Photovoltaic cell grid line electroplating device

Abstract

The utility model provides a photovoltaic cell grid line electroplating device, which relates to the technical field of photovoltaic cells and comprises a conductive pressure plate, a rotating component and a flexible conductive component. According to the photovoltaic cell grid line electroplating device provided by the embodiment of the invention, the flexible conductive component is arranged, the conductive pressure plate is connected with the cathode of the power supply to form a current path, the conductive pressure plate presses the battery piece, and the contact area with the battery piece is increased, so that no relative displacement between the conductive pressure plate and the battery piece can be realized, and the uniformity of the electroplating grid line is further improved; and meanwhile, the rotating assembly is arranged, so that the combined body of the battery piece and the conductive pressure plate moves forwards on the rotating assembly, and electroplating processing is realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to photovoltaic cell technical field especially is related to a photovoltaic cell grid line electroplating device. BACKGROUND

[0002] In the development of the existing crystalline silicon photovoltaic cell, the patterning metal electrode process is a relatively core and key process step. Currently, the screen printing silver paste process is commonly used. In the manufacturing process of the PERC, Topcon and HIT cells, the silver paste cost accounts for about 26%, 42% and 46% of the non-silicon manufacturing cost, respectively. It can be seen that further reducing the silver paste cost has become an important link for photovoltaic cell cost reduction. More than 90% of the raw material cost in the silver paste is silver powder. Silver is a noble metal, and its high price is its natural attribute. Therefore, it is obviously not feasible to continuously reduce the metallization of photovoltaic cells by reducing the unit price of silver paste. Therefore, reducing the silver paste consumption and low-cost metal replacement silver paste technology have become the main research direction of metallization cost reduction. The current main technologies include: SWCT (no main grid technology), SMBB (super multi-main grid technology), silver-coated copper powder paste, copper plating, etc. Among them, the electroplating of base metal grid lines fundamentally replaces the use of silver metal and is the most complete solution technology. Although the copper grid line technology is a hot spot for photovoltaic cell cost reduction, the technology is not mature and there is no industrialization case. The development of reliable cell electroplating equipment is a key link.

[0003] For this electroplating process, the conductive roller and conductive brush equipment structures proposed in the industry have the problems of small contact area between the conductive device and the cell piece, relative motion friction, and the like, resulting in low production efficiency of the electroplated grid lines and poor grid line uniformity.

[0004] Therefore, the utility model is proposed. UTILITY MODEL CONTENT

[0005] One of the purposes of the utility model is to provide a photovoltaic cell grid line electroplating device. The photovoltaic cell grid line electroplating device increases the contact area with the cell piece by setting the conductive pressure disc, realizes no relative displacement between the conductive pressure disc and the cell piece, and can improve the uniformity of the electroplated grid lines.

[0006] In order to achieve the above purposes of the utility model, the following technical solutions are adopted:

[0007] The utility model provides a photovoltaic cell grid line electroplating device, which comprises a conductive pressure disc, a rotating assembly and a flexible conductive member.

[0008] The conductive pressure disc is arranged above the rotating assembly, and a battery piece to be processed into a metal grid line is clamped between the rotating assembly and the conductive pressure disc, and the rotating assembly can rotate around its own axis to drive the battery piece and the conductive pressure disc to move.

[0009] One end of the flexible conductive member is electrically connected to the upper surface of the conductive pressure disc, and the other end of the flexible conductive member is used to be connected to the cathode of a power supply.

[0010] Preferably, a conductive contact layer is arranged between the conductive pressure disc and the battery piece, the conductive contact layer is connected to the lower surface of the conductive pressure disc and abuts against the upper surface of the battery piece.

[0011] Preferably, the photovoltaic cell grid line electroplating device further comprises a conductive sliding rail.

[0012] The conductive sliding rail is arranged above the conductive pressure disc, and the end of the flexible conductive member away from the conductive pressure disc is slidingly connected to the conductive sliding rail.

[0013] The conductive sliding rail is used to be electrically connected to the cathode of a power supply.

[0014] Preferably, the conductive sliding rail is arranged as a linear sliding rail, and the material of the conductive sliding rail is a conductive metal.

[0015] Preferably, the vertical projection of the battery piece can cover the vertical projection of the conductive pressure disc.

[0016] Preferably, the material of the conductive pressure disc is a conductive metal or graphite material.

[0017] Preferably, the conductive contact layer comprises at least one of conductive sponge, conductive rubber and conductive carbon fiber felt.

[0018] Preferably, the photovoltaic cell grid line electroplating device further comprises an electroplating tank.

[0019] The electroplating tank is provided with electroplating liquid and an electroplating anode.

[0020] The rotating assembly is arranged in the electroplating tank.

[0021] Preferably, the rotating assembly comprises a plurality of rollers.

[0022] The rollers are uniformly and spacedly arranged along the length direction of the electroplating tank.

[0023] Preferably, the photovoltaic cell grid line electroplating device further comprises a light induction member.

[0024] The light induction member is arranged inside or outside the electroplating tank, and the light emitted by the light induction member is used to irradiate the processing surface of the battery piece immersed in the electroplating liquid.

[0025] The light emitting component emits light with an illuminance of 3000-10000 LX.

[0026] Compared with the prior art, the utility model has the following beneficial effects:

[0027] The photovoltaic cell grid line electroplating device provided by the utility model, by setting the flexible conductive component, connecting the conductive pressure disc with the power supply cathode, forming a current path, by pressing the conductive pressure disc on the cell piece, increasing the contact area with the cell piece, realizing no relative displacement between the conductive pressure disc and the cell piece, and further improving the uniformity of the electroplated grid line, and simultaneously by setting the rotating assembly, making the combination of the cell piece and the conductive pressure disc move forward on the rotating assembly, realizing electroplating processing. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the specific embodiments of the utility model or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0029] Figure 1 The structure diagram of the photovoltaic cell grid line electroplating device provided by the utility model embodiment.

[0030] Icon: 100-conductive pressure disc;200-rotating assembly;210-roller;300-flexible conductive component;400-conductive slide rail;500-electroplating tank;600-electroplating solution;700-cell piece;710-silicon nitride film layer. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the utility model embodiments clearer, the following will combine the drawings in the utility model embodiments to clearly and completely describe the technical scheme in the utility model embodiments, obviously, the described embodiments are some embodiments of the utility model, rather than all the embodiments. The components of the utility model embodiments described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0033] Some embodiments of the present application will be described in detail with reference to the drawings. In the case of no conflict, the following examples and features in the examples can be combined with each other.

[0034] As Figure 1 shown, the photovoltaic cell grid line electroplating device provided by the embodiment includes: a conductive platen 100, a rotating assembly 200, and a flexible conductive member 300; the conductive platen 100 is arranged above the rotating assembly 200, the battery piece 700 to be processed with metal grid lines is arranged between the rotating assembly 200 and the conductive platen 100, the rotating assembly 200 can rotate around its own axis to drive the battery piece 700 and the conductive platen 100 to move; one end of the flexible conductive member 300 is electrically connected with the upper surface of the conductive platen 100, and the other end of the flexible conductive member 300 is used to be connected with the cathode of a power supply.

[0035] The photovoltaic cell grid line electroplating device provided by the embodiment connects the conductive platen 100 with the cathode of the power supply through the flexible conductive member 300 to form a current path, and increases the contact area with the battery piece 700 by pressing the battery piece 700 with the conductive platen 100, so that no relative displacement occurs between the conductive platen 100 and the battery piece 700, and the uniformity of electroplating grid lines is improved, and the combination of the battery piece 700 and the conductive platen 100 moves forward on the rotating assembly 200 through the rotating assembly 200, so that electroplating processing is realized.

[0036] As to the shape and structure of the conductive platen 100, in detail:

[0037] The conductive platen 100 is arranged above the rotating assembly 200, and the battery piece 700 to be processed with metal grid lines is arranged between the rotating assembly 200 and the conductive platen 100.

[0038] In an optional embodiment, the material of the conductive platen 100 is conductive metal or graphite material.

[0039] Specifically, the platen in the embodiment is a platen type metal electrode, the main body of which is made of conductive metal such as copper, aluminum, steel, etc., or graphite, so that longer service life and corrosion resistance can be obtained. The platen in the embodiment does not contact the electroplating solution 600 at all during plating, and can be used in a dry-in and dry-out cycle during the process without cleaning and maintenance.

[0040] In an optional embodiment, the vertical projection of the battery piece 700 can cover the vertical projection of the conductive platen 100.

[0041] Further preferably, the shape of the conductive platen 100 is consistent with that of the battery piece 700.

[0042] Further preferably, the area of the conductive pressure disc 100 is smaller than the area of the battery piece 700 to be processed.

[0043] Specifically, the lower surface of the pressure disc is a plane, which corresponds to the battery piece 700 to be processed and has an area slightly smaller than that of the battery piece 700 to be processed. The size of the battery piece 700 can be a single-crystal silicon piece of a mainstream specification in the industry, such as M10, 18X, G12, G12R, etc. For example, if the battery piece 700 is square, the pressure disc is also square, and the side length is less than 10 mm of the battery piece 700 to avoid the plating solution 600 contacting the edge of the pressure disc and causing short circuit. Moreover, during plating, the pressure disc is fully conductive to the non-plated surface of the battery, so that the current is uniformly distributed on the whole surface of the battery and is not affected by the resistivity of the intermediate battery piece 700 to be processed. Therefore, the present embodiment is applicable to the plating of a high-resistance TOPCon semi-finished battery piece 700 and the plating of a low-resistance HJT semi-finished battery piece 700 after deposition of a copper seed layer.

[0044] It should be noted that the pressure disc is not only fully conductive to the non-plated surface of the battery, but also forms a current loop in the order of “power supply anode-electroplating tank 500 anode-electroplating solution 600-battery piece 700-pressure disc-flexible conductive member 300-conductive sliding rail 400-power supply cathode” during electroplating processing. Therefore, the current can flow between the pressure disc, the plated surface and the non-plated surface of the battery piece.

[0045] In an optional embodiment, a conductive contact layer is arranged between the conductive pressure disc 100 and the battery piece 700, which is connected to the lower surface of the conductive pressure disc 100 and abuts against the upper surface of the battery piece 700.

[0046] Specifically, a flexible conductive contact layer is attached to the lower surface of the pressure disc. The conductive contact layer is made of a conductive flexible material, which can be selected from, for example, conductive sponge, conductive rubber, and conductive carbon fiber felt, to improve the conductive contact effect between the pressure disc and the battery piece 700. The flexible and large-area conductive structure of the conductive contact layer is firm and reliable, and is not easy to scratch and damage the fragile battery piece 700.

[0047] Regarding the shape and structure of the flexible conductive member 300, in detail:

[0048] One end of the flexible conductive member 300 is electrically connected to the upper surface of the conductive pressure disc 100, and the other end of the flexible conductive member 300 is used to connect to the power supply cathode.

[0049] Specifically, the upper surface of the conductive pressure disc 100 is connected to a plurality of flexible and elastic conductive members. The flexible conductive member 300 is made of an elongated elastic metal material, such as a wire, which is used to connect the cathode power supply. A single pressure disc can be provided with multiple flexible conductive members 300, such as 2 to 5, to enhance the stability of the conduction.

[0050] In detail, the shape and structure of the conductive slide rail 400 are as follows:

[0051] The conductive slide rail 400 is arranged above the conductive pressure disc 100, and the flexible conductive member 300 is slidably connected to the conductive slide rail 400 at an end away from the conductive pressure disc 100; the conductive slide rail 400 is used to be electrically connected to the cathode of the power supply.

[0052] In detail, one end of the flexible conductive member 300 is electrically connected to the upper surface of the conductive pressure disc 100, and the other end is slidably connected to the conductive slide rail 400; the flexible conductive member 300 can slide on the conductive slide rail 400, and the conductive slide rail 400 is in contact with the flexible conductive member 300 to form an electric circuit.

[0053] In an optional embodiment, the conductive slide rail 400 includes a slide rail and a sliding part; the slide rail is electrically connected to the cathode of the power supply; the sliding part can slide on the slide rail and simultaneously contact a conductor (such as a copper conductor) on the slide rail to form an electrical connection; the flexible conductive member 300 is connected to the sliding part at an end away from the conductive pressure disc 100; an electric circuit is formed among the slide rail, the sliding part, and the flexible conductive member 300.

[0054] In an optional embodiment, the sliding part can be arranged as a conductive slide block.

[0055] In an optional embodiment, the conductive slide rail 400 can be arranged as a slide wire.

[0056] In an optional embodiment, the conductive slide rail 400 is arranged as a linear slide rail, and the material of the conductive slide rail 400 is a conductive metal.

[0057] In detail, the material of the conductive slide rail 400 is a conductive metal, such as copper, aluminum, steel, nickel, etc.; the conductive slide rail 400 is preferably a linear slide rail; the conductive slide rail 400 is suspended above the electroplating tank 500 and extends along the length direction of the electroplating tank 500; for example, if the device is arranged as 5 tracks (i.e., 5 rows of battery pieces 700 move at the same time), and the flexible conductive member 300 above each pressure disc is 3, then a total of 15 conductive rails are needed.

[0058] In detail, the shape and structure of the electroplating tank 500 are as follows:

[0059] The electroplating tank 500 is provided with an electroplating solution 600 and an electroplating anode.

[0060] Specifically, the embodiment adopts the chain type wet processing main machine structure of the water floating mode of the roller 210. The electroplating tank 500 is internally provided with the electroplating solution 600. The electroplating solution 600 can be selected from commercially available products. The nickel plating solution, the copper plating solution, the tin plating solution, the silver plating solution, etc. can be selected according to the product structure design. The anode in the tank can be selected from commercially available products. The titanium mesh for electroplating or the soluble anode corresponding to the electroplating solution 600 can be selected. The structure of the anode is subject to the non-blocking induced light source. For example, the large aperture titanium mesh is selected to achieve the light transmission purpose. The slender soluble anode is arranged in the interval of the induced light source.

[0061] Regarding the shape and structure of the rotating assembly 200, in detail:

[0062] The rotating assembly 200 is arranged in the electroplating tank 500. The rotating assembly 200 can rotate around the axis itself to drive the battery piece 700 and the conductive pressure plate 100 to move.

[0063] Specifically, the embodiment adopts the chain type wet processing main machine structure of the water floating mode of the roller 210. The rotating assembly 200 in the embodiment is consistent with the structure of the roller 210 in the main machine structure. Since the rotating assembly 200 of this part is the prior art, the rotating function can be realized. Therefore, the structure and working principle are not described in detail.

[0064] In an optional embodiment, the rotating assembly 200 includes a plurality of rollers 210. The rollers 210 are uniformly and spacedly arranged along the length direction of the electroplating tank 500.

[0065] Specifically, the uniformly and spacedly arranged rollers 210 can further improve the uniformity of the electroplated battery grid lines.

[0066] In an optional embodiment, the photovoltaic battery grid electroplating device further includes a light induction member. The light induction member is arranged inside or outside the electroplating tank 500. The light emitted by the light induction member is used to irradiate the processing surface of the battery piece 700 immersed in the electroplating solution 600.

[0067] Specifically, the light induction member is a light induction light source. The light source can be arranged inside the electroplating tank 500. The electroplating solution 600 immerses the light source. Alternatively, as an alternative embodiment, the bottom plate of the electroplating tank 500 is made of transparent material. The light source is arranged below the bottom plate. The light source irradiates the battery piece 700 through the bottom plate and the electroplating solution 600. The light irradiated by the light induction member to the processing surface of the battery piece 700 should reach 3000-10000LX illumination. The light source controller can be used for adjustment to cope with the influence of the electroplating solution 600 of different formulations on the illumination. The light source can be selected from the LED light source for illumination. The spectrum is in the visible light range. The white light or other monochromatic light can be selected.

[0068] In an alternative embodiment, during the reprocessing, the process sets a constant voltage, for example, 0.5-5V, and the current is proportional to the battery piece 700 in the tank during processing, for example, the processing current of each battery piece 700 is 0.5 ampere, and there are 30 battery pieces in the machine during processing, then the current detected by the power supply should be 15 amperes.

[0069] In an alternative embodiment, during the processing, when the processing surface of the battery piece 700 is the N surface, the light-induced light source must be turned on to activate the carrier of the battery piece 700 due to the reverse bias of the battery piece 700 junction. When the processing surface of the battery piece 700 is the P surface, the light-induced light source can be turned off due to the forward bias of the battery piece 700 junction, saving power and reducing light pollution.

[0070] In an alternative embodiment, after the grid line is plated using the device provided in this embodiment, a water washing and drying section can be provided to realize automatic continuous processing. The water washing and drying section is a prior art, and the plating solution 600 can be cleaned and dried, and the structure and working principle are not described in detail.

[0071] The photovoltaic cell grid line plating device provided in this embodiment is used in the processing of the battery piece 700. Each battery piece 700 to be processed is placed on the roller 210 to move, and the lower surface is in contact with the plating solution 600 as a whole, and is irradiated by the light source at the same time. At the same time, the upper surface of each battery piece 700 to be processed is pressed by a pressure plate, and the battery carries the pressure plate to run on the roller 210. At the same time, the flexible conductive member 300 on the pressure plate is in sliding connection with the conductive slide rail 400, and the flexible conductive member 300 can slide along the length direction of the conductive slide rail 400 to form a current path. During plating processing, the current forms a current loop according to the path of "power anode-plating tank 500 inside anode-plating solution 600-battery piece 700-pressure plate-flexible conductive member 300-conductive slide rail 400-power cathode".

[0072] The photovoltaic cell grid line plating device provided in this embodiment is used in the processing of the battery piece 700. Each battery piece 700 to be processed is placed on the roller 210 to move, and the lower surface is in contact with the plating solution 600 as a whole, and is irradiated by the light source at the same time. At the same time, the upper surface of each battery piece 700 to be processed is pressed by a pressure plate, and the battery carries the pressure plate to run on the roller 210. At the same time, the flexible conductive member 300 on the pressure plate is in sliding connection with the conductive slide rail 400, and the flexible conductive member 300 can slide along the length direction of the conductive slide rail 400 to form a current path. During plating processing, the current forms a current loop according to the path of "power anode-plating tank 500 inside anode-plating solution 600-battery piece 700-pressure plate-flexible conductive member 300-conductive slide rail 400-power cathode".

[0073] The photovoltaic cell grid line electroplating device provided by the embodiment has a large contact area with the cell and no displacement, thereby improving the uniformity of the electroplated grid line; a conductive contact layer is connected to the lower surface of the conductive platen 100, and the flexible large-area conductive structure is firm and reliable and is not easy to scratch and damage the fragile cell sheet 700; the embodiment provides a conductive slide rail 400, and the worn slide rail can be maintained and replaced at any time during long-term production, thereby facilitating later maintenance. The photovoltaic cell grid line electroplating device provided by the embodiment can greatly protect the cell sheet and provide stable contact resistance, thereby improving the uniformity of the electroplated grid line. Meanwhile, the photovoltaic cell grid line electroplating device provided by the embodiment can be efficiently processed, thereby improving the productivity of the cell sheet 700.

[0074] The embodiment provides a photovoltaic cell grid line electroplating method using the photovoltaic cell grid line electroplating device, and the method comprises the following steps.

[0075] The electroplating solution 600 is added to the electroplating tank 500, the cell sheet 700 to be processed is placed on the rotating assembly 200, and the conductive platen 100 is pressed on the cell sheet 700, so that the cell sheet 700 is electroplated with a grid line, thereby obtaining a photovoltaic cell with an electroplated grid line.

[0076] The following specifically lists an embodiment of the photovoltaic cell grid line electroplating method using the photovoltaic cell grid line electroplating device.

[0077] Embodiment 1

[0078] The embodiment provides a photovoltaic cell grid line electroplating method using the photovoltaic cell grid line electroplating device, and the method comprises the following steps.

[0079] S1, workpiece preparation: select a standard G12 size, process the blue film sheet semi-finished product to be processed with a metal grid line and having completed double-sided silicon nitride film layer 710 grid line patterning and slotting, the P surface has been slotted to expose the silicon base material, and the N surface has been slotted to expose the phosphorus-doped POLY layer;

[0080] S2, add the nickel sulfamate electroplating solution to the electroplating tank and to the processing liquid level height, the temperature is 25-50°C, turn on the induction light source, adjust the light source illuminance, and make the illuminance above the electroplating solution reach 5000LX;

[0081] S3, set the process time to 30 seconds and the voltage to 2.3 volts (the voltage setting is related to the resistance of the wire, platen, slide rail and other components and the electroplating solution 600 formula, and needs to be measured and adjusted);

[0082] S4, load the cell sheet to be processed between the rotating assembly and the platen, the cell sheet faces downward and is placed on the rotating assembly, and then the conductive platen is pressed on the cell sheet, the N surface is started to be plated with nickel, and the actual nickel plating thickness is about 0.5-1um;

[0083] S5, the battery piece of the previous step is turned over, i.e. P face downward, and is loaded again to start plating nickel on P face. The induced light source can be turned off, the voltage is set to 3 volts, and the process time is 30 seconds (since there is no light-induced effect on plating P face, the voltage is set slightly higher than that for plating N face, the actual voltage setting is related to the resistance of the wire, pressure plate, guide rail and other components and the electroplating solution formula, and needs to be adjusted according to actual measurement), and the actual plating thickness of nickel is about 0.5-1 um;

[0084] S6, after the plating nickel process is completed, copper sulfate electroplating solution is added to the processing liquid level in another device described in the embodiment, the temperature is 25-50°C, the induced light source is turned on, the light intensity is adjusted so that the light intensity above the solution reaches 5000LX;

[0085] S7, the battery piece of the previous step is turned over, i.e. N face downward, and is loaded into the device to start plating copper on N face, the process time is set to 300 seconds, and the voltage is 1.5 volts (the voltage setting is related to the resistance of the wire, pressure plate, guide rail and other components and the electroplating solution formula, and needs to be adjusted according to actual measurement), and the actual plating thickness of copper is about 8-10 um;

[0086] S8, the battery piece of the previous step is turned over, i.e. P face downward, and is loaded into the device again to start plating copper on P face. The induced light source can be turned off, the voltage is set to 2.2 volts, and the process time is 300 seconds (since there is no light-induced effect on plating P face, the voltage is set slightly higher than that for plating N face, the actual voltage setting is related to the resistance of the wire, pressure plate, guide rail and other components and the electroplating solution formula, and needs to be adjusted according to actual measurement), and the actual plating thickness of copper is about 8-10 um;

[0087] S9, after the plating copper process is completed, methyl sulfonic acid tin electroplating solution is added to the processing liquid level in another device described in the embodiment, the temperature is 10-20°C, the induced light source is turned on, the light intensity is adjusted so that the light intensity above the solution reaches 5000LX;

[0088] S10, the battery piece of the previous step is turned over, i.e. N face downward, and is loaded into the device to start plating tin on N face, the process time is set to 20 seconds, and the voltage is 1 volt (the voltage setting is related to the resistance of the wire, pressure plate, guide rail and other components and the electroplating solution formula, and needs to be adjusted according to actual measurement), and the actual plating thickness of tin is about 0.5 um.

[0089] S11, the battery piece of the previous step is turned over, i.e. P face downward, and is loaded into the device to start plating tin on P face. The induced light source can be turned off, the voltage is set to 1.5 volts, and the process time is 20 seconds (since there is no light-induced effect on plating P face, the voltage is set slightly higher than that for plating N face, the actual voltage setting is related to the resistance of the wire, pressure plate, guide rail and other components and the electroplating solution formula, and needs to be adjusted according to actual measurement), and the actual plating thickness of copper is about 0.5 um.

[0090] S12, after the above steps are completed, the TOPCon cell sheet with double-sided plated grid lines is prepared, and normal performance test grading can be performed.

[0091] The photovoltaic cell prepared by the photovoltaic cell grid line plating method has more uniform grid lines and higher cell yield.

[0092] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A photovoltaic cell grid line electroplating apparatus, characterized by, The utility model relates to a kind of metal grid line processing device, including: Conductive pressure disc (100), rotating assembly (200) and flexible conductive member (300); The conductive pressure disc (100) is arranged above the rotating assembly (200), the rotating assembly (200) and the conductive pressure disc (100) between the battery piece (700) to be metal grid line processing are clamped, the rotating assembly (200) can rotate around its axis, to drive the battery piece (700) and the conductive pressure disc (100) move; One end of the flexible conductive member (300) is electrically connected with the upper surface of the conductive pressure disc (100), and the other end of the flexible conductive member (300) is used to be connected with the cathode of power supply.

2. The photovoltaic cell grid line electroplating apparatus of claim 1, wherein, The conductive pressure disc (100) is provided with a conductive contact layer between the battery piece (700), the conductive contact layer is connected with the lower surface of the conductive pressure disc (100), and the upper surface of the battery piece (700) is abutted.

3. The photovoltaic cell grid line electroplating apparatus of claim 1, wherein, It also includes a conductive slide rail (400); The conductive slide rail (400) is arranged above the conductive pressure disc (100), and the end of the flexible conductive member (300) away from the conductive pressure disc (100) is slidably connected with the conductive slide rail (400); The conductive slide rail (400) is used to be electrically connected with the cathode of power supply.

4. The photovoltaic cell grid line electroplating apparatus of claim 3, wherein, The conductive slide rail (400) is arranged as a linear slide rail, and the material of the conductive slide rail (400) is conductive metal.

5. The photovoltaic cell grid line electroplating apparatus of claim 1, wherein, The vertical projection of the battery piece (700) can cover the vertical projection of the conductive pressure disc (100); The material of the conductive pressure disc (100) is conductive metal or graphite material.

6. The photovoltaic cell grid line electroplating apparatus of claim 2, wherein, The conductive contact layer includes at least one of conductive sponge, conductive rubber and conductive carbon fiber felt.

7. The photovoltaic cell grid line electroplating apparatus of claim 6, wherein, It also includes an electroplating tank (500); The electroplating tank (500) is provided with electroplating liquid (600) and electroplating anode in it; The rotating assembly (200) is arranged in the electroplating tank (500).

8. The photovoltaic cell grid line electroplating apparatus of claim 7, wherein, The rotating assembly (200) includes a plurality of rollers (210); The rollers (210) are uniformly spaced along the length direction of the electroplating tank (500).

9. The photovoltaic cell grid line electroplating apparatus of claim 7, wherein, It also includes a light induction member; The light induction member is arranged inside or outside the electroplating tank (500), and the light emitted by the light induction member is used to irradiate the processing surface of the battery piece (700) immersed in the electroplating liquid (600).

10. The photovoltaic cell grid line electroplating apparatus of claim 9, wherein, The illuminance of the light emitted by the light induction member is 3000-10000LX.

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