Chip inductor and power supply

Abstract

The utility model provides a chip inductor and a power source. The chip inductor comprises a mounting base, and the mounting base is provided with a containing cavity; the coil assembly is arranged in the accommodating cavity, and the coil assembly comprises a first coil and a second coil; and the retaining wall is arranged in the accommodating cavity and between the first coil and the second coil, and the retaining wall is provided with an opening to form an adsorption space for adsorbing the surface mounting device.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic technical field especially relates to a surface mount inductor and power supply. BACKGROUND

[0002] In switching power supply such as AC-DC power supply, inductor is generally assembled in the AC input end of power supply, and is mainly used for restraining common-mode electromagnetic interference.

[0003] The structure of inductor is similar to transformer, but only has one winding. In prior art, in order to meet various electrical technical indexes, barrier is arranged between the two end frames and coil in transformer respectively. But when inductor needs to be surface mounted on circuit board, the barrier cannot provide adsorption space for suction nozzle of surface mount device due to the obstruction of barrier. The existing scheme is to increase cover plate on the top of inductor, but the way of increasing cover plate increases cost and is not conducive to heat dissipation of inductor. SUMMARY

[0004] The application provides a surface mount inductor and power supply, and the surface mount inductor can provide adsorption space for surface mount device.

[0005] The application provides a surface mount inductor, which comprises:

[0006] The mounting seat has a receiving cavity;

[0007] The coil assembly is arranged in the receiving cavity, and the coil assembly comprises a first coil and a second coil;

[0008] The barrier is arranged in the receiving cavity and between the first coil and the second coil, and the barrier has an opening to form adsorption space.

[0009] The application further provides a power supply comprising the surface mount inductor.

[0010] The surface mount inductor and power supply provided by the application comprise a mounting seat, a coil assembly and a barrier. The mounting seat has a receiving cavity, the coil assembly is arranged in the receiving cavity, and the barrier is arranged between the first coil and the second coil of the coil assembly. The barrier has an opening to expose part of the mounting seat and form adsorption space, so that the surface mount device can be adsorbed. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to make the technical solutions in the embodiments of the present application clearer, the accompanying drawings needed in the embodiment description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and other accompanying drawings can be obtained by those skilled in the art without any creative effort on the basis of these accompanying drawings.

[0012] Figure 1 A first structure diagram of a patch inductor provided by an embodiment of the present application.

[0013] Figure 2 A second structure diagram of a patch inductor provided by an embodiment of the present application. DETAILED DESCRIPTION

[0014] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without any creative effort belong to the scope of protection of the present application.

[0015] An embodiment of the present application provides a patch inductor and a power supply, the patch inductor can provide an adsorption space for a surface mounted device to be adsorbed, which will be described in detail below with reference to the accompanying drawings.

[0016] Please refer to Figure 1 , Figure 1 A first structure diagram of a patch inductor provided by an embodiment of the present application.

[0017] An embodiment of the present application provides a patch inductor 100, which comprises a mounting seat 10, a coil assembly 20 and a barrier wall 30. The mounting seat 10 has a receiving cavity 11. The coil assembly 20 is arranged in the receiving cavity 11, and the coil assembly 20 comprises a first coil 21 and a second coil 22. The barrier wall 30 is arranged in the receiving cavity 11 and between the first coil 21 and the second coil 22, and the barrier wall 30 has an opening 31 to expose part of the structure of the mounting seat 10 to form an adsorption space for a surface mounted device (SMD) to be adsorbed. In the patch inductor 100 provided by the embodiment of the present application, there is no need to additionally add a cover plate on the top of the patch inductor 100, which is beneficial to heat dissipation of the patch inductor 100.

[0018] The chip inductor 100 can be fixed to the circuit board of the power supply by the surface mount technology (SMT) of the electronic circuit surface assembly technology, also known as the surface mounting or surface mounting technology. Specifically, the suction nozzle of the surface mount device is adsorbed on the mounting seat 10, the chip inductor 100 is moved to the surface of the printed circuit board (PCB) or the surface of other substrates, and is welded and assembled by reflow soldering or dip soldering and the like.

[0019] Please continue to refer to Figure 1 and Figure 2 , Figure 2 The second structure diagram of the chip inductor provided by the embodiment of the application is shown. The first coil 21 and the second coil 22 are indirectly connected to the live wire and the zero wire of the alternating current. In order to meet the safety requirements, a barrier wall 30 is added between the first coil 21 and the second coil 22. Specifically, the barrier wall 30 includes a first spacing portion 32 and a second spacing portion 33, and the first spacing portion 32 and the second spacing portion 33 are arranged in a spaced manner to form an opening 31. The first spacing portion 32 and the second spacing portion 33 are located between the minimum distance of the first coil 21 and the second coil 22. The distance between the first spacing portion 32 and the second spacing portion 33 is greater than or equal to 0.5 mm, that is, the width of the opening 31 is greater than or equal to 0.5 mm, so as to avoid the suction nozzle of the surface mount device.

[0020] The thickness of the barrier wall 30 is greater than or equal to 2.5 mm, so as to increase the safety distance.

[0021] The mounting seat 10 and the barrier wall 30 are both made of insulating materials, which can play an insulating shielding role and effectively protect the coil assembly 20 from electromagnetic interference during operation. Optionally, the mounting seat 10 and the barrier wall 30 can both be made of plastic materials. The plastic material has excellent insulating properties, and specifically, the above-mentioned mounting seat 10 and the barrier wall 30 can be one of polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polystyrene (PS) or acrylonitrile-butadiene-styrene copolymer (ABS).

[0022] The mounting seat 10 and the barrier wall 30 are integrally formed. The mounting seat 10 and the barrier wall 30 can be jointly prepared by injection molding, and the integrally formed manner can make the mounting seat 10 and the barrier wall 30 not easy to be disconnected, thereby improving the stability of the structure.

[0023] The coil assembly 20 comprises a magnetic core 23, and the first coil 21 and the second coil 22 are respectively wound on the magnetic core 23; the retaining wall 30 is further provided with at least one limiting slot, and the magnetic core 23 is clamped in the limiting slot to fix the relative position of the coil assembly 20 and the mounting seat 10, improve the tightness of the connection, and further improve the structural stability of the surface-mounted inductor.

[0024] Specifically, please refer to Figure 2 The magnetic core 23 comprises a first magnetic column 231, a first connecting portion 232, a second magnetic column 233 and a second connecting portion 234 connected in sequence, the first coil 21 is wound on the first magnetic column 231, the second coil 22 is wound on the second magnetic column 233, the retaining wall 30 is provided with a first limiting slot 34 and a second limiting slot 35, the first connecting portion 232 is clamped in the first limiting slot 34, and the second connecting portion 234 is clamped in the second limiting slot 35. The first spacing portion 32 is provided with the first limiting slot 34, and the second spacing portion 33 is provided with the second limiting slot 35. The first magnetic column 231, the first connecting portion 232, the second magnetic column 233 and the second connecting portion 234 can be integrally formed. The cross-sectional area of the first magnetic column 231 and the second magnetic column 233 can be the same, the cross-sectional area of the first connecting portion 232 and / or the second connecting portion 234 is larger than that of the first magnetic column 231 and / or the second magnetic column 233, and the first connecting portion 232 and the second connecting portion 234 can block the axial movement of the first coil 21 and the second coil 22.

[0025] The surface-mounted inductor 100 can form a common mode inductance, the first coil 21 and the second coil 22 are made of the same material and have the same number of turns. For the same coil, the first magnetic column 231 and the second magnetic column 233 are made of different materials, and their conduction rates are different, resulting in different sizes of the common mode inductance; the thicker the first magnetic column 231 and the second magnetic column 233, the larger the common mode inductance; for the same first magnetic column 231 and the second magnetic column 233, the larger the current passing through the coil and the more the number of turns, the larger the common mode inductance; for the same first magnetic column 231 and the second magnetic column 233, the common mode inductance formed is different due to different tightness of the coil winding.

[0026] The first coil 21 and the second coil 22 are made of enameled copper wire, enameled aluminum wire, flat copper wire or flat aluminum wire.

[0027] The surface-mounted inductor 100 can be surface-mounted on the surface of a printed circuit board or the surface of other substrates, and is welded and assembled by reflow soldering or immersion soldering. The surface-mounted inductor 100 is generally assembled in the AC input end of the power supply, mainly used for suppressing common mode electromagnetic interference and improving the stability of the power supply.

[0028] The patch inductor 100 and the power supply provided by the embodiments of the present application, the patch inductor 100 comprises a mounting seat 10, a coil assembly 20 and a retaining wall 30, the mounting seat 10 has a receiving cavity 11, the coil assembly 20 is arranged in the receiving cavity 11, the retaining wall 30 is arranged between the first coil 21 and the second coil 22 of the coil assembly 20, the retaining wall 30 has an opening 31 to expose part of the mounting seat 10 to form an adsorption space for surface mount devices to be adsorbed.

[0029] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0030] In the description of the present application, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features.

[0031] The patch inductor and the power supply provided by the embodiments of the present application are described in detail above. The principles and implementation modes of the present application are described by applying specific examples in this paper, and the above description of the embodiments is only used to help understand the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed, and the above description should not be understood as the limitation of the present application.

Claims

1. A patch inductor, characterized by, The application relates to a patch inductor, comprising: a mounting base having a receiving cavity; a coil assembly arranged in the receiving cavity, the coil assembly comprising a first coil and a second coil; a barrier wall arranged in the receiving cavity and between the first coil and the second coil, the barrier wall having an opening to form an adsorption space.

2. The patch inductor of claim 1, wherein, The barrier wall comprises a first spacing part and a second spacing part, the first spacing part and the second spacing part are arranged to form the opening, and the distance between the first spacing part and the second spacing part is greater than or equal to 0.5 mm.

3. The patch inductor of claim 1, wherein, The thickness of the barrier wall is greater than or equal to 2.5 mm.

4. The patch inductor of claim 1, wherein, The mounting base and the barrier wall are both made of insulating material.

5. The patch inductor of claim 1, wherein, The mounting base and the barrier wall are integrally formed.

6. The patch inductor according to any one of claims 1 to 5, wherein The coil assembly comprises a magnetic core, the first coil and the second coil are respectively arranged on the magnetic core, at least one limiting groove is arranged on the barrier wall, and the magnetic core is clamped in the limiting groove.

7. The patch inductor of claim 6, wherein, The magnetic core comprises a first magnetic column, a first connecting part, a second magnetic column and a second connecting part which are sequentially connected, the first coil is arranged on the first magnetic column, the second coil is arranged on the second magnetic column, the barrier wall is provided with a first limiting groove and a second limiting groove, the first connecting part is clamped in the first limiting groove, and the second connecting part is clamped in the second limiting groove.

8. The patch inductor according to any one of claims 1 to 5, wherein The first coil and the second coil are made of the same material and have the same number of turns.

9. The patch inductor of claim 8, wherein, The first coil and the second coil are made of enameled copper wire, enameled aluminum wire, flat copper wire or flat aluminum wire.

10. A power supply, characterized by, The application further relates to a patch inductor comprising any one of the patch inductors according to claims 1 to 9.

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