Anti-static mechanism and vehicle

Abstract

The utility model discloses an anti-static mechanism and a vehicle. The anti-static mechanism comprises a shell and a circuit board assembly. The shell is internally provided with an accommodating space, the shell is provided with a channel communicated with the accommodating space, the channel comprises a first end arranged in the shell and a second end arranged outside the shell, the circuit board assembly is arranged in the accommodating space and comprises a circuit board and an electronic device arranged on the circuit board, the first end of the channel and the electronic device are arranged on the two back-to-back sides of the circuit board, the two back-to-back surfaces of the circuit board are provided with exposed grounding layers, and the grounding layers are adjacent to the channel. In this way, electrostatic protection of electronic devices on the circuit board can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of automobile electronics, in particular to a static electricity prevention mechanism and a vehicle. BACKGROUND

[0002] With the rapid development of the automobile industry, especially the continuous progress of intelligentization, electrification and automation technology in recent years, the position of automobile electronics in modern vehicles is becoming increasingly important. Early automobile electronic systems mainly focused on basic functions such as engine control, brake system and headlight control. However, with the gradual increase of automobile functions, especially in the aspects of autonomous driving, intelligent interconnection and electrification, the types and complexity of automobile electronics have also greatly increased. Static electricity is a common problem in automobile electronics. Static discharge not only causes damage to components in automobile electronics, but also affects the normal operation of equipment and product quality. Therefore, the influence of static discharge on electronic components on circuit boards has become a problem to be solved. CONTENT OF THE INVENTION

[0003] The technical problem solved by the present application is to provide a static electricity prevention mechanism and a vehicle that can improve the static electricity protection of electronic components on circuit boards.

[0004] To solve the above technical problem, one technical solution adopted by the present application is to provide a static electricity prevention mechanism, comprising: a housing having an accommodation space inside, a channel being provided on the housing and being in communication with the accommodation space, the channel comprising a first end provided inside the housing and a second end provided outside the housing; a circuit board assembly provided in the accommodation space, comprising a circuit board and electronic components provided on the circuit board, wherein the first end of the channel is provided on the two sides of the circuit board opposite to the electronic components, and the two surfaces of the circuit board opposite to each other are provided with exposed ground layers, and the ground layers are provided adjacent to the channel.

[0005] The electronic components comprise a crystal oscillator.

[0006] The material of the housing comprises at least one of polycarbonate, polytetrafluoroethylene, polystyrene and polypropylene.

[0007] The channel extends in a straight line.

[0008] The circuit board is provided parallel to the channel, the distance between the circuit board and the housing in a first direction is in a range of 1mm to 1.5mm, and the distance between the circuit board and the channel in a second direction is greater than 1mm, the first direction is parallel to the circuit board, and the second direction is perpendicular to the circuit board.

[0009] The channel is bent and extended, the shell comprises a first sub-shell and a second sub-shell, the first sub-shell is arranged on the periphery of the second sub-shell at least partially, so that the channel is formed between the first sub-shell and the second sub-shell.

[0010] The second end of the channel and the electronic device are arranged on the same side of the circuit board.

[0011] The ground layer comprises at least two metal layers.

[0012] The thickness of the shell is greater than 1.8 mm.

[0013] To solve the above technical problems, another technical solution adopted by the present application is to provide a vehicle comprising the anti-static mechanism as described in any of the above.

[0014] The beneficial effects of the present application are that, unlike the prior art, in the present application, the electronic device on the circuit board and the channel are located on two sides of the circuit board, so that after the static radiation enters the accommodation space from the channel, the static radiation needs to pass through the ground layer of the circuit board to reach the electronic device, thereby the ground layer can be used to reduce the electric field strength of the static radiation, without the need to increase an additional static shielding layer, which also plays a static shielding role on the electronic device, on the one hand, simplifying the anti-static mechanism, and on the other hand, playing a static protection role on the electronic device on the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor. Among them:

[0016] Figure 1 is a structural schematic diagram of an embodiment of the anti-static mechanism of the present application;

[0017] Figure 2 is a structural schematic diagram of another embodiment of the anti-static mechanism of the present application. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0019] The electrostatic discharge (ESD) test is to evaluate the tolerance and anti-interference performance of electronic products when encountering electrostatic discharge, which may cause damage to electronic products, especially in small electronic devices and circuits. Therefore, the electrostatic discharge test is crucial for quality control and reliability verification of electronic products. In the electrostatic discharge test, the static generator discharges to the air, and the static radiation affects the normal operation of electronic devices on the circuit board. When the crystal oscillator operates abnormally, it may cause the clock signal to be unstable or completely lost, and the processor and microcontroller may not start or run normally. To solve the influence of static radiation on electronic devices, the following technical solutions are proposed:

[0020] Referring to Figure 1 , the anti-static mechanism 100 includes a housing 1 and a circuit board assembly 2. The housing 1 is internally provided with a containing space 11, and the housing 1 is provided with a passage 12 communicating with the containing space 11. The passage 12 includes a first end 121 arranged inside the housing 1 and a second end 122 arranged outside the housing 1. The circuit board assembly 2 is arranged in the containing space 11 and includes a circuit board 21 and electronic devices 22 arranged on the circuit board 21. The first end 121 of the passage 12 is arranged on the two sides of the circuit board 21 opposite the electronic devices 22, and the two surfaces of the circuit board 21 opposite each other are provided with exposed ground layers 211 adjacent to the passage 12.

[0021] Specifically, the inside of the housing 1 is in communication with the outside through the passage 12, and the circuit board assembly 2 is arranged in the containing space 11 of the housing 1. The electronic devices 22 on the circuit board 21 are respectively located on the two sides of the circuit board 21 opposite the first end 121 of the passage 12. When the electrostatic discharge test is performed, the static radiation enters the containing space 11 of the housing 1 from the outside along the passage 12. Since the static radiation is a transient electric field, the charges in the ground layer 211 of the circuit board 21 migrate in the transient electric field, and the two surfaces of the circuit board 21 exhibit polarity, forming an electric field on one side of the electronic devices 22 on the circuit board 21. During this change process, since the static radiation is a transient electric field with extremely high frequency and extremely short time, the parasitic inductance impedance of the ground layer 211 is large under this condition, thereby suppressing the formation of an electric field on one side of the electronic devices 22 on the circuit board 21. That is, after the static radiation is suppressed by the ground layer 211 in the circuit board 21, the electric field strength of the static radiation reaching the circuit board 21 on which the electronic devices 22 are located is effectively weakened, that is, the ground layer 211 plays a role of static shielding for the electronic devices 22, thereby reducing the influence of static radiation on the electronic devices 22.

[0022] The electronic device 22 on the circuit board 21 and the passage 12 are located on both sides of the circuit board 21 in the present application, and the electrostatic radiation enters the accommodation space 11 from the passage 12. The electrostatic radiation needs to pass through the grounding layer 211 of the circuit board 21 first to reach the electronic device 22, so that the grounding layer 211 can be used to reduce the electric field strength of the electrostatic radiation, and the electronic device 22 is also shielded by the grounding layer 211 without adding an additional electrostatic shielding layer. On the one hand, the anti-static mechanism 100 is simplified, and on the other hand, the electronic device 22 on the circuit board 21 is protected from static electricity.

[0023] In an embodiment, the circuit board 21 comprises a printed circuit board (PCB), and the grounding layer 211 generally occupies a large part of the printed circuit board. The electronic device 22 and the passage 12 on the shell 1 are located on both sides of the printed circuit board, so that the grounding layer 211 shields the electronic device 22 from static electricity.

[0024] In an embodiment, the electronic device 22 comprises a crystal oscillator. Specifically, in the electrostatic discharge test, the electrostatic discharge may cause the following problems to the crystal oscillator: the electrostatic discharge may directly act on the electrode of the crystal oscillator, causing damage or breakdown of the material on the electrode; the electrostatic discharge may also cause a small crack or change in the structure inside the crystal oscillator, and may also damage the core part of the crystal oscillator, such as the crystal. In summary, the electrostatic radiation will cause the crystal oscillator frequency to drift, and in severe cases, the crystal oscillator will fail. In the present application, the grounding layer 211 protects the crystal oscillator from static electricity, so that in the electrostatic discharge test, the electrostatic radiation enters the accommodation space 11 from the passage 12, first passes through the grounding layer 211 on one side of the circuit board 21, and then reaches the other side of the circuit board 21 where the crystal oscillator is located. The grounding layer 211 suppresses the electric field generated by the electrostatic radiation to the side of the crystal oscillator, reduces the influence of the electrostatic radiation on the crystal oscillator, and improves the stability of the crystal oscillator under the electrostatic radiation.

[0025] In an embodiment, the crystal oscillator comprises at least one of a quartz crystal oscillator, a temperature-compensated crystal oscillator, and a constant-temperature crystal oscillator. That is, the crystal oscillator comprises one or more of a quartz crystal oscillator, a temperature-compensated crystal oscillator, and a constant-temperature crystal oscillator. For example, only a quartz crystal oscillator or only a constant-temperature crystal oscillator can be provided on the circuit board 21, or a quartz crystal oscillator and a constant-temperature crystal oscillator can be provided.

[0026] In an embodiment, the material of the shell 1 comprises at least one of polycarbonate, polytetrafluoroethylene, polystyrene, and polypropylene. Specifically, the material of the shell 1 comprises one or more of polycarbonate, polytetrafluoroethylene, polystyrene, and polypropylene. The material of the shell 1 can be only polycarbonate, or a mixture of polycarbonate and polytetrafluoroethylene. In other embodiments, the material of the shell 1 also comprises metal, for example, the material of the shell 1 is aluminum, or the material of the shell 1 is copper.

[0027] In an embodiment, the housing 1 is fixedly connected with the circuit board 21 by screws or bolts.

[0028] Referring to Figure 2 In an embodiment, the channel 12 extends in a bent manner, the housing 1 comprises a first sub-housing 13 and a second sub-housing 14, the first sub-housing 13 is arranged on the periphery of the second sub-housing 14 to form the channel 12 between the first sub-housing 13 and the second sub-housing 14.

[0029] Specifically, the channel 12 is formed between the first sub-housing 13 and the second sub-housing 14, when performing the electrostatic discharge test, the electrostatic radiation enters the accommodating space 11 from the channel 12 between the first sub-housing 13 and the second sub-housing 14, since the channel 12 extends in a bent manner, the path of the electrostatic radiation is lengthened, which can reduce the electric field intensity of the electrostatic radiation reaching the circuit board 21 and reduce the influence of the electrostatic radiation on the electronic device 22. In an application scenario, the electronic device 22 is a crystal oscillator, since the channel 12 extends in a bent manner, the path of the electrostatic radiation is lengthened, thereby reducing the electric field intensity at the crystal oscillator and reducing the influence of the electrostatic radiation on the crystal oscillator.

[0030] Continuing to refer to Figure 2 In an embodiment, the second end 122 of the channel 12 and the electronic device 22 are arranged on the same side of the circuit board 21. Specifically, the first sub-housing 13 is arranged on the periphery of the second sub-housing 14, the second end 122 of the channel 12 and the electronic device 22 are arranged on the same side of the circuit board 21, which further lengthens the path of the electrostatic radiation, which can reduce the electric field intensity of the electrostatic radiation reaching the circuit board 21 and reduce the influence of the electrostatic radiation on the electronic device 22.

[0031] Continuing to refer to Figure 1 In an embodiment, the channel 12 extends in a straight line. Specifically, the first sub-housing 13 and the second sub-housing 14 are arranged along the second direction Y, when the channel 12 extends in a straight line, when performing the electrostatic discharge test, the electrostatic radiation enters the accommodating space 11 from the channel 12 between the first sub-housing 13 and the second sub-housing 14, and the electronic device 22 is shielded from static electricity by the grounding layer 211, without the need for the housing 1 to lengthen the path of the electrostatic radiation. In this embodiment, the first sub-housing 13 and the second sub-housing 14 are easy to splice, which facilitates the preparation of the housing 1.

[0032] Further, the first sub-housing 13 and the second sub-housing 14 have the same structure, which can be prepared by the same process during preparation, thereby improving the preparation efficiency.

[0033] Further, the first sub-housing 13 and the second sub-housing 14 are made of the same material, which reduces the types of materials used in the manufacturing process, reduces the frequency of material switching, and improves the manufacturing efficiency.

[0034] With reference to the accompanying drawings Figure 1 In an embodiment, the circuit board 21 is arranged parallel to the passage 12, wherein the distance L1 between the circuit board 21 and the housing 1 in the first direction X is in the range of 1 mm to 1.5 mm, and the distance L2 between the circuit board 21 and the passage 12 in the second direction Y is greater than 1 mm, the first direction X is parallel to the circuit board 21, and the second direction Y is perpendicular to the circuit board 21.

[0035] Specifically, the distance L1 between the edge of the circuit board 21 and the inner surface of the housing 1 is in the range of 1 mm to 1.5 mm, for example, the distance L1 between the edge of the circuit board 21 and the inner surface of the housing 1 is 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, or 1.5 mm. Arranging the distance L1 between the circuit board 21 and the housing 1 in the first direction X in this range can greatly reduce the size of the housing 1 while providing electrostatic protection for the electronic device 22. The distance L2 between the circuit board 21 and the passage 12 in the second direction Y is 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, or 6 mm. It should be noted that the present application does not limit the distance L2 between the circuit board 21 and the passage 12 in the second direction Y.

[0036] In an embodiment, the ground layer 211 includes at least two metal layers. Specifically, the ground layer 211 can include 2 metal layers, 4 metal layers, 6 metal layers, or 8 metal layers. The number of metal layers increases the electrostatic shielding capability of the ground layer 211. It should be noted that the present application does not limit the number of metal layers. In another embodiment, the ground layer 211 includes only a single metal layer.

[0037] Further, the material of the metal layer includes copper, which has excellent electrical conductivity, second only to silver, so it can efficiently conduct current. In the design of the circuit board 21, the main function of the ground layer 211 is to provide a stable electrical reference point to ensure the normal operation of the circuit. Using copper as the ground layer 211 can effectively reduce noise, interference, or signal distortion caused by poor grounding in the circuit. In the present application, using copper as the material of the ground layer can provide electrostatic shielding for the electronic device while reducing additional production costs.

[0038] In an embodiment, the thickness of the housing 1 is greater than 1.8 mm to improve the anti-static capability. Specifically, the thickness of the housing 1 can be 1.8 mm, 1.9 mm, 2.0 mm, 2.1 mm, 2.2 mm, or 2.3 mm. It should be noted that the present application does not limit the thickness of the housing 1.

[0039] The application also protects a vehicle comprising the anti-static mechanism 100 as in any of the above embodiments. It should be noted that the application does not limit the type of vehicle.

[0040] The above only describes the embodiments of the application, and does not limit the patent scope of the application, and any equivalent structure or equivalent process transformation using the content of the application specification and drawings, or directly or indirectly applied to other related technical fields, are also included in the patent protection scope of the application.

Claims

1. An anti-static mechanism, characterized by, The application relates to an anti-static mechanism. The application relates to an anti-static mechanism. The application relates to an anti-static mechanism.

2. The anti-static mechanism according to claim 1, wherein, The application relates to an anti-static mechanism.

3. The anti-static mechanism according to claim 1, wherein, The application relates to an anti-static mechanism.

4. The anti-static mechanism of claim 1, wherein The application relates to an anti-static mechanism.

5. The anti-static mechanism according to claim 1, wherein The application relates to an anti-static mechanism.

6. The anti-static mechanism of claim 1, wherein, The application relates to an anti-static mechanism.

7. The anti-static mechanism according to claim 6, wherein The application relates to an anti-static mechanism.

8. The anti-static mechanism of claim 1, wherein, The application relates to an anti-static mechanism.

9. The anti-static mechanism of claim 1, wherein, The application relates to an anti-static mechanism.

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