Spraying device for cleaning semiconductor

Abstract

The utility model relates to the technical field of semiconductor production and processing, in particular to a spraying device for cleaning a semiconductor, which comprises a device main body, a cleaning bin, a storage grid plate, a water tank, a water conveying component, a screw rod, a driving component, a spray head, a spraying component, a waste liquid hopper and a waste liquid component, a cleaning bin is arranged on the inner side of the device body, a storage grid plate is arranged on the inner side of the cleaning bin, a water tank is arranged on the top of the device body, a water conveying assembly is arranged on one side of the water tank, a lead screw is arranged on the top of the inner side of the cleaning bin, a driving assembly is arranged on the outer side of the lead screw, a spray head is arranged on the bottom face of the lead screw, and a spraying assembly is arranged on one side of the spray head. A waste liquid hopper is arranged below the storage grid plate, and a waste liquid assembly is arranged on the bottom face of the waste liquid hopper. According to the utility model, through a liquid spraying pretreatment mode, before and after the surface of the semiconductor is sprayed and washed, the semiconductor is wetted by cleaning liquid, so that the cleaning liquid fully reacts with chemical substances of the semiconductor, the cleaning effect of the device is guaranteed, and the practical value of the device is effectively enhanced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor production and processing, especially relates to a kind of semiconductor cleaning is used spray device. BACKGROUND

[0002] In the semiconductor manufacturing process, various process steps will produce impurity particles, semiconductor surface will remain tiny silicon chips, abrasive particles, etc., and after chemical process, semiconductor surface will remain chemical substances, therefore, need to clean semiconductor by means of spray device.

[0003] Most of the present semiconductor cleaning device is directly washed away the particles and chemical residues on the surface of semiconductor by the liquid impact force of spray head, the cleaning method is relatively single, often difficult to fully clean the chemical residues on the surface of semiconductor, affect the cleaning degree of device.

[0004] Therefore, in view of the fact that the existing semiconductor cleaning device is often difficult to fully clean the chemical residues on the surface of semiconductor, a kind of semiconductor cleaning is used spray device can be designed, by means of liquid pre-treatment, before and after spraying and washing semiconductor surface, semiconductor is wetted by cleaning liquid, so that cleaning liquid and semiconductor chemical substances fully react, guarantee the cleaning effect of device, thereby effectively enhance the practical value of device. SUMMARY

[0005] In order to overcome the problem that most of the semiconductor cleaning device is directly washed by spray head, the cleaning method is relatively single, often difficult to fully clean the chemical residues on the surface of semiconductor, affect the cleaning degree of device.

[0006] The technical scheme of the utility model is as follows: a kind of semiconductor cleaning is used spray device, including device main body, support frame, cleaning bin, article grid plate, opening and closing assembly, water tank, water delivery component, screw rod, drive assembly, spray head, spray assembly, waste liquid bucket and waste liquid component;The bottom surface of device main body is provided with support frame, the inner side of device main body is provided with cleaning bin, the inner side of cleaning bin is provided with article grid plate, the side of cleaning bin is provided with opening and closing assembly, the top of device main body is provided with water tank, the side of water tank is provided with water delivery component, the inner side top of cleaning bin is provided with screw rod, the outer side of screw rod is provided with drive assembly, the bottom surface of screw rod is provided with spray head, spray head is provided with multiple groups, the side of spray head is provided with spray assembly, the below of article grid plate is provided with waste liquid bucket, the bottom surface of waste liquid bucket is provided with waste liquid component.

[0007] Preferably, the support frame is arranged to support the main body of the device, the grid plate is arranged to place the semiconductor to be cleaned, thereby placing the semiconductor in the cleaning chamber, the opening and closing assembly is arranged to flexibly open and close the cleaning chamber, the water tank is arranged to store the semiconductor cleaning solution, the water delivery assembly is arranged to deliver the cleaning solution to the spray head, the drive assembly is arranged to drive the rotation of the lead screw, the rotation of the lead screw is arranged to drive the movement of the spray head, the spray head is arranged to reciprocate in the cleaning chamber, the spray assembly is arranged to spray the semiconductor, the spray head is arranged to spray the semiconductor surface with the washing liquid, the waste water after washing is arranged to fall into the waste liquid tank through the grid plate, the waste liquid tank is arranged to store the waste water, and the waste liquid assembly is arranged to flexibly discharge the waste water in the waste liquid tank, thereby realizing the full reaction of the cleaning solution and the semiconductor chemical substances, ensuring the full cleaning effect of the device, and enhancing the practical value of the device.

[0008] Preferably, the opening and closing assembly comprises a door panel, a handle and an electromagnetic lock; the door panel is arranged on one side of the cleaning chamber, the door panel is rotatably connected to the main body of the device on one side, the handle is arranged on one side of the door panel, and the electromagnetic lock is arranged on the other side of the door panel.

[0009] Preferably, the opening and closing assembly further comprises a sealing groove and a sealing rubber strip; the sealing groove is arranged on one side of the main body of the device, two groups of sealing grooves are symmetrically arranged, the sealing rubber strip is arranged on one side of the door panel, two groups of sealing rubber strips are symmetrically arranged, and the sealing rubber strip and the sealing groove are mutually embedded.

[0010] Preferably, the water delivery assembly comprises a water inlet, a sealing plug, a water delivery pipe and a water pump; the water tank is provided with a water inlet on the top, the water inlet is provided with a sealing plug on the inner side, the water tank is provided with a water delivery pipe on one side, the other end of the water delivery pipe is connected to one side of the main body of the device, and the water pump is arranged on the outer side of the water delivery pipe.

[0011] Preferably, the drive assembly comprises a motor, a connecting block, a first distribution box and a hose; the motor is arranged on the outer side of the main body of the device, the output end of the motor is connected to the lead screw, the connecting block is arranged on the outer side of the lead screw, the first distribution box is arranged on the bottom surface of the connecting block, the hose is arranged on one side of the first distribution box, and the hose is connected to the water delivery pipe.

[0012] Preferably, the spray assembly comprises a second distribution box, a third distribution box and a liquid outlet; the first distribution box is provided with the second distribution box on the bottom surface, the spray head is arranged on the bottom surface of the second distribution box, the first distribution box is provided with the third distribution box on the bottom surface, two groups of third distribution boxes are symmetrically arranged, the third distribution boxes are arranged on both sides of the second distribution box, the third distribution boxes are provided with the liquid outlet on the bottom surface, and multiple groups of liquid outlets are arranged.

[0013] Preferably, the waste liquid assembly comprises a liquid discharge pipeline and an electromagnetic valve; the waste liquid tank is provided with the liquid discharge pipeline on the bottom surface, and the liquid discharge pipeline is provided with the electromagnetic valve on one side.

[0014] When cleaning semiconductors, the main body of the device is supported and fixed by a support frame. The semiconductor to be cleaned is placed on a grid plate, allowing for flexible placement of the semiconductor in the cleaning chamber. The semiconductor cleaning solution is stored in a water tank and delivered to the nozzle. Rotating the screw moves the nozzle, causing it to reciprocate within the cleaning chamber. First, the semiconductor is pre-treated by spraying water, and then the surface of the semiconductor is rinsed with rinsing solution sprayed from the nozzle. The wastewater after rinsing falls into the waste liquid hopper through the grid plate for storage. This method addresses the problem that most semiconductor cleaning devices rely solely on the impact force of the liquid sprayed from the nozzle to wash away particles and chemical residues on the semiconductor surface. This relatively simple cleaning method often fails to adequately clean the chemical residues on the semiconductor surface, thus enhancing the practical value of the device. Attached Figure Description

[0015] Figure 1 The diagram shown is a three-dimensional structural schematic of a semiconductor cleaning spray device according to this utility model;

[0016] Figure 2 The diagram shown is a three-dimensional structural schematic of the water supply component of a spray device for semiconductor cleaning according to this utility model.

[0017] Figure 3 The diagram shown is a three-dimensional structural schematic of the opening and closing components of a spray device for semiconductor cleaning according to this utility model.

[0018] Figure 4 The diagram shown is a three-dimensional structural schematic of the spray component of a semiconductor cleaning spray device according to this utility model.

[0019] Explanation of reference numerals in the attached drawings: 1. Main body of the device; 101. Support frame; 2. Cleaning chamber; 201. Storage grid plate; 202. Door panel; 203. Handle; 204. Electromagnetic lock; 205. Sealing groove; 206. Sealing strip; 3. Water tank; 301. Water inlet; 302. Sealing plug; 303. Water supply pipe; 304. Water pump; 4. Lead screw; 401. Motor; 402. Connecting block; 403. First dispensing tank; 404. Hose; 5. Nozzle; 501. Second dispensing tank; 502. Third dispensing tank; 503. Spray outlet; 6. Waste liquid hopper; 601. Drainage pipe; 602. Solenoid valve. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] Please see Figures 1-4The utility model provides a kind of embodiment: a kind of semiconductor cleaning is spouted device, including device main body 1, support frame 101, cleaning bin 2, article grid plate 201, open-close assembly, water tank 3, water delivery component, screw rod 4, driving assembly, spray head 5, spray assembly, waste liquid bucket 6 and waste liquid component;The bottom of device main body 1 is provided with support frame 101, the inside of device main body 1 is provided with cleaning bin 2, the inside of cleaning bin 2 is provided with article grid plate 201, one side of cleaning bin 2 is provided with open-close assembly, the top of device main body 1 is provided with water tank 3, one side of water tank 3 is provided with water delivery component, the inside top of cleaning bin 2 is provided with screw rod 4, the outside of screw rod 4 is provided with driving assembly, the bottom of screw rod 4 is provided with spray head 5, spray head 5 is provided with multiple groups, one side of spray head 5 is provided with spray assembly, the below of article grid plate 201 is provided with waste liquid bucket 6, the bottom of waste liquid bucket 6 is provided with waste liquid component.

[0022] Please refer to Figures 1-4 In the embodiment, open-close assembly includes door plate 202, handle 203, electromagnetic lock 204, sealing groove 205 and sealing rubber strip 206;One side of cleaning bin 2 is provided with door plate 202, one side of door plate 202 is rotatably connected with device main body 1, one side of door plate 202 is provided with handle 203, the other side of door plate 202 is provided with electromagnetic lock 204, one side of device main body 1 is provided with sealing groove 205, sealing groove 205 is symmetrically provided with two groups, one side of door plate 202 is provided with sealing rubber strip 206, sealing rubber strip 206 is symmetrically provided with two groups, sealing rubber strip 206 and sealing groove 205 are mutually embedded, door plate 202 is rotatably driven by handle 203, cleaning bin 2 is flexibly opened and closed by door plate 202, door plate 202 is flexibly locked by electromagnetic lock 204, sealing rubber strip 206 is embedded in sealing groove 205 by closing door plate 202, and the sealing effect of door plate 202 is guaranteed by sealing rubber strip 206;Water delivery component includes water inlet 301, sealing plug 302, water delivery pipe 303 and water pump 304;The top of water tank 3 is provided with water inlet 301, the inside of water inlet 301 is provided with sealing plug 302, one side of water tank 3 is provided with water delivery pipe 303, the other end of water delivery pipe 303 is connected with one side of device main body 1, the outside of water delivery pipe 303 is provided with water pump 304, cleaning fluid is injected into water tank 3 by water inlet 301, sealing plug 302 is used to flexibly block water inlet 301, cleaning fluid is pumped into water tank 3 by starting water pump 304, and cleaning fluid is delivered to spray head 5 by water delivery pipe 303;

[0023] The driving assembly comprises a motor 401, a connecting block 402, a first distribution tank 403 and a hose 404; the motor 401 is arranged outside the device body 1, the output end of the motor 401 is connected with the lead screw 4, the connecting block 402 is arranged outside the lead screw 4, the bottom surface of the connecting block 402 is provided with the first distribution tank 403, one side of the first distribution tank 403 is provided with the hose 404, the hose 404 is connected with the water delivery pipe 303 in a penetrating manner, the lead screw 4 is driven to rotate by the motor 401, the connecting block 402 is driven to move by the rotating lead screw 4, the first distribution tank 403 is connected and fixed by the connecting block 402, the cleaning liquid is delivered into the first distribution tank 403 by the hose 404, and the cleaning liquid is distributed by the first distribution tank 403; the spraying assembly comprises a second distribution tank 501, a third distribution tank 502 and a liquid pouring port 503; the bottom surface of the first distribution tank 403 is provided with the second distribution tank 501, the spray head 5 is arranged on the bottom surface of the second distribution tank 501, the bottom surface of the first distribution tank 403 is provided with the third distribution tank 502, the third distribution tank 502 is symmetrically provided with two groups, the third distribution tank 502 is arranged on the two sides of the second distribution tank 501, the bottom surface of the third distribution tank 502 is provided with the liquid pouring port 503, and a plurality of liquid pouring ports 503 are arranged; the cleaning liquid is distributed and delivered to the spray head 5 by the second distribution tank 501, the cleaning liquid is distributed and delivered to the liquid pouring port 503 by the third distribution tank 502, the cleaning liquid flows out of the liquid pouring port 503, and the cleaning liquid wets the surface of the semiconductor in pretreatment; the waste liquid assembly comprises a liquid discharge pipeline 601 and an electromagnetic valve 602; the bottom surface of the waste liquid tank 6 is provided with the liquid discharge pipeline 601, one side of the liquid discharge pipeline 601 is provided with the electromagnetic valve 602, the liquid discharge pipeline 601 is flexibly opened and closed by the electromagnetic valve 602, and the cleaning waste liquid in the waste liquid tank 6 is discharged by the liquid discharge pipeline 601.

[0024] Before the cleaning operation, the device body 1 is supported and fixed by the supporting frame 101, the cleaning liquid is poured into the water tank 3 from the water inlet 301, the water inlet 301 is blocked by the sealing plug 302, the handle 203 is pulled to open the door plate 202, the semiconductor is placed on the placing grid plate 201 in the cleaning bin 2, then the door plate 202 is closed to make the sealing rubber strip 206 embedded in the sealing groove 205, and the door plate 202 is locked by the electromagnetic lock 204;

[0025] During the cleaning operation, the water pump 304 is started to draw the cleaning liquid in the water tank 3 by the water delivery pipe 303, the cleaning liquid is pumped to the hose 404, the cleaning liquid is distributed and delivered to the second distribution tank 501 and the third distribution tank 502 by the first distribution tank 403, the liquid pouring port 503 is poured with the cleaning liquid, and the cleaning liquid is sprayed by the spray head 5 to flush the semiconductor;

[0026] At the same time, the motor 401 drives the screw rod 4 to rotate, the rotating screw rod 4 drives the connecting block 402 to move, the nozzle 5 reciprocatingly flushes the semiconductor surface, the washing liquid falls into the waste liquid tank 6 through the storage grid plate 201, finally, the handle 203 is pulled to open the door plate 202, the cleaned semiconductor is taken out, the electromagnetic valve 602 opens the liquid discharge pipeline 601, and the waste liquid is discharged.

[0027] Through the above steps, the semiconductor is placed in the cleaning bin 2 by setting the support frame 101 to support the fixing device main body 1, the semiconductor to be cleaned is placed on the storage grid plate 201, the cleaning bin 2 is flexibly opened and closed through the opening and closing assembly, the semiconductor cleaning liquid is stored in the water tank 3, the cleaning liquid is delivered to the nozzle 5 through the water delivery assembly, the screw rod 4 is driven to rotate through the driving assembly, the nozzle 5 is driven to move through the rotating screw rod 4, the nozzle 5 reciprocatingly moves in the cleaning bin 2, the semiconductor is preprocessed through the spraying assembly, the semiconductor surface is flushed by the washing liquid sprayed through the nozzle 5, the waste water after washing falls into the waste liquid tank 6 through the storage grid plate 201, the waste water after cleaning is stored in the waste liquid tank 6, the waste water in the waste liquid tank 6 is flexibly discharged through the waste liquid assembly, so that the cleaning liquid and the semiconductor chemical substances fully react, and the cleaning effect of the device is guaranteed.

[0028] The embodiments of the utility model are described in detail above in combination with the drawings, but the utility model is not limited to the above-mentioned embodiments, and various changes can be made within the knowledge range of the person skilled in the art without departing from the purpose of the utility model.

Claims

1. A semiconductor cleaning spraying device, comprising a device main body (1), a supporting frame (101), a cleaning bin (2), a storage grid plate (201), an opening and closing assembly; characterized in that: It also includes a water tank (3), a water delivery assembly, a lead screw (4), a drive assembly, a spray head (5), a spraying assembly, a waste liquid bucket (6) and a waste liquid assembly; the bottom surface of the device main body (1) is provided with a support frame (101), the inner side of the device main body (1) is provided with a cleaning bin (2), the inner side of the cleaning bin (2) is provided with a storage grid plate (201), one side of the cleaning bin (2) is provided with an opening and closing assembly, the top of the device main body (1) is provided with a water tank (3), one side of the water tank (3) is provided with a water delivery assembly, the inner side top of the cleaning bin (2) is provided with a lead screw (4), the outer side of the lead screw (4) is provided with a drive assembly, the bottom surface of the lead screw (4) is provided with a spray head (5), the spray head (5) is provided with multiple groups, one side of the spray head (5) is provided with a spraying assembly, the lower side of the storage grid plate (201) is provided with a waste liquid bucket (6), the bottom surface of the waste liquid bucket (6) is provided with a waste liquid assembly.

2. The semiconductor cleaning spray device according to claim 1, characterized by: The opening and closing assembly comprises a door plate (202), a handle (203) and an electromagnetic lock (204); one side of the cleaning bin (2) is provided with a door plate (202), one side of the door plate (202) is rotatably connected with the device main body (1), one side of the door plate (202) is provided with a handle (203), and the other side of the door plate (202) is provided with an electromagnetic lock (204).

3. The semiconductor cleaning spray device of claim 2, wherein: The opening and closing assembly further comprises a sealing groove (205) and a sealing rubber strip (206); one side of the device main body (1) is provided with a sealing groove (205), two groups of sealing grooves (205) are symmetrically provided, one side of the door plate (202) is provided with a sealing rubber strip (206), two groups of sealing rubber strips (206) are symmetrically provided, and the sealing rubber strip (206) and the sealing groove (205) are mutually embedded.

4. The semiconductor cleaning spray device of claim 2, wherein: The water delivery assembly comprises a water inlet (301), a sealing plug (302), a water delivery pipe (303) and a water pump (304); the top of the water tank (3) is provided with a water inlet (301), the inner side of the water inlet (301) is provided with a sealing plug (302), one side of the water tank (3) is provided with a water delivery pipe (303), the other end of the water delivery pipe (303) is connected with one side of the device main body (1), and the outer side of the water delivery pipe (303) is provided with a water pump (304).

5. The semiconductor cleaning spray apparatus of claim 4, wherein: The drive assembly comprises a motor (401), a connecting block (402), a first distribution tank (403) and a hose (404); the outer side of the device main body (1) is provided with a motor (401), the output end of the motor (401) is connected with the lead screw (4), the outer side of the lead screw (4) is provided with a connecting block (402), the bottom surface of the connecting block (402) is provided with a first distribution tank (403), one side of the first distribution tank (403) is provided with a hose (404), and the hose (404) is connected with the water delivery pipe (303).

6. The semiconductor cleaning spray apparatus of claim 5, wherein: The spray assembly comprises a second distribution tank (501), a third distribution tank (502) and a spraying opening (503); the bottom surface of the first distribution tank (403) is provided with the second distribution tank (501), the spray head (5) is arranged on the bottom surface of the second distribution tank (501), the bottom surface of the first distribution tank (403) is provided with the third distribution tank (502), the third distribution tank (502) is symmetrically provided with two groups, the third distribution tank (502) is arranged on the two sides of the second distribution tank (501), the bottom surface of the third distribution tank (502) is provided with the spraying opening (503), and the spraying opening (503) is provided with a plurality of groups.

7. The semiconductor cleaning spray apparatus of claim 5, wherein: The waste liquid assembly comprises a liquid discharge pipeline (601) and an electromagnetic valve (602); the bottom surface of the waste liquid bucket (6) is provided with the liquid discharge pipeline (601), and one side of the liquid discharge pipeline (601) is provided with the electromagnetic valve (602).

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