Inspection device for detecting photoelectric conversion function of equipment bottom plate

Abstract

The utility model relates to an inspection device for detecting a photoelectric conversion function of an equipment base plate. Comprising a single-chip microcomputer, the single-chip microcomputer is connected with a photoelectric conversion module and a first power module, the photoelectric conversion module is connected with a second power module, the power module transmits power to the single-chip microcomputer, and the second power module transmits power to the photoelectric conversion module; pins VBAT, VSS and VDD of the STM32F303CCT6 are connected with the output of the first power module, PA1 and PA2 are connected with a pin 4 and a pin 5 of the HC-SFP-20P, PA3 and PA4 are connected with a pin 7 and a pin 9 of the HC-SFP-20P, PA6 and PA7 are connected with a pin 19 and a pin 18 of the HC-SFP-20P, and PB6 and PB5 are connected with a pin 13 and a pin 12 of the HC-SFP-20P. The single-chip microcomputer and the photoelectric conversion module communicate with each other, so that mutual conversion and output of an optical signal and an electric signal are realized, and the photoelectric conversion function of the equipment bottom plate is accurately inspected.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit design technical field, concretely relates to a kind of inspection device of equipment bottom plate photoelectric conversion function detection. BACKGROUND

[0002] Test fixtures are specialized equipment or tools designed to ensure product quality. They simulate real-world usage environments to test product performance and reliability. These fixtures are designed by teams of specialized engineers, taking into account product structure, testing requirements, and operational convenience, and are made of metal, plastic, or composite materials. They not only perform performance testing, life testing, and environmental suitability testing, but also simplify the operation process, reduce human error, and improve testing efficiency. Although the accuracy and reliability of test fixtures need to be checked and maintained regularly, they are an indispensable part of product quality assurance. As products are updated, test fixtures also need to be upgraded to meet new testing requirements, ensuring that products meet design standards and user expectations before they leave the factory.

[0003] When testing the photoelectric conversion function of a certain special equipment bottom plate, an optical power meter is used to test the optical fiber first, and then a corresponding test board is borrowed from a cooperative company for testing. The equipment may be damaged during transportation, which is time-consuming and laborious. Currently, there is no fixture that meets the testing requirements of this special equipment. Therefore, a circuit board is needed to test the photoelectric conversion function of the special equipment floor. SUMMARY

[0004] The problem to be solved by the utility model is to provide a device bottom plate testing fixture for detecting the photoelectric conversion module of the device.

[0005] To solve the technical problems of the prior art, the utility model adopts the technical scheme of a kind of inspection device of equipment bottom plate photoelectric conversion function detection, including single-chip microcomputer, single-chip microcomputer connects photoelectric conversion module and power module one, photoelectric conversion module connects power module two, power module one is sent power to single-chip microcomputer, power module two is sent power to photoelectric conversion module;Single-chip microcomputer model is STM32F303CCT6, photoelectric conversion module model is HC-SFP-20P, power module one is powered by the pin VBAT, VSS, VDD of STM32F303CCT6 for single-chip microcomputer, PA1, PA2 connect the pin 4, pin 5 of HC-SFP-20P, PA3, PA4 connect the pin 7, pin 9 of HC-SFP-20P, PA6, PA7 connect the pin 19, pin 18 of HC-SFP-20P, PB6, PB5 connect the pin 13, pin 12 of HC-SFP-20P.

[0006] Preferably, the model of power module one and power module two is TPSS4202.

[0007] Preferably, the power supply module one supplies 3.3V power supply voltage to the single-chip microcomputer, and the power supply module two supplies 3.3V power supply voltage to the photoelectric conversion module.

[0008] Preferably, the PA0 of the STM32F303CCT6 is connected with the input signal KEY.

[0009] Preferably, the PB2 pin of the STM32F303CCT6 is connected with the BOOTO pin.

[0010] The utility model discloses the beneficial effects are as follows:

[0011] 1. The utility model discloses tooling adopts single-chip microcomputer and photoelectric conversion module intercommunication, realizes the mutual conversion and output of optical signal and electric signal, and the tooling adopts domestic hardware to replace imported hardware, can still be more fast, accurate to the photoelectric conversion function of the equipment bottom plate carries out the inspection, and the photoelectric conversion function test tooling of the equipment has realized the breakthrough from nothing to something.

[0012] 2. The power supply module one and the power supply module two provide corresponding working voltage for the single-chip microcomputer and the photoelectric conversion module through the 28V power supply of conversion bottom plate, do not need to prepare separate external power supply for it, and the operation is simple, time-saving and labor-saving. DRAWINGS

[0013] Figure 1 It is the connection schematic diagram of the utility model tooling;

[0014] Figure 2 It is the power supply module one circuit diagram of the utility model;

[0015] Figure 3 It is the power supply module two circuit diagram of the utility model;

[0016] Figure 4 It is the single-chip microcomputer principle diagram of the utility model;

[0017] Figure 5 It is the photoelectric conversion module circuit principle diagram of the utility model;

[0018] Figure 6 It is the tooling self-inspection and feedback function inspection work diagram of the utility model;

[0019] Figure 7 It is the receiving optical signal flow chart of the utility model;

[0020] Figure 8 It is the hardware connection schematic diagram of the utility model. DETAILED DESCRIPTION

[0021] The embodiments of the present application are given for the purpose of illustration and description only, and are not intended to be exhaustive or to limit the present application to the forms disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. Embodiments are chosen and described in order to best explain the principles of the present application and its practical application, and to enable others skilled in the art to understand the present application for various embodiments with various modifications as are suited to the particular use contemplated.

[0022] In order to solve the problems in the background art, the utility model provides a kind of test tool, and the test with the tool can directly test the photoelectric conversion function of the equipment bottom plate, without function one by one to accept, can greatly shorten acceptance time in subsequent test, leave more time for production and experiment.The tool of the utility model can more quickly and accurately accept the photoelectric conversion function of special equipment.Here, the tool uses STM32F303CCT6 single-chip microcomputer and a crowd of localized components (resistor, capacitor, inductor etc.).

[0023] The utility model test tool includes single-chip microcomputer, single-chip microcomputer connects photoelectric conversion module and power module one, photoelectric conversion module connects power module two, power module one sends power to single-chip microcomputer, the power voltage that power module one sends to single-chip microcomputer is 3.3V, power module two sends power to photoelectric conversion module, the power voltage that power module two sends to photoelectric conversion module is 3.3V;Power module one and power module two model are all TPSS4202;Single-chip microcomputer model is STM32F303CCT6, photoelectric conversion module model is HC-SFP-20P, power module one is powered by the pin VBAT, VSS, VDD of STM32F303CCT6, PA1, PA2 connect the pin 4 of HC-SFP-20P, pin 5, PA3, PA4 connect the pin 7 of HC-SFP-20P, pin 9, PA6, PA7 connect the pin 19 of HC-SFP-20P, pin 18, PB6, PB5 connect the pin 13 of HC-SFP-20P, pin 12;The PA0 of STM32F303CCT6 is connected to input signal KEY;The signal connection between the PB2 pin of STM32F303CCT6 and BOOTO pin is shown in the figure. Figure 2 As shown in the figure, the circuit diagram of power module one is shown, and the 28V voltage provided by the bottom plate is converted into 3.3V voltage required by single-chip microcomputer by power module one;As shown in the figure, Figure 3 As shown in the figure, the circuit diagram of power module two is shown, and the 28V voltage provided by the bottom plate is converted into 3.3V voltage required by photoelectric conversion module by power module two. Figure 4The single-chip microcomputer circuit diagram is shown. The program written by computer is written into the single-chip microcomputer through the DB9 connector, so that the single-chip microcomputer outputs an electrical signal at a frequency of 2 times per second. One of the output signals is returned to the computer for recording as a set value. The other output signal is transmitted to the photoelectric conversion module. The photoelectric conversion module converts the electrical signal into an optical signal. The optical signal is output through an optical fiber. Figure 5 The photoelectric conversion module circuit diagram is shown. The optical signal output by the photoelectric conversion module is captured and recorded as a measured value by a light power meter or other measuring equipment. The measured value and the set value are compared with a standard value to perform testing.

[0024] STM32F303CCT6 is a microcontroller based on the high-performance ARM Cortex-M4 32-bit RISC core. It has a running frequency of up to 72MHz, and it has a floating-point unit (FPU), a memory protection unit (MPU), and an embedded trace macrocell (ETM) built-in. It integrates high-speed embedded memory, including up to 256KB of Flash memory and up to 40KB of SRAM. STM32F303CCT6 provides a rich set of peripheral interfaces, including up to four fast 12-bit ADCs (5Msps), seven comparators, four operational amplifiers, up to two DAC channels, a low-power RTC, up to five general-purpose 16-bit timers, a general-purpose 32-bit timer, and two timers dedicated to motor control. In addition, it has multiple communication interfaces, including up to two I2C, up to three SPI (two of which support multiplexed full-duplex I2S), three USARTs, up to two UARTs, CAN, and USB. This microcontroller can work in a temperature range of -40 to +85°C, supports a power supply of 2.0 to 3.6V, and provides comprehensive power-saving modes to meet the design requirements of low-power applications. This microcontroller uses the ARM Cortex-M4 core, which can set the function of the GPIO pin through programming, such as input, output, analog, or multiplexing. When outputting signals, by configuring the GPIO as push-pull or open-drain output mode and setting the pin level high or low, STM32F303CCT6 can control external devices. At the same time, it also supports multiple communication interfaces such as SPI, USART, etc., through which the microcontroller can send data or control signals to realize data exchange with external devices. In addition, the built-in timer and ADC of STM32F303CCT6 can also generate or process output signals to meet different application requirements. HC-SFP-20P is an SFP packaged optical module interface, whose working principle mainly revolves around the conversion and transmission of its optical and electrical signals. This interface design is used to provide high-speed data communication by converting electrical signals into optical signals for long-distance transmission on optical fibers. HC-SFP-20P has 20 pins, supporting multiple functions, including data transmission, signal control, and status monitoring. Its differential signal input and output allow high-speed data transmission, while TX_Fault, TX_Disable, and LOS control signals are used for module status monitoring and control. Through these pins, HC-SFP-20P can effectively communicate with the host device to ensure accurate data transmission and reception.

[0025] As Figure 6As shown is the tool self-checking and feedback function test work diagram, through the computer or host computer input instruction, the single-chip microcomputer receives the instruction and continuously outputs the electric signal, the electric signal is transmitted to the photoelectric conversion module, the photoelectric conversion module converts the received electric signal into optical signal, the photoelectric conversion module captures and records the output optical signal with optical power meter, so as to prove that the photoelectric conversion function is normal; again through the upper board card input signal to the tool conversion into optical signal output; such as Figure 7 As shown is the tool receiving optical signal work flow chart, the photoelectric conversion module converts the optical signal into electric signal and transmits to the single-chip microcomputer after receiving the optical signal, and the single-chip microcomputer outputs the electric signal and transmits to the lower board card and host computer; the two can verify whether the signal transmission function of the measured board is normal. Figure 8 The hardware connection schematic diagram related to the utility model, wherein the J18BW64T connector is responsible for the communication signal of the upper and lower board cards and the power supply of the whole tool.

[0026] The utility model adopts power module one and power module two, power module one and power module two provide corresponding working voltage for single-chip microcomputer and photoelectric conversion module through the 28V power supply provided by conversion bottom plate, and do not need to prepare separate external power supply for it, and the photoelectric conversion module circuit adopts SFP optical module and converts the electric signal into electric signal. The utility model tool can more quickly and accurately check and accept the equipment. Through the acceptance tool, it can ensure that every product has undergone strict test and verification before leaving the factory, so as to guarantee the consistency and reliability of the product. The detection tool can automatically execute repetitive test task, so that the detection process is more efficient.

Claims

1. A testing device for detecting the photoelectric conversion function of a device base plate, characterized in that: The single-chip microcomputer is connected with a photoelectric conversion module and a power module one, the photoelectric conversion module is connected with a power module two, the power module one supplies power to the single-chip microcomputer, and the power module two supplies power to the photoelectric conversion module; the single-chip microcomputer is of STM32F303CCT6 type, the photoelectric conversion module is of HC-SFP-20P type, the power module one supplies power to the single-chip microcomputer through a pin VBAT, a pin VSS and a pin VDD of the STM32F303CCT6, PA1 and PA2 are connected with a pin 4 and a pin 5 of the HC-SFP-20P, PA3 and PA4 are connected with a pin 7 and a pin 9 of the HC-SFP-20P, PA6 and PA7 are connected with a pin 19 and a pin 18 of the HC-SFP-20P, and PB6 and PB5 are connected with a pin 13 and a pin 12 of the HC-SFP-20P.

2. The apparatus for detecting the function of photoelectric conversion of the backplane as claimed in claim 1, wherein: The power module one and the power module two are both of TPSS4202 type.

3. The apparatus for detecting the function of photoelectric conversion of the device backplane according to claim 2, wherein: The power module one supplies power with a voltage of 3.3V to the single-chip microcomputer, and the power module two supplies power with a voltage of 3.3V to the photoelectric conversion module.

4. The apparatus for detecting the function of photoelectric conversion of the device backplane according to claim 3, wherein: PA0 of the STM32F303CCT6 is connected with an input signal KEY.

5. The apparatus for detecting the function of the light-electricity conversion of the backplane as claimed in claim 4, wherein: A signal is connected between a PB2 pin of the STM32F303CCT6 and a BOOTO pin.

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