Low-order low-resistance copper-embedded FPC flexible circuit board

By incorporating Kevlar fiber tear-resistant mesh, reinforcing edges, and unloading grooves onto the flexible circuit board, the problem of cracking during bending is solved, achieving higher bending and tear resistance and extending the service life of the circuit board.

CN223694050UActive Publication Date: 2025-12-19ZHUHAI CHINA EAGLE ELECTRONIC CIRCTCUIS CO LTD
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Patent Information

Application Number
CN202423027143.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-09
Publication Date
2025-12-19
Estimated Expiration
2034-12-09

AI Technical Summary

Technical Problem

Existing flexible circuit boards are prone to cracking when subjected to bending. Current technologies add reinforcing edges to the circuit board, but this still easily leads to cracking during repeated insertion, removal, and bending.

Method used

The conductive layer is reinforced with Kevlar fiber mesh on both sides, and the conductive layer is wrapped with reinforcing edges with unloading grooves and carbon fiber tear-resistant lines. Combined with polyimide material in the substrate layer, a multi-layer structure is formed to enhance bending resistance and tear resistance.

Benefits of technology

It improves the bending and tear resistance of the circuit board. Through the design of tear-resistant mesh and reinforcing edges, stress concentration is reduced and the service life of the circuit board is extended.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a low-order low-resistance copper-embedded FPC flexible circuit board, which relates to the technical field of circuit boards and comprises a base material layer, a conducting layer arranged at the top of the base material layer, golden fingers arranged at two ends of the conducting layer, a film covering layer arranged at the top of the conducting layer, anti-tearing nets arranged at two sides of the conducting layer, and reinforcing sheets arranged at the bottoms of the two golden fingers. When the two sides of the circuit board are cracked, a conductive layer of a core of the circuit board can be damaged only by passing through an anti-cracking net, the edges of the two sides of the circuit board are further wrapped with reinforcing edges, the bending resistance of the circuit board is improved through the reinforcing edges, the anti-tearing performance of the circuit board is improved through the reinforcing edges, and unloading grooves are further formed in the edges of the reinforcing edges, so that the anti-cracking performance of the circuit board is improved. The stress concentration of the circuit board is reduced through the unloading grooves, so that the bending resistance of the circuit board is further improved, the anti-tearing lines made of carbon fibers are further installed in the installation holes in the reinforcing edges, the anti-tearing effect of the two sides of the circuit board can be further improved through the high-strength carbon fiber anti-tearing lines, and the defect that the circuit board is prone to cracking is overcome.
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Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field especially relates to a low order low resistance's buried copper FPC flexible circuit board. BACKGROUND

[0002] According to the Chinese open (announcement) no. CN219834475U discloses a kind of flexible printed circuit board and liquid crystal display module, belong to circuit board technical field, the flexible printed circuit board includes body, and hot-pressing end and plug end are equipped on body. The end of the gold finger of hot-pressing end and plug end at the interface of body is not on same straight line. The flexible printed circuit board improves the design of gold finger, can improve the bending resistance of gold finger interface, reduce the problem of gold finger folding injury, fracture in production process.

[0003] The above-mentioned technology and the bending resistance and tear resistance of the flexible circuit board of prior art are not high, and the existing circuit board only adds reinforcing edge to the edge of the circuit board when resisting bending. However, the added reinforcing edge is still prone to cause the circuit board to crack during the repeated plugging and unplugging of the gold finger and the back-and-forth bending of the circuit board, thereby affecting the use of the circuit board. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the shortcoming that circuit board is easy to crack in prior art, and provides a low order low resistance's buried copper FPC flexible circuit board.

[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a low order low resistance's buried copper FPC flexible circuit board, including substrate layer, the top of substrate layer is equipped with conductive layer, the both ends of conductive layer are equipped with gold finger, the top of conductive layer is equipped with film layer, the both sides of conductive layer are equipped with tear-resistant net, the bottom of two gold fingers is equipped with reinforcing sheet, the both sides of substrate layer are equipped with reinforcing edge, the inside of two reinforcing edges is equipped with mounting hole, the inside of two mounting holes is equipped with tear-resistant line, the side door of two reinforcing edges is equipped with unloading groove.

[0006] Preferably, the top of the substrate layer is sequentially provided with the conductive layer and the film layer, and the substrate layer, the conductive layer and the film layer are adhered to each other.

[0007] Preferably, the substrate layer is made of polyimide or polyester film, the conductive layer is made of copper foil by chemical etching, and the film layer is made of polyimide plus epoxy resin hot setting adhesive.

[0008] Preferably, the two tear-resistant nets are mirror-imaged with the conductive layer as the center, and both of the two tear-resistant nets are made of Kevlar fiber, and both of the two tear-resistant nets are adhered to the top surface of the substrate layer.

[0009] Preferably, the two gold fingers are made of copper foil plated with gold, and the two ends of the conductive layer are connected with the gold fingers.

[0010] Preferably, the two reinforcing sheets are made of stainless steel sheets, and the two reinforcing sheets are adhered to the bottom surface of the gold fingers.

[0011] Preferably, the two reinforcing edges wrap the two sides of the substrate layer and the film layer, the two reinforcing edges are made of polyester imine, the unloading grooves are arranged at the end away from the film layer, the mounting holes are arranged between the unloading grooves and the film layer, and the two anti-tear lines are made of carbon fibers.

[0012] Advantages

[0013] In the utility model, the anti-tear net made of Kevlar fiber is arranged on the two sides of the conductive layer, the anti-tear net and the conductive layer are in the same plane, so that when the circuit board cracks on the two sides, the anti-tear net needs to be passed first to damage the conductive layer of the core of the circuit board, the reinforcing edges are wrapped on the two side edges of the circuit board, the bending resistance of the circuit board is increased through the reinforcing edges, the anti-tear property of the circuit board is increased, the unloading grooves are arranged at the edges of the reinforcing edges, the stress concentration of the circuit board is reduced through the unloading grooves, so that the bending resistance of the circuit board is further increased, the anti-tear lines made of carbon fibers are arranged in the mounting holes in the reinforcing edges, the high-strength carbon fiber anti-tear lines further increase the anti-tear effect on the two sides of the circuit board, and the defect that the circuit board is easy to crack is solved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is an isometric view of the utility model;

[0015] Figure 2 It is a partial isometric view of the utility model;

[0016] Figure 3 It is a top view of the utility model;

[0017] Figure 4 It is a partial isometric view of the utility model; Figure 3 It is a sectional view of A-A of the utility model.

[0018] Legend:

[0019] 1, substrate layer; 2, conductive layer; 3, film layer; 4, gold finger; 5, reinforcing sheet; 6, anti-tear net; 7, reinforcing edge; 8, unloading groove; 9, mounting hole; 10, anti-tear line. DETAILED DESCRIPTION

[0020] In order to make the technical means, creation characteristics, purposes and effects of the utility model easy to understand, the utility model is further described below in combination with specific embodiments and drawings, but the following embodiments are only preferred embodiments of the utility model, not all. Based on the embodiments in the embodiments, other embodiments obtained by those skilled in the art without creative labor all belong to the protection scope of the utility model.

[0021] The specific embodiments of the utility model are described below in combination with the drawings. Embodiment one

[0023] Referring to Figures 1-4 A low-order low-resistance buried copper FPC flexible circuit board, including substrate layer 1, the top of substrate layer 1 is provided with conductive layer 2, the both ends of conductive layer 2 are provided with golden fingers 4, the top of conductive layer 2 is provided with film layer 3, the both sides of conductive layer 2 are provided with anti-tear nets 6, the bottom of two golden fingers 4 is provided with reinforcing sheets 5, the both sides of substrate layer 1 are provided with reinforcing edges 7, the inside of two reinforcing edges 7 is provided with mounting holes 9, the inside of two mounting holes 9 is provided with anti-tear lines 10, the side door of two reinforcing edges 7 is provided with unloading grooves 8, the top of substrate layer 1 is conductive layer 2 and film layer 3 in turn, and substrate layer 1, conductive layer 2 and film layer 3 are bonded with each other, substrate layer 1 adopts polyimide or polyester film, conductive layer 2 is made by copper foil through chemical etching, film layer 3 is made of polyimide plus adhesive epoxy resin thermosetting glue, two anti-tear nets 6 are mirror image set up with conductive layer 2 as the center, and two anti-tear nets 6 are made of Kevlar fiber, two anti-tear nets 6 are bonded on the top surface of substrate layer 1, two golden fingers 4 are made of copper foil gold plating, and the both ends of conductive layer 2 are gold connected with golden fingers 4, two reinforcing sheets 5 are made of stainless steel sheet, and two reinforcing sheets 5 are bonded on the bottom surface of golden fingers 4, two reinforcing edges 7 wrap the both sides of substrate layer 1 and film layer 3, and reinforcing edge 7 is made of polyester imine, the unloading grooves 8 set up on the surface of two reinforcing edges 7 are away from one end of film layer 3, two mounting holes 9 are set up in the middle of unloading grooves 8 and film layer 3, and two anti-tear lines 10 are made of carbon fiber.

[0024] Conductive layer 2 and anti-tear line 10 are adhered to the top surface of substrate layer 1, and film layer 3 is adhered to the bottom surface of conductive layer 2 and anti-tear line 10, substrate layer 1 provides mechanical support and insulation for the flexible circuit board, and substrate layer 1 made of polyimide has excellent heat resistance, chemical resistance and mechanical strength, conductive layer 2 is made of copper foil by chemical etching, forming a circuit path for the transmission of electronic signals, the anti-tear net 6 made of high-strength Kevlar fiber on both sides of the conductive layer 2 will prevent the expansion of the crack when the circuit board is cracked, thereby protecting the conductive layer 2 between the two anti-tear nets 6, the film layer 3 covers the top surface of the conductive layer 2 and the anti-tear net 6 and protects the conductive layer 2, preventing the circuit of the conductive layer 2 from being oxidized and mechanically damaged, the adhesive of substrate layer 1 and conductive layer 2 and anti-tear net 6 can be epoxy resin glue, gold fingers 4 made of gold-plated copper foil have excellent conductivity and oxidation resistance to ensure stable transmission of the circuit board signal, because the two sides of the conductive layer 2 are connected with the gold-plated gold fingers 4, when one side of the gold finger 4 receives a signal, it will be transmitted to the gold finger 4 on the other side of the conductive layer 2 through the conductive layer 2, thereby completing the signal transmission of the circuit board, the reinforcing edge 7 is adhered and wrapped around the edges of the substrate layer 1 and the film layer 3 with epoxy resin glue, the reinforcing edge 7 made of polyimide provides additional mechanical support and stability and increases the bending resistance of the circuit board, preventing the circuit board from being damaged due to bending or pressure during assembly and operation, and the two reinforcing sheets 5 made of stainless steel sheets can effectively protect the gold fingers 4 from being deformed and damaged during insertion.

[0025] The specific anti-tear of the circuit board is that the reinforcing edges 7 on both sides of the circuit board increase the thickness of the edges on both sides of the circuit board, thereby increasing the bending resistance of the circuit board, and the multiple relief grooves 8 opened on the surface of the reinforcing edge 7 will disperse the stress of the circuit board when it is bent, preventing the circuit board from cracking on both sides due to stress concentration, further enhancing the bending resistance and anti-tear of the circuit board, when the reinforcing edge 7 is damaged and cracked due to long-term use, the carbon fiber anti-tear line 10 installed in the mounting hole 9 inside the reinforcing edge 7 prevents the crack of the reinforcing edge 7 from expanding, thereby affecting the circuit board, when both sides of the circuit board and the reinforcing edge 7 are cracked, the anti-tear net 6 made of Kevlar fiber on both sides of the conductive layer 2 of the circuit board will protect the conductive layer 2 at the core of the circuit board, because the anti-tear net 6 is at the same level as the conductive layer 2 and is set on both sides of the conductive layer 2, when the circuit board on both sides is also cracked, it will first pass through the anti-tear net 6 before damaging the conductive layer 2 at the core of the circuit board, thereby protecting the normal use of the circuit board. Specific embodiment two:

[0027] Reference Figures 1-4A low-order low-resistance buried copper FPC flexible circuit board, further based on the basic structure in specific embodiment one, can be coated with a circuit board protective paint containing solvent acrylic resin on the bottom surface of the film layer 3 and the bottom surface of the substrate layer 1, the circuit board protective paint containing solvent acrylic resin has the characteristics of fast surface drying, curing time, good three-proofing, low price, transparent color, flexible texture, easy to repair, so that when the circuit board may be affected by the adverse factors of the operating environment, the substrate layer 1, the conductive layer 2 and the film layer 3 of the circuit board are protected from environmental erosion, the electronic operating performance degradation condition can be reduced or eliminated, and the service life is improved and prolonged.

[0028] In summary:

[0029] 1. A tear-resistant net 6 made of Kevlar fiber is arranged on both sides of the conductive layer 2, the tear-resistant net 6 is in the same plane as the conductive layer 2, so that when the circuit board cracks on both sides, the tear-resistant net 6 must be passed through to damage the core conductive layer 2 of the circuit board, and the reinforcing edge 7 is wrapped on both side edges of the circuit board, the bending resistance of the circuit board is increased through the reinforcing edge 7, and the tear resistance of the circuit board is increased, and the unloading groove 8 is arranged at the edge of the reinforcing edge 7, the stress concentration of the circuit board is reduced through the unloading groove 8, so that the bending resistance of the circuit board is further increased, and the tear-resistant line 10 made of carbon fiber is arranged in the mounting hole 9 in the reinforcing edge 7, the high-strength carbon fiber tear-resistant line 10 can further increase the tear-resistant effect of both sides of the circuit board, and the disadvantage that the circuit board is prone to cracking is solved.

[0030] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can include direct contact between the first and second features, or indirect contact between the first and second features through another feature therebetween. Moreover, the first feature "above", "over" and "on" the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature includes the first feature directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0031] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only preferred examples of the present application and do not limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A low-order low-resistance buried copper FPC flexible circuit board comprising a substrate layer (1), characterized in that: The top of the substrate layer (1) is provided with a conductive layer (2), both ends of the conductive layer (2) are provided with a gold finger (4), the top of the conductive layer (2) is provided with a film layer (3), both sides of the conductive layer (2) are provided with a tear-resistant net (6), the bottom of the two gold fingers (4) is provided with a reinforcing sheet (5), both sides of the substrate layer (1) are provided with a reinforcing edge (7), the inside of the two reinforcing edges (7) is provided with a mounting hole (9), the inside of the two mounting holes (9) is provided with a tear-resistant line (10), and the side door of the two reinforcing edges (7) is provided with an unloading groove (8).

2. The low order low resistance buried copper FPC flexible circuit board according to claim 1, characterized in that: The top of the substrate layer (1) is provided with a conductive layer (2) and a film layer (3) in sequence, and the substrate layer (1), the conductive layer (2) and the film layer (3) are bonded with each other.

3. The low order low resistance buried copper FPC flexible circuit board according to claim 1, characterized in that: The substrate layer (1) is made of polyimide or polyester film, the conductive layer (2) is made of copper foil by chemical etching, and the film layer (3) is made of polyimide plus adhesive epoxy resin thermosetting glue.

4. The low order low resistance buried copper FPC flexible circuit board of claim 1, wherein: The two tear-resistant nets (6) are mirror image arranged with the conductive layer (2) as the center, and the two tear-resistant nets (6) are made of Kevlar fiber, and the two tear-resistant nets (6) are bonded on the top surface of the substrate layer (1).

5. The low order low resistance buried copper FPC flexible circuit board of claim 1, wherein: The two gold fingers (4) are made of copper foil gold plating, and the two ends of the conductive layer (2) are gold connected with the gold fingers (4).

6. The low order low resistance buried copper FPC flexible circuit board of claim 1, wherein: The two reinforcing sheets (5) are made of stainless steel sheet, and the two reinforcing sheets (5) are bonded on the bottom surface of the gold finger (4).

7. The low order low resistance buried copper FPC flexible circuit board of claim 1, wherein: The two reinforcing edges (7) wrap the two edges of the substrate layer (1) and the film layer (3), and the reinforcing edge (7) is made of polyester imine, the unloading groove (8) opened on the surface of the two reinforcing edges (7) is arranged at one end away from the film layer (3), the two mounting holes (9) are arranged in the middle of the unloading groove (8) and the film layer (3), and the two tear-resistant lines (10) are made of carbon fiber.

Citation Information

Patent Citations

  • Flexible printed circuit board and liquid crystal display module

    CN219834475U