Rapid cooling equipment for processing freeze-dried powder injection
By combining a cooling assembly with semiconductor cooling chips and heat sink fins, along with an atomizing nozzle and a circulating water system, the problem of slow cooling speed of freeze-dried powder injections has been solved, achieving rapid cooling and improved stability.
Patent Information
- Application Number
- CN202520022165.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-06
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2035-01-06
AI Technical Summary
Existing rapid cooling equipment for lyophilized powder injections uses water cooling and air cooling methods, which cause the coolant temperature to rise and the cooling rate to be slow. This results in the lyophilized powder injections remaining in a high-temperature environment for too long, affecting their stability.
The cooling assembly, which combines semiconductor cooling chips and heat dissipation fins with atomizing nozzles and a circulating water system, achieves rapid cooling and recycling of the coolant.
This technology enables lyophilized powder injections to reach the required low-temperature environment in a short time, reduces the time spent at high temperatures, and improves the stability and cooling efficiency of lyophilized powder injections.
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Figure CN223691402U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to freeze-dried powder injection processing technical field, especially related to a kind of quick cooling equipment of processing freeze-dried powder injection. BACKGROUND
[0002] Freeze-dried powder injection (freeze-dried injection) is a kind of preparation that is converted from drug solution into solid powder by freeze-drying technology, and is widely used in biopharmaceutical, chemical pharmaceutical and other fields. In the preparation process of freeze-dried powder injection, rapid cooling is one of the key steps to ensure the stability and quality of active ingredients of drugs.
[0003] After searching, the prior art, Chinese patent application number: CN201920514370.5, discloses a kind of quick cooling equipment of processing freeze-dried powder injection, the upper part of the fixed frame is equipped with transmission assembly, the upper part of the fixed frame is equipped with cooling assembly at transmission assembly position, the transmission assembly includes transmission frame installed on the top of fixed frame, the inside of transmission frame is symmetrically connected with transmission sprocket, the transmission chain is connected between the outside of two transmission sprockets, the outside of transmission chain is installed with a week equidistantly The transmission motor is installed at the bottom end of transmission frame, and the output shaft of transmission motor is connected with the input end of one of transmission sprocket. The quick cooling equipment of processing freeze-dried powder injection disclosed in the utility model can realize continuous cooling treatment of the whole device, effectively improve the work efficiency of user, improve the practicability of the whole device, and bring better use prospect.
[0004] However, the above-mentioned quick cooling equipment of processing freeze-dried powder injection still has the following defects:
[0005] The cooling equipment cools freeze-dried powder injection by water cooling and air cooling, but the temperature of cooling liquid will rise after long-term circulation, and the cooling speed is slow with simple air cooling method, which leads to that freeze-dried powder injection stays in high temperature environment for too long time, thereby affecting the stability of freeze-dried powder injection. Therefore, we need to propose a kind of quick cooling equipment of processing freeze-dried powder injection to solve the above problems. UTILITY MODEL CONTENTS
[0006] The utility model aims at providing a kind of quick cooling equipment of processing freeze-dried powder injection, which can effectively reduce the temperature of cooling liquid in water tank by setting cooling assembly, so that cooling liquid can quickly reduce the temperature of freeze-dried powder injection, ensure that freeze-dried powder injection can reach the required low temperature environment in a short time, reduce the residence time of freeze-dried powder injection in high temperature environment, improve the stability of freeze-dried powder injection, to solve the problems proposed in the above background technology.
[0007] To achieve the above object, the utility model provides the following technical scheme: a kind of quick cooling equipment of freeze-dried powder injection processing, including cooling tank, water tank for storing cooling liquid is installed on the lateral wall of cooling tank, cooling assembly for cooling freeze-dried powder injection is installed on the water tank and cooling tank, cooling assembly for cooling cooling liquid in water tank is installed on the water tank, water recovery assembly for recycling cooling liquid is installed on the water tank and cooling tank;
[0008] The cooling assembly includes a protective box installed on the side wall of the water tank, and a semiconductor refrigeration sheet is installed in the protective box.
[0009] Further, the heat dissipation end of the semiconductor refrigeration sheet is provided with a heat conduction plate, the side of the heat conduction plate away from the semiconductor refrigeration sheet is provided with a heat dissipation fin, and a heat dissipation fan is installed on the heat dissipation fin.
[0010] Further, a plurality of side walls of the protective box are provided with heat dissipation holes, and a dust screen is installed in each of the heat dissipation holes.
[0011] Further, the cooling assembly includes a water outlet pump installed on one end of the outer wall of the water tank, an inlet pipe is installed on the water outlet pump, and a connecting pipe is installed on the end of the inlet pipe away from the water outlet pump.
[0012] Further, a plurality of water spray pipes are installed on the connecting pipe, one end of each of the plurality of water spray pipes penetrates the cooling tank and is installed on the other side of the inner wall of the cooling tank, and a plurality of atomizing nozzles are installed on each of the plurality of water spray pipes.
[0013] Further, the water recovery assembly includes a water recovery tank installed on the bottom inner wall of the cooling tank, and a filter screen is installed on the water recovery tank.
[0014] Further, the water recovery assembly further includes a water recovery pipe installed between the water tank and the water recovery tank, and a water recovery pump is installed on the water recovery tank.
[0015] The utility model has the advantages that:
[0016] By the arrangement of the cooling assembly, the temperature of the cooling liquid in the water tank can be effectively reduced, so that the cooling liquid can quickly reduce the temperature of the freeze-dried powder injection, and the freeze-dried powder injection can reach the required low-temperature environment in a short time, the residence time of the freeze-dried powder injection in a high-temperature environment is reduced, and the stability of the freeze-dried powder injection is improved.
[0017] The other features and advantages of the present application will be described in the following description and, in part, will become apparent to those skilled in the art upon examination of the following description or can be learned by practice of the present application. The objects and other advantages of the present application can be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.
[0019] Fig. 1 The overall structure schematic diagram according to the embodiment of the present application is shown.
[0020] Fig. 2 The side surface structure schematic diagram of the cooling box according to the embodiment of the present application is shown.
[0021] Fig. 3 The cooling assembly structure schematic diagram according to the embodiment of the present application is shown.
[0022] In the figure: 110, cooling box; 210, water tank; 220, water outlet pump; 230, water inlet pipe; 240, connecting pipe; 250, water spraying pipe; 260, atomizing nozzle; 310, protection box; 311, heat dissipation hole; 312, dust screen; 320, semiconductor refrigeration sheet; 330, heat conduction plate; 340, heat dissipation fin; 350, heat dissipation fan; 410, backwater tank; 420, filter screen; 430, backwater pump; 440, backwater pipe. DETAILED DESCRIPTION
[0023] In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the following will combine the drawings in the embodiments of the present application to clearly and completely explain the technical solutions in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.
[0024] Please refer to Figs. 1-3The utility model provides a kind of technical scheme: a kind of quick cooling equipment of processing freeze-dried powder injection. Including cooling box 110, the side wall of cooling box 110 is equipped with water tank 210 for storing cooling liquid, cooling assembly for cooling freeze-dried powder injection is installed on water tank 210 and cooling box 110, cooling assembly for cooling cooling liquid in water tank 210 is installed on water tank 210, water recovery assembly for recycling cooling liquid is installed on water tank 210 and cooling box 110;The cooling assembly includes protective box 310, the side wall of water tank 210 is equipped with protective box 310, semiconductor refrigeration piece 320 is installed in protective box 310, and semiconductor refrigeration piece 320 is installed on the side wall of water tank 210.
[0025] By the semiconductor refrigeration piece 320 in protective box 310, cooling liquid in water tank 210 is refrigerated, the temperature of cooling liquid in water tank 210 can be effectively reduced, cooling liquid can quickly reduce the temperature of freeze-dried powder injection, ensure that freeze-dried powder injection can reach the required low-temperature environment in short time, reduce the residence time of freeze-dried powder injection in high-temperature environment, improve the stability of freeze-dried powder injection.
[0026] The heat dissipation end of semiconductor refrigeration piece 320 is equipped with heat conduction plate 330, heat dissipation fin 340 is installed on the side, away from semiconductor refrigeration piece 320, of heat conduction plate 330, and heat dissipation fan 350 is installed on heat dissipation fin 340. Heat dissipation is carried out for semiconductor refrigeration piece 320 by the heat conduction plate 330 and heat dissipation fin 340, effectively expelling the heat generated by semiconductor refrigeration piece 320, to avoid the accumulation of a large amount of heat in semiconductor refrigeration piece 320, resulting in reduced refrigeration effect of semiconductor refrigeration piece 320. Heat dissipation fan 350 is arranged to accelerate the flow rate of air on heat dissipation fin 340, improving the heat dissipation efficiency of heat dissipation fin 340.
[0027] A plurality of side walls of protective box 310 are provided with heat dissipation holes 311, and a plurality of dustproof nets 312 are installed in the heat dissipation holes 311. The heat dissipation holes 311 are arranged to realize the circulation of air in the protective box 310, so that the hot air in the protective box 310 can be discharged to the outside of the protective box 310, and the heat dissipation work of the semiconductor refrigeration piece 320 is realized. The dustproof nets 312 effectively block dust and sundries from entering the inside of the protective box 310, avoiding the accumulation of dust in the protective box 310.
[0028] The cooling assembly includes a water outlet pump 220, which is installed on one end of the outer wall of the water tank 210, and a water inlet pipe 230 is installed on the water outlet pump 220, and a connecting pipe 240 is installed on the end, away from the water outlet pump 220, of the water inlet pipe 230.
[0029] The connecting pipe 240 is provided with a plurality of groups of water spraying pipes 250, one end of each group of the water spraying pipes 250 penetrates through the cooling box 110 and is mounted on the inner wall of the other side of the cooling box 110, and a plurality of groups of atomizing nozzles 260 are mounted on each group of the water spraying pipes 250.
[0030] The water outlet pump 220 is arranged to transport the cooling liquid in the water tank 210 through the water inlet pipe 230 and branch through the connecting pipe 240 to the plurality of groups of water spraying pipes 250, and the plurality of groups of water spraying pipes 250 spray the cooling liquid on the freeze-dried powder injection through the atomizing nozzles 260, so that the freeze-dried powder injection is cooled to a low temperature environment in a short time. The freeze-dried powder injection is stored in the cooling bottle, and the freeze-dried powder injection is cooled by the contact between the cooling bottle and the cooling liquid.
[0031] The water return assembly includes a water return tank 410 mounted on the bottom inner wall of the cooling box 110, and a filter screen 420 mounted on the water return tank 410.
[0032] The water return tank 410 is arranged to store the sprayed cooling liquid. The filter screen 420 is used to filter dust and impurities in the cooling liquid to prevent the cooling liquid from being contaminated.
[0033] The water return assembly further includes a water return pipe 440 mounted between the water tank 210 and the water return tank 410, and a water return pump 430 mounted on the water return tank 410.
[0034] The water return pump 430 is arranged to transport the cooling liquid in the water return tank 410 to the water tank 210 through the water return pipe 440, so that the cooling liquid is recycled, effectively reducing resource consumption and production cost.
[0035] Specifically, the internal electrical connection structure of the water outlet pump 220, the atomizing nozzle 260, the semiconductor refrigeration fin 320, the heat dissipation fan 350 and the water return pump 430 is well known to those skilled in the art, and will not be described here. The electrical components in this application are externally connected to the power supply when in use.
[0036] The circuits and electrical components and modules involved are prior art, and those skilled in the art can implement them without further description. The content protected by the utility model does not involve improvement of software.
[0037] The control method of the present application is automatically controlled by a controller. The control circuit of the controller can be realized by simple programming by those skilled in the art, and it is a common knowledge in the art. Moreover, the present application is mainly used to protect mechanical devices, so the control method and circuit connection will not be explained in detail.
[0038] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features therein can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.
Claims
1. A rapid cooling device for processing lyophilized powder injections, characterized by: The application relates to a cooling box (110) which is provided with a water tank (210) for storing cooling liquid on the side wall of the cooling box (110), wherein a cooling assembly for cooling freeze-dried powder injections is arranged on the water tank (210) and the cooling box (110), a cooling assembly for cooling the cooling liquid in the water tank (210) is arranged on the water tank (210), and a water recovery assembly for recovering the cooling liquid is arranged on the water tank (210) and the cooling box (110). The cooling assembly comprises a protective box (310) which is arranged on the side wall of the water tank (210), and a semiconductor refrigeration sheet (320) is arranged in the protective box (310) and on the side wall of the water tank (210).
2. The rapid cooling device for processing freeze-dried powder injection according to claim 1, characterized in that: The heat dissipation end of the semiconductor refrigeration sheet (320) is provided with a heat conduction plate (330), the side, away from the semiconductor refrigeration sheet (320), of the heat conduction plate (330) is provided with a heat dissipation fin (340), and the heat dissipation fin (340) is provided with a heat dissipation fan (350).
3. The rapid cooling device for processing freeze-dried powder injection according to claim 2, characterized in that: A plurality of groups of side walls of the protective box (310) are provided with heat dissipation holes (311), and a plurality of groups of dustproof nets (312) are arranged in the heat dissipation holes (311).
4. The rapid cooling device for processing freeze-dried powder injection according to claim 3, characterized in that: The cooling assembly comprises a water outlet pump (220) which is arranged on the outer wall of one end of the water tank (210), and the water outlet pump (220) is provided with a water inlet pipe (230), and the end, away from the water outlet pump (220), of the water inlet pipe (230) is provided with a connecting pipe (240).
5. The rapid cooling device for processing freeze-dried powder injection according to claim 4, characterized in that: The connecting pipe (240) is provided with a plurality of groups of water spraying pipes (250), one end of each group of the water spraying pipes (250) penetrates through the cooling box (110) and is arranged on the inner wall of the other side of the cooling box (110), and each group of the water spraying pipes (250) is provided with a plurality of groups of atomizing nozzles (260).
6. The rapid cooling device for processing freeze-dried powder injection according to claim 5, characterized in that: The water recovery assembly comprises a water recovery tank (410) which is arranged on the bottom inner wall of the cooling box (110), and the water recovery tank (410) is provided with a filter screen (420).
7. The rapid cooling device for processing freeze-dried powder injection according to claim 6, characterized in that: The water recovery assembly further comprises a water recovery pipe (440) which is arranged between the water tank (210) and the water recovery tank (410), and the water recovery tank (410) is provided with a water recovery pump (430).
Citation Information
Patent Citations
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