Protection structure and photoelectric chip packaging structure
By using a magnetically fixed, removable protective cover structure in the optoelectronic chip packaging, the problems of contamination and damage to the optical port during the process are solved, achieving efficient protection and simplifying the production process, while reducing usage costs.
Patent Information
- Application Number
- CN202423266500.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-27
AI Technical Summary
How to protect the optical port of an optical chip and prevent it from being contaminated or damaged during the manufacturing process, especially during the packaging of optoelectronic chips.
A protective structure is adopted, including a heat dissipation cover and a removable protective cover, which are fixed by magnetic components. The protective cover covers the notch and opening of the heat dissipation cover, replacing the plastic sealing process, protecting the optical port, and the protective cover can be removed after the encapsulation is completed.
It effectively avoids contamination and damage to the aperture, improves product yield, simplifies the production process, increases production efficiency, and protects the cover plate so that it can be reused and reduces usage costs.
Smart Images
Figure CN223680095U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of chip packaging especially relates to a protection structure and photoelectric chip packaging structure. BACKGROUND
[0002] With the development of information technology, higher and higher requirements are put forward to the transmission rate, time delay, energy efficiency and other aspects of optical modules, and the photoelectric hybrid packaging (CPO) structure of packaging optical chips and electrical chips in the same packaging body has been widely applied. In the photoelectric chip packaging structure, a through silicon via is made on the optical chip or the electrical chip, and then the through silicon via is vertically stacked with a matching electrical chip / optical chip, and the formed three-dimensional photoelectric integrated packaging has the advantages of large interconnection density and small parasitic parameters, and is an important development direction of high-speed optical interconnection. However, in the packaging process, the optical port of the optical chip is easy to be contaminated or damaged in the plastic packaging process. The light port cleanliness of the light-sensitive device is very high, therefore, how to protect the optical port of the optical chip and avoid the optical port from being contaminated or damaged in the process is a problem to be solved at present. SUMMARY
[0003] The utility model solves the technical problem of how to protect the optical port of the optical chip and avoid the optical port from being contaminated or damaged, and provides a protection structure and photoelectric chip packaging structure.
[0004] In order to solve the above problems, the utility model provides a protection structure, include: the heat dissipation cover plate includes first body and the first bending part around the edge of first body, one side of first body has a gap, the first bending part is formed with the opening that communicates with the gap, the protection cover plate is detachably arranged on the surface of heat dissipation cover plate away from the extension direction of first bending part, the protection cover plate includes second body and the second bending part at the edge of second body, the second body is arranged on the surface of first body and covers the gap, the second bending part covers the opening, at least one first magnetic part is arranged in the heat dissipation cover plate, the protection cover plate includes at least one second magnetic part corresponding with first magnetic part.
[0005] In order to solve the above problems, the utility model provides a kind of optoelectronic chip packaging structure, comprising: substrate;Optical chip is arranged on the surface of substrate, and the surface of one side of optical chip is provided with a light port;Electric chip is inverted on the surface of optical chip away from the side of light port;Protective structure, using the protective structure of the utility model, the first body of the heat dissipation cover plate of the protective structure is arranged on the surface of electric chip, the projection of the first body on the substrate covers optical chip and electric chip, and the notch of the first body exposes the light port, the first bending part of the heat dissipation cover plate extends to the surface of substrate, and the opening of the first bending part exposes the light port, the protective cover plate of the protective structure is detachably arranged on the surface of heat dissipation cover plate away from the extension direction of the first bending part, the second body of the protective cover plate covers the notch, and the second bending part of the protective cover plate covers the opening.
[0006] The above technical solution is provided with a detachable protective cover plate on the surface of heat dissipation cover plate away from the extension direction of the first bending part, the second body of protective cover plate is fixed by magnetic attraction with the first body of heat dissipation cover plate, the second body of protective cover plate covers the notch of heat dissipation cover plate, and the second bending part covers the opening of heat dissipation cover plate, in the process of optoelectronic chip packaging, protective structure is packaged on the surface of optical chip and electric chip, heat dissipation cover plate is used to replace plastic packaging process, and notch and opening corresponding to the light port of optical chip are arranged on the surface of heat dissipation cover plate, which is convenient for optical chip to be inserted with optical fiber, and also can avoid pollution and damage of optical port by plastic packaging process, and improve product yield.In addition, the protective cover plate is detachably arranged on the surface of heat dissipation cover plate away from the extension direction of the first bending part, the first magnetic member and the second magnetic member are demagnetized before delivery after optoelectronic chip packaging is completed, and the protective cover plate is removed, so that the light port is exposed, and the optical fiber is conveniently inserted.The structure of the optoelectronic chip packaging structure provided by the utility model is relatively simple, the disassembly of the protective cover plate can be realized automatically, the production efficiency is improved, and the protective cover plate after disassembly can be reused, which greatly reduces the use cost.
[0007] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the utility model. The technology, method and equipment known to those skilled in the related art can not be discussed in detail, but under appropriate circumstances, the technology, method and equipment should be regarded as part of the authorized description. BRIEF DESCRIPTION OF DRAWINGS
[0008] In order to more clearly illustrate the technical scheme in the specific embodiment of the utility model, the drawings needed in the following specific embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some specific embodiments of the utility model, and those skilled in the art can obtain other drawings according to these drawings without creating labor.
[0009] Figure 1 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application.
[0010] Figure 2 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application. Figure 1 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application.
[0011] Figure 3 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application.
[0012] Figure 4 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application. Figure 3 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application.
[0013] Figure 5 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application.
[0014] Figure 6 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application. Figure 5 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application.
[0015] Figure 7 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application.
[0016] Figure 8 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application. DETAILED DESCRIPTION
[0017] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, any other embodiments obtained by a person skilled in the art without creative work fall within the protection scope of the present application.
[0018] Please refer to Figures 1-2 , wherein, Figure 1 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application. Figure 2 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application. Figure 1 Figure 1 is a bottom view structural schematic diagram of a first embodiment of the protection structure according to the present application. Figures 1-2As shown, the protection structure comprises a heat dissipation cover plate 14 and a protection cover plate 15. The heat dissipation cover plate 14 comprises a first body 141 and a first bending part 142 surrounding the edge of the first body 141, one side of the first body 141 has a gap 143, and the first bending part 142 is formed with an opening 144 in communication with the gap 143. The protection cover plate 15 is detachably arranged on the surface of the heat dissipation cover plate 14 away from the extending direction of the first bending part 142, and the protection cover plate 15 comprises a second body 151 and a second bending part 152 located at the edge of the second body 151. The second body 151 is arranged on the surface of the first body 141 and covers the gap 143, and the second bending part 152 covers the opening 144. At least one first magnetic member 140 is arranged in the heat dissipation cover plate 14, and the protection cover plate 15 comprises at least one second magnetic member 150 corresponding to the first magnetic member 140.
[0019] The technical scheme disclosed in the above embodiment can realize the following effects. The detachable protection cover plate is arranged on the surface of the heat dissipation cover plate away from the extending direction of the first bending part, the second body of the protection cover plate is fixed by magnetic attraction with the first body of the heat dissipation cover plate, the second body of the protection cover plate covers the gap of the heat dissipation cover plate, and the second bending part covers the opening of the heat dissipation cover plate. In the process of packaging the optoelectronic chip, the protection structure is packaged on the surface of the optical chip and the electrical chip, the heat dissipation cover plate is used to replace the plastic packaging process, and the gap and the opening corresponding to the optical port of the optical chip are arranged on the surface of the heat dissipation cover plate, so as to facilitate the insertion of the optical fiber and avoid the pollution and damage of the plastic packaging process to the optical port, thereby improving the product yield. In addition, the protection cover plate is detachably arranged on the surface of the heat dissipation cover plate away from the extending direction of the first bending part. After the packaging of the optoelectronic chip is completed, the first magnetic member and the second magnetic member are demagnetized before the product is shipped, and the protection cover plate is removed, so that the optical port is exposed, thereby facilitating the insertion of the optical fiber. The structure of the optoelectronic chip packaging structure provided by the embodiment is relatively simple, the disassembly and assembly of the protection cover plate can be realized automatically, the production efficiency is improved, and the protection cover plate after disassembly can be reused, thereby greatly reducing the use cost.
[0020] In the embodiment, the second bending part 152 is arranged on one side of the second body 151 close to the gap 143, so as to cover the opening 144. The arrangement of the second bending part 152 on one side can simplify the manufacturing process and the disassembly process of the protection cover plate 15.
[0021] In other embodiments, the second bending part 152 can also be arranged around the edge of the second body 151. That is, when the protective cover plate 15 is arranged on the surface of the heat dissipation cover plate 14, the second bending part 152 surrounds the first bending part 142, and there is no need to distinguish the arrangement direction of the second bending part 152 of the protective cover plate 15 in use, and any direction can realize that the second bending part 152 covers the opening 144. It is worth noting that when the second bending part 152 is arranged around the edge of the second body 151, the area of the second body 151 needs to be greater than the area of the first body 141; and when the second bending part 152 is arranged on only one side of the second body 151, there is no such limitation.
[0022] In some embodiments, the first magnetic part 140 is arranged at the center position of the first body 141, and the second magnetic part 150 is arranged correspondingly with the first magnetic part 140. By arranging the first magnetic part 140 and the second magnetic part 150 corresponding to the positions in the first body 141 and the second body 151 respectively, the protective cover plate 15 can be fixed on the surface of the heat dissipation cover plate 14 and realize the detachable function. The disassembly of the protective cover plate 15 can be realized automatically, which improves the production efficiency, and the protective cover plate 15 after disassembly can be reused, which greatly reduces the use cost. By arranging the first magnetic part 140 at the center position of the first body 141 and arranging the second magnetic part 150 correspondingly with the first magnetic part 140, the second magnetic part 150 is also basically located at the center position of the second body 151 at this time, and the magnetic attraction is realized at the center positions of the first body 141 and the second body 151, which can improve the fixing effect of the protective cover plate 15. In other embodiments, the magnetic attraction can also be realized at the edge position, which can make the disassembly more convenient and easy compared with the realization of the magnetic attraction at the center position.
[0023] In some embodiments, the first magnetic part 140 and the second magnetic part 150 are both magnetic beads. In other embodiments, the first magnetic part 140 and the second magnetic part 150 can also be magnetic cores or electromagnetic coils, etc.
[0024] In some embodiments, the second body 151 of the protective cover plate 15 covers the entire surface of the first body 141 of the heat dissipation cover plate 14, and can also protect the heat dissipation cover plate 14. When the second body 151 of the protective cover plate 15 completely covers the first body 141 of the heat dissipation cover plate 14, the second body 151 has a larger contact area with the first body 141, which increases the friction between the second body 151 and the first body 141 and reduces the possibility of abnormal falling of the protective cover plate 15.
[0025] In some embodiments, the material of the heat dissipation cover plate 14 is copper. Metal copper has good heat dissipation performance, and the heat dissipation cover plate 14 is made of metal copper to ensure the heat dissipation performance of the heat dissipation cover plate 14.
[0026] In some embodiments, the material of the protective cover plate 15 is metal.
[0027] In other embodiments, the material of the protective cover plate 15 can also be non-metal, such as glass, silicon, organic material, etc. The protective cover plate 15 is made of non-metal material, which can reduce production cost and avoid the problem of metal material being easy to wear and harden. In addition, the protective cover plate 15 can also be made of transparent material, such as glass, etc.
[0028] Please refer to Figures 3-4 , wherein, Figure 3 is a bottom view structural schematic diagram of the second embodiment of the protection structure of the utility model; Figure 4 is Figure 3 a sectional view along the direction of BB' in the figure; wherein the invisible part is drawn by dotted line. Figures 3-4 The embodiment shown in the figure is different from the embodiment shown in the figure Figures 1-2 , the first body 141 is provided with a plurality of first magnetic members 140, the second body 151 is provided with a plurality of second magnetic members 150, and the plurality of first magnetic members 140 and the plurality of second magnetic members 150 are one-to-one corresponding. In this embodiment, a plurality of one-to-one corresponding first magnetic members 140 and second magnetic members 150 are arranged, which further improves the stability of the fixation of the protective cover plate 15 and the heat dissipation cover plate 14, and avoids the falling of the protective cover plate 15.
[0029] In other embodiments, the plurality of first magnetic members 140 are arrayed to form a first array, the plurality of second magnetic members 150 are arrayed to form a second array, and the first array and the second array are correspondingly arranged.
[0030] Please refer to Figures 5-6 , Figure 5 is a top view structural schematic diagram of the third embodiment of the protection structure of the utility model; Figure 6 is Figure 5 a sectional view along the direction of CC' in the figure; wherein the invisible part is drawn by dotted line. Figures 5-6 The embodiment shown in the figure is different from the embodiment shown in the figure Figures 1-2 , the second body 151 of the protective cover plate 15 covers part of the surface of the first body 141 of the heat dissipation cover plate 14. On the premise that the second body 151 can completely cover the gap 143, the area of the second body 151 covering the heat dissipation cover plate 14 is reduced to reduce the cost.
[0031] Please refer to Figure 7 It is the structural schematic view of the fourth embodiment of the protection structure. Figure 7 The embodiment shown is different from Figures 1-2 The protection cover plate 15 is made of magnetic material. The entire protection cover plate 15 has magnetism, which can further improve the stability of the protection cover plate 15 fixed on the heat dissipation cover plate 14, and avoid the abnormal falling of the protection cover plate 15. Further, the heat dissipation cover plate 14 in the embodiment is also made of magnetic material, without the need to set magnetic beads in the heat dissipation cover plate 14 and the protection cover plate 15, which reduces the complexity of the manufacturing process of the heat dissipation cover plate 14 and the protection cover plate 15.
[0032] Please refer to Figure 8 It is the structural schematic view of the first embodiment of the photoelectric chip packaging structure. As shown in Figure 8 The photoelectric chip packaging structure includes: a substrate 11, an optical chip 12, an electric chip 13, and a protection structure 19. The optical chip 12 is arranged on the surface of the substrate 11, and the surface of one side of the optical chip 12 is provided with an optical port 120. The electric chip 13 is inverted on the surface of the optical chip 12 away from the optical port 120. The protection structure 19 adopts the protection structure of the utility model, the first body 141 of the heat dissipation cover plate 14 of the protection structure 19 is arranged on the surface of the electric chip 13, the projection of the first body 141 on the substrate 11 covers the optical chip 12 and the electric chip 13, and the notch 143 of the first body 141 exposes the optical port 120. The first bending part 142 of the heat dissipation cover plate 14 extends to the surface of the substrate 11, and the opening 144 of the first bending part 142 exposes the optical port 120. The protection cover plate 15 of the protection structure 19 is detachably arranged on the surface of the heat dissipation cover plate 14 away from the extension direction of the first bending part 142, the second body 151 of the protection cover plate 15 covers the notch 143, and the second bending part 152 of the protection cover plate 15 covers the opening 144.
[0033] The technical scheme is characterized in that a detachable protection cover plate is arranged on the surface of the heat dissipation cover plate, the second body of the protection cover plate is fixed to the first body of the heat dissipation cover plate through magnetic attraction, the second body of the protection cover plate covers the gap of the heat dissipation cover plate, the light port is protected above the light port, the second bending part covers the light port on the side of the light port, and the protection cover plate relatively isolates the light port from the external environment. The photoelectric chip packaging structure provided by the utility model reduces the dust-free cleanliness requirement of subsequent processes, avoids the pollution of the product light port by pollutants in the subsequent process, and improves the product yield. In addition, the structure of the photoelectric chip packaging structure is relatively simple, the disassembly and assembly of the protection cover plate can be automatically realized, the production efficiency is improved, and the protection cover plate after disassembly can be reused, so that the use cost is greatly reduced.
[0034] In some embodiments, the substrate 11 is a substrate for electrically connecting a semiconductor chip to other devices outside, which can include circuit traces in the substrate body of a dielectric material layer. The substrate 11 can include a package substrate, an interposer or a printed circuit board (PCB). In the present embodiment, the surface of the substrate 11 away from the optical chip 12 is also provided with a plurality of external solder balls 110, which can be solder balls formed by a ball planting process or conductive copper pillars.
[0035] In some embodiments, the optical chip 12 can be an active optoelectronic chip such as a laser, a modulator, a detector or a plurality of optoelectronic integrated chips, which can be a silicon optical chip or an indium, gallium, arsenic, phosphorus compound semiconductor material or silicon carbide, silicon nitride material. The light port 120 of the optical chip 12 is used for alignment, connection and optical coupling with an external optical fiber.
[0036] In some embodiments, the functional circuit (not shown) on the surface of the optical chip 12 is electrically connected to the substrate 11 through the wire 16. In other embodiments, a through silicon via can be provided in the optical chip 12 to achieve electrical connection between the functional circuit on the surface of the optical chip 12 and the substrate 11.
[0037] In some embodiments, the electrical chip 13 is a chip related to the optical chip 12 and needs to be interconnected, including a driving chip, an amplification chip, a signal processing chip, an ASIC chip, a power supply chip, etc. The electrical chip 13 is assembled on the upper surface of the optical chip 12 in a flip-chip or wire bonding manner.
[0038] In the present embodiment, the protection structure 19 adopts Figures 1-2The first body 141 is provided with at least one first magnetic member 140, and the second body 151 is provided with at least one second magnetic member 150 corresponding to the first magnetic member 140. The protective cover is detachably arranged on the surface of the heat dissipation cover. After the photoelectric chip is packaged, the first magnetic member and the second magnetic member are demagnetized before delivery, the protective cover is removed, the light port is exposed, and the optical fiber is conveniently plugged.
[0039] It should be noted that the references in the specification to "an embodiment", "embodiment", "exemplary embodiment", "some embodiments" and the like indicate that the embodiment described can include a particular feature, structure, or characteristic, but every embodiment can not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Furthermore, where a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the purview of one of ordinary skill in the relevant art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
[0040] Generally, terms can be understood to be contextually used. For example, the term "one or more", as used in this document, can be used to describe any feature, structure, or characteristic in the singular or can be used to describe combinations of features, structures or characteristics in the plural, depending on the context. Similarly, terms such as "a", "an" or "the" can also be understood to express a singular usage or to express a plural usage, depending on the context in which they are used. Additionally, the term "based on" can be understood as not necessarily intended to convey an exclusive set of factors, but rather can instead allow for existence of other factors not explicitly described. It should also be noted in the description that "connected" or "coupled" not only means that one component is directly coupled to another component, but also means that one component is indirectly coupled to another component through an intermediate component.
[0041] It should be noted that the terms "include" and "have" and their conjugations involved in the present application are intended to cover non-exclusive inclusion. The terms "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, unless the context clearly indicates otherwise, and it should be understood that the data thus used can be interchanged under appropriate circumstances. In addition, the embodiments and features in the present application can be combined with each other under the condition of no conflict. Furthermore, in the above description, the description of known components and technologies is omitted to avoid unnecessary confusion of the concept of the present application. In each of the above embodiments, the focus is on the difference from other embodiments, and the same / similar parts between the embodiments can be referred to each other.
[0042] The above merely is preferred implementation manner of the present application, it should be pointed out, for ordinary skilled person in the technical field, under the premise of not departing from the principle of the present application, can also make several improvements and refinements, these improvements and refinements also should be regarded as the protection scope of the present application.
Claims
1. A protective structure, characterized in that, The application relates to a heat-dissipating cover plate and a protective cover plate. The heat-dissipating cover plate comprises a first body and a first bending part surrounding the edge of the first body, one side of the first body is provided with a gap, and the first bending part is provided with an opening communicating with the gap. The protective cover plate is detachably arranged on the surface of the heat-dissipating cover plate away from the extending direction of the first bending part, the second body of the protective cover plate covers the gap, and the second bending part of the protective cover plate covers the opening. The heat-dissipating cover plate is provided with at least one first magnetic part, and the protective cover plate is provided with at least one second magnetic part corresponding to the first magnetic part.
2. The protective structure of claim 1, wherein, The second bending part is arranged on the side of the second body close to the gap.
3. The protective structure of claim 1, wherein, The second bending part is arranged around the edge of the second body.
4. The protective structure of claim 1, wherein, The first magnetic part is arranged at the center of the first body, and the second magnetic part is arranged corresponding to the first magnetic part.
5. The protective structure of claim 1, wherein, The first body is provided with a plurality of first magnetic parts, the second body is provided with a plurality of second magnetic parts, and the positions of the plurality of first magnetic parts and the plurality of second magnetic parts correspond to each other.
6. The protective structure of claim 1, wherein, The second body of the protective cover plate covers the whole surface of the first body of the heat-dissipating cover plate.
7. The protective structure of claim 1, wherein, The second body of the protective cover plate covers part of the surface of the first body of the heat-dissipating cover plate.
8. The protective structure of claim 1, wherein, The material of the protective cover plate is non-metal.
9. The protective structure of claim 1, wherein, The protective cover plate is made of a magnetic material.
10. An optoelectronic chip package structure, comprising: The application relates to a substrate, an optical chip and an electric chip. The optical chip is arranged on the surface of the substrate, and one side of the surface of the optical chip is provided with an optical port. The electric chip is flip-chip arranged on the surface of the optical chip away from the optical port. The protective structure is the protective structure as claimed in any one of claims 1-9, the first body of the heat-dissipating cover plate of the protective structure is arranged on the surface of the electric chip, the projection of the first body on the substrate covers part of the optical chip and the electric chip, the gap of the first body exposes the optical port, the first bending part of the heat-dissipating cover plate extends to the surface of the substrate, the opening of the first bending part exposes the optical port, the protective cover plate of the protective structure is detachably arranged on the surface of the heat-dissipating cover plate away from the extending direction of the first bending part, the second body of the protective cover plate covers the gap, and the second bending part of the protective cover plate covers the opening.