Automobile solid-state relay
By rationally arranging the first and second circuit boards in the automotive solid-state relay, and setting up finned heat sinks and input/output terminals, the problem of poor heat dissipation of internal electronic components was solved, achieving better heat dissipation and product miniaturization.
Patent Information
- Application Number
- CN202520017023.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-06
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2035-01-06
AI Technical Summary
The current automotive solid-state relays have an unreasonable internal electronic component layout, which prevents heat from being dissipated in time, resulting in increased temperature and reduced load capacity.
The layout of the first circuit board and the second circuit board is adopted. The high-power electronic components are placed on the first circuit board, and the finned heat sink is set on the outer wall opposite to the inner wall of the housing. The input terminal and the output terminal are installed on the side of the first circuit board close to the second circuit board, so that their terminals pass through the second circuit board and extend out of the housing. The input terminal, the output terminal and the finned heat sink are reasonably arranged to improve the heat dissipation effect and reduce the size.
This improves the heat dissipation inside the relay while reducing the overall size, thus miniaturizing the product.
Smart Images

Figure CN223693048U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of automobile battery protection, especially relates to a solid state relay of automobile. BACKGROUND
[0002] Solid state relay (SSR) is a kind of electronic switch device, and it can control larger load current or voltage through smaller current control signal, and it can play important roles such as automatic regulation, safety protection and conversion circuit in circuit.
[0003] The electronic components in the existing solid state relay of automobile are not reasonably arranged, so that the heat generated by some high-power components during work cannot be discharged in time, which indirectly causes the temperature in the relay to rise and the load capacity to rapidly decrease. UTILITY MODEL CONTENT
[0004] The utility model solves the technical problems that provide a kind of solid state relay of automobile, can improve the heat dissipation effect.
[0005] In order to solve the above technical problems, the utility model adopts the technical scheme that:
[0006] A kind of solid state relay of automobile, including the hollow shell, the first circuit board, the second circuit board, input terminal stud and output terminal stud are arranged in the shell, the first circuit board and the second circuit board are sequentially arranged on the inner wall of shell, the first circuit board and the second circuit board are equipped with spacing, and the first circuit board and the second circuit board are electrically connected;
[0007] The first electronic component is electrically connected on the first circuit board, the second electronic component is electrically connected on the second circuit board, the power of the first electronic component is greater than the power of the second electronic component, the opposite outer wall of the inner wall of the shell is equipped with fin radiator, the input terminal stud and the output terminal stud are all installed on the side surface of the first circuit board close to the second circuit board, and the wiring end of the input terminal stud and the wiring end of the output terminal stud all pass through the second circuit board and extend to the outside of the shell.
[0008] Further, the input terminal stud and the output terminal stud are the same structure, the input terminal stud includes flat mounting portion and cylindrical wiring portion, the mounting portion is connected with the wiring portion, and the mounting portion and the wiring portion are perpendicular to each other, the mounting portion is installed on the first circuit board, and the wiring end of the wiring portion passes through the second circuit board and extends to the outside of the shell.
[0009] Further, the input terminal stud and the output terminal stud are respectively arranged on the opposite ends of the side surface of the first circuit board close to the second circuit board.
[0010] Further, edges of opposite ends of the second circuit board are inwardly recessed to form grooves for the input terminal post and the output terminal post to pass through.
[0011] Further, a plurality of conductive posts are arranged between the first circuit board and the second circuit board, and the first circuit board and the second circuit board are electrically connected through the conductive posts.
[0012] Further, the conductive posts are copper posts.
[0013] Further, the shell comprises a cover body having an opening at one end and being hollow inside, a bottom plate is arranged at the opening of the cover body, the first circuit board is arranged on the inner surface of the bottom plate, and the finned heat sink is arranged on the outer surface opposite to the inner surface of the bottom plate.
[0014] Further, a through slot is arranged on the bottom plate and is matched with the shape of the first circuit board, and the first circuit board is in contact with the finned heat sink.
[0015] Further, the bottom plate is a heat-conducting plate.
[0016] Further, the finned heat sink comprises a heat dissipation base plate and a plurality of heat dissipation fins arranged along the width direction of the heat dissipation base plate, the first electronic element comprises a plurality of MOS tubes, the plurality of MOS tubes are arranged in sequence along the width direction of the heat dissipation base plate, and a heat dissipation block is arranged between adjacent two heat dissipation fins of the heat dissipation base plate relative to the position of the MOS tube.
[0017] The utility model discloses the beneficial effect lies in:
[0018] The first circuit board and the second circuit board are arranged on the inner wall of the shell in sequence, the electronic element with small power is arranged on the second circuit board, the electronic element with large power is arranged on the first circuit board, the finned heat sink is arranged on the outer wall opposite to the inner wall of the shell, that is, the finned heat sink is arranged close to the first circuit board with the large-power electronic element, so that the heat dissipation effect of the internal components of the relay can be improved, the input terminal post and the output terminal post are arranged on the side surface of the first circuit board close to the second circuit board, the wiring end of the input terminal post and the wiring end of the output terminal post pass through the second circuit board and extend to the outside of the shell, so that the input terminal post and the output terminal post do not need additional space, and the overall size can be reduced, the first circuit board, the second circuit board, the input terminal post and the output terminal post are reasonably arranged, so that the heat dissipation effect of the internal components of the relay can be improved, and the overall size can be reduced, and the product can be miniaturized. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1The overall structure schematic diagram of the automobile solid-state relay in the utility model is shown in the figure.
[0020] Figure 2 The partial structure schematic diagram of the automobile solid-state relay in the utility model is shown in the figure.
[0021] Figure 3 The front view structure schematic diagram of the automobile solid-state relay in the utility model is shown in the figure. Figure 2
[0022] Figure 4 The structure schematic diagram of the input terminal post in the utility model is shown in the figure.
[0023] Figure 5 The structure schematic diagram of the bottom plate in the utility model is shown in the figure.
[0024] Figure 6 The structure schematic diagram of the second circuit board in the utility model is shown in the figure.
[0025] Figure 7 The structure schematic diagram of the fin heat sink in the utility model is shown in the figure.
[0026] Label explanation:
[0027] 1, shell; 11, bottom plate; 111, through slot; 2, first circuit board; 3, second circuit board; 31, recess; 4, input terminal post; 41, mounting portion; 42, terminal portion; 5, output terminal post; 6, fin heat sink; 61, heat dissipation base plate; 62, heat dissipation fin; 63, heat dissipation block; 7, conductive column. Specific implementation
[0028] In order to explain the technical content, the purpose and the effect of the utility model in detail, the following will be explained in combination with the embodiment and the drawings.
[0029] Please refer to Figure 1 and Figure 2 The technical scheme adopted by the utility model is:
[0030] An automobile solid-state relay, comprising a hollow shell, a first circuit board, a second circuit board, an input terminal post and an output terminal post are arranged in the shell, the first circuit board and the second circuit board are arranged on an inner wall of the shell in sequence, a spacing is arranged between the first circuit board and the second circuit board, and the first circuit board and the second circuit board are electrically connected.
[0031] The first circuit board is electrically connected with a first electronic component, the second circuit board is electrically connected with a second electronic component, the power of the first electronic component is greater than the power of the second electronic component, a fin radiator is arranged on the opposite outer wall of the inner wall of the shell, the input terminal and the output terminal of the input terminal and the output terminal are arranged on the side of the first circuit board close to the second circuit board, and the input terminal and the output terminal of the input terminal and the output terminal pass through the second circuit board and extend to the outside of the shell.
[0032] From the above description, the beneficial effects of the utility model are that:
[0033] The first circuit board and the second circuit board are arranged on the inner wall of the shell in sequence, the electronic component with small power is arranged on the second circuit board, and the electronic component with large power is arranged on the first circuit board, the fin radiator is arranged on the opposite outer wall of the inner wall of the shell, that is, the fin radiator is arranged close to the first circuit board with the large-power electronic component, so that the heat dissipation effect of the internal components of the relay can be improved, the input terminal and the output terminal are arranged on the side of the first circuit board close to the second circuit board, and the input terminal and the output terminal of the input terminal and the output terminal pass through the second circuit board and extend to the outside of the shell, so that the input terminal and the output terminal do not need additional space, and the overall volume can be reduced.
[0034] Further, the input terminal and the output terminal are the same structure, the input terminal comprises a flat mounting portion and a cylindrical terminal portion, the mounting portion is connected with the terminal portion, and the mounting portion and the terminal portion are perpendicular to each other, the mounting portion is mounted on the first circuit board, and the terminal end of the terminal portion passes through the second circuit board and extends to the outside of the shell.
[0035] From the above description, the input terminal comprises a flat mounting portion and a cylindrical terminal portion, and the flat mounting portion is mounted on the first circuit board, so that the stability of the installation of the input terminal and the output terminal is improved.
[0036] Further, the input terminal and the output terminal are arranged on the opposite two ends of the side of the first circuit board close to the second circuit board.
[0037] Further, the edges of the opposite two ends of the second circuit board are inwardly recessed to form grooves for the input terminal and the output terminal to pass through.
[0038] Furthermore, a plurality of conductive posts are provided between the first circuit board and the second circuit board, and the first circuit board and the second circuit board are electrically connected through the conductive posts.
[0039] As can be seen from the above description, the first circuit board and the second circuit board are electrically connected by conductive pillars, which not only enables the first circuit board and the second circuit board to form a stable support, but also further improves the stability of the overall structure.
[0040] Furthermore, the conductive pillar is a copper pillar.
[0041] Furthermore, the housing includes a cover with an opening at one end and a hollow interior, a base plate covering the opening of the cover, the first circuit board being mounted on the inner surface of the base plate, and the finned heat sink being mounted on the outer surface opposite to the inner surface of the base plate.
[0042] Furthermore, a through slot adapted to the shape of the first circuit board is provided on the base plate, and the first circuit board contacts the finned heat sink.
[0043] Furthermore, the base plate is a heat-conducting plate.
[0044] Furthermore, the finned heat sink includes a heat sink substrate and a plurality of heat sink fins arranged along the width direction of the heat sink substrate. The first electronic component is a plurality of MOS transistors, which are arranged sequentially along the width direction of the heat sink substrate. A heat sink block is provided between two adjacent heat sink fins of the heat sink substrate relative to the position of the MOS transistors.
[0045] As can be seen from the above description, by providing a heat sink between two adjacent heat sink fins on the heat sink substrate relative to the MOS transistor, the heat dissipation effect of the components on the first circuit board can be further improved, thereby further improving the overall heat dissipation effect.
[0046] Please refer to Figures 1 to 7 As shown, Embodiment 1 of this utility model is as follows:
[0047] Please refer to Figure 1 , Figure 2 and Figure 3 An automotive solid-state relay includes a hollow housing 1. Inside the housing 1, there are a first circuit board 2, a second circuit board 3, an input terminal 4, and an output terminal 5. The first circuit board 2 and the second circuit board 3 are sequentially disposed on an inner wall of the housing 1. There is a gap between the first circuit board 2 and the second circuit board 3, and the first circuit board 2 and the second circuit board 3 are electrically connected.
[0048] The first circuit board 2 is electrically connected with first electronic elements, the second circuit board 3 is electrically connected with second electronic elements, the power of the first electronic elements is greater than the power of the second electronic elements, the inner wall of the shell 1 is provided with fin radiators 6 on the opposite outer wall, the input terminal 4 and the output terminal 5 are both installed on the side of the first circuit board 2 close to the second circuit board 3, and the wiring end of the input terminal 4 and the wiring end of the output terminal 5 both pass through the second circuit board 3 and extend to the outside of the shell 1.
[0049] Please refer to Figure 4 , the input terminal 4 and the output terminal 5 are the same structure, the input terminal 4 includes a flat mounting portion 41 and a cylindrical wiring portion 42, the mounting portion 41 is connected with the wiring portion 42, and the mounting portion 41 and the wiring portion 42 are perpendicular to each other, the mounting portion 41 is installed on the first circuit board 2, and the wiring end of the wiring portion 42 passes through the second circuit board 3 and extends to the outside of the shell 1.
[0050] Please refer to Figure 2 and Figure 3 , the input terminal 4 and the output terminal 5 are respectively arranged on the opposite ends of the side of the first circuit board 2 close to the second circuit board 3.
[0051] Please refer to Figure 6 , the edges of the opposite ends of the second circuit board 3 are inwardly recessed to form recesses 31 for the input terminal 4 and the output terminal 5 to pass through respectively.
[0052] Please refer to Figure 2 , a plurality of conductive columns 7 are arranged between the first circuit board 2 and the second circuit board 3, and the first circuit board 2 and the second circuit board 3 are electrically connected through the conductive columns 7.
[0053] The conductive column 7 is a copper column.
[0054] Please refer to Figure 2 , the shell 1 includes a cover body with an opening at one end and a hollow inside, a bottom plate 11 (the material of the bottom plate 11 is aluminum) is arranged on the opening of the cover body, the first circuit board 2 is installed on the inner surface of the bottom plate 11, and the fin radiator 6 is installed on the outer surface opposite to the inner surface of the bottom plate 11.
[0055] Please refer to Figure 5 , a through slot 111 is arranged on the bottom plate 11 and is matched with the shape of the first circuit board 2, and the first circuit board 2 is in contact with the fin radiator 6.
[0056] The bottom plate 11 is a heat-conducting plate.
[0057] Please refer to Figure 7The finned radiator 6 comprises a heat dissipation base plate 61 and a plurality of heat dissipation fins 62 arranged along the width direction of the heat dissipation base plate 61, the first electronic components are a plurality of MOS tubes, the plurality of MOS tubes are arranged along the width direction of the heat dissipation base plate 61 in sequence, and the heat dissipation base plate 61 is provided with a heat dissipation block 63 between adjacent two heat dissipation fins 62 relative to the position of the MOS tube.
[0058] In summary, the automobile solid-state relay provided by the utility model, through setting the first circuit board and the second circuit board, the first circuit board and the second circuit board are sequentially arranged on an inner wall of the shell, and the electronic component with small power is arranged on the second circuit board, and the electronic component with large power is arranged on the first circuit board, since the electronic component with large power can generate a large amount of heat, therefore, the finned radiator is arranged on the opposite outer wall of the inner wall of the shell, that is, the finned radiator is arranged close to the first circuit board with the large-power electronic component, so that the heat dissipation effect of the internal components of the relay can be improved; the input terminal post and the output terminal post are both mounted on the side surface of the first circuit board close to the second circuit board, the wiring end of the input terminal post and the wiring end of the output terminal post both pass through the second circuit board and extend to the outside of the shell, so that the input terminal post and the output terminal post do not need additional space for placement, and the overall volume can be reduced; through the reasonable layout of the first circuit board, the second circuit board, the input terminal post and the output terminal post, the heat dissipation effect of the internal components of the relay can be improved, and the overall volume can be reduced, so that the product is miniaturized.
[0059] The above only describes the embodiments of the utility model, and does not limit the patent range of the utility model, and any equivalent transformation or direct or indirect application in the related technical field based on the content of the utility model specification and drawings is also included in the patent protection range of the utility model.
Claims
1. An automotive solid state relay, characterized by, The shell is internally hollow, and the shell is internally provided with a first circuit board, a second circuit board, an input terminal post and an output terminal post, the first circuit board and the second circuit board are sequentially arranged on an inner wall of the shell, a spacing is arranged between the first circuit board and the second circuit board, and the first circuit board is electrically connected with the second circuit board; The first circuit board is electrically connected with a first electronic element, the second circuit board is electrically connected with a second electronic element, the power of the first electronic element is greater than the power of the second electronic element, an opposite outer wall of the inner wall of the shell is provided with a fin heat sink, the input terminal post and the output terminal post are both mounted on a side surface of the first circuit board close to the second circuit board, and the terminal end of the input terminal post and the terminal end of the output terminal post both pass through the second circuit board and extend to the outside of the shell.
2. The automotive solid state relay of claim 1, wherein, The input terminal post and the output terminal post are the same in structure, the input terminal post comprises a flat mounting portion and a cylindrical terminal portion, the mounting portion is connected with the terminal portion, and the mounting portion and the terminal portion are perpendicular to each other, the mounting portion is mounted on the first circuit board, and the terminal end of the terminal portion passes through the second circuit board and extends to the outside of the shell.
3. The automotive solid state relay of claim 1, wherein, The input terminal post and the output terminal post are respectively arranged on opposite ends of a side surface of the first circuit board close to the second circuit board.
4. The automotive solid state relay of claim 3, wherein, The edges of opposite ends of the second circuit board are inwardly recessed to form grooves for the input terminal post and the output terminal post to pass through.
5. The automotive solid state relay of claim 1, wherein, A plurality of conductive columns are arranged between the first circuit board and the second circuit board, and the first circuit board and the second circuit board are electrically connected through the conductive columns.
6. The automotive solid state relay of claim 5, wherein, The conductive columns are copper columns.
7. The automotive solid state relay of claim 1, wherein, The shell comprises a cover body having an opening at one end and being internally hollow, a bottom plate is arranged on the opening of the cover body, the first circuit board is mounted on an inner surface of the bottom plate, and the fin heat sink is mounted on an outer surface opposite to the inner surface of the bottom plate.
8. The automotive solid state relay of claim 7, wherein, A through groove is formed on the bottom plate and is adapted to the shape of the first circuit board, and the first circuit board is in contact with the fin heat sink.
9. The automotive solid state relay of claim 7, wherein, The bottom plate is a heat-conducting plate.
10. The automotive solid state relay of claim 1, wherein, The fin heat sink comprises a heat dissipation base plate and a plurality of heat dissipation fins arranged along the width direction of the heat dissipation base plate, the first electronic element is a MOS tube, a plurality of MOS tubes are sequentially arranged along the width direction of the heat dissipation base plate, and a heat dissipation block is arranged between adjacent two heat dissipation fins of the heat dissipation base plate opposite to the position of the MOS tube.