FPC (Flexible Printed Circuit) structure convenient for detection after binding of multiple ICs (Integrated Circuit)
By introducing conductive structures and exposed copper test points into the FPC structure, the problem that traditional FPCs cannot effectively detect the bonding status of multiple ICs is solved, thus achieving product quality stability and connection reliability.
Patent Information
- Application Number
- CN202422860854.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-22
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-11-22
AI Technical Summary
Traditional FPCs cannot effectively detect the status after bonding multiple ICs, resulting in unstable product quality.
Design an FPC structure that facilitates testing after multiple ICs are bonded together. Through the cooperation of the first and second conduction structures, conduction between multiple ICs and between bonding bits is achieved. After the FPC and TFT glass are bonded together, the continuity test is performed through exposed copper test points.
It enables effective testing of multiple ICs after bonding, ensuring stable product quality, and avoids cracking at the connection point through stress dispersion grooves and chamfer design, thus improving the stability of the connection.
Smart Images
Figure CN223681250U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to display module technical field, especially, relate to a kind of FPC structure of convenient multiple IC binding after detection. BACKGROUND
[0002] LED unit board, also known as LED display screen module, is composed of LED light-emitting diode and driving circuit, driving IC and plastic kit. LED display screen unit board, also known as LED display screen module or simply unit board, is the main component unit of LED display screen, which is composed of LED light-emitting diode and driving circuit, driving IC and plastic kit. In the LED display screen industry, LED unit boards are divided into two categories.
[0003] In the TFT LCD manufacturing process, the binding of multiple ICs is one of the key steps. The traditional FPC cannot effectively detect the state after binding when binding multiple ICs, resulting in unstable product quality. Therefore, a FPC structure for convenient multiple IC binding detection is proposed. UTILITY MODEL CONTENT
[0004] Therefore, it is necessary to provide a FPC structure for convenient multiple IC binding detection. The cooperation of the first and second conduction structures realizes the conduction between multiple ICs and the conduction between multiple binding sites. After the FPC and TFT glass are bound together, the copper exposure test point can be used for path testing after binding.
[0005] To solve the above technical problems, the utility model adopts the following technical solutions:
[0006] A FPC structure for convenient multiple IC binding detection includes a FPC body with two binding areas on the FPC body. The two binding areas are respectively provided with a first binding end and a second binding end. The FPC body is connected with TFT glass through the first binding end and the second binding end.
[0007] The first binding end and the second binding end are bridged by a bridging FPC, and the first conduction structure is connected to the bridging FPC to conduct the first binding end and the second binding end.
[0008] The second conduction structure is provided on the two binding points of the TFT glass corresponding to the first binding end and the second binding end, and the first binding end and the second binding end can form a test loop after being bound with the TFT glass under the action of the second conduction structure.
[0009] Further, the TFT glass has a first driving IC end and a second driving IC end.
[0010] The first driving IC end and the second driving IC end are respectively correspondingly arranged with the first binding end and the second binding end.
[0011] Further, the second conduction structure is a glass ITO trace, and the glass ITO trace has two sections.
[0012] The two sections of the glass ITO trace are respectively arranged on the back surfaces of the first driving IC end and the second driving IC end.
[0013] Further, after the first driving IC end and the second driving IC end are bound with the corresponding first binding end and the second binding end, the glass ITO trace is connected with the corresponding bridge FPC.
[0014] Further, a stress dispersion groove is formed between the bridge FPC and the FPC body.
[0015] Further, the bridge FPC is connected with the TFT glass through ACF glue.
[0016] Further, the first conduction structure is an FPC bridge trace, and the FPC bridge trace is arranged on the bridge FPC.
[0017] Further, two ends of the FPC bridge trace are respectively connected with the corresponding gold fingers of the first binding end and the second binding end.
[0018] Further, one end of the first binding end away from the FPC bridge trace connection end has a first copper exposure test point, and one end of the second binding end away from the FPC bridge trace connection end has a second copper exposure test point.
[0019] The first copper exposure test point and the second copper exposure test point are respectively connected with the corresponding first binding end and the second binding end.
[0020] Further, stress dispersion chamfers are formed at four corners of the stress dispersion groove.
[0021] Compared with the prior art, the FPC structure has the following beneficial effects:
[0022] The FPC structure provided by the utility model can connect and conduct the first binding end and the second binding end through the first conduction structure, so that the first binding end, the first driving IC end, the second binding end and the second driving IC end can be sequentially conducted after the FPC body and the TFT glass are bound, and then a multimeter is connected to the gold fingers on the outermost sides of the first binding end and the second binding end to test.
[0023] Through the design of the first copper deposit test point and the second copper deposit test point, when the external table is used for connection test, the first copper deposit test point and the second copper deposit test point can be directly connected to the surface of the corresponding first copper deposit test point and the second copper deposit test point for connection test, so that the test point is more eye-catching, and actual detection is facilitated.
[0024] Through the design of the stress dispersion groove and the stress dispersion chamfer, the stress between the FPC body and the bridge FPC can be dispersed while meeting the bridge FPC connection requirement, so that the connection is not easy to crack due to excessive stress. BRIEF DESCRIPTION OF DRAWINGS
[0025] Figure 1 A structure diagram of the FPC structure convenient for detection after multi-IC binding is provided for the utility model.
[0026] Figure 2 A first binding end and a second binding end structure diagram of the FPC structure convenient for detection after multi-IC binding is provided for the utility model.
[0027] Figure 3 A structure diagram of the FPC structure convenient for detection after multi-IC binding is provided for the utility model. Figure 2 An enlarged structure diagram of position A in the middle.
[0028] Figure 4 A TFT glass structure diagram of the FPC structure convenient for detection after multi-IC binding is provided for the utility model.
[0029] Figure 5 An assembly test state structure diagram of the FPC structure convenient for detection after multi-IC binding is provided for the utility model.
[0030] Figure 6 An enlarged structure diagram of position B in the middle. Figure 5 An enlarged structure diagram of position B in the middle.
[0031] The following is the mark explanation in the figure:
[0032] FPC body 1, binding area 11, first binding end 12, second binding end 13.
[0033] TFT glass 2, first driving IC end 21, second driving IC end 22.
[0034] Bridge FPC 3, stress dispersion groove 31, stress dispersion chamfer 32.
[0035] Glass ITO wire 4.
[0036] FPC bridge wire 5.
[0037] A first copper leaching test point 6;
[0038] A second copper leaching test point 7. DETAILED DESCRIPTION
[0039] In order to make the person skilled in the art better understand the technical scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application.
[0040] As described in the background, in the TFT LCD manufacturing process, the binding of the multi-IC is one of the key steps, and the traditional FPC cannot effectively detect the state after the binding when binding multiple ICs, resulting in unstable product quality.
[0041] In order to solve this technical problem, the present application provides an FPC structure convenient for detecting after multi-IC binding, which is applied to a display module.
[0042] Specifically, please refer to Figures 1-6 The FPC structure convenient for detecting after multi-IC binding specifically includes an FPC body 1, two binding areas 11 are provided on the FPC body 1, the two binding areas 11 are respectively provided with a first binding end 12 and a second binding end 13, and the FPC body 1 is connected with a TFT glass 2 through the first binding end 12 and the second binding end 13.
[0043] Among them, the first binding end 12 and the second binding end 13 are bridged with a bridging FPC 3, and a first conduction structure is connected on the bridging FPC 3 for conducting the first binding end 12 and the second binding end 13.
[0044] The two binding points of the TFT glass 2 corresponding to the first binding end 12 and the second binding end 13 are provided with a second conduction structure, and the first binding end 12 and the second binding end 13 can form a test loop after being bound with the TFT glass 2 under the action of the second conduction structure.
[0045] The utility model provides a kind of FPC structure of convenient multiple IC binding detection, first conducting structure can be connected to first binding end 12 and second binding end 13 by first conducting structure, so that after FPC body 1 and TFT glass 2 are bound, first binding end 12, first drive IC end 21, second binding end 13 and second drive IC end 22 can be sequentially conducted, then multimeter is connected to the gold finger of the outermost side of first binding end 12 and second binding end 13 and is tested, if multimeter shows short circuit, it can indicate that binding effect is good, if it shows short circuit, it needs to be re-bound.
[0046] In order for those skilled in the art to better understand the utility model scheme, the technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings.
[0047] It should be noted that the embodiments in the utility model and the features and technical solutions in the embodiments can be combined with each other without conflict.
[0048] It should be noted that: similar signs and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0049] Please refer to Figures 1-6 A kind of FPC structure of convenient multiple IC binding detection, including FPC body 1, there are two binding areas 11 on the FPC body 1, two binding areas 11 are respectively provided with first binding end 12 and second binding end 13, the FPC body 1 is bound and connected with TFT glass 2 by first binding end 12 and second binding end 13;
[0050] Wherein, bridge FPC 3 is bridged between first binding end 12 and second binding end 13, and first conducting structure is connected on the bridge FPC 3 for conducting first binding end 12 and second binding end 13;
[0051] Second conducting structure is provided on the two binding points of first binding end 12 and second binding end 13 of the TFT glass 2, and first binding end 12 and second binding end 13 can form test loop after being bound with TFT glass 2 under the action of second conducting structure;
[0052] The TFT glass 2 has first drive IC end 21 and second drive IC end 22, wherein the first drive IC end 21 and the second drive IC end 22 are respectively arranged corresponding to the first binding end 12 and the second binding end 13.
[0053] The second conducting structure is glass ITO wiring 4, and the glass ITO wiring 4 has two sections.
[0054] Two said glass ITO traces 4 are respectively arranged on the back of the first driving IC end 21 and the second driving IC end 22;
[0055] After the first driving IC end 21 and the second driving IC end 22 are bound with the corresponding first binding end 12 and the second binding end 13, the glass ITO trace 4 can be connected with the corresponding bridge FPC 3;
[0056] The first conduction structure is an FPC bridge trace 5, the FPC bridge trace 5 is arranged on the bridge FPC 3, and two ends of the FPC bridge trace 5 are respectively connected with the gold fingers at the ends of the first binding end 12 and the second binding end 13
[0057] The first binding end 12 has a first copper exposure test point 6 at one end away from the connection end of the FPC bridge trace 5, and the second binding end 13 has a second copper exposure test point 7 at one end away from the connection end of the FPC bridge trace 5, wherein the first copper exposure test point 6 and the second copper exposure test point 7 are respectively connected with the corresponding first binding end 12 and the second binding end 13;
[0058] Through the design of the first conduction structure and the second conduction structure, the first binding end 12 and the second binding end 13 can be conducted. When the FPC body 1 is bound with the TFT glass 2, the glass ITO trace 4 (on the left side), the FPC bridge trace 5, and the glass ITO trace 4 (on the right side) form a conduction, and then the first copper exposure test point 6 and the second copper exposure test point 7 are matched to finally form a conduction connection of the first copper exposure test point 6, the glass ITO trace 4 (on the left side), the FPC bridge trace 5, the glass ITO trace 4 (on the right side), and the second copper exposure test point 7. Then an external multimeter is connected to the first copper exposure test point 6 and the second copper exposure test point 7 to test the loop state. If the multimeter shows a short circuit, it indicates that the binding state between the FPC body 1 and the TFT glass 2 is good. If it shows a short circuit, it indicates that the binding needs to be re-performed, and the binding is defective.
[0059] The FPC structure provided in Embodiment 1 is further optimized to facilitate detection after multi-IC binding. Since the bridge FPC 3 in Embodiment 1 is rear-mounted, its fixed state is a problem after the FPC body 1 is fixed. Therefore, in this embodiment, the fixing problem of the added bridge FPC 3 is solved by hot pressing. Specifically, as shown in Figure 4 The bridge FPC 3 is connected with the TFT glass 2 by hot pressing through ACF glue. The bridge FPC 3 is connected with the FPC body 1 by hot pressing, and at the same time, it can be well connected with the TFT glass 2, further improving its stability.
[0060] Further optimization is made to the FPC structure provided in Embodiment 1 or 2 for facilitating post-bonding detection of multi-IC, as shown in Figures 1-6 As shown in the figure, a stress dispersion groove 31 is formed between the bridge FPC 3 and the FPC body 1, and stress dispersion chamfers 32 are formed at the four corners of the stress dispersion groove 31. By designing the stress dispersion chamfers 31, the stress at the connection between the bridge FPC 3 and the FPC body 1 can be dispersed, avoiding the situation that the stress is too concentrated and easily causes the connection to crack, and ensuring the stability of the connection.
[0061] The use process of the FPC structure for facilitating post-bonding detection of multi-IC provided by the utility model is as follows: the FPC bridge wiring is used to connect between the first bonding position 12 and the second bonding position 13, and then the glass ITO wiring is designed at the first drive IC end 21 and the second drive IC end 22, so that the first exposed copper test point 6, the glass ITO wiring (left side), the FPC bridge wiring 5, the glass ITO wiring (right side) and the second exposed copper test point 7 are in conduction after the FPC body 1 is bonded with the TFT glass 2, an external multimeter is connected to the first exposed copper test point 6 and the second exposed copper test point 7, the loop state is tested, and if short circuit is displayed, it indicates that the bonding state is good, and if short circuit is displayed, it indicates that re-bonding is needed.
[0062] In the utility model, unless otherwise clearly defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection or communication with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the communication or interaction relationship between two elements, unless otherwise clearly limited. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific situation.
[0063] Obviously, the above described embodiments are only part of the embodiments of the utility model, not all the embodiments, the preferred embodiments of the utility model are given in the drawings, but do not limit the patent range of the utility model. The utility model can be realized in many different forms, and conversely, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing specific embodiments, or make equivalent replacement to part of the technical features. Any equivalent structure made by using the contents of the utility model specification and drawings, directly or indirectly used in other related technical fields, is also within the patent protection range of the utility model.
Claims
1. An FPC structure that facilitates detection after multiple IC bonding, characterized in that, The application relates to a flexible printed circuit (FPC) and a TFT glass (2) connected with the FPC. The first binding end (12) and the second binding end (13) are bridged by a bridging FPC (3), and a first conduction structure is connected on the bridging FPC (3) to conduct the first binding end (12) and the second binding end (13). The TFT glass (2) is provided with a second conduction structure at two binding points corresponding to the first binding end (12) and the second binding end (13), so that the first binding end (12) and the second binding end (13) can form a test loop after being bound with the TFT glass (2) under the action of the second conduction structure.
2. The FPC structure of claim 1, wherein, The TFT glass (2) is provided with a first driving IC end (21) and a second driving IC end (22). The first driving IC end (21) and the second driving IC end (22) are respectively arranged corresponding to the first binding end (12) and the second binding end (13).
3. The FPC structure of claim 2, wherein, The second conduction structure is a glass ITO trace (4), and the glass ITO trace (4) has two sections. The two sections of the glass ITO trace (4) are respectively arranged on the back surfaces of the first driving IC end (21) and the second driving IC end (22).
4. The FPC structure of claim 3, wherein, After the first driving IC end (21) and the second driving IC end (22) are bound with the corresponding first binding end (12) and second binding end (13), the glass ITO trace (4) is connected with the corresponding bridging FPC (3).
5. The FPC structure of claim 1, wherein, The bridging FPC (3) and the FPC body (1) are combined to form a stress dispersion groove (31).
6. The FPC structure of claim 5, wherein, The bridging FPC (3) is connected with the TFT glass (2) through ACF glue.
7. The FPC structure of claim 5, wherein, The first conduction structure is a FPC bridging trace (5) arranged on the bridging FPC (3).
8. The FPC structure of claim 7, wherein, The two ends of the FPC bridging trace (5) are respectively connected with the corresponding gold fingers at the ends of the first binding end (12) and the second binding end (13).
9. The FPC structure of claim 8, wherein, The first binding end (12) is provided with a first copper exposure test point (6) at one end away from the connecting end of the FPC bridging trace (5), and the second binding end (13) is provided with a second copper exposure test point (7) at one end away from the connecting end of the FPC bridging trace (5). The first copper exposure test point (6) and the second copper exposure test point (7) are respectively connected with the corresponding first binding end (12) and second binding end (13).
10. The FPC structure of claim 5, wherein, Stress dispersion chamfers (32) are formed at the four corners of the stress dispersion groove (31).