Wafer type communication unit

Abstract

The utility model discloses a wafer type communication unit which comprises a unit body, bolts are installed at four corners of the outer surface of the upper end of the unit body in a threaded mode, a heat dissipation assembly is fixedly installed on the outer surface of the lower end of the unit body, and a positioning sleeve is arranged on the outer wall of the lower portion of each bolt in a sleeved mode. The heat dissipation assembly comprises a heat dissipation box, a heat conduction plate, a cooling liquid inlet valve, a cooling liquid outlet valve and a baffle plate, and the heat dissipation box is fixedly installed on the outer surface of the lower end of the unit body. According to the wafer type communication unit provided by the utility model, the unit body can be rapidly cooled through the arranged heat dissipation assembly, the reliability of equipment is improved, a limiting effect is achieved through the arranged positioning sleeve, the heat dissipation assembly at the bottom of the unit body is prevented from being extruded, and the positioning sleeve is made of rubber, so that a buffering effect is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to communication unit technical field, concretely is a wafer type communication unit. BACKGROUND

[0002] In various communication equipment cabinets, various functional modular units are installed, and these units will be provided with unit panels according to different functional needs.

[0003] In the prior art, a wafer type communication unit is recorded in a Chinese patent document with the authorization announcement number CN219248244U. This patent changes the traditional fixing method of the unit body to a sliding stud fixing method, and the stud is also connected to the support sheet, the damping base and the damping column. When the communication unit is subjected to vibration, the support sheet used to support the communication unit transmits force to the damping column, and the damping column releases force through the damping base, achieving a more scientific and reasonable damping effect.

[0004] However, the following disadvantages exist during use:

[0005] 1. The damping structure is relatively complex;

[0006] 2. Lack of heat dissipation structure, the wafer (chip) generates a large amount of heat during operation, which is due to the fact that part of the injected current is converted into heat as energy loss when the transistor inside the chip is working. If this heat cannot be effectively dissipated in time, it will cause the chip temperature to be too high, thereby affecting the performance, stability and service life of the chip. For example, high temperature may cause the chip performance to decline, and even cause the computer to crash, blue screen and other faults, which will also accelerate the aging of electronic components and reduce the reliability of the equipment.

[0007] Therefore, we propose a wafer type communication unit. Utility model content

[0008] (I) Technical problem solved

[0009] In view of the deficiencies of the prior art, the utility model provides a wafer type communication unit, which has the advantages of heat dissipation and buffering, and can effectively solve the problems in the background art.

[0010] (II) Technical scheme

[0011] To achieve the above purpose, the utility model adopts the technical scheme: a wafer type communication unit, comprising a unit body, four corners of the outer surface of the upper end of the unit body are provided with bolts, the lower end of the unit body is provided with a heat dissipation assembly, the outer wall of the lower part of the bolt is provided with a positioning sleeve, the heat dissipation assembly comprises a heat dissipation box, a heat conduction plate, a cooling liquid inlet valve, a cooling liquid outlet valve and a baffle, and the heat dissipation box is fixedly installed on the lower end of the unit body.

[0012] Preferably, the heat-conducting plate is fixedly installed on the upper end outer surface of the heat-dissipating box.

[0013] Preferably, the heat-conducting plate is fixedly installed on the upper end outer surface of the heat-dissipating box.

[0014] Preferably, the cooling liquid inlet valve is fixedly installed on one side of the outer surface of one end of the heat-dissipating box, and the cooling liquid outlet valve is fixedly installed on the other side of the outer surface of one end of the heat-dissipating box.

[0015] Preferably, the baffle is fixedly installed in the heat-dissipating box.

[0016] Preferably, the height of the positioning sleeve is greater than the sum of the height of the heat-dissipating box and the thickness of the heat-conducting glue in the heat-dissipating assembly.

[0017] (Three) beneficial effects

[0018] Compared with the prior art, the utility model provides a wafer type communication unit, has the following beneficial effects:

[0019] 1、 this wafer type communication unit, through the heat-dissipating assembly set up, it is convenient to carry out quick cooling to unit body, improve the reliability of equipment.

[0020] 2、 this wafer type communication unit, through the positioning sleeve set up, play the role of limiting, avoid the heat-dissipating assembly of unit body bottom to be extruded, and the material of positioning sleeve is rubber, play the role of buffering. DETAILED DESCRIPTION

[0021] Figure 1 It is the whole structure schematic view of a wafer type communication unit of the utility model.

[0022] Figure 2 It is the side view of a wafer type communication unit of the utility model.

[0023] Figure 3 It is the structure schematic view of bolt and positioning sleeve in a wafer type communication unit of the utility model.

[0024] Figure 4 It is the structure schematic view of heat-dissipating assembly in a wafer type communication unit of the utility model.

[0025] Figure 5 It is the overhead sectional view of heat-dissipating assembly in a wafer type communication unit of the utility model.

[0026] In the drawing: 1, unit body;2, bolt;3, heat-dissipating assembly;4, positioning sleeve;5, heat-dissipating box;6, heat-conducting plate;7, cooling liquid inlet valve;8, cooling liquid outlet valve;9, baffle. DETAILED DESCRIPTION

[0027] In order to make the technical means, creative features, purposes and effects of the utility model easy to understand, the utility model is further described below in combination with specific embodiments.

[0028] The embodiment is a wafer type communication unit.

[0029] As shown in Figures 1-5 the drawing, the utility model discloses a unit body 1, the four corners of the outer surface of the upper end of unit body 1 are all screw mounted with bolt 2, the outer surface of the lower end of unit body 1 is fixedly installed with heat dissipation assembly 3, the outer wall of the lower part of bolt 2 is sleeved with positioning sleeve 4, heat dissipation assembly 3 includes heat dissipation box 5, heat conduction plate 6, cooling liquid inlet valve 7, cooling liquid outlet valve 8 and baffle plate 9, and heat dissipation box 5 is fixedly installed on the outer surface of the lower end of unit body 1.

[0030] Heat conduction plate 6 is fixedly installed on the outer surface of the upper end of heat dissipation box 5, heat conduction glue is arranged between heat conduction plate 6 and unit body 1, and the heat conduction glue is adhered between the outer surface of the lower end of unit body 1 and the outer surface of the upper end of heat conduction plate 6, cooling liquid inlet valve 7 is fixedly installed on one side of the outer surface of one end of heat dissipation box 5, cooling liquid outlet valve 8 is fixedly installed on the other side of the outer surface of one end of heat dissipation box 5, and baffle plate 9 is fixedly installed in heat dissipation box 5, and the height of positioning sleeve 4 is greater than the sum of the height of heat dissipation box 5 in heat dissipation assembly 3 and the thickness of heat conduction glue.

[0031] It should be noted that the utility model is a wafer type communication unit, the unit body 1 and bolt 2 recorded in the text all belong to the prior art, and bolt 2 is used for fixing unit body 1, which can be effectively known by the person skilled in the art, and specific details will not be repeated, heat dissipation assembly 3 is installed in the inside of unit body 1, cooling liquid inlet valve 7 and cooling liquid outlet valve 8 in heat dissipation assembly 3 are all externally connected with a cooling liquid circulating pump, cooling liquid enters the inside of baffle plate 9 through cooling liquid inlet valve 7, and the cooling liquid is guided through baffle plate 9, heat conduction plate 6 is arranged, the material of heat conduction plate 6 is pure copper, the efficiency of heat exchange can be improved, unit body 1 is rapidly cooled through the cooling liquid, and then the cooling liquid is discharged through cooling liquid outlet valve 8, positioning sleeve 4 is arranged, positioning sleeve 4 is sleeved on the outer wall of the lower part of bolt 2, plays a limiting role, avoids that heat dissipation assembly 3 at the bottom of unit body 1 is extruded, and the material of positioning sleeve 4 is rubber, plays a buffering role.

[0032] It is to be noted that, in this document, the terms such as first and second, etc. are used merely to distinguish one entity or action from another, and do not necessarily require or imply any such actual relationship or order between such entities or actions. Moreover, the terms "comprising", "including", or any other variant thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, an element defined by the statement "comprising a" does not exclude the existence of additional identical elements in the process, method, article, or apparatus that includes the stated element.

[0033] The basic principle and main features of the present application and the advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principle of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application.

Claims

1. A wafer type communication unit comprising a unit body (1), the four corners of the outer surface of the upper end of the unit body (1) being screw mounted with bolts (2), characterized in that: The lower end outer surface of the unit body (1) is fixedly provided with a heat dissipation assembly (3), the outer wall of the lower part of the bolt (2) is sleeved with a positioning sleeve (4), the heat dissipation assembly (3) comprises a heat dissipation box (5), a heat conduction plate (6), a cooling liquid inlet valve (7), a cooling liquid outlet valve (8) and a baffle (9), and the heat dissipation box (5) is fixedly installed on the lower end outer surface of the unit body (1).

2. A wafer-type communication unit according to claim 1, characterized in that: The heat conduction plate (6) is fixedly installed on the upper end outer surface of the heat dissipation box (5).

3. A wafer communications unit according to claim 2, wherein: The heat conduction plate (6) and the unit body (1) are provided with heat conduction glue, and the heat conduction glue is bonded between the lower end outer surface of the unit body (1) and the upper end outer surface of the heat conduction plate (6).

4. A wafer communications unit according to claim 3, wherein: The cooling liquid inlet valve (7) is fixedly installed on one side of the outer surface of one end of the heat dissipation box (5), and the cooling liquid outlet valve (8) is fixedly installed on the other side of the outer surface of one end of the heat dissipation box (5).

5. A wafer communications unit according to claim 4, wherein: The baffle (9) is fixedly installed in the heat dissipation box (5).

6. A wafer communications unit according to claim 5, wherein: The height of the positioning sleeve (4) is greater than the sum of the height of the heat dissipation box (5) and the thickness of the heat conduction glue in the heat dissipation assembly (3).

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