Vehicle-mounted universal module test base plate with clearance design
By using a vehicle-mounted universal module test base plate with a clear design, the problems of signal interference and contact impedance of test fixtures are solved, resulting in higher test accuracy and module production yield, and reducing module damage and waste.
Patent Information
- Application Number
- CN202423153032.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-20
AI Technical Summary
When testing existing automotive universal modules, external signal interference, high contact impedance, and low flatness of the test fixture lead to poor connection stability, resulting in misjudgment and waste.
Design a vehicle-mounted universal module test baseboard with a clearance design. Except for the contact PAD area, the test target module area is not covered with a conductive dielectric layer. Instead, an isolation strip and solder mask layer are set to avoid signal interference and electrostatic discharge, ensuring that the signal flows directly back to the inner layer of the motherboard and reducing contact impedance.
Improve test stability and accuracy, reduce defect rate, prevent external signal interference, ensure flatness of connection end face, avoid signal attenuation and module damage, and improve production efficiency.
Smart Images
Figure CN223681312U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of module production test devices, and particularly relates to a clearance designed vehicle-mounted universal module test base plate. BACKGROUND
[0002] Currently, a vehicle-mounted universal module is produced automatically by using automatic equipment. The quality of the produced vehicle-mounted universal module is strictly controlled, and the quality requirement of the vehicle-mounted module is extremely high. Abnormal products that do not meet the test requirements are directly scrapped. The precision of the automatic equipment and the quality of the raw materials are key factors that determine the quality of the produced vehicle-mounted universal module. When the vehicle-mounted universal module is tested, the quality of the test fixture is also an important key factor that affects the judgment of the quality of the vehicle-mounted universal module.
[0003] If the quality of the vehicle-mounted universal module itself is normal, the test fixture is misjudged due to external signal interference, high contact impedance, low flatness, poor connection stability and large signal attenuation factors during the test stage, and the misjudged vehicle-mounted universal module is obviously unreasonable to be scrapped, resulting in waste.
[0004] Therefore, it is urgent to improve the structure of the test fixture to solve the above problems. CONTENT OF THE UTILITY MODEL
[0005] The utility model mainly aims at the above problems, and provides a clearance designed vehicle-mounted universal module test base plate, which aims to solve the technical problems in the background art.
[0006] To achieve the above purpose, the utility model provides a clearance designed vehicle-mounted universal module test base plate, which comprises a support substrate, the support substrate is provided with a test target module area and a test base connection area, the test target module area is arranged in the test base connection area, the test target module area is provided with a plurality of contact pads, and the test target module area is not provided with a conductive medium layer except the plurality of contact pads.
[0007] Further, the test target module area is provided with a solder mask layer except the plurality of contact pads.
[0008] Further, an isolation belt is arranged between the test target module area and the test base connection area, and the isolation belt is not provided with a conductive medium layer.
[0009] Further, the conductive medium layer is made of copper.
[0010] Further, the surface layer of the test base connection area is exposed to the conductive medium layer.
[0011] Further, the test base connection area is provided with a docking position. Further, the test base connection area is provided with a docking position.
[0012] Further, the docking position is provided with a solder resist layer.
[0013] Further, the test base connecting area is provided with a placement alignment mark.
[0014] Further, the test target module area and the test base connecting area are both rectangular in shape.
[0015] Further, the number of contact pads is 970.
[0016] Compared with the prior art, the vehicle-mounted universal module test board with the net space design provided by the utility model can effectively block the connection between the test support substrate surface layer and the test target module, avoid signal interference, effectively block the release of static electricity from the test target module pin due to the ESD effect of the test board, and thus better reflow the system signal, so that the vehicle-mounted universal module signal can be directly reflowed to the inner layer of the mainboard, avoid misjudgment caused by interference, and the test target module area 1 is not coated with a conductive medium layer except for the plurality of contact pads, so that the contact is not raised after the net space, and therefore the test fixture and the board can be better in close contact, and the contact impedance is reduced. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is a structural schematic diagram of a conventional vehicle-mounted universal module test board in the prior art.
[0018] Figure 2 It is a structural schematic diagram of a vehicle-mounted universal module test board with a net space design according to the utility model.
[0019] The reference signs shown in the figure are as follows: 1, test target module area; 2, test base connecting area; 3, contact pad; 4, isolation belt; 5, docking position; 6, placement alignment mark. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model. It can be understood that the drawings are only provided for reference and illustration, and are not used to limit the utility model. The connection relationship shown in the drawings is only for clear description, and does not limit the connection mode.
[0021] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component, or a middle component can exist at the same time. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. It should also be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected, or it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. The terms used in the description of the present application are only for the purpose of describing the specific embodiments, and are not intended to limit the present application.
[0022] It should also be noted that in the description of the present application, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.
[0023] Please refer to Figure 2 The embodiment provides a clearance designed vehicle-mounted universal module test backboard, which comprises a support substrate, the support substrate is provided with a test target module area 1 and a test base connection area 2; the test target module area 1 is arranged in the test base connection area 2; the test target module area 1 is provided with a plurality of contact pads 3, and the test target module area 1 is not provided with a conductive medium layer except the plurality of contact pads 3.
[0024] The contact pad 3 is a contact point of a test probe / tested module.
[0025] Please refer to Figure 1 , Figure 1The traditional vehicle-mounted general module test board structure schematic diagram is shown in FIG. 1. The support substrate is entirely coated with a conductive medium layer, and only the contact PAD and the contact PAD, and the contact PAD and the test base connecting area 2 are separated. A solder resist layer is provided at the non-contact PAD. However, the contact PAD of the traditional vehicle-mounted general module test board is elevated due to the solder resist layer, so that the pins on the vehicle-mounted general module to be tested are additionally elevated when connected to the contact PAD, resulting in insufficient and unstable connection between the pins and the contact PAD, and thus signal distortion, leading to false test results.
[0026] The application prevents the filling of the conductive medium layer in the test target module area 1 except for the plurality of contact PADs 3, effectively blocks the connection between the test support substrate surface layer and the test target module, avoids signal interference, effectively blocks the release of static electricity from the pins of the test target module due to the ESD effect of the test board, and thus better reflows the system signal, so that the vehicle-mounted general module signal can be directly reflowed to the inner layer of the mainboard, avoiding false test and false judgment caused by interference. In addition, the test target module area 1 is not coated with a conductive medium layer except for the plurality of contact PADs 3, and the clearance is avoided after being cleaned, so that the test fixture and the board can be better in close contact, reducing the contact impedance.
[0027] Preferably, the test target module area 1 is provided with a solder resist layer except for the plurality of contact PADs 3.
[0028] Since there is no conductive medium layer at this position, the thickness of the solder resist layer set on this basis will not affect the contact between the contact PAD 3 and the pins on the module, ensuring good contact and reducing contact impedance and signal distortion. The contact PAD 3 and the contact PAD 3 are separated by the solder resist layer, and the test module and the support substrate are separated by the corresponding solder resist layer, so that only the contact PAD 3 and the pins on the module are electrically connected, avoiding interference.
[0029] Please refer to Figure 2 The test target module area 1 and the test base connecting area 2 are provided with an isolation belt 4, and the isolation belt 4 is not coated with a conductive medium layer.
[0030] Preferably, the material of the conductive medium layer is copper.
[0031] In some embodiments, the material of the conductive medium layer can also be gold or silver, which has lower resistance and better conductivity.
[0032] Please refer to Figure 2 The surface layer of the test base connecting area 2 is exposed to the conductive medium layer.
[0033] The exposed conductive medium layer can effectively release ESD. Since the test base connecting area 2 is in contact with the test base, the test base generally has grounding measures, so that ESD is effectively released through the mainboard ground plane, avoiding direct action on the current test module PAD.
[0034] Through this design, the test base can effectively avoid introducing ESD (electrostatic discharge) to directly act on the test module pad, causing damage to the tested vehicle-mounted universal module, effectively improving the quality of the production module and reducing the failure rate.
[0035] In this way, external interference signals can be effectively shielded, avoiding direct action of external interference signals on the current test module and improving test accuracy.
[0036] Please refer to Figure 2 The test base connecting area 2 is provided with a docking site 5.
[0037] The docking site 5 can be a recess or a protrusion, which serves to cooperate with the corresponding docking structure in the test fixture to achieve docking positioning.
[0038] Preferably, the docking site 5 is provided with a solder resist layer.
[0039] Please refer to Figure 2 The test base connecting area 2 is provided with a placement alignment mark 6.
[0040] The test target module area 1 and the test base connecting area 2 are both rectangular in outer contour.
[0041] The placement alignment mark 6 is triangular, which facilitates workers to identify the position in the test fixture when the support substrate is square in outer contour.
[0042] In some embodiments, the number of contact pads 3 is 970.
[0043] In summary, the packaging design can not only improve test stability and accuracy, but also effectively increase the yield of module production, increase benefits, effectively prevent external signals from interfering with the module, ensure the flatness of the connection end face, effectively reduce the contact impedance of the test module and the base plate, avoid signal attenuation, effectively protect the module test production from the direct action of static electricity on the module bottom pad, causing damage to the module in production and causing scrap.
[0044] In the specification and claims of the present application, the words "comprise / contain" and the words "have / including" and their variants are used to specify the presence of the stated features, values, steps or components, but do not exclude the presence or addition of one or more other features, values, steps, components or combinations thereof.
[0045] For the sake of clarity, some features of the present application are described in different embodiments, however, these features can also be described in a single embodiment. Conversely, some features of the present application are described in a single embodiment for the sake of brevity, however, these features can also be described in different embodiments, alone or in any suitable combination.
[0046] The above merely describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A clear design vehicle general module test backplane, characterized in that, The test target module area is provided in the test base connecting area; the test target module area is provided with a plurality of contact pads, and the test target module area is not provided with a conductive medium layer except the plurality of contact pads.
2. The overhead designed vehicle general module test board according to claim 1, wherein, The test target module area is provided with a solder mask layer except the plurality of contact pads.
3. The overhead designed vehicle universal module test bed as claimed in claim 1 wherein, The test target module area and the test base connecting area are provided with an isolation belt, and the isolation belt is not provided with a conductive medium layer.
4. The overhead designed vehicle general module test board of claim 1, wherein, The material of the conductive medium layer is copper.
5. The overhead designed vehicle general module test board according to claim 1, wherein, The surface layer of the test base connecting area is exposed to the conductive medium layer.
6. The overhead designed vehicle general module test board of claim 1, wherein, The test base connecting area is provided with a docking position.
7. The overhead designed vehicle general module test board according to claim 6, wherein, The docking position is provided with a solder mask layer.
8. The overhead designed vehicle general module test board of claim 1, wherein, The test base connecting area is provided with a placement alignment mark.
9. The overhead designed vehicle universal module test bed as claimed in claim 1 wherein, The test target module area and the test base connecting area are both rectangular in outer contour.
10. The overhead designed vehicle universal module test bed as claimed in claim 1 wherein, The number of the contact pads is 970.