Computing module and computing device

Abstract

The embodiment of the utility model provides a computing module and computing equipment, the computing module is arranged in a shell assembly of the computing equipment, and the length direction of the shell assembly is parallel to a first direction; wherein the calculation module comprises a force calculation plate, the force calculation plate comprises a plate body and a plurality of calculation units, the calculation units are arranged on the side surface of the plate body, the length direction of the plate body is parallel to the first direction, and the width direction of the plate body is parallel to the vertical direction. According to the technology of the embodiment of the invention, the internal space of the shell assembly can be fully utilized, and the area of the arrangement area of the calculation units can be increased while the internal space of the shell assembly occupied by the plate body is reduced, so that the arrangement number of the calculation units is increased, and the operation performance of the calculation board is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, and particularly relates to a computing module and a computing device. BACKGROUND

[0002] As a core component of a computing board, the arrangement area of a computing unit is limited by the layout of the board. When the spatial layout of the board is poor, the arrangement range of the computing unit is directly compressed. This not only limits the number of computing units on the computing board, but also hinders the improvement of the operation performance of the computing device as a whole, and it is difficult to meet the growing demand for high-performance computing. Therefore, how to optimize the layout of the computing board has become a key technical problem to be solved. CONTENT OF THE UTILITY MODEL

[0003] The present application provides a computing module and a computing device to solve or alleviate one or more technical problems in the prior art.

[0004] As an aspect of the present application, the present application provides a computing module, which is arranged in a housing assembly of a computing device, and the length direction of the housing assembly is parallel to a first direction; the computing module comprises: a computing board, the computing board comprising a board body and a plurality of computing units, the plurality of computing units being arranged on the side surface of the board body, the length direction of the board body being parallel to the first direction, and the width direction of the board body being parallel to a vertical direction.

[0005] In an embodiment, the ratio of the width size of the board body to the length size of the board body is less than or equal to 1 / 6.

[0006] In an embodiment, the plurality of computing units are arranged on the side surface of the board body, and the plurality of computing units are arranged in at least one row, and the plurality of computing units in each row are arranged adjacent to each other along the length direction of the board body.

[0007] In an embodiment, the plurality of computing units are arranged in two rows, and the two rows of computing units are arranged spaced apart in the width direction of the board body.

[0008] In an embodiment, the two rows of computing units are arranged in series.

[0009] In an embodiment, the computing board further comprises a conductive row, the conductive row being arranged on the side surface of the board body, and any two adjacent computing units in each row of computing units are electrically connected through the conductive row.

[0010] In an embodiment, the number of conductive rows is a plurality, and any two adjacent computing units in each row of computing units are respectively provided with a conductive row.

[0011] In an embodiment, the plate body comprises a first end and a second end oppositely arranged in a length direction of the plate body, and the computing unit adjacent to the second end in the first row of computing units is electrically connected to the computing unit adjacent to the second end in the second row of computing units through the first conductive member.

[0012] In an embodiment, the first end of the plate body is provided with a plug-in end, and the plug-in end is configured to be plugged into the plug-in interface of the power module.

[0013] In an embodiment, the computing unit adjacent to the first end in the first row of computing units and the computing unit adjacent to the first end in the second row of computing units are electrically connected to the plug-in end through the second conductive member.

[0014] In an embodiment, the plug-in end comprises a positive electrode contact end and a negative electrode contact end, and the second conductive member comprises a positive electrode conductive member and a negative electrode conductive member, the positive electrode conductive member is electrically connected to the positive electrode contact end, and the negative electrode conductive member is electrically connected to the negative electrode contact end.

[0015] In an embodiment, the plug-in end further comprises a backup connection end, the backup connection end can be arranged between the positive electrode contact end and the negative electrode contact end, and a size of the backup connection end in the first direction is greater than or equal to sizes of the positive electrode contact end and the negative electrode contact end in the first direction L1.

[0016] In an embodiment, the plug-in end is further provided with a detection connection end, and the detection connection end is arranged between the positive electrode contact end and the negative electrode contact end; wherein a distance between an edge of the detection connection end adjacent to the first end of the plate body and an edge of the plate body at the first end is greater than distances between edges of the positive electrode contact end and the negative electrode contact end adjacent to the first end of the plate body and the edge of the plate body at the first end.

[0017] In an embodiment, a width size of the plate body is greater than a width size of the plug-in end.

[0018] In an embodiment, the computing module further comprises at least one heat dissipation structure arranged on at least one side of the plate body, and the heat dissipation structure comprises a heat dissipation plate and a heat dissipation fin group.

[0019] In an embodiment, the plate body is provided with a plurality of connection holes for the fasteners to pass through to mount the heat dissipation structure to the plate body.

[0020] In an embodiment, the plurality of computing units are arranged in two rows, and the two rows of computing units are arranged at intervals in a width direction of the plate body; wherein the plurality of connection holes are arranged between the two rows of computing units, and the plurality of connection holes are arranged at intervals in the first direction.

[0021] In an embodiment, the plurality of connection holes are arranged on a center line of the plate body in the width direction.

[0022] In an embodiment, the computing power board further comprises a first connector, the first connector being configured to be communicatively connected with a data line of the control circuit board.

[0023] In an embodiment, the first connector is centrally arranged between the positive electrode conductive member and the negative electrode conductive member of the second conductive member.

[0024] In an embodiment, the computing power board further comprises a second connector, the second connector being configured to be electrically connected with a cable of a temperature detection unit of the computing device.

[0025] According to another aspect of the embodiments of the present application, a computing device is also provided, comprising: a housing assembly, an inner portion of which is defined as a cavity; and the computing module according to any one of the embodiments of the present application, the computing module being arranged in the cavity.

[0026] According to the technology of the embodiments of the present application, the inner space of the housing assembly can be fully utilized, the area of the arrangement region of the computing unit can be increased while reducing the space occupied by the board in the inner space of the housing assembly, thereby improving the arrangement number of the computing unit and the computing performance of the computing power board.

[0027] The above summary is intended to illustrate the present application and is not intended to be limiting thereof. Further aspects, embodiments and features of the present application will be apparent from the drawings and the following detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0028] In the drawings, like reference numerals refer to same or similar components throughout the several views. These drawings are not necessarily to scale. It should be understood that these drawings are merely schematic representations, which are intended to provide a generalized illustration of the structures, components and flows, characterized in accordance with the present application. They are not intended to provide a detailed description of each component illustrated.

[0029] Figure 1 An example of a perspective view of a computing power board of the computing module according to an embodiment of the present application is provided.

[0030] Figure 2 An example of a front view of a computing power board of the computing module according to an embodiment of the present application is provided.

[0031] Figure 3 An example of a connection diagram of the computing module and the power module according to an embodiment of the present application is provided.

[0032] Figure 4 An example of an enlarged view of a partial structure of a computing power board of the computing module according to an embodiment of the present application is provided.

[0033] Figure 5 An example of an exploded view of the computing device according to an embodiment of the present application without a shell is provided.

[0034] BRIEF DESCRIPTION OF DRAWINGS

[0035] 1-computing device;

[0036] 100-housing assembly;

[0037] 200-fan;

[0038] 300-power module;

[0039] 400-computing module;

[0040] 410-computing board; 410a-board body; 410a1-first end; 410a2-second end; 410b-computing unit; 4101-first row of computing units; 4102-second row of computing units; 411-plug end; 411a-positive plug end; 411b-negative plug end; 412-connection hole; 413-first connector; 414-second connector; 415-first conductive piece; 416-second conductive piece; 416a-positive conductive piece; 416b-negative conductive piece; 417-conductive row; 418-temperature sensor; 419a-backup connection end; 419b-detection connection end;

[0041] 420-heat dissipation structure; 421-heat dissipation fin; 422-fastening screw; 430-support beam;

[0042] 500-control module;

[0043] L1-first direction; L2-second direction. DETAILED DESCRIPTION

[0044] Hereinafter, only certain exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the drawings and the description are considered to be exemplary in nature rather than limiting.

[0045] The computing unit is the core component of the computing board, and its arrangement area is limited by the layout of the board body. When the spatial layout of the board body is not good, the arrangement range of the computing unit is directly compressed. This not only limits the number of computing units on the computing board, but also hinders the overall improvement of the computing performance of the computing device, making it difficult to meet the growing demand for high-performance computing. Therefore, how to optimize the layout of the computing board has become a key technical problem to be solved.

[0046] Based on the above defects existing in the related art, the embodiments of the present application provide a computing module, the computing power board of the computing module includes a board body and a plurality of computing units arranged on the board body. By arranging the board body in the internal space of the shell assembly in parallel to the first direction in the length direction and parallel to the vertical direction in the width direction, the internal space of the shell assembly can be fully utilized, the area of the arrangement area of the computing units can be increased while reducing the space occupied by the board body in the internal space of the shell assembly, thereby increasing the arrangement number of the computing units and improving the computing performance of the computing power board.

[0047] The embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be noted that in the drawings of the present application, L1 represents the first direction, which can be parallel to the length direction of the shell assembly. The length direction of the shell assembly can be understood as a straight line direction extending from one end of the longest side of the shell assembly to the other end. L2 represents the second direction, which can be perpendicular to the first direction or parallel to the width direction of the shell assembly. The width direction of the shell assembly can be a direction perpendicular to the length direction of the shell assembly and in the same plane. The reference description of the first direction L1 and the second direction L2 provided in the embodiments of the present application is for the convenience of understanding, and cannot be understood as a limitation of the embodiments of the present application.

[0048] The computing module of the embodiments of the present application can be arranged in the shell assembly of the computing device. Figure 1 An example of a perspective structural schematic diagram of the computing power board of the computing module according to the embodiments of the present application is provided, Figure 2 An example of an elevation view of the computing power board of the computing module according to the embodiments of the present application is provided, Figure 1 and Figure 2 As shown in the drawings, the computing module of the embodiments of the present application can include a computing power board 410. Specifically, the computing power board 410 includes a board body 410a and a plurality of computing units 410b, the plurality of computing units 410b are arranged on the side surface of the board body 410a, the length direction of the board body 410a is parallel to the first direction L1, and the width direction of the board body is parallel to the vertical direction. The vertical direction can be a direction perpendicular to the first direction L1 and the second direction L2, respectively.

[0049] In the embodiments of the present application, the computing power board 410 can be a hardware device or a module for providing computing power, and can be applied to the fields of high-performance computing (HPC), artificial intelligence (AI) training, data centers, etc. The board body 410a can adopt a printed circuit board. The computing unit can adopt at least one of a CPU (Central Processing Unit) chip, a GPU (Graphic Processing Unit) chip, a FPGA (Field Programmable Gate Array) chip, an ASIC (Application-Specific Integrated Circuit) chip, an NPU (Neural Processing Unit) chip, and a TPU (Tensor Processing Unit) chip.

[0050] For example, the plurality of computing units 410b adopted by the computing power board 410 are the same.

[0051] In some examples, the computing power board 410 can adopt a plurality of computing units 410b of the same model.

[0052] In other examples, the computing power board 410 can adopt a plurality of computing units 410b of the same size.

[0053] In other examples, the computing power board 410 can adopt a plurality of computing units 410b of the same specification.

[0054] In other examples, the computing power board 410 can adopt a plurality of computing units 410b of the same function.

[0055] It should be noted that the above is only an example description, and in other examples of the present application, a plurality of computing units 410b with at least two parameters of model, size, specification, and function being the same respectively can also be adopted.

[0056] Exemplarily, the plate body 410a can be rectangular in shape, the length direction of the plate body 410a refers to the extension direction of the longer side edge of the plate body 410a, and the width direction of the plate body 410a refers to the extension direction of the shorter side edge of the plate body 410a. The plane on which the plate body 410a is located can be arranged perpendicularly to the second direction L2, the length direction of the plate body 410a is arranged parallel to the first direction L1, and the width direction of the plate body 410a is arranged parallel to the vertical direction. The first direction L1 can be the length direction of the shell assembly, the second direction L2 can be the width direction of the shell assembly, and the vertical direction can be a direction perpendicular to the first direction L1 and the second direction L2, respectively.

[0057] It should be noted that, by arranging the plate body 410a parallel to the first direction L1 in the length direction and parallel to the vertical direction in the width direction inside the shell assembly, the internal space of the shell assembly can be fully utilized, the area of the arrangement region of the computing unit 410b can be increased while reducing the space occupied by the plate body 410a in the internal space of the shell assembly, thereby increasing the arrangement number of the computing unit 410b and improving the computing performance of the computing power board 410. In addition, by arranging the plane on which the computing power board is located parallel to the vertical direction, the air resistance generated by the computing power board 410 to the airflow flowing from the air inlet to the air outlet during the operation of the fan 200 can be reduced, and the airflow has a high flow rate when flowing through the computing power board 410, thereby ensuring the cooling efficiency of the computing power board 410.

[0058] In an embodiment, the ratio of the width dimension of the plate body 410a to the length dimension of the plate body 410a is less than or equal to 1 / 6.

[0059] It can be understood that the width dimension of the plate body 410a refers to the dimension of the plate body 410a in the width direction thereof, and the length dimension of the plate body 410a refers to the dimension of the plate body 410a in the length direction thereof. The specific values of the width dimension and the length dimension of the plate body 410a and the ratio thereof can be arranged correspondingly according to the overall shape and size of the shell assembly and the shape and size of the internal cavity thereof.

[0060] Exemplarily, the overall shape of the shell assembly can be generally cuboid, and the length dimension of the shell assembly in the first direction L1 can be greater than the height dimension of the shell assembly in the vertical direction. Correspondingly, the shape of the cavity inside the shell assembly can be generally cuboid, and the length dimension of the cavity in the first direction L1 can be greater than the height dimension of the cavity in the vertical direction. In order to maximize the utilization of the cavity space inside the shell assembly by the board 410a, in the embodiment of the present application, the length direction of the board 410a can be arranged parallel to the first direction L1, and the width direction of the board 410a can be arranged parallel to the vertical direction, and the length dimension of the board 410a can be greater than the width dimension thereof. The ratio of the width dimension of the board 410a to the length dimension thereof can be set to be less than or equal to 1 / 6.

[0061] In some examples, the ratio of the width dimension of the board 410a to the length dimension thereof can be set to be 1 / 6, i.e., the aspect ratio of the board 410a is 4.

[0062] In other examples, the ratio of the width dimension of the board 410a to the length dimension thereof can be set to be 1 / 8, i.e., the aspect ratio of the board 410a is 8.

[0063] In still other examples, the ratio of the width dimension of the board 410a to the length dimension thereof can be set to be 1 / 10, i.e., the aspect ratio of the board 410a is 10.

[0064] It should be noted that the above is only an exemplary description and should not be construed as a limitation on the present application. As for the length dimension, the width dimension and the ratio of the two of the board 410a, a person skilled in the art can make corresponding arrangements according to the shape and size of the cavity of the shell assembly to improve the space utilization of the board 410a in the cavity inside the shell assembly.

[0065] In one embodiment, as shown in Figure 1 and Figure 2 The plurality of computing units 410b are arranged on the side surface of the board 410a, and the plurality of computing units 410b are arranged in at least one row, and the plurality of computing units 410b in each row are arranged adjacent to each other along the length direction of the board 410a.

[0066] It should be noted that, since the length dimension of the board 410a is greater than the width dimension thereof, in order to maximize the number of computing units 410b arranged on the limited area of the side surface of the board 410a, the row direction of the plurality of computing units 410b arranged in a row can be arranged parallel to the length direction of the board. In this way, the number of computing units 410b in each row can be maximized.

[0067] In some examples, multiple computing units 410b can be arranged in a row, with the multiple computing units 410b in the row arranged adjacent to each other in a direction parallel to the length direction of the plate 410a.

[0068] In a specific example, the multiple computing units 410b in this row can be centrally positioned along the width of the plate 410a, such that the distance between each computing unit 410b in the row and the two side edges of the plate 410a extending along the length direction are equal. This arrangement allows the heat generated by the computing units 410b during operation to be evenly distributed to both sides of the plate 410a along its width, thereby improving the temperature uniformity of the plate 410a and preventing localized heat concentration.

[0069] In another specific example, the multiple calculation units in the row can also be non-centered in the width direction of the plate 410a, so that the distance between each calculation unit 410b in the row and the two side edges of the plate 410a extending in the length direction are not equal. For example, the distance between each calculation unit 410b in the row and the upper side edge of the plate 410a extending in the length direction is greater than the distance between each calculation unit 410b and the lower side edge of the plate 410a extending in the length direction. As another example, the distance between each calculation unit 410b in the row and the upper side edge of the plate 410a extending in the length direction is less than the distance between each calculation unit 410b and the lower side edge of the plate 410a extending in the length direction.

[0070] It should be noted that the above is merely an exemplary description and should not be construed as a limitation of this application. In other examples of this application, multiple computing units 410b may also be arranged in columns on the plate 410a, with the column direction parallel to the width direction of the plate 410a.

[0071] In one implementation, such as Figure 1 and Figure 2 As shown, multiple computing units 410b are arranged in two rows. In each row, multiple computing units are arranged adjacent to each other in a direction parallel to the length direction of the plate 410a. The two rows of computing units are spaced apart in the width direction of the plate 410a.

[0072] In some examples, the two rows of computing units are symmetrically arranged about the centerline in the width direction of the plate 410a, so that the distance between the two rows of computing units and the side edge of the plate 410a on their respective adjacent sides is equal. This arrangement allows the two rows of computing units to be evenly distributed on the plate 410a, thereby improving the temperature uniformity of the computing board 410.

[0073] In some examples, the two rows of computing units are asymmetrically arranged about a center line in the width direction of the plate body 410a. In this case, the distance between the first row of computing units 4101 adjacent to the upper side edge of the plate body 410a and the upper side edge of the plate body 410a is greater than the distance between the second row of computing units 4102 adjacent to the lower side edge of the plate body 410a and the lower side edge of the plate body 410a. It should be noted that, in the process of the airflow flowing upwards from the air inlet to the air outlet, the airflow has a better air cooling effect on the second row of computing units 4102 located upstream of the airflow than on the first row of computing units 4101 located downstream of the airflow. By setting the distance between the first row of computing units 4101 and the upper side edge of the plate body 410a to be greater than the distance between the second row of computing units 4102 and the lower side edge of the plate body 410b, the plate body 410a can reserve a larger heat dissipation space for the first row of computing units 4101 than for the second row of computing units 4102, thereby balancing the cooling capacity of the two rows of computing units to make the cooling capacity of the two rows of computing units as consistent as possible, and further improving the temperature uniformity of the computing power board 410.

[0074] It should be noted that the above is only an exemplary description and should not be construed as limiting the present application. In other examples of the present application, the plurality of computing units 410b can also be arranged in two columns, and the plurality of computing units in each column can be arranged adjacent to each other in a direction parallel to the width direction of the plate body 410a, and the two columns of computing units are arranged at intervals in the length direction of the plate body 410a. In addition, the two columns of computing units can be symmetrically arranged or asymmetrically arranged about a center line in the length direction of the plate body 410a.

[0075] In the embodiments of the present application, the number of computing units 410b included in the two rows of computing units can be equal or not equal.

[0076] In some examples, the number of computing units 410b included in the first row of computing units 4101 adjacent to the upper side edge of the plate body 410a is equal to the number of computing units 410b included in the second row of computing units 4102 adjacent to the lower side edge of the plate body 410a.

[0077] In other examples, the number of computing units 410b included in the first row of computing units 4101 adjacent to the upper side of the plate body 410a is greater than the number of computing units 410b included in the second row of computing units 4102 adjacent to the lower side edge of the plate body 410a. In this case, the pitch between any two adjacent computing units 410b in the first row of computing units 4101 is less than the pitch between any two adjacent computing units 410b in the second row of computing units 4102.

[0078] In some examples, the number of computing units 410b included in the first row of computing units 4101 adjacent to the upper side of the plate body 410a is less than the number of computing units 410b included in the second row of computing units 4102 adjacent to the lower side of the plate body 410a. In some examples, the distance between any two adjacent computing units 410b in the first row of computing units 4101 is greater than the distance between any two adjacent computing units 410b in the second row of computing units 4102.

[0079] In some examples, the ratio of the width dimension to the length dimension of the plate body 410a can be 1 / 8. The two rows of computing units can be symmetrically arranged about a center line in the width direction of the plate body. In some examples, the number of computing units 410b included in the first row of computing units 4101 can be equal to the number of computing units 410b included in the second row of computing units 4102, and each can be 33. The distance between any two adjacent computing units 410b in the first row of computing units 4101 can be equal to the distance between any two adjacent computing units 410b in the second row of computing units 4102.

[0080] It should be noted that the above is only an example description and should not be construed as a limitation on the present application. The number of rows of computing units 410b and the number of computing units 410b in each row on the plate body 410a can be flexibly set by those skilled in the art according to the size of the computing units 410b and the size of the plate body 410a.

[0081] In some examples, the two rows of computing units are arranged in series.

[0082] In some examples, the plurality of computing units 410b in the first row of computing units 4101 can be arranged in series, and the plurality of computing units 410b in the second row of computing units 4102 can be arranged in series. In addition, the first row of computing units 4101 and the second row of computing units 4102 can be arranged in parallel, or can be arranged in series.

[0083] In some examples, the computing power board 410 can further include a conductive row 417, which can be disposed on the side surface of the plate body 410a. The number of conductive rows 417 can be two, and each conductive row 417 can extend along the length direction of the plate body 410a.

[0084] In some examples, the conductive row 417 can be a one-piece structure, and the plurality of computing units 410b in each row of computing units can be electrically connected to the conductive row 417 through a solder pad, so that the plurality of computing units 410b in each row of computing units are connected in series.

[0085] In some examples, the conductive row 417 can include a plurality of conductive pieces arranged adjacent to each other along the length direction of the plate body 410a, and any two adjacent computing units 410b in each row of computing units are electrically connected by a conductive piece, so that the plurality of computing units 410b in each row of computing units are connected in series with each other.

[0086] In some examples, the material of the conductive row 417 can be copper, and the conductive row 417 can be a copper row.

[0087] In some examples, the material of the conductive row 417 can be copper, and the conductive row 417 can be a copper row.

[0088] In some examples, the material of the conductive row 417 can be copper, and the conductive row 417 can be a copper row.

[0089] It should be noted that the above is only an example description and should not be construed as a limitation on the present application. As for the material selection of the conductive row 417, a person skilled in the art can use any type of conductive material known at present or in the future, such as gold, platinum, or conductive polymers with conductive properties, etc.

[0090] In one embodiment, as shown in FIG. 4A, the plate body 410a includes a first end 410a1 and a second end 410a2 arranged opposite to each other along the length direction of the plate body 410a, and the computing unit 410b adjacent to the second end 410a2 in the first row of computing units 4101 is electrically connected to the computing unit 410b adjacent to the second end 410a2 in the second row of computing units 4102 by the first conductive piece 415. Figure 2

[0091] In some examples, the first conductive piece 415 can be a one-piece structure, and the computing unit adjacent to the second end 410a2 in the first row of computing units 4101 and the computing unit adjacent to the second end 410a2 in the second row of computing units 4102 are respectively electrically connected to the first conductive piece 415, so as to connect the first row of computing units 4101 and the second row of computing units 4102 in series with each other.

[0092] In some examples, the first conductive piece 415 can be a one-piece structure, and the computing unit adjacent to the second end 410a2 in the first row of computing units 4101 and the computing unit adjacent to the second end 410a2 in the second row of computing units 4102 are respectively electrically connected to the first conductive piece 415, so as to connect the first row of computing units 4101 and the second row of computing units 4102 in series with each other. ​

[0093] Exemplarily, the material of the first conductive member 415 can adopt copper, aluminum or silver.

[0094] It should be noted that the above is only an exemplary description, and the skilled in the art can adopt any type of conductive material known at present or in the future for the selection of the material of the first conductive member 415, for example, gold, platinum or conductive polymer with conductive properties, etc.

[0095] Figure 3 Exemplarily, a connection diagram of the computing module and the power module of the embodiment of the present application is provided, as shown in Figure 2 and Figure 3 In an embodiment, the first end 410a1 of the board body 410a is provided with a plug end 411, and the plug end 411 is used for plug-in cooperation with the plug interface of the power module 300.

[0096] Through the above embodiment, the computing board 410 and the power module 300 do not need to be connected by wires, which simplifies the connection mode of the computing board 410 and the power module 300, improves the disassembly and assembly convenience between them, and is convenient for subsequent maintenance and maintenance.

[0097] In an embodiment, the computing unit adjacent to the first end 410a1 in the first row of computing units 4101 and the computing unit adjacent to the first end 410a1 in the second row of computing units 4102 are electrically connected to the plug end 411 through the second conductive member 416.

[0098] Exemplarily, the plug end 411 can include a positive electrode connection end 411a and a negative electrode connection end 411b, and the second conductive member 416 can include a positive electrode conductive member 416a and a negative electrode conductive member 416b, the positive electrode conductive member 416a is electrically connected to the positive electrode connection end 411a, and the negative electrode conductive member 416b is electrically connected to the negative electrode connection end 411b.

[0099] In some examples, the positive electrode contact end 411a is arranged adjacent to the upper side edge of the plate body 410a, and the negative electrode contact end 411b is arranged adjacent to the lower side edge of the plate body 410a. The positive electrode conductive member 416a is arranged adjacent to the upper side edge of the plate body 410a, and the negative electrode conductive member 416b is arranged adjacent to the lower side edge of the plate body 410a. The positive electrode conductive member 416a is electrically connected with the positive electrode contact end 411a, and the positive electrode conductive member 416a is electrically connected with the computing unit 410b adjacent to the first end 410a1 of the first row of computing units 4101. The negative electrode conductive member 416b is electrically connected with the negative electrode contact end 411b, and the negative electrode conductive member 416b is electrically connected with the computing unit 410b adjacent to the first end 410a1 of the second row of computing units 4102. In this way, the current direction can flow from the computing unit 410b adjacent to the first end 410a1 of the first row of computing units 4101 to the computing unit 410b adjacent to the second end 410a2, and then flow from the computing unit adjacent to the second end 410a2 of the second row of computing units 4102 to the computing unit 410b adjacent to the first end 410a1.

[0100] In other examples, the negative electrode contact end 411b is arranged adjacent to the upper side edge of the plate body 410a, and the positive electrode contact end 411a is arranged adjacent to the lower side edge of the plate body 410a. The negative electrode conductive member 416b is arranged adjacent to the upper side edge of the plate body 410a, and the positive electrode conductive member 416a is arranged adjacent to the lower side edge of the plate body 410a. The positive electrode conductive member 416a is electrically connected with the positive electrode contact end 411a, and the positive electrode conductive member 416a is electrically connected with the computing unit 410b adjacent to the first end 410a1 of the second row of computing units 4102. The negative electrode conductive member 416b is electrically connected with the negative electrode contact end 411b, and the negative electrode conductive member 416b is electrically connected with the computing unit 410b adjacent to the first end 410a1 of the first row of computing units 4101. In this way, the current direction can flow from the computing unit 410b adjacent to the first end 410a1 of the second row of computing units 4102 to the computing unit 410b adjacent to the second end 410a2, and then flow from the computing unit 410b adjacent to the second end 410a2 of the first row of computing units 4101 to the computing unit 410b adjacent to the first end 410a1.

[0101] Exemplarily, the material of the second conductive member 416 can be copper, aluminum or silver.

[0102] It should be noted that the above is only an exemplary description, and for the selection of the material of the first conductive member 415, a person skilled in the art can use any type of conductive material known at present or known in the future, for example, gold, platinum or conductive polymers with conductive properties, etc.

[0103] Figure 4 Exemplarily, a partial structure enlarged schematic view of the computing module of the computing module according to the embodiment of the present application is provided, as shown inFigure 4 As shown, the positive connection end 411a can be electrically connected to the positive conductive part 416a through a conductive row 417, for example. The conductive row 417 can be a one-piece structure, or the conductive row 417 can include a plurality of conductive pieces electrically connected in sequence, with a gap between adjacent two conductive pieces, and the adjacent two conductive pieces are electrically connected through a trace on the board 410a.

[0104] In an embodiment, as shown in FIG. 4, the plug-in end 411 further includes a detection connection end 419b. Figure 4 As shown, the plug-in end 411 further includes a backup connection end 419a.

[0105] For example, the backup connection end 419a can be disposed between the positive connection end 411a and the negative connection end 411b. The size of the backup connection end 419a in the first direction L1 is greater than or equal to the size of the positive connection end 411a and the negative connection end 411b in the first direction L1.

[0106] It should be noted that the backup connection end 419a is electrically insulated from the positive connection end 411a, the negative connection end 411b, the positive conductive part 416a, the negative conductive part 416b, the computing unit 410b, and other components on the board 410a, respectively, that is, the backup connection end 419a is not conductive with any component on the board 410a. The backup connection end 419a is used to electrically connect with any one of the positive connection end 411a or the negative connection end 411b in the case of damage or failure of the positive connection end 411a or the negative connection end 411b, to serve as a backup connection end.

[0107] In this way, the maintenance convenience of the computing power board 410 in the case of failure can be improved.

[0108] In an embodiment, as shown in FIG. 4, the plug-in end 411 further includes a detection connection end 419b. Figure 4 As shown, the plug-in end 411 further includes a backup connection end 419a.

[0109] For example, the detection connection end 419b is disposed between the positive connection end 411a and the negative connection end 411b. The detection connection end 419b is disposed side by side and spaced apart from the backup connection end.

[0110] The distance between the edge of the first end 410a1 of the plate body 410a adjacent to the connection end 419b and the edge of the plate body 410a at the first end 410a1 is greater than the distance between the edge of the first end 410a1 of the plate body 410a adjacent to the positive and negative connection ends 411a and 411b and the edge of the plate body 410a at the first end 410a1. In other words, the edge of the first end 410a1 of the plate body 410a adjacent to the connection end 419b is arranged farther away from the edge of the plate body 410a at the first end 410a1 than the edge of the first end 410a1 of the plate body 410a adjacent to the positive and negative connection ends 411a and 411b.

[0111] The distance between the edge of the first end 410a1 of the plate body 410a away from the connection end 419b and the edge of the plate body 410a at the first end 410a1 is equal to the distance between the edge of the first end 410a1 of the plate body 410a away from the positive and negative connection ends 411a and 411b and the edge of the plate body 410a at the first end 410a1. In other words, the edge of the first end 410a1 of the plate body 410a away from the connection end 419b is flush with the edge of the first end 410a1 of the plate body 410a away from the positive and negative connection ends 411a and 411b, respectively.

[0112] Exemplarily, a terminal corresponding to the detection connection end 419b is arranged in the plug-in interface 303 of the power supply module 300. When the plug-in end 411 is not completely plugged into the plug-in interface 303 of the power supply module 300, and the detection connection end 419b does not form an electrical contact with the terminal in the plug-in interface 303, the detection connection end 419b outputs a first level signal. When the plug-in end 411 is completely plugged into the plug-in interface 303 of the power supply module 300, and the detection connection end 419b forms an electrical connection with the corresponding terminal in the plug-in interface 303 of the power supply module 300, the detection connection end 419b outputs a second level signal. One of the first level signal and the second level signal can be a low level signal, and the other can be a high level signal.

[0113] Therefore, according to the level signal output by the detection connection end 419b, it can be judged whether the plug-in end 411 of the computing power plate 410 is properly plugged into the plug-in interface 303 of the power supply module 300, thereby realizing detection of whether the computing power plate 410 and the power supply module are properly assembled.

[0114] In an embodiment, as shown in FIG. 4, the width dimension of the plate body 410a is greater than the width dimension of the plug-in end 411. Figure 4

[0115] ​Exemplarily, the plug-in end 411 is formed by extending outwardly along the side of the first end 410a1 of the plate body 410a, and the plug-in end 411 has a cross-sectional difference with the two side edges of the plate body 410a in the width direction of the plate body 410a respectively.

[0116] It should be noted that the plug-in end 411 is used to be electrically connected with the plug-in interface 303 of the power module 300. Since the plug-in interface 303 of the power module 300 adopts a standardized electrical connection interface, the width size of the plug-in end 411 needs to be set according to the standardized electrical connection interface. By setting the width size of the plate body 410a to be greater than the width size of the plug-in end 411, the plate body 410a can have a larger heat dissipation area in the width direction, thereby improving the heat dissipation capability of the plate body 410a itself.

[0117] In an embodiment, as shown in Figure 1 and Figure 2 , the plate body 410a is provided with a plurality of connecting holes 412, and the connecting holes 412 are used for the fasteners to pass through to mount the heat dissipation structure 420 to the plate body 410a.

[0118] Exemplarily, the plurality of computing units 410b are arranged in two rows, and the two rows of computing units 410b are arranged at intervals in the width direction of the plate body 410a. Among them, the plurality of connecting holes 412 are arranged between the two rows of computing units, and the plurality of connecting holes 412 are arranged at intervals along the first direction L1.

[0119] In some examples, the plurality of connecting holes 412 can be arranged on the center line of the plate body 410a in the width direction. The plurality of connecting holes 412 are arranged at equal intervals.

[0120] In an embodiment, as shown in Figure 3 , in the embodiment of the present application, the computing module further comprises at least one heat dissipation structure 420, and the heat dissipation structure 420 is arranged on at least one side of the plate body 410a. The heat dissipation structure 420 is in thermal connection with the computing power plate 410. For example, the heat dissipation structure 420 is in contact with the computing power plate 410, or there is a small gap between them, so that the heat dissipation structure 420 and the computing power plate 410 can exchange heat. During the working process of the computing power plate 410, the heat dissipation structure 420 absorbs the heat generated by the computing power plate 410 and conducts the heat to the cavity inside the shell assembly.

[0121] Exemplarily, the heat dissipation structure 420 can include a heat dissipation plate and a heat dissipation fin group arranged on the heat dissipation plate. The heat dissipation plate and the heat dissipation fin group can be two pairs, and the two pairs of heat dissipation plate and heat dissipation fin group are arranged on opposite sides of the plate body 410a. Each heat dissipation fin group includes a plurality of heat dissipation fins 421 arranged at intervals. A plurality of through holes corresponding to the plurality of connecting holes 412 are formed on the heat dissipation plate, and the fastening screws 422 pass through the through holes and are connected with the corresponding connecting holes 412 to fixedly connect the heat dissipation plate with the surface of the plate body 410a.

[0122] In some examples, the material of the heat dissipation structure 420 can be selected as aluminum to adapt to application scenarios with high requirements for weight control.

[0123] In other examples, the material of the heat dissipation structure 420 can be selected as copper to obtain better heat dissipation performance.

[0124] It should be noted that the above selection of the material of the heat dissipation structure 420 is only illustrative and does not constitute a limitation on the present application. Those skilled in the art can flexibly select the material of the heat dissipation structure 420 according to the actual situation to achieve the heat dissipation effect of the computing power plate 410.

[0125] Exemplarily, between any two adjacent heat dissipation fins 421 in each heat dissipation fin group, a flow guiding gap can be defined, and the extension direction of the flow guiding gap can be arranged parallel to the vertical direction.

[0126] Exemplarily, in each heat dissipation fin group, the plurality of heat dissipation fins 421 can be arranged side by side along the first direction L1, and any two adjacent heat dissipation fins are spaced apart from each other. The heat dissipation fin 421 can be in the shape of a sheet, and the plane on which the heat dissipation fin 421 is arranged is parallel to the vertical direction. In this way, a flow guiding gap can be defined between any two adjacent heat dissipation fins 421, and the airflow can quickly pass through the flow guiding gap when flowing through the heat dissipation fin group, thereby increasing the contact area between the airflow and the heat dissipation fin 421 on one hand, and ensuring the flow rate of the airflow on the other hand, thereby increasing the heat exchange efficiency between the airflow and the heat dissipation structure 420.

[0127] In some examples, the heat dissipation structure 420 can include one heat dissipation fin group arranged on the side surface of the computing power plate 410 where the computing unit is arranged, and the heat dissipation fin group can include a plurality of heat dissipation fins 421 arranged at intervals.

[0128] In other examples, the heat dissipation structure 420 can include two heat dissipation fin groups, and the two heat dissipation fin groups can be arranged on opposite sides of the computing power plate 410. Each heat dissipation fin group can include a plurality of heat dissipation fins 421 arranged at intervals.

[0129] In one specific example, the heat dissipation structure 420 can include two groups of heat dissipation fins in parallel arrangement along the first direction L1 and in thermal connection with the computing power board 410. The two groups of heat dissipation fins can be respectively arranged on opposite sides of the computing power board 410 along the second direction L2, and each group of heat dissipation fins can include a plurality of heat dissipation fins 421 arranged at intervals. The material of the heat dissipation fins 421 can be a metal with high thermal conductivity, such as aluminum, copper, silver, etc. The surface of the heat dissipation fins 421 can be treated, such as coated with a thermal conductive coating or increased in surface roughness, to further improve the heat dissipation efficiency. In addition, the thickness and spacing of the heat dissipation fins 421 can be designed by those skilled in the art according to specific heat dissipation requirements, and the material and thickness of the heat dissipation fins 421 are not specifically limited in the embodiments of the present application to achieve the function of ensuring heat dissipation performance.

[0130] For example, referring to Figure 3 , the heat dissipation structure 420 can further include a plurality of support beams 430 arranged at the bottom of the computing power board 410. The plurality of support beams 430 are arranged at intervals along the first direction L1, and each support beam 430 extends along the second direction L2, and each support beam 430 is supported on the bottom wall of the cavity.

[0131] Thus, stable support can be provided for the installation of the computing module 400 in the cavity inside the shell assembly, and the heat dissipation structure 420 can be kept separate from the bottom wall of the cavity of the shell assembly to avoid the adverse effects of the high-temperature heat dissipation fins 421 contacting the bottom wall of the shell assembly, while ensuring that the airflow generated by the fan 200 can flow through the gap between the heat dissipation fins 421 and the inner wall of the shell assembly, improving the heat dissipation efficiency.

[0132] In one embodiment, as shown in Figure 4 , the computing power board 410 further includes a first connector 413 for communication connection with the data line of the control circuit board 530.

[0133] In the embodiments of the present application, the control circuit board 530 sends computing tasks and processing data to the computing power board 410 through the data line. After receiving the computing tasks and processing data through the first connector 413, the plurality of computing units 410b perform operation processing in sequence. The operation processing sequence of the plurality of computing units 410b is arranged in the opposite direction of the series connection of the power transmission.

[0134] For example, the first connector 413 can be arranged adjacent to the first end 410a1 of the board body 410a. The first connector 413 can be located between the positive conductive member 416a and the negative conductive member 416b.

[0135] In this way, the distance between the first connector 413 and the plug-in end 411 can be shortened, thereby shortening the length of the wiring between the first connector 413 and the plug-in end 411.

[0136] In some examples, the first connector 413 can be centrally arranged between the positive conductive member 416a and the negative conductive member 416b.

[0137] In other examples, the first connector 413 can be arranged between the positive conductive member 416a and the negative conductive member 416b, and the first connector 413 is arranged adjacent to the positive conductive member 416a.

[0138] In yet other examples, the first connector 413 can be arranged between the positive conductive member 416a and the negative conductive member 416b, and the first connector 413 is arranged adjacent to the negative conductive member 416b.

[0139] It should be noted that the above is only an exemplary description, and the specific arrangement position of the first connector 413 on the board body 410a can be flexibly arranged by those skilled in the art according to actual conditions.

[0140] In an embodiment, as shown in Figure 4 The computing power board 410 further comprises a second connector 414 for electrically connecting with a cable of a temperature detection unit of the computing device.

[0141] In the embodiments of the present application, the temperature detection unit of the computing device can be multiple and distributed at different positions of the computing device.

[0142] In some examples, the bottom of the housing assembly of the computing device can be provided with an ambient temperature detection unit for detecting the ambient temperature of the environment in which the computing device is located.

[0143] In other examples, the temperature detection unit can be arranged at the air inlet and / or air outlet of the computing device for detecting the air inlet temperature and / or air outlet temperature of the computing device.

[0144] In yet other examples, the computing power board 410 of the computing module can further be provided with a temperature detection unit for detecting the temperature of the computing power board 410 during operation. For example, as shown in Figure 1 The computing power board 410 further comprises a temperature sensor 418, which can be arranged at the central position of the board body 410a, so that the temperature value detected by the temperature sensor 418 conforms to the average temperature of the board body 410a.

[0145] It should be noted that the above is only an exemplary description and should not be construed as a limitation on the present application. In other examples of the present application, a person skilled in the art can flexibly set the setting position of the temperature detection unit according to the actual situation. For example, the temperature detection unit can be set at multiple positions in the bottom of the shell assembly, the air inlet, the air outlet, and the computing power board 410. In addition, the temperature detection unit can also be set in other positions of the computing device, such as the inside of the control module 500.

[0146] In some examples, the computing power board 410 can supply power to the temperature detection unit through the cable connected with the second connector 414.

[0147] In other examples, the computing power board 410 can not only supply power to the temperature detection unit through the cable connected with the second connector 414, but also receive the temperature detection result from the temperature detection unit through the cable connected with the second connector 414, and transmit the temperature detection result to the control module of the computing device.

[0148] Exemplarily, the control module controls the working parameters of the computing power board 410 and the fan according to the temperature detection result. For example, in the case that the temperature detection result of the ambient temperature detection unit 70 is lower than the corresponding temperature threshold, the control module can control the computing power board 410 to increase the operating frequency or control the fan to increase the rotating speed, so as to increase the temperature of the warm air discharged from the air outlet. For another example, in the case that the temperature of the temperature sensor 418 is higher than the corresponding temperature threshold, the control module can control the computing power board 410 to decrease the operating frequency or control the fan to increase the rotating speed, so as to decrease the heat amount of the computing power board 410 or improve the air cooling effect of the fan on the computing power board 410.

[0149] Figure 5 An example is provided to show the exploded view of the computing device 1 without the shell according to the embodiments of the present application. As shown in the figure, the computing device 1 provided by the embodiments of the present application includes the shell assembly 100 and the computing module 400 of the above-mentioned embodiments. The inside of the shell assembly 100 is defined as a cavity, and the computing module 400 is arranged in the cavity. Figure 5

[0150] Exemplarily, the computing device 1 further includes the fan 200. The inside of the shell assembly 100 is defined as a cavity, and the shell assembly 100 is provided with an air outlet communicating with the cavity. The fan 200 is arranged in the cavity and is used to generate an airflow flowing through the computing module 400, and the airflow is discharged from the air outlet. The shell assembly 100 is also provided with an air inlet communicating with the cavity. By arranging the air inlet and the air outlet, an air duct is formed in the cavity. During the operation of the fan 200, the airflow flows in the air duct, i.e., flows in the direction from the air inlet to the air outlet.

[0151] ​Exemplarily, the computing device 1 further comprises a power module 300, the power module 300, the computing module 400 and the fan 200 are arranged in the shell assembly 100.

[0152] In some examples, the shell assembly 100 can comprise an inner shell, and the computing module 400, the power module 300 and the fan 200 of the computing device 1 can be arranged in the frame structure of the inner shell in a screw connection manner. In the screw connection manner, the fixing of the modules of the computing device 1 is more stable, and the computing device 1 can be ensured not to be affected by vibration or impact during transportation.

[0153] In other examples, the computing module 400, the power module 300 and the fan 200 of the computing device 1 can be arranged in the frame structure of the inner shell in a snap connection manner. In the snap connection manner, the installation and disassembly of the modules of the computing device 1 are more convenient, which is conducive to the maintenance and replacement of the modules of the computing device 1.

[0154] It should be noted that the above is only an exemplary description, and the embodiments of the present application do not specifically limit the connection manner of the functional modules of the computing device 1 and the inner shell, and a person skilled in the art can flexibly select other connection manners according to actual needs.

[0155] Referring to Figures 1 to 4 , the inside of the shell assembly 100 can define a cavity of the computing device 1, and the cavity can be in communication with the outside of the computing device 1 through the air inlet and the air outlet. The functional modules such as the computing module 400, the power module 300 and the fan 200 can be arranged in the cavity of the shell assembly 100, and the shell assembly 100 provides fixing and protection.

[0156] According to the computing device 1 provided by the embodiments of the present application, the air inlet and the air outlet in communication with the internal cavity are formed on the shell assembly 100, the computing module 400 and the fan 200 are integrated in the shell assembly 100, and the fan 200 can generate a flowing air current from the air inlet to the air outlet. The air current flows through the computing module 400 in the flowing process to take away the heat generated by the computing module 400, thereby achieving cooling of the computing module 400. In addition, the hot air discharged from the air outlet of the shell assembly 100 can be used for heating, thereby realizing the reuse of the heat generated by the computing module 400, and improving the energy utilization rate of the computing device 1.

[0157] Regarding the relative position relationship between the fan 200 and the computing module 400, the fan 200 can be arranged on the upper side of the computing module 400, and in order to correspondingly arrange the air outlet with the air outlet direction of the fan 200, the air outlet can be arranged adjacent to the top of the shell assembly 100. The air outlet arranged adjacent to the top of the shell assembly 100 can be understood as that the distance between the air outlet and the top of the shell assembly 100 is less than the distance between the air outlet and the bottom of the shell assembly 100.

[0158] In some examples, the fan 200 and the computing module 400 are arranged in a vertical direction. The fan 200 can be located directly above the computing module 400. In this case, the fan 200 is arranged adjacent to a top wall inside the cavity of the housing assembly 100, and the computing module 400 is arranged adjacent to a bottom of the cavity of the housing assembly 100. The air outlet is arranged on a side of the housing assembly 100 and adjacent to the top, so that the air outlet is arranged in correspondence with the air outlet direction of the fan 200.

[0159] In other examples, the fan 200 and the computing module 400 are arranged in a vertical direction. The fan 200 can be located diagonally above the computing module 400. The air outlet is arranged on a side of the housing assembly 100 and adjacent to the top, so that the air outlet is arranged in correspondence with the air outlet direction of the fan 200.

[0160] In the description of the present application, the vertical direction can be consistent with the direction of gravity or height, that is, the direction perpendicular to the horizontal upward or downward. It can be understood that, relative to lower temperature air, higher temperature air has lower density and generally floats upward. By using the above examples, during operation of the fan 200, an air flow path from bottom to top can be formed inside the housing assembly 100, which is in cooperation with the natural upward direction of the higher temperature air, so that the warm air flowing through the computing module 400 is more easily discharged, and the heat reflux inside the housing assembly 100 can be reduced, thereby improving the cooling and heating efficiency of the computing device 1.

[0161] It should be noted that the above examples are only exemplary descriptions and cannot be understood as limitations of the present application. Regarding the relative position relationship between the fan 200 and the computing module 400, in other examples of the present application, the fan 200 and the computing module 400 can also be arranged side by side in a horizontal direction, and a person skilled in the art can flexibly arrange them according to the shape of the housing assembly 100 and the layout of the internal space.

[0162] Exemplarily, the fan 200 can be a cross-flow fan, and the air inlet direction of the air inlet and the air outlet direction of the air outlet are perpendicular to each other.

[0163] In some examples, the cross-flow fan 200 can be arranged inside the cavity of the housing assembly 100 and can be used to generate air flow flowing from the air inlet to the air outlet. In this case, the air inlet direction of the air inlet and the air outlet direction of the air outlet can be perpendicular to each other. Specifically, the cross-flow fan can be provided with a cylindrical impeller filled with blades inside. The impeller is driven to rotate by a motor, so that the air flow enters the cross-flow fan from the air inlet and is finally discharged from the air outlet. During operation of the cross-flow fan, the air flow generated by the cross-flow fan can rise from the bottom of the housing assembly 100, flow through the computing module 400 and the power module 300, enter the air inlet of the fan 200, and then be blown to the outside of the housing assembly 100 through the air outlet, so as to carry away the heat generated by the computing module 400 and the power module 300.

[0164] It can be understood that the cross-flow fan is also called a cross-flow fan or a tangential flow fan, which is a fan with a special structure. Its working principle is to make the air in the fan wheel flow along the radial direction of the fan wheel. Through the action of the fan impeller, the airflow makes a curved flow inside the impeller, and the airflow is obtained at the outlets on both sides of the fan wheel. The cross-flow fan usually has a relatively long cylindrical impeller with a relatively small diameter. Since the cross-flow fan has the advantages of uniform air volume, low noise, compact structure, etc., by adopting the cross-flow fan as the fan 200, the uniformity of the air volume of the warm air blown out of the air outlet can be improved, the noise during the operation of the computing device 1 can be reduced, and the size of the computing device 1 can be reduced to reduce the space occupation.

[0165] It should be noted that in other examples of the present application, the fan 200 is not limited to using a cross-flow fan, but can also use an axial flow fan, a centrifugal fan, a mixed flow fan, a cross-flow fan, or other types of fans such as a bladeless fan, etc. for generating airflow flowing from the air inlet to the air outlet.

[0166] Exemplarily, the cavity can include a first sub-cavity and a second sub-cavity in communication, the first sub-cavity can be located on the upper side of the second sub-cavity, the fan 200 can be arranged in the first sub-cavity, and the computing module 400 can be arranged in the second sub-cavity.

[0167] Exemplarily, the interior of the shell assembly 100 can adopt a frame structure, and the interior of the shell assembly 100 can be defined by the frame structure to include a first sub-cavity and a second sub-cavity in communication. The first sub-cavity can be located on the upper side of the second sub-cavity in the vertical direction, and the fan 200 can be arranged in the first sub-cavity along the first direction L1. The second sub-cavity can be located on the lower side of the first sub-cavity in the vertical direction, and the power module 300 and the computing module 400 can be electrically connected to each other and arranged adjacent to each other in the second sub-cavity along the first direction L1.

[0168] In the embodiments of the present application, the opening position of the air outlet can be correspondingly arranged with the position of the air exhaust area of the fan 200, and the opening size can be correspondingly arranged according to the area size of the air exhaust area of the fan 200, so as to ensure that the airflow exhausted by the fan 200 can be exhausted from the interior of the shell assembly 100, avoid the high-temperature airflow to stay or form vortex in the shell assembly 100, and thus avoid affecting the heat dissipation effect of the computing device 1.

[0169] In the embodiments of the present application, in order to ensure that the airflow generated by the fan 200 can flow through the computing module 400 and the power module 300, the position of the air inlet needs to be determined according to the arrangement mode of the computing module 400 and the power module 300 in the shell assembly 100 and the position of the air outlet.

[0170] In order to utilize the principle of natural rising of higher temperature air, the fan 200 can be located above the computing module 400 and the power module 300 in the vertical direction, and the air outlet can be located above the air inlet in the vertical direction, so that the computing module 400 and the power module 300 can be located above the air inlet and below the air outlet in the vertical direction, so that the airflow generated by the fan 200 can flow through the computing module 400 and the power module 300 during the process of flowing from the air inlet to the air outlet. During the operation of the fan 200, the air inlet direction at the air inlet can be set to the direction towards the computing module 400 and the power module 300.

[0171] In some embodiments, when the fan 200 is arranged on the upper side of the computing module 400 and the power module 300, the air inlet of the fan 200 can be opened at the bottom of the housing assembly 100. During the operation of the fan 200, the airflow generated by the fan 200 can rise from the bottom of the housing assembly 100, flow through the second sub-cavity in which the computing module 400 and the power module 300 are installed, and then be blown to the outside of the housing assembly 100 through the first sub-cavity in which the fan 200 is installed, so as to carry away the heat generated by the computing module 400 and the power module 300.

[0172] For example, the opening position of the air inlet at the bottom of the housing assembly 100 can correspond to the installation position of the computing module 400, and the opening size thereof can be designed according to the size of the heat dissipation area of the computing module 400, so as to ensure that the low-temperature airflow can uniformly flow through the heat dissipation area of the computing module 400.

[0173] For example, the opening position of the air inlet at the bottom of the housing assembly 100 can correspond to the installation position of the computing module 400 and the power module 300, and the opening size thereof can be designed according to the size of the heat dissipation area of the computing module 400 and the heat dissipation area of the power module 300, so as to ensure that the low-temperature airflow can uniformly flow through the heat dissipation area of the computing module 400 and the heat dissipation area of the power module 300.

[0174] Other configurations of the computing device 1 of the above embodiments can be implemented by various technical solutions known to those skilled in the art now and in the future, which will not be described in detail here.

[0175] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "central", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of facilitating the description of the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0176] In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0177] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection, or communication; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0178] In the present application, unless otherwise explicitly specified and limited, the first feature "above" or "below" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "above", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0179] It is to be understood that even though various steps of the methods of the present application are described in a particular order in the drawings, this is not required or implied in any way as to the order of the steps described, or that all of the described steps be performed, to realize the desired results. Additional or alternative steps can be employed or certain steps can be omitted, various steps can be combined into a single step, and / or a single step can be separated into multiple steps, etc. The above-described diagrams are merely schematic illustrations of the processes included in the methods according to the exemplary embodiments of the present application, and are not intended to be limiting. It is readily understood that the processes shown in the above-described diagrams do not indicate or limit the time sequence of the processes. In addition, it is readily understood that the processes can be executed synchronously or asynchronously, for example, in multiple modules.

[0180] The above disclosure provides many different embodiments or examples for implementing different structures of the present application. For the purpose of simplicity, the elements and settings of the particular examples in the above are described in some detail. This is, of course, done without loss of generality and is merely intended to provide examples and not limitation. Moreover, the present application can repeat reference numerals and / or reference letters in different examples and this repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and / or settings discussed.

[0181] The above descriptions are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of various changes or replacements within the technical scope disclosed by the present application, and these should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A computing module, characterized by, A computing device is provided, including: a computing module, disposed in a housing assembly of the computing device, a length direction of the housing assembly being parallel to a first direction; the computing module including:

2. The computing module of claim 1, wherein, a computing board including a board body and a plurality of computing units; 3. The computing module of claim 1, wherein, wherein the plurality of computing units are disposed on a side surface of the board body, a length direction of the board body being parallel to the first direction, and a width direction of the board body being parallel to a vertical direction.

4. The computing module of claim 3, wherein, a ratio of a width dimension of the board body to a length dimension of the board body is less than or equal to 1 / 6.

5. The computing module of claim 4, wherein, the plurality of computing units are disposed on the side surface of the board body, and the plurality of computing units are arranged in at least one row, and the plurality of computing units in each row are adjacently arranged along the length direction of the board body.

6. The computing module of claim 3, wherein, the plurality of computing units are arranged in two rows, and the two rows of computing units are spaced apart in the width direction of the board body.

7. The computing module of claim 6, wherein, the two rows of computing units are connected in series.

8. The computing module of claim 4, wherein, the computing board further includes a plurality of conductive rows disposed on the side surface of the board body, and any two adjacent computing units in each row of the computing units are electrically connected by the conductive rows.

9. The computing module of claim 8, wherein, the number of the conductive rows is a plurality, and each of the conductive rows is disposed between any two adjacent computing units in each row of the computing units.

10. The computing module of claim 9, wherein, the board body includes a first end and a second end oppositely disposed in the length direction of the board body, and a computing unit adjacent to the second end in the first row of computing units is electrically connected to a computing unit adjacent to the second end in the second row of computing units by a first conductive member.

11. The computing module of claim 10, wherein, the first end of the board body is provided with a plug-in end for plug-in cooperation with a plug-in port of a power module.

12. The computing module of claim 11, wherein, a computing unit adjacent to the first end in the first row of computing units and a computing unit adjacent to the first end in the second row of computing units are electrically connected to the plug-in end by a second conductive member.

13. The computing module of claim 11, wherein, the plug-in end includes a positive electrode connection end and a negative electrode connection end, the second conductive member includes a positive electrode conductive member and a negative electrode conductive member, the positive electrode conductive member is electrically connected to the positive electrode connection end, and the negative electrode conductive member is electrically connected to the negative electrode connection end.

14. The computing module of claim 9, wherein, the plug-in end further includes a backup connection end, the backup connection end can be disposed between the positive electrode connection end and the negative electrode connection end, and a dimension of the backup connection end in the first direction is greater than or equal to dimensions of the positive electrode connection end and the negative electrode connection end in the first direction L1.

15. The computing module of claim 1, wherein, the plug-in end is further provided with a detection connection end, the detection connection end is disposed between the positive electrode connection end and the negative electrode connection end, and a distance between an edge of the detection connection end adjacent to the first end of the board body and an edge of the board body at the first end is greater than a distance between edges of the positive electrode connection end and the negative electrode connection end adjacent to the first end of the board body and an edge of the board body at the first end. a width dimension of the board body is greater than a width dimension of the plug-in end.

16. The computing module of claim 15, wherein, further including: at least one heat dissipation structure disposed on at least one side of the board body, the heat dissipation structure including a heat dissipation plate and a heat dissipation fin group. the board body is provided with a plurality of connection holes for fasteners to pass through to mount the heat dissipation structure on the board body.

17. The computing module of claim 16, wherein, The plurality of computing units are arranged in two rows, and the two rows of computing units are arranged at intervals in the width direction of the board body; wherein a plurality of connection holes are arranged between the two rows of computing units, and the plurality of connection holes are arranged at intervals along a first direction.

18. The computing module of claim 17, wherein, The plurality of connection holes are arranged on the center line of the board body in the width direction.

19. The computing module of any one of claims 1 to 18, wherein, The computing power board further comprises a first connector for communication connection with a data line of a control circuit board.

20. The computing module of claim 19, wherein, The first connector is arranged centrally between the positive electrode conductive member and the negative electrode conductive member of the second conductive member.

21. The computing module of any one of claims 1 to 18, wherein, The computing power board further comprises a second connector for electrical connection with a cable of a temperature detection unit of a computing device.

22. A computing device, comprising: Comprising: A housing assembly defining a cavity therein; The computing module according to any one of claims 1 to 21 is arranged in the cavity. The computing module according to any one of claims 1 to 21 is arranged in the cavity.

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