Light and thin magnetic suction type integrated turbine heat dissipation semiconductor refrigeration device

Abstract

The utility model provides a lighter and thinner magnetic suction type integrated turbine heat dissipation semiconductor refrigeration device which comprises a shell, an air inlet is formed in the top of the shell, an air outlet is formed in one side of the shell, cooling fins are fixedly installed in the shell, a worm wheel fan is fixedly installed on one side of the interior of the shell, and the worm wheel fan is fixedly installed on the other side of the interior of the shell. A battery is fixedly installed in the shell, and the circuit board is arranged in the shell. According to the lighter and thinner magnetic suction type integrated turbine heat dissipation semiconductor refrigeration device, the refrigeration piece is matched with the cold conduction piece to dissipate heat of mobile equipment, meanwhile, the worm wheel fan is matched with the air inlet, the air outlet and the heat dissipation piece to dissipate heat of the refrigeration piece, and therefore an axial flow fan of a heat dissipation device in the market is replaced with the worm wheel fan, and the heat dissipation efficiency is improved. And the shell of the turbofan and the device shell are integrally designed to carry out better work, and meanwhile, the device becomes light and thin, so that a user can use the device better and conveniently.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor refrigeration, especially lighter and thinner magnetic attraction type integrated turbine heat dissipation semiconductor refrigeration device. BACKGROUND

[0002] Semiconductor refrigeration piece, also called thermoelectric refrigeration piece, is a kind of heat pump, its advantage is no sliding part, application in some space limited, reliability requirement high, no refrigerant pollution's occasion, utilize the Peltier effect of semiconductor material, when direct current passes through the electric couple of series connection of two different semiconductor materials, can respectively absorb heat and release heat in the two ends of electric couple, can realize the purpose of refrigeration, it is a kind of negative heat resistance refrigeration technology, its characteristics are no moving parts, and reliability is also higher.

[0003] At present, the heat dissipation of mobile devices on the market, such as mobile phones, tablet computers and the like, is a big pain point, especially when using for a long time or running a large APP, it will heat seriously, which affects the performance of mobile devices, and even causes safety hazards, and the common heat dissipation device on the market is large in size, large in volume and thick in thickness, thereby causing many inconveniences to users when using.

[0004] Therefore, it is necessary to provide lighter and thinner magnetic attraction type integrated turbine heat dissipation semiconductor refrigeration device to solve the above technical problems. UTILITY MODEL CONTENTS

[0005] The utility model provides lighter and thinner magnetic attraction type integrated turbine heat dissipation semiconductor refrigeration device, solves the problem that the common heat dissipation device on the market is large in size, large in volume and thick in thickness, causing many inconveniences to users when using.

[0006] To solve the above technical problems, the lighter and thinner magnetic attraction type integrated turbine heat dissipation semiconductor refrigeration device provided by the utility model comprises:

[0007] The shell is provided with an air inlet at the top, an air outlet is formed in the inside of one side of the shell, heat dissipation fins are fixedly installed in the inside of the shell, a worm gear fan is fixedly installed on one side of the inside of the shell, and a battery is fixedly installed in the inside of the shell.

[0008] The circuit board is arranged in the inside of the shell, a power supply port is fixedly installed on one side of the circuit board, a display screen is fixedly installed on one side of the circuit board, a touch spring key is arranged on one side of the circuit board, and a temperature sensor is fixedly installed on one side of the circuit board.

[0009] The refrigeration piece is arranged in the inside of the shell, and a cold guide piece is arranged on one side of the refrigeration piece.

[0010] Preferably, the inside of the shell is fixedly installed with a protective sheet, one side of the protective sheet is fixedly installed with a magnetic sheet, and one side of the magnetic sheet is fixedly installed with a magnetic isolation sheet.

[0011] Preferably, the protective sheet is composed of a non-metallic material, such as plastic, aragonite, etc., and is arranged on one side of the magnetic sheet for protecting the magnetic sheet.

[0012] Preferably, the inside of the shell is provided with two sliding grooves, and the inside of each of the two sliding grooves is slidably connected with a sliding block.

[0013] Preferably, the inside of each of the two sliding blocks is provided with an installation groove, and the inside of each of the two installation grooves is fixedly connected with a magnetic stone.

[0014] Preferably, one side of the sliding block is fixedly connected with a mounting bracket, and the inside of the mounting bracket is fixedly connected with a filter.

[0015] Preferably, one side of each of the two sliding blocks is fixedly connected to the two ends of the mounting bracket.

[0016] Compared with the related art, the semiconductor refrigeration device with a lighter and thinner magnetic suction type integrated turbine heat dissipation has the following beneficial effects:

[0017] The semiconductor refrigeration device with a lighter and thinner magnetic suction type integrated turbine heat dissipation provided by the utility model can replace the axial flow fan of the heat dissipation device on the market with a worm gear fan, and make the shell of the turbine fan and the device shell into an integrated design to work better while making the device lighter and thinner, facilitating better use of the device by the user. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 FIG. 1 is a structural schematic view of a first embodiment of the semiconductor refrigeration device with a lighter and thinner magnetic suction type integrated turbine heat dissipation provided by the utility model;

[0019] Figure 2 FIG. 2 is a rear view of the shell shown in FIG. 1; Figure 1

[0020] FIG. 3 is a structural schematic view of the inside of the shell shown in FIG. 1; Figure 3 Figure 1 FIG. 4 is a structural schematic view of the inside elements of the shell shown in FIG. 1;

[0021] Figure 4 Figure 1 FIG. 5 is a structural schematic view of the inside elements of the shell shown in FIG. 1;

[0022] Figure 5 ​​A schematic diagram of the structure of a second embodiment of the thinner and lighter magnetic integrated turbine cooling semiconductor refrigeration device provided by this utility model;

[0023] Figure 6 for Figure 5 The diagram shows the structure of the filter element.

[0024] Figure 7 for Figure 5 The enlarged schematic diagram of part A is shown.

[0025] The following are the labels in the diagram: 1. Housing, 2. Air inlet, 3. Air outlet, 4. Heat sink, 5. Battery, 6. Circuit board, 7. Power supply port, 8. Display screen, 9. Touch spring button, 10. Temperature sensor, 11. Worm gear fan, 12. Cooling plate, 13. Cooling plate, 14. Magnetic shield, 15. Magnetic plate, 16. Protective plate, 17. Sliding groove, 18. Sliding block, 19. Mounting groove, 20. Magnet, 21. Mounting bracket, 22. Filter. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0027] First Embodiment

[0028] Please refer to the following: Figure 1 , Figure 2 , Figure 3 and Figure 4 ,in, Figure 1 A schematic diagram of the structure of the first embodiment of the thinner and lighter magnetic integrated turbine heat dissipation semiconductor refrigeration device provided by this utility model.

[0029] Figure 2 for Figure 1 The diagram shows a rear view of the housing. Figure 3 for Figure 1 The diagram shows the internal structure of the shell. Figure 4 for Figure 1 The diagram shows the internal components of the housing. A thinner, more lightweight, magnetically-assisted, integrated turbine-type semiconductor cooling device includes:

[0030] The housing 1 has an air inlet 2 on its top and an air outlet 3 on the inside of one side of the housing 1. A heat sink 4 is fixedly installed inside the housing 1. A worm gear fan 11 is fixedly installed on one side of the inside of the housing 1. A battery 5 is fixedly installed inside the housing 1.

[0031] A circuit board 6 is arranged inside the shell 1, one side of the circuit board 6 is fixedly installed with a power supply port 7, one side of the circuit board 6 is fixedly installed with a display screen 8, one side of the circuit board 6 is provided with a touch spring button 9, one side of the circuit board 6 is fixedly installed with a temperature sensor 10.

[0032] A refrigeration sheet 12 is arranged inside the shell 1, one side of the refrigeration sheet 12 is provided with a cold guide sheet 13.

[0033] The circuit board 6 is used for overall electrical control.

[0034] The temperature sensor 10 is used for detecting temperature.

[0035] The display screen 8 is used for displaying power and temperature value.

[0036] The touch spring button 9 is used for user control interaction.

[0037] The power supply port 7 is a USB power supply port, used for connecting external power input,

[0038] The battery 5 is used for powering the device in a non-direct power supply state.

[0039] The worm gear fan 11 includes a rotor blade and a driving stator, the rotating blade is used to rotate the central rotor blade under the driving of the stator, the driving stator generates a magnetic field using electric energy to drive the rotor blade to rotate, and the worm gear fan 11 is electrically connected with the circuit board 6.

[0040] The refrigeration sheet 12 is electrically connected with the circuit board 6, and is used as an active heat exchanger of the refrigeration device.

[0041] The cold guide sheet 13 is tightly connected with one side of the refrigeration sheet 12, and is used as a medium for heat exchange with the mobile device.

[0042] The heat isolation sheet is arranged between the heat dissipation sheet 4 and the refrigeration sheet 12, and is used for isolating the cold surface from the hot surface.

[0043] The heat dissipation sheet 4 is processed from a metal with multiple fins, forms an air duct, and is tightly connected with the other side of the refrigeration sheet 12, one side of the air duct faces the air outlet, and the other side faces the worm gear fan 11.

[0044] The shell 1 is fixedly installed with a protection sheet 16, one side of the protection sheet 16 is fixedly installed with a magnetic sheet 15, and one side of the magnetic sheet 15 is fixedly installed with a magnetic isolation sheet 14.

[0045] The magnetic sheet 15 is used for fixing the device on the target mobile device, one side of the magnetic sheet 15 is tightly connected with the magnetic isolation sheet 14, and the other side is tightly connected with the protection sheet 16, the magnetic attraction mode is tightly connected with the target mobile device, the heat conduction effect is better, the fixing is simpler, and the device is convenient to take.

[0046] The magnetic isolation sheet 14 is made of metal material and has the function of magnetic isolation and is used for the function of fixing the magnetic sheet 15.

[0047] The protective sheet 16 is made of non-metal material, such as plastic, argyre, etc., and is arranged on one side of the magnetic sheet 15 and is used for the function of protecting the magnetic sheet 15.

[0048] The working principle of the lighter and thinner magnetic suction type integrated turbine heat dissipation semiconductor refrigeration device is as follows:

[0049] In use, the mobile device is cooled by the refrigeration sheet 12 and the cooling guide sheet 13.

[0050] At the same time, the air outside the shell 1 enters the inside of the shell 1 through the air inlet 2, passes through the cooling fins 4, and is discharged through the air outlet 3, thereby cooling the inside of the shell 1.

[0051] Compared with the related art, the lighter and thinner magnetic suction type integrated turbine heat dissipation semiconductor refrigeration device has the following beneficial effects:

[0052] The lighter and thinner magnetic suction type integrated turbine heat dissipation semiconductor refrigeration device provided by the utility model has the refrigeration sheet 12 cooperating with the cooling guide sheet 13 to cool the mobile device, the worm gear fan 11 cooperating with the air inlet 2, the air outlet 3 and the cooling fins 4 to cool the refrigeration sheet 12, the axial flow fan of the heat dissipation device on the market is replaced by the worm gear fan 11, the shell of the turbine fan 1 is integrated with the device shell 1 to work better, the device is made lighter and thinner, and the user can use it better.

[0053] Second embodiment

[0054] Please refer to Figure 5 , Figure 6 and Figure 7 , based on the lighter and thinner magnetic suction type integrated turbine heat dissipation semiconductor refrigeration device provided by the first embodiment of the application, the second embodiment of the application provides another lighter and thinner magnetic suction type integrated turbine heat dissipation semiconductor refrigeration device. The second embodiment is only a preferred mode of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0055] Specifically, the lighter and thinner magnetic suction type integrated turbine heat dissipation semiconductor refrigeration device provided by the second embodiment of the application is different in that the lighter and thinner magnetic suction type integrated turbine heat dissipation semiconductor refrigeration device is provided with two sliding grooves 17 in the inside of the shell 1, and a sliding block 18 is slidably connected in the inside of each of the two sliding grooves 17.

[0056] The inner part of each of the two sliding blocks 18 is provided with a mounting groove 19, and the inner part of each of the two mounting grooves 19 is fixedly connected with a magnet 20.

[0057] One side of the sliding block 18 is fixedly connected with a mounting rack 21, and the inner part of the mounting rack 21 is fixedly connected with a filter 22.

[0058] One side of each of the two sliding blocks 18 is fixedly connected to the two ends of the mounting rack 21.

[0059] One end of each of the two sliding grooves 17 is an opening, which is used for inserting the two sliding blocks 18 into the inner part of the two sliding grooves 17.

[0060] The filter 22 can be a dustproof net, a filter screen or the like, which is used for filtering the air entering into the inner part of the shell 1, so as to prevent dust, lint, foreign matters and the like from entering into the inner part of the shell 1.

[0061] The inner part of each of the two sliding blocks 18 is provided with a mounting groove 19, and the inner part of each of the two mounting grooves 19 is fixedly connected with a magnet 20, which is used for limiting the filter 22 after the two magnets 20 in the inner part of the two sliding blocks 18 and the two magnets 20 in the inner part of the shell 1 are adsorbed to each other.

[0062] The working principle of the lighter and thinner magnetic type integrated turbine heat dissipation semiconductor refrigeration device is as follows:

[0063] In use, the filter 22 is used for filtering the air entering into the inner part of the shell 1.

[0064] When the filter 22 is disassembled, replaced or cleaned, the filter 22 is pulled to one side to drive the two sliding blocks 18 to move and separate to one side in the inner part of the two sliding grooves 17, and then the filter 22 can be disassembled.

[0065] When the filter 22 is installed, the two sliding blocks 18 at the two ends of the filter 22 are inserted into the inner part of the two sliding grooves 17, and then moved to a proper position to one side, and then the two magnets 20 in the inner part of the two sliding blocks 18 and the two magnets 20 in the inner part of the shell 1 are adsorbed to each other to limit the filter 22.

[0066] Compared with the related art, the lighter and thinner magnetic type integrated turbine heat dissipation semiconductor refrigeration device has the following beneficial effects:

[0067] The utility model provides lighter and thinner magnetic attraction type integrated turbine radiating semiconductor refrigeration plant, through filter piece 22 to the air that enters the inside of casing 1 carries out the filtration to prevent dust, lint or other foreign matter from entering the inside of casing 1, influence the work of internal electronic component.

[0068] The above is only the embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent process transformation using the contents of the utility model specification and drawings, or direct or indirect application in other related technical fields, are all included in the patent protection range of the utility model.

Claims

1. A magnetic type integrated semiconductor refrigeration device with lighter and thinner turbine heat dissipation, characterized in that, Include: The shell, the top of the shell is provided with air inlet, the inside of a side of the shell is provided with air outlet, the inside of the shell is fixedly installed with fin, the inside of the shell is fixedly installed with worm gear fan, the inside of the shell is fixedly installed with battery; The circuit board is arranged in the inside of the shell, the one side of the circuit board is fixedly installed with power supply port, the one side of the circuit board is fixedly installed with display screen, the one side of the circuit board is provided with touch spring button, the one side of the circuit board is fixedly installed with temperature sensor; The cooling fin is arranged in the inside of the shell, the one side of the cooling fin is provided with cold lead.

2. The lighter and thinner magnetic type integrated semiconductor refrigeration device with a turbine heat sink according to claim 1, characterized in that, The inside of the shell is fixedly installed with protection sheet, the one side of the protection sheet is fixedly installed with magnetic sheet, the one side of the magnetic sheet is fixedly installed with magnetic separation sheet.

3. The lighter and thinner magnetic type integrated semiconductor refrigeration device with a turbine heat sink according to claim 2, characterized in that, The protection sheet is composed of non-metallic material, such as plastic, agil, etc., is arranged on one side of the magnetic sheet, and is used for protecting the magnetic sheet.

4. The lighter and thinner magnetic type integrated semiconductor refrigeration device with a turbine heat sink according to claim 2, characterized in that, The inside of the shell is provided with two sliding grooves, and the inside of the two sliding grooves is slidably connected with sliding block.

5. The lighter and thinner magnetic type integrated turbine-cooled semiconductor refrigeration device of claim 4, wherein The inside of the two sliding blocks is provided with mounting groove, and the inside of the two mounting grooves is fixedly connected with magnet.

6. The lighter and thinner magnetic type integrated turbine-cooled semiconductor refrigeration device of claim 5, wherein The one side of the sliding block is fixedly connected with mounting frame, and the inside of the mounting frame is fixedly connected with filter.

7. The lighter and thinner magnetic type integrated turbine-cooled semiconductor refrigeration device of claim 6, wherein The one side of the two sliding blocks is respectively fixedly connected to the two ends of the mounting frame.

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