Automatic blanking positioning device of double-sided polishing machine
By designing an automatic wafer unloading and positioning device that connects the spindle, suction cup bracket, and sensor combination, the problems of complex structure and high cost of existing devices are solved, realizing a simple, low-cost, and highly adaptable wafer unloading solution.
Patent Information
- Application Number
- CN202423104534.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-12-16
AI Technical Summary
Existing automatic feeding and positioning devices for double-sided polishing machines are complex in structure, costly, difficult for non-professionals to debug, and cannot adapt to wafers of different sizes and types.
An automatic unloading and positioning device was designed, which includes a connecting spindle, a connecting disk, a suction cup bracket, and a negative pressure buffer suction cup. It combines photoelectric sensors and color sensors for coarse and fine positioning, and adopts a detachable connection structure to adapt to different wafers, thereby reducing the positioning accuracy requirements.
It features a simple structure, low cost, and easy use, enabling rapid installation and debugging. It adapts to wafers of different sizes and types, improving material cutting efficiency and reducing costs.
Smart Images
Figure CN223685131U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to blanking positioning device technical field, concretely relates to a double -sided polishing machine automatic blanking positioning device. BACKGROUND
[0002] At present, due to the fierce market competition, the factory is more and more high to automation, the trend of "machine replaces people" and action are more and more fast, so research and development are aimed at the production line equipment of double -sided polishing machine wafer blanking, and it is very necessary and urgent to design and develop full -automatic, low -cost solution.It can replace a part of manpower on one hand, satisfy the demand of customer to improve work efficiency;On the other hand, it can improve the added value of company machine, increase the highlight, and improve market competitiveness.Currently, the positioning mode for automatic blanking in the industry needs to be matched with camera vision, and the device structure is complex, the use mode is complex, the non-professional person can not debug, and the cost is high.Therefore, the utility model provides a double -sided polishing machine automatic blanking positioning device. UTILITY MODEL CONTENTS
[0003] The utility model aims at providing a double -sided polishing machine automatic blanking positioning device.
[0004] To solve the above technical problem, the utility model aims at realizing as follows:
[0005] A double -sided polishing machine automatic blanking positioning device, comprising: connecting main shaft;The bottom of the connecting main shaft is provided with a connecting disc;A plurality of suction cup supports are arranged on the connecting disc;A plurality of negative pressure buffer suction cups are arranged on the suction cup support;
[0006] The connecting disc is provided with a photoelectric sensor and a color sensor;The photoelectric sensor is staggered with the suction cup support, and the detection direction is downward;The color sensor is staggered with the suction cup support and the photoelectric sensor, and the detection direction is downward.
[0007] On the basis of the above scheme and as the preferred scheme of the above scheme, the sliding slot is set up on the suction cup support along the length direction;The negative pressure buffer suction cup is detachably arranged in the sliding slot, and the connecting mounting plate is arranged below;The connecting mounting plate is detachably connected with the suction cup support through the bolt arranged in the sliding slot, and the mounting groove is symmetrically set up on the connecting mounting plate;The negative pressure buffer suction cup is detachably arranged in the mounting groove.
[0008] On the basis of the above scheme and as the preferred scheme of the above scheme, the negative pressure buffer suction cup is provided with a threaded section on the upper, and the detachable connection with the sliding slot and the mounting groove is realized by cooperating with the nut.
[0009] On the basis of the above scheme and as a preferred scheme of the above scheme, the photoelectric sensor is connected to the connecting disc through a first connecting support; a first through hole and a first arc hole are formed in a first end of the first connecting support, and the first connecting support is detachably connected to the connecting disc in cooperation with bolts arranged in the first through hole and the first arc hole.
[0010] On the basis of the above scheme and as a preferred scheme of the above scheme, the photoelectric sensor is connected to the connecting disc through a first connecting support; a first through hole and a first arc hole are formed in a first end of the first connecting support, and the first connecting support is detachably connected to the connecting disc in cooperation with bolts arranged in the first through hole and the first arc hole.
[0011] On the basis of the above scheme and as a preferred scheme of the above scheme, the color sensor is connected to the connecting disc through a second connecting support.
[0012] The beneficial effects of the utility model are:
[0013] The automatic blanking positioning device of the double-sided machine has the advantages of simple structure, simple use, quick installation and debugging, low cost, simultaneous work of multiple negative pressure buffer suction discs, no need for precise suction of the center of a wafer, low requirement for the positioning precision of a sensor, allowance of certain deviation, stable and accurate blanking and grabbing action, guarantee of wafer unbreakability, scheme expandability, strong applicability, expansion to various types of new and old machines, adaptation to wafer products of different sizes, different types and different processes, faster time than manual work, one-to-two, that is, one mechanical arm and positioning device can be matched with two machines, improved efficiency and cost saving. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is a structural schematic view of the utility model.
[0015] Figure 2 It is a schematic view of the position relationship between the utility model, a clamp and a wafer.
[0016] Figure 3 It is a structural schematic view of a suction support and a negative pressure buffer suction disc of the utility model.
[0017] Figure 4 It is a structural schematic view of a first connecting support and a photoelectric sensor of the utility model.
[0018] In the figure: 1, connecting main shaft; 2, connecting disc; 3, suction cup support; 4, negative pressure buffer suction cup; 5, photoelectric sensor; 6, color sensor; 7, connecting mounting plate; 8, sliding slot; 9, mounting slot; 10, first connecting support; 11, first through hole; 12, first arc hole; 13, connecting secondary plate; 14, second through hole; 15, second arc hole; 16, second connecting support; 17, clamp; 18, wafer. DETAILED DESCRIPTION
[0019] The utility model is further explained in connection with the drawings and specific embodiments.
[0020] As Figure 1 and Figure 2 shown, an automatic unloading positioning device of a double-sided polishing machine, comprising: a connecting main shaft 1, the top end of the connecting main shaft 1 is connected with a mechanical hand, and the bottom is provided with a connecting disc 2. A plurality of suction cup supports 3 are arranged on the connecting disc 2, and a plurality of negative pressure buffer suction cups 4 are arranged on the suction cup supports 3.
[0021] In this embodiment, the number of suction cup supports 3 is three, which are evenly distributed along the circumference of the connecting disc 2. Each suction cup support 3 includes three negative pressure buffer suction cups 4, the top of the negative pressure buffer suction cup 4 is connected with a negative pressure device, and the bottom is provided with a soft pad to avoid damage to the wafer caused by collision.
[0022] Specifically, as Figure 3 shown, a sliding slot 8 is formed on the suction cup support 3 along the length direction thereof. A negative pressure buffer suction cup 4 is detachably arranged in the sliding slot 8. A connecting mounting plate 7 is arranged below the sliding slot 8, the connecting mounting plate 7 is detachably connected with the suction cup support 3 through bolts arranged in the sliding slot 8, and symmetrically formed mounting slots 9 are formed on the connecting mounting plate 7, and one negative pressure buffer suction cup 4 is detachably arranged in each mounting slot 9. The connecting mounting plate 7 is connected with the suction cup support 3 through bolts, when the bolts are loosened, the connecting mounting plate 7 can be moved along the sliding slot 8 to adjust the positions of the two negative pressure buffer suction cups 4. At the same time, the negative pressure buffer suction cup 4 is provided with a threaded section on the top, and is detachably connected with the sliding slot 8 and the mounting slot 9 by cooperating with a nut, by loosening the nut on the negative pressure buffer suction cup 4, the negative pressure buffer suction cup 4 can be moved in the sliding slot 8 or the mounting slot 9, so as to adjust the positions of the three negative pressure buffer suction cups 4 to adapt to the unloading of wafers of different sizes, models and types.
[0023] The connecting disc 2 is provided with a photoelectric sensor 5 and a color sensor 6, the photoelectric sensor 5 is arranged staggered with the suction cup support 3, and the detection direction is downward. The color sensor 6 is arranged staggered with the suction cup support 3 and the photoelectric sensor 5, and the detection direction is downward.
[0024] The lower polishing disc of the double-sided polishing machine starts to run, and the clamp 17 is rotated. The photoelectric sensor 5 on the automatic unloading positioning device performs the first rough positioning on the clamp 17 that is running. After the first clamp 17 is positioned, the automatic unloading positioning device runs above the clamp 17. The automatic unloading positioning device rotates back and forth, and the color sensor 6 performs the second fine positioning on the clamp 17. The color sensor 6 judges the accurate position of the wafer 18 by the color feature point. After the position is confirmed, the vacuum is opened, and the automatic unloading positioning device sucks the wafer 18 by the negative pressure buffer chuck 4.
[0025] Preferably, the photoelectric sensor 5 is connected to the connecting disc 2 through the first connecting bracket 10. As shown in the drawings, the first connecting bracket 10 is a straight plate structure, and a first end of the first connecting bracket 10 is provided with a first through hole 11 and a first arc hole 12, and is detachably connected with the connecting disc 2 through the bolts arranged in the first through hole 11 and the first arc hole 12. The bolts can move in the first arc hole 12, and when the bolts are loosened, the first connecting bracket 10 can be rotated to adjust the position of the photoelectric sensor 5 to adapt to different use requirements. Figure 4
[0026] Meanwhile, the photoelectric sensor 5 is detachably connected with the second end of the first connecting bracket 10 through the connecting secondary plate 13. The connecting secondary plate 13 is an L-shaped plate structure, and is detachably connected with the vertical plate formed by the second end of the first connecting bracket 10. The connecting secondary plate 13 is provided with a second through hole 14 and a second arc hole 15, and is detachably connected with the first connecting bracket 10 through the bolts arranged in the second through hole 14 and the second arc hole 15. The bolts can move in the second arc hole 15, and when the bolts are loosened, the connecting secondary plate 13 can be rotated to adjust the position of the photoelectric sensor 5, and the applicability of the device is improved.
[0027] The color sensor 6 is connected with the connecting disc 2 through the second connecting bracket 16. The first end of the second connecting bracket 16 is connected with the connecting disc 2, and the second end is connected with the color sensor 6.
[0028] The automatic unloading positioning device is installed on the upper surface of the T-shaft rotating shaft of the unloading robot and is driven to rotate by a servo motor. The double-sided polishing machine and the unloading robot are directly connected and controlled. When the polishing program of the wafer is completed, the upper polishing disc is automatically raised, and the unloading robot receiving the processing completion signal runs to the waiting station. The lower polishing disc part of the double-sided polishing machine starts to run and drive the clamp 17 to rotate. The photoelectric sensor 5 on the automatic unloading positioning device performs the first rough positioning on the clamp 17 running over. After the first clamp 17 is positioned, the automatic unloading positioning device runs above the clamp 17. The automatic unloading positioning device rotates back and forth to drive the color sensor 6 to perform the second fine positioning on the clamp 17. The color feature points are used to determine the accurate position of the wafer 18. After the position is confirmed, the vacuum is opened, and the automatic unloading positioning device uses the negative pressure buffer chuck 4 to suck the wafer 18.
[0029] After the sucking is completed, the robot runs to the rotary table station, the vacuum is closed, the wafer falls into the work station hole on the rotary table, and the rotary table rotates to pour the wafer into the box. The unloading robot sends the unloading completion signal to the machine table, the machine table rotates, the next clamp to be grabbed is driven to the unloading station, and the robot waits for the grabbing. The above steps are repeated to complete the unloading operation of all wafers.
[0030] The preferred embodiments of the present application are described in detail above. It should be understood that those skilled in the art can make many modifications and changes to the present application without creative labor according to the concept of the present application. Therefore, any technical solution obtained by logical analysis, reasoning or limited experiment on the basis of the prior art according to the concept of the present application shall be within the protection scope defined by the claims.
Claims
1. A double-sided polishing machine automatic unloading positioning device, characterized in that, Include: Connecting main shaft (1); the bottom of connecting main shaft (1) is provided with connecting disc (2); a plurality of suction disc supports (3) are arranged on the connecting disc (2); a plurality of negative pressure buffer suction discs (4) are arranged on the suction disc support (3); The connecting disc (2) is provided with a photoelectric sensor (5) and a color sensor (6); the photoelectric sensor (5) is arranged staggered with the suction disc support (3), and the detection direction is downward; the color sensor (6) is arranged staggered with the suction disc support (3) and the photoelectric sensor (5), and the detection direction is downward.
2. The automatic feeding and positioning device of a double-sided polishing machine according to claim 1, wherein The suction disc support (3) is provided with a sliding slot (8) along the length direction; the negative pressure buffer suction disc (4) is detachably arranged in the sliding slot (8), and a connecting mounting plate (7) is arranged below; the connecting mounting plate (7) is detachably connected with the suction disc support (3) through the bolt arranged in the sliding slot (8), and the connecting mounting plate (7) is symmetrically provided with a mounting groove (9); the negative pressure buffer suction disc (4) is detachably arranged in the mounting groove (9).
3. The automatic feeding and positioning device of a double-sided polishing machine according to claim 2, wherein, The negative pressure buffer suction disc (4) is provided with a threaded section, and is detachably connected with the sliding slot (8) and the mounting groove (9) by cooperating with the nut.
4. The automatic feeding and positioning device of a double-sided polishing machine according to claim 1, wherein, The photoelectric sensor (5) is connected to the connecting disc (2) through a first connecting support (10); the first connecting support (10) is provided with a first through hole (11) and a first arc hole (12) at the first end, and is detachably connected with the connecting disc (2) by cooperating with the bolts arranged in the first through hole (11) and the first arc hole (12) respectively.
5. The automatic feeding and positioning device of a double-sided polishing machine according to claim 4, wherein, The photoelectric sensor (5) is detachably connected with the second end of the first connecting support (10) through a connecting secondary plate (13); the connecting secondary plate (13) is provided with a second through hole (14) and a second arc hole (15), and is detachably connected with the end of the first connecting support (10) by cooperating with the bolts arranged in the second through hole (14) and the second arc hole (15) respectively.
6. The automatic feeding and positioning device of a double-sided polishing machine according to claim 1, wherein The color sensor (6) is connected with the connecting disc (2) through a second connecting support (16).