusting plate movably arranged on the inner side of the adjusting groove, a two-way screw rod is arranged in the movable adjusting plate in a spiral transmission mode, the upper end and the lower end of the two-way screw rod rotationally penetrate through the outer side of the adjusting groove, and hand wheels are fixedly arranged at the upper end and the lower end of the two-way screw rod. After the rubber bottom feet are moved according to the thickness of the display card to make contact with the display card, the hand wheel is rotated to drive the shifting and adjusting plate through the two-way screw rod, the heat dissipation mechanism is driven to move in the adjusting groove, and a heating area can be accurately positioned; the motor drives the two-way screw rod to drive the cooling fan to move, and the infrared temperature sensor is combined for monitoring, so that targeted air-cooling heat dissipation of a heating area of the independent graphics card is realized, the heat dissipation effect is remarkably enhanced, and stable operation of the graphics card is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of computer technology, and in particular to a heat dissipation structure for an independent graphics card. Background Technology

[0002] Some graphics card cooling structures include a base, exhaust plate, baffle, housing, top plate, conversion chamber, and auxiliary cooling fan. The advantages of this design are its novel structure and practical function. It places the graphics card in a sealed space, where activated carbon in the filter chamber absorbs airborne dust, preventing it from adhering to the graphics card. When the computer is not in use, the baffle seals the exhaust channel, similarly preventing dust from entering. This structure also facilitates the installation and replacement of the graphics card. However, some areas of the graphics card generate significant heat during operation, especially in a sealed space where heat dissipation is limited, leading to heat buildup and affecting the card's normal operation. Utility Model Content

[0003] In view of the above problems, this utility model is proposed to provide an independent graphics card heat dissipation structure that overcomes or at least partially solves the above problems, and can solve the problem of limited heat dissipation methods in existing graphics cards.

[0004] Specifically, this utility model provides a heat dissipation structure for an independent graphics card, comprising:

[0005] A heat dissipation positioning frame has an adjustment groove in its middle, and two heat dissipation mechanisms are symmetrically and movable along the middle of the inner side of the adjustment groove.

[0006] The heat dissipation mechanism includes a shift plate movably disposed inside the adjustment groove, and a bidirectional screw is provided inside the shift plate for spiral drive. Both ends of the bidirectional screw rotate through the outside of the adjustment groove and are fixedly provided with a handwheel.

[0007] Preferably, a heat dissipation frame is provided on one side of the adjustment plate, and telescopic grooves are provided inside both ends of the heat dissipation frame. A telescopic rod is assembled between the telescopic grooves and the adjustment plate.

[0008] Preferably, two sets of cooling fans are movably arranged inside the heat dissipation frame, and each cooling fan is equipped with an infrared temperature sensor at its bottom.

[0009] Preferably, a bidirectional lead screw is rotatably installed inside the heat dissipation frame, and one end of the bidirectional lead screw is connected to a motor fixed to the inner wall of the heat dissipation frame.

[0010] Preferably, the heat sink frame is fitted with rubber feet on one side close to the discrete graphics card.

[0011] Preferably, the heat dissipation positioning frame is integrally fixed with a load-bearing top frame at both ends, and a load-bearing bottom frame is arranged below the load-bearing top frame, and a extending outer frame is detachably arranged between the load-bearing top frame and the load-bearing bottom frame.

[0012] The extending outer frame and the load-bearing top frame and the load-bearing bottom frame are fixedly assembled through locking pins.

[0013] Preferably, three support locking plates are slidably arranged on the inner wall of the bottom of the load-bearing bottom frame, and mounting holes suitable for external bolt fixed assembly are arranged at both ends of the inner part of the support locking plates.

[0014] The heat dissipation positioning frame is integrally fixed with a load-bearing top frame at both ends, and a load-bearing bottom frame is arranged below the load-bearing top frame, and a extending outer frame is detachably arranged between the load-bearing top frame and the load-bearing bottom frame.

[0015] In the independent graphics card heat dissipation structure, the height of the heat dissipation mechanism can be conveniently adjusted according to the height of the independent graphics card through the cooperation of the screw hole position and the locking pin between the load-bearing top frame, the load-bearing bottom frame and the extending outer frame, the independent graphics card is well adapted to different heights, and the universality of the heat dissipation positioning frame is effectively improved.

[0016] Further, after the rubber foot is moved to contact the graphics card according to the thickness of the graphics card, the hand wheel is rotated to drive the moving plate through the bidirectional screw rod, the heat dissipation mechanism is driven to displace in the adjusting groove, and the heating area can be accurately positioned; the motor drives the heat dissipation fan to move, and the infrared temperature sensor is combined to monitor, so that targeted air cooling heat dissipation of the heating area of the independent graphics card is realized, the heat dissipation effect is significantly enhanced, and the stable operation of the graphics card is ensured.

[0017] The above and other objects, advantages and features of the present application will become more apparent from the following detailed description of some embodiments thereof, given by way of example only, in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0018] Some specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be understood that the drawings are not necessarily drawn to scale. In the drawings:

[0019] Figure 1 is a structural schematic view of an independent graphics card heat dissipation structure provided by the present application;

[0020] Figure 2 is a structural schematic view of a side surface of an independent graphics card heat dissipation structure provided by the present application;

[0021] Figure 3 is a structural schematic view of an independent graphics card heat dissipation structure provided by the present application;

[0022] Figure 4 is a structural schematic view of a heat dissipation mechanism in an independent graphics card heat dissipation structure provided by the present application;

[0023] Figure 5 This is a schematic diagram of the infrared temperature sensor structure in a discrete graphics card heat dissipation structure provided in this application.

[0024] In the picture:

[0025] 1. Heat dissipation positioning bracket; 2. Load-bearing top bracket; 3. Adjustment groove;

[0026] 4. Heat dissipation mechanism; 401. Adjustment plate; 402. Heat dissipation frame; 403. Telescopic groove; 404. Telescopic rod; 405. Rubber feet; 406. Cooling fan; 407. Two-way lead screw; 408. Motor; 409. Infrared temperature sensor;

[0027] 5. Double-acting screw; 6. Load-bearing base frame; 7. Extended outer frame; 8. Support locking plate; 9. Locking bolt; 10. Mounting hole; 11. Handwheel. Detailed Implementation

[0028] The following reference Figures 1 to 5 This invention describes the independent graphics card heat dissipation structure according to an embodiment of the present invention. In this description, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" and "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of the present invention, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0029] Unless otherwise expressly specified and limited, the terms "set," "install," "connect," "link," "fix," and "couple" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] In addition, in the description of the embodiments, the first feature being "on" or "under" the second feature can include the first and second features being in direct contact, or can include the first and second features not being in direct contact but being in contact through another feature between them. That is, in the description of the embodiments, the first feature being "on", "above", and "over" the second feature includes the first feature being directly above and obliquely above the second feature, or only means that the first feature is higher in horizontal height than the second feature. The first feature being "under", "below", or "underneath" the second feature can be the first feature being directly below or obliquely below the second feature, or only means that the first feature is lower in horizontal height than the second feature.

[0031] In the description of the embodiments, the description with reference to the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0032] Please refer to Figures 1 to 5 In the embodiment, a heat dissipation structure of a separate graphics card is provided, comprising: a heat dissipation positioning frame 1; a middle part is provided with an adjusting groove 3, and two heat dissipation mechanisms 4 are movably arranged on the inner side of the adjusting groove 3 along the middle part; the heat dissipation mechanism 4 comprises a shift plate 401 movably arranged on the inner side of the adjusting groove 3, and a bidirectional screw 5 is spirally arranged in the shift plate 401, and the upper and lower ends of the bidirectional screw 5 are rotatably penetrated on the outer side of the adjusting groove 3, and a hand wheel 11 is fixedly arranged.

[0033] One side of the shift plate 401 is provided with a heat dissipation frame 402, and the inner sides of the two ends of the heat dissipation frame 402 are provided with expansion grooves 403, and an expansion rod 404 is arranged between the expansion grooves 403 and the shift plate 401. Two groups of heat dissipation fans 406 are movably arranged in the heat dissipation frame 402, and the bottoms of the heat dissipation fans 406 are provided with infrared temperature sensors 409.

[0034] A bidirectional screw rod 407 is rotatably arranged in the heat dissipation frame 402, and one end of the bidirectional screw rod 407 is connected with a motor 408 fixedly arranged on the inner wall of the heat dissipation frame 402. A rubber foot 405 is arranged on the side close to the separate graphics card of the heat dissipation frame 402. The two ends of the heat dissipation positioning frame 1 are integrally provided with bearing top frames 2, and the lower side of the bearing top frame 2 is provided with a bearing bottom frame 6, and the bearing top frame 2 and the bearing bottom frame 6 are detachably arranged with an extension outer frame 7.

[0035] The extension outer frame 7 and the load-bearing top frame 2 and the load-bearing bottom frame 6 are fixedly assembled through the locking bolt 9.

[0036] The working principle of the present application according to the above-mentioned embodiment is:

[0037] The heat dissipation mechanism 4 is connected with the computer mainboard through a line and is automatically controlled in speed and position through a computer program.

[0038] The height of the heat dissipation positioning frame 1 can be adjusted through the extension outer frame 7 between the load-bearing top frame 2 and the load-bearing bottom frame 6, and during the height adjustment, the locking bolt 9 is used for locking assembly according to the position of the screw hole between the load-bearing top frame 2, the load-bearing bottom frame 6 and the extension outer frame 7, that is, the two heat dissipation mechanisms 4 can be adjusted according to the height position of the independent graphics card.

[0039] According to the thickness of the independent graphics card, the rubber feet 405 in the two groups of heat dissipation mechanisms 4 are moved to contact the independent graphics card, the hand wheel 11 is manually rotated, the hand wheel 11 drives the bidirectional screw rod 5 to rotate, the bidirectional screw rod 5 drives the moving plate 401 to rotate spirally, the two groups of heat dissipation mechanisms 4 are moved in the adjusting groove 3 through the moving plate 401 along the bidirectional screw rod 5, the heating area of the independent graphics card is monitored through the moving heat dissipation fan 406 and the infrared temperature sensor 409, and the independent graphics card is subjected to targeted heat dissipation through the air cooling of the heat dissipation fan 406.

[0040] In the present application, unless otherwise explicitly specified and limited, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements or the interaction relationship between two elements, unless otherwise explicitly limited, the above-mentioned terms can be understood according to the specific meaning in the present application by the person skilled in the art.

[0041] At this point, those skilled in the art should recognize that although the present application has been shown and described in detail in the above-mentioned embodiments, many other variants or modifications in accordance with the principles of the present application can be directly determined or deduced according to the disclosure of the present application without departing from the spirit and scope of the present application. Therefore, the scope of the present application should be understood and recognized as covering all these other variants or modifications.

Claims

1. A heat dissipation structure for an independent graphics card, characterized in that, include: A heat dissipation positioning frame (1) has an adjustment groove (3) in its middle, and two heat dissipation mechanisms (4) are symmetrically arranged on the inner side of the adjustment groove (3) along the middle. The heat dissipation mechanism (4) includes a shift plate (401) movably arranged inside the adjustment groove (3), and a double screw (5) is provided inside the shift plate (401) with a spiral drive. The upper and lower ends of the double screw (5) rotate through the outer side of the adjustment groove (3), and a handwheel (11) is fixedly provided.

2. The independent graphics card heat dissipation structure according to claim 1, characterized in that, The adjustment plate (401) is provided with a heat dissipation frame (402) on one side. The heat dissipation frame (402) has telescopic grooves (403) inside both ends. A telescopic rod (404) is assembled between the telescopic groove (403) and the adjustment plate (401).

3. The independent graphics card heat dissipation structure according to claim 2, characterized in that, The heat dissipation frame (402) is equipped with two sets of cooling fans (406), and each cooling fan (406) is equipped with an infrared temperature sensor (409) at its bottom.

4. The independent graphics card heat dissipation structure according to claim 2, characterized in that, A bidirectional lead screw (407) is rotatably mounted inside the heat dissipation frame (402), and one end of the bidirectional lead screw (407) is connected to a motor (408) fixed to the inner wall of the heat dissipation frame (402).

5. The independent graphics card heat dissipation structure according to claim 4, characterized in that, The heatsink (402) is fitted with rubber feet (405) on the side closest to the discrete graphics card.

6. The independent graphics card heat dissipation structure according to claim 1, characterized in that, The heat dissipation positioning frame (1) is fixed with a load-bearing top frame (2) at both ends, and a load-bearing base frame (6) is provided below the load-bearing top frame (2). An extension frame (7) can be detachably installed between the load-bearing top frame (2) and the load-bearing base frame (6).

7. The independent graphics card heat dissipation structure according to claim 6, characterized in that, The load-bearing base frame (6) has three support locking plates (8) slidably arranged on the inner wall of the bottom, and the support locking plates (8) have mounting holes (10) at both ends for fixing with external bolts.

Images