Clamp for fixing wafer

Abstract

The utility model discloses a clamping apparatus for fixing a wafer, the clamping apparatus comprises a clamping seat and a clamping head, the clamping seat is connected with the clamping head, and the clamping head comprises three parts: an upper end head with a gradient, a middle part with an arc-shaped clamping groove, and a lower end part with a gliding gradient. According to the clamp for fixing the wafer provided by the utility model, on one hand, the stress stability of the wafer in the operation process is improved, and on the other hand, the surface friction force is increased; the fixture is made of a PFA carbon fiber material and is designed into an outer edge with a reasonable gradient, so that the problems of incomplete cleaning and the like caused by liquid splashing in the cleaning process are solved; two wafers can be fixed at a time, the wafer cleaning efficiency can be improved or special technical requirements in production can be met, and the beneficial effects of balanced stress, high friction force and efficient cleaning of the wafers in the operation process can be achieved.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing fixtures, and in particular to a wafer clamp. Background Technology

[0002] As transistor sizes shrink, wafer manufacturing processes become increasingly complex, placing ever higher demands on semiconductor wet cleaning technology. Cleaning processes are required before and after almost every step in chip manufacturing to remove surface contaminants and ensure wafer surface cleanliness. Therefore, the stability and friction resistance of wafer clamping mechanisms are crucial. Uneven clamping forces can damage the wafer; insufficient friction during clamping can lead to wafer detachment due to instability; liquid splashing at the clamping ends during cleaning can result in incomplete cleaning; and the high-speed rotation forces during cleaning significantly affect the stress on the wafer's outer edge due to the material of the clamping mold. All these factors necessitate high standards for the requirements and materials of wafer clamping molds. This invention proposes a clamp that can fit the outer edge of a wafer, which improves the stability of the wafer under stress during operation and increases surface friction. The clamp head is designed with an outer edge with a reasonable slope to prevent problems such as incomplete cleaning caused by liquid splashing during cleaning. The overall clamp design is made of PFA carbon fiber material, which has a higher coefficient of friction than ETFE material.

[0003] Furthermore, current wafer clamping accessories are often designed for the thickness of a single wafer. In actual production processes, to improve efficiency or meet technical requirements, it is necessary to clamp two layers of wafers simultaneously, and current clamping accessories cannot be used in such scenarios. Utility Model Content

[0004] In view of the current insufficient stability and friction of the fixtures used in the wafer cleaning process, this utility model provides a fixture for fixing wafers that can achieve the beneficial effects of balanced force and high friction.

[0005] To achieve the above objectives, the embodiments of this utility model adopt the following technical solutions:

[0006] A wafer fixing fixture, characterized in that it comprises: a fixture base and a fixture head, the fixture base being connected to the fixture head, the fixture head comprising three parts: an upper end with a slope, a middle part having an arc-shaped groove, and a lower end with a downward slope.

[0007] According to one aspect of the utility model, in the middle part of the arc-shaped card slot, the card slot fits seamlessly with the edge of the wafer.

[0008] According to one aspect of the utility model, the bottom portion of the middle part and the top portion of the lower part are connected at one point.

[0009] According to one aspect of the utility model, the top part of the upper end is horizontal, the circular side of the top part of the upper end is bevelled downward and extends to the bottom part of the upper end with a slope.

[0010] According to one aspect of the utility model, the angle between the slope and the horizontal line of the bottom part is α, and α ranges from 30 to 70 degrees.

[0011] According to one aspect of the utility model, the bottom part of the upper end is connected to the top part of the middle part, and the holder is connected to the chuck, that is, the top part of the holder is connected to the bottom part of the lower end of the chuck.

[0012] According to one aspect of the utility model, the height of the middle part with the circular arc-shaped slot is 1.4-1.6mm.

[0013] According to one aspect of the utility model, the holder is in the shape of a cylinder, the cross section of the chuck is circular, and the chuck is located on one side of the upper end of the holder and deviates from the central axis.

[0014] According to one aspect of the utility model, one side of the bottom part of the lower end of the chuck is connected to the outer edge of the holder, and the other side of the bottom part of the lower end of the chuck extends to the other outer edge of the holder, in the shape of a slope.

[0015] According to one aspect of the utility model, the material of the chuck is PFA or ETFE.

[0016] The utility model has the advantages that: the chuck is designed with a circular arc-shaped slot, can be seamlessly attached to the edge of a wafer, and has a reasonable slope on the top, preventing liquid splashing during cleaning from causing incomplete cleaning and other problems, so that the wafer can maintain balanced stress during operation, has high friction, and is not easy to fall off. DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained by those skilled in the art without creative labor.

[0018] Figure 1 It is an appearance schematic view of the chuck for fixing the wafer.

[0019] Figure 2 It is a structure schematic view of the chuck in the first embodiment of the utility model.

[0020] Figure 3 It is a top view of the chuck for fixing the wafer.

[0021] Figure 4 This is a schematic diagram of the middle part structure with an arc-shaped slot according to the present invention. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example 1

[0024] like Figure 1 As shown, a wafer fixing fixture includes a fixture 1 and a fixture head 2. The fixture 1 is connected to the fixture head 2. The fixture head 2 includes three parts: an upper end 21 with a slope, a middle part 22 with an arc-shaped groove, and a lower end 23 with a downward slope.

[0025] like Figure 2 As shown, in the middle part 22 with the arc-shaped slot 222, the slot 222 fits seamlessly with the edge of the wafer 3 and intersects with the previous V-shaped groove. In this embodiment, the slot 222 has an arc shape, which makes the wafer fit seamlessly with the arc-shaped slot, increasing the surface contact area. Then the wafer will be subjected to balanced force during operation, which improves the stress stability of the wafer during operation and increases the surface friction.

[0026] The bottom part 223 of the middle part 22 is connected to the top part 231 of the lower part 23 at one point.

[0027] The top portion 211 of the upper end head 21 is horizontal, and the circular side of the top portion 211 is chamfered downwards and extends with a slope towards the central axis to the bottom portion 213 of the upper end head 21. The angle between the extended slope and the horizontal line of the bottom portion 213 is α, where α is 60 degrees. The design of the clamp head with a reasonably sloped outer edge and a downward chamfer helps to prevent problems such as incomplete cleaning caused by liquid splashing during the cleaning process.

[0028] In some other implementations, α ranges from 30 to 70 degrees.

[0029] The bottom part 211 of the upper end 21 is connected to the top part 221 of the middle part 22.

[0030] The card holder 1 is connected to the card head 2 by connecting the top part 11 of the card holder 1 to the bottom part 233 of the lower end 23 of the card head 2. The card head 2 has a circular cross-section and is located on one side of the upper end of the card holder 1.

[0031] As Figure 2 shown, the lower end 23 of the clamp head 2 is connected to the outer side of the clamp seat 1, and the other side of the lower end 23 of the clamp head 2 extends to the other side of the outer side of the clamp seat 1, forming a slope.

[0032] The entire clamp is made of PFA carbon fiber, and the performance of PFA carbon fiber is as follows: elongation at break / %: 280-400; tensile strength / MPa: 28-31; flexural modulus / MPa: 648-682; tensile elastic modulus (Young's modulus) / MPa: 500-600; hardness (Shore D): D55-60; friction coefficient: 0.2. The performance of ETFE is as follows: elongation at break / %: 420-460; tensile strength / MPa: 42-47; flexural modulus / MPa: 883-1179; tensile elastic modulus (Young's modulus) / MPa: 586-655; hardness (Shore D): D75; friction coefficient: 0.06. Among them, PFA carbon fiber has a higher friction coefficient than ETFE material, which means higher friction, so that the clamped wafer is not easy to fall off during cleaning.

[0033] Example 2

[0034] As Figure 1 shown, a clamp for fixing a wafer includes a clamp seat 1 and a clamp head 2, the clamp seat 1 is connected with the clamp head 2, and the clamp head 2 includes three parts: an upper end 21 with a slope, a middle part 22 with a circular-arc-shaped clamping groove, and a lower end 23 with a downward slope.

[0035] As Figure 2 shown, the middle part 22 with the circular-arc-shaped clamping groove 222 is seamlessly fitted with the edge of the wafer 3, intersecting the previous V-shaped groove, and the clamping groove 222 in this embodiment has a circular arc shape, so that the wafer is seamlessly fitted with the circular-arc-shaped clamping groove, increasing the surface contact area; then the wafer will be balanced in the operation process, on the one hand, improving the stress stability of the wafer in the operation, and on the other hand, increasing the surface friction.

[0036] Among them, the height of the middle part 22 with the circular-arc-shaped clamping groove is 1.4-1.6mm. As Figure 4 shown, the selection of this height makes the clamp for fixing the wafer be able to fix two wafers at a time, which can improve the wafer cleaning efficiency or meet the special technical needs in production.

[0037] The above merely describes a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A jig for fixing a wafer, characterized by comprising: The utility model relates to a wafer clamping device, comprising: A clamping seat and a clamping head, the clamping head is connected with the clamping seat, the clamping head comprises three parts: an upper end head with a slope, a middle part with a circular-arc clamping groove, and a lower end part with a lower slope.

2. The wafer fixing holder according to claim 1, wherein In the middle part with the circular-arc clamping groove, the clamping groove is seamlessly fitted with the wafer edge.

3. The wafer holding fixture according to claim 1, wherein The bottom part of the middle part is connected with the top part of the lower end part.

4. The wafer holding fixture according to claim 1, wherein The top part of the upper end head is horizontal, the circular side of the top part of the upper end head is downwardly chamfered and extends to the bottom part of the upper end head with a slope towards the central axis.

5. The wafer holding fixture according to claim 4, wherein The slope is the included angle with the horizontal line of the bottom part, the range of the included angle is 30 to 70 degrees.

6. The wafer holding fixture of claim 1, wherein The bottom part of the upper end head is connected with the top part of the middle part, the clamping seat is connected with the clamping head, and the top part of the clamping seat is connected with the bottom part of the lower end part of the clamping head.

7. The wafer holding fixture of claim 1, wherein The height of the middle part with the circular-arc clamping groove is 1.4-1.6mm.

8. The wafer holding fixture according to claim 7, wherein The clamping seat is in the shape of a cylinder, the cross section of the clamping head is circular, and the clamping head is located on one side of the upper end of the clamping seat and deviates from the central axis.

9. The wafer holding fixture according to claim 7, wherein One side of the bottom part of the lower end part of the clamping head is connected with the outer edge side of the clamping seat, and the other side of the bottom part of the lower end part of the clamping head extends to the other outer edge of the clamping seat and is in the shape of a slope.

10. The wafer fixing holder according to any one of claims 1 to 9, wherein The material of the clamping device is PFA or ETFE.

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