Image acquisition module
By placing an image sensing chip within a through-hole in the circuit board and utilizing an insulating connection structure and a flat surrounding structure, the problem of unstable connection in the image acquisition module was solved, achieving a tight connection and no glue overflow effect.
Patent Information
- Application Number
- CN202423171897.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-12-20
AI Technical Summary
There is room for improvement in the way existing image acquisition modules are set on the circuit board, especially in the connection and fixation between the image sensing chip and the circuit board, which is not stable enough and is prone to problems such as glue overflow and residue.
Design an image acquisition module, wherein an image sensing chip is disposed in a through opening of a circuit substrate and connected to the circuit substrate by an insulating connection structure, and the lower surface of the sensing chip is not covered by the insulating connection structure. The circuit substrate has a flat surrounding structure to ensure that the lower surface of the chip is flush with the lower surface of the substrate, thereby enhancing connection stability.
This achieves a tight connection between the image sensing chip and the circuit board, avoiding glue overflow and residue, and enhancing the stability and reliability of the connection.
Smart Images
Figure CN223694227U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to an image sensor, especially to an image acquisition module for acquiring images. BACKGROUND
[0002] In the prior art, the image sensing chip of the image acquisition module can be arranged on the top end of the circuit substrate without opening by wire bonding, or the image sensing chip of the image acquisition module can be arranged on the bottom end of the circuit substrate with opening by flip-chip bonding. However, the existing image acquisition module still has room for improvement. SUMMARY
[0003] The utility model provides an image acquisition module for acquiring images to solve the problems in the prior art.
[0004] To improve or solve the above problems, one of the technical means adopted by the utility model is to provide an image acquisition module, which comprises a circuit substrate, an image sensing chip and an insulating connecting structure. The circuit substrate has an upper surface, a lower surface and a through opening connected between the upper surface and the lower surface. The image sensing chip is arranged in the through opening of the circuit substrate and electrically connected to the circuit substrate. The insulating connecting structure is arranged in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate. Wherein, a lower surface of the image sensing chip is not covered by the insulating connecting structure and exposed outside; wherein, the circuit substrate has a flat surrounding structure close to and surrounding the through opening, and a lower surface of the flat surrounding structure is flush with the lower surface of the image sensing chip.
[0005] Further, the circuit substrate comprises a circuit layout layer arranged on the lower surface of the circuit substrate and an insulating cover layer for covering the circuit layout layer, and the circuit layout layer has a plurality of conductive circuit portions close to and surrounding the through opening; wherein, the insulating cover layer comprises a plurality of first cover portions, a plurality of second cover portions and a plurality of recessed spaces, the plurality of first cover portions are arranged on the lower surface of the circuit substrate, the plurality of second cover portions are respectively used for covering the plurality of conductive circuit portions, and each recessed space is located between the corresponding first cover portion and the adjacent two second cover portions.
[0006] Further, the planar surrounding structure of the circuit substrate includes a plurality of filling material layers, and the plurality of filling material layers of the planar surrounding structure are respectively filled in the plurality of recessed spaces of the insulating covering layer; wherein a lower surface of each of the filling material layers of the planar surrounding structure and a lower surface of each of the second covering portions of the insulating covering layer are flush with each other, and the lower surface of each of the filling material layers of the planar surrounding structure and a lower surface of the image sensing chip are flush with each other; wherein the insulating connecting structure has a lower surrounding surface exposed and not covered, and the lower surrounding surface of the insulating connecting structure, the lower surface of the planar surrounding structure, and the lower surface of the image sensing chip are flush with each other.
[0007] Further, the planar surrounding structure of the circuit substrate includes a plurality of filling material layers and a thickening material layer, the plurality of filling material layers of the planar surrounding structure are respectively filled in the plurality of recessed spaces of the insulating covering layer, and the thickening material layer is used to cover the plurality of filling material layers and the plurality of second covering portions; wherein the thickening material layer of the planar surrounding structure has a planar surface, and the planar surface of the thickening material layer of the planar surrounding structure and the lower surface of the image sensing chip are flush with each other; wherein the insulating connecting structure has a lower surrounding surface exposed and not covered, and the lower surrounding surface of the insulating connecting structure, the lower surface of the planar surrounding structure, and the lower surface of the image sensing chip are flush with each other.
[0008] Further, the circuit substrate includes a circuit layout layer disposed on a lower surface of the circuit substrate and an insulating covering layer used to cover the circuit layout layer, and the circuit layout layer has a plurality of conductive circuit portions close to and surrounding the through-opening.
[0009] Further, the insulating connecting structure has a main filling layer disposed in the through-opening of the circuit substrate and a surrounding filling layer connected to the main filling layer, the surrounding filling layer is configured as the planar surrounding structure, and the surrounding filling layer is disposed on the lower surface of the circuit substrate and covers the plurality of conductive circuit portions of the circuit layout layer; wherein a lower surface of the main filling layer, a lower surface of the surrounding filling layer as the planar surrounding structure, and the lower surface of the image sensing chip are flush with each other.
[0010] Further, the lower surface of the circuit substrate has a circuit layout-free area, the circuit layout-free area of the circuit substrate is surrounded by the circuit layout layer and the insulating covering layer, and the circuit layout-free area of the circuit substrate is configured as the planar surrounding structure; wherein a maximum width of the circuit layout-free area of the circuit substrate is between 100 μm and 150 μm; wherein the insulating connecting structure has a lower surrounding surface exposed and not covered, and the lower surrounding surface of the insulating connecting structure, the circuit layout-free area of the circuit substrate, and the lower surface of the image sensing chip are flush with each other.
[0011] Further, the upper surface of the circuit substrate has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are respectively electrically connected to the plurality of substrate conductive pads of the circuit substrate through the plurality of metal leads; wherein the insulating connecting structure is tightly connected between a peripheral surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate; wherein the inner surrounding surface of the through opening of the circuit substrate is configured as a roughened surrounding surface, thereby increasing the adhesion or contact area between the insulating connecting structure and the circuit substrate; wherein all or a portion of the peripheral surrounding surface of the image sensing chip is covered by the insulating connecting structure, thereby adjusting the adhesion or contact area between the insulating connecting structure and the image sensing chip; wherein the thickness of the insulating connecting structure is less than or equal to the thickness of the image sensing chip, and the thickness of the insulating connecting structure is less than or equal to the thickness of the circuit substrate.
[0012] Further, the image acquisition module further comprises a lens assembly, the lens assembly comprises a lens carrier disposed on the circuit substrate and a lens module carried by the lens carrier, and an upper surface of the image sensing chip has an image sensing area corresponding to the lens module.
[0013] Further, the image acquisition module further comprises a filter assembly, the filter assembly is disposed above the image sensing chip by support of a plurality of support bodies or a surrounding support body, and the filter assembly is surrounded by the plurality of metal leads.
[0014] One of the beneficial effects of the present application is that the image acquisition module provided by the present application can substantially (or completely) level the lower surface of the image sensing chip with the lower surface of the flat surrounding structure through the technical solutions of "the image sensing chip is disposed in the through opening of the circuit substrate and electrically connected to the circuit substrate", "the insulating connecting structure is disposed in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate", "a lower surface of the image sensing chip is not covered by the insulating connecting structure and exposed", and "the circuit substrate has a flat surrounding structure close to and surrounding the through opening".
[0015] For a further understanding of the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, the drawings provided are only for reference and illustration, and are not intended to limit the present application. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 The cross-sectional schematic view of the image acquisition module provided by the first embodiment of the present application (before the temporary carrier substrate is removed).
[0017] Figure 2 A cross-sectional view of the flat surrounding structure and the insulating cover layer provided by the first embodiment of the present application. Figure 1 A cross-sectional view of the II-II cross-sectional line (before the temporary bearing substrate is removed).
[0018] Figure 3 A cross-sectional view of the image acquisition module provided by the first embodiment of the present application (after the temporary bearing substrate is removed).
[0019] Figure 4 A cross-sectional view of the flat surrounding structure and the insulating cover layer provided by the first embodiment of the present application. Figure 3 A cross-sectional view of the IV-IV cross-sectional line (after the temporary bearing substrate is removed).
[0020] Figure 5 A cross-sectional view of the image acquisition module provided by the second embodiment of the present application (before the temporary bearing substrate is removed).
[0021] Figure 6 A cross-sectional view of the flat surrounding structure and the insulating cover layer provided by the second embodiment of the present application. Figure 5 A cross-sectional view of the VI-VI cross-sectional line (before the temporary bearing substrate is removed).
[0022] Figure 7 A cross-sectional view of the image acquisition module provided by the second embodiment of the present application (after the temporary bearing substrate is removed).
[0023] Figure 8 A cross-sectional view of the flat surrounding structure and the insulating cover layer provided by the second embodiment of the present application. Figure 7 A cross-sectional view of the VIII-VIII cross-sectional line (after the temporary bearing substrate is removed).
[0024] Figure 9 A cross-sectional view of the image acquisition module provided by the third embodiment of the present application (before the insulating connecting structure is filled).
[0025] Figure 10 A cross-sectional view of the image acquisition module provided by the third embodiment of the present application (after the insulating connecting structure is filled).
[0026] Figure 11 A bottom view of the circuit substrate of the image acquisition module provided by the fourth embodiment of the present application.
[0027] Figure 12A cross-sectional view of the image acquisition module provided by the fourth embodiment of the present application (before the insulating connecting structure is filled).
[0028] Figure 13 A cross-sectional view of the image acquisition module provided by the fourth embodiment of the present application (after the insulating connecting structure is filled).
[0029] Figure 14 A functional block diagram of a portable electronic device using the image acquisition module provided by the fifth embodiment of the present application. DETAILED DESCRIPTION
[0030] The following is a description of the embodiments of the image acquisition module disclosed by the present application through specific embodiments. Those skilled in the art can understand the advantages and effects of the present application from the disclosure. The present application can be implemented or applied through other different embodiments, and the details in the specification can be modified and changed based on different viewpoints and applications without departing from the concept of the present application. In addition, it should be stated in advance that the drawings of the present application are only simple schematic illustrations and are not actual size depictions. The following embodiments will further describe the related technical content of the present application in detail, but the disclosed content is not intended to limit the protection scope of the present application. In addition, the term "or" used herein may, depending on the actual situation, include any one or a combination of multiple associated listed items.
[0031] First Embodiment
[0032] Referring to Figures 1 to 4 , the first embodiment of the present application provides an image acquisition module M (or an image sensing module or an image capturing module), which includes a circuit substrate 1, an image sensing chip 2, an insulating connecting structure 3, and a lens assembly 4. It is worth noting that, Figure 1 The front view cross-sectional view of the image acquisition module provided by the first embodiment of the present application before the temporary carrier substrate is removed, and Figure 2 is a partial side view cross-sectional view of Figure 1 . In addition, Figure 3 The front view cross-sectional view of the image acquisition module provided by the first embodiment of the present application after the temporary carrier substrate is removed, and Figure 4 is a partial side view cross-sectional view of Figure 3 .
[0033] Furthermore, in combination with Figure 1 , Figure 2 and Figure 3As shown, the circuit board 1 may have an upper surface 1001, a lower surface 1002, and a through opening 1003 (or a through opening 1003 penetrating the circuit board 1) connecting the upper surface 1001 and the lower surface 1002. The image sensing chip 2 may be disposed within the through opening 1003 of the circuit board 1 and electrically connected to the circuit board 1. In addition, an insulating connection structure 3 may be disposed within the through opening 1003 of the circuit board 1 and connected between the image sensing chip 2 and the circuit board 1. The lens assembly 4 may include a lens carrier 41 disposed on the circuit board 1 and a lens module 42 (e.g., composed of multiple optical lenses) supported by the lens carrier 41. For example, the upper surface 1001 of the circuit board 1 may have multiple substrate conductive pads 10P, and the upper surface 2001 of the image sensing chip 2 may have an image sensing area 20S corresponding to the lens module 42 and multiple chip conductive pads 20P. The multiple chip conductive pads 20P of the image sensing chip 2 may be electrically connected to the multiple substrate conductive pads 10P of the circuit board 1 via multiple metal leads W (which may be any conductive metal material, such as gold, silver, or copper). Furthermore, depending on different application requirements, the image sensing chip 2 may be a charge-coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS). However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.
[0034] Furthermore, in coordination Figure 1 and Figure 2 As shown, the circuit board 1 may have a flat surrounding structure 11 (shown schematically only) close to and surrounding the through opening 1003. Figure 2 and Figure 4 However, it was not displayed. Figure 1 and Figure 3). In addition, a lower surface 2002 of the image sensing chip 2 is exposed and not covered by the insulating connecting structure 3, and a lower surface of the flat surrounding structure 11 can be substantially (or completely) level with the lower surface 2002 of the image sensing chip 2. For example, the circuit substrate 1 can include a circuit layout layer 101 (e.g., a copper circuit layout layer) disposed on a lower surface 1002 of the circuit substrate 1 and an insulating cover layer 102 (e.g., a solder mask or a resist layer) for covering the circuit layout layer 101, and the circuit layout layer 101 can have a plurality of conductive circuit portions 1010 proximate to and surrounding the through opening 1003. Further, the insulating cover layer 102 can include a plurality of first cover portions 102A disposed on the lower surface 1002 of the circuit substrate 1, a plurality of second cover portions 102B (each of which can be stepped or recessed) for covering the plurality of conductive circuit portions 1010, respectively, and a plurality of recessed spaces 102C each located between a corresponding first cover portion 102A and two adjacent second cover portions 102B. In addition, the flat surrounding structure 11 of the circuit substrate 1 can include a plurality of filler material layers 111 (e.g., a conductive material that does not electrically conduct with the circuit layout layer 101 or a non-conductive material that is the same as or different from the material of the insulating cover layer 102), and the plurality of filler material layers 111 of the flat surrounding structure 11 can be filled (completely filled) in the plurality of recessed spaces 102C of the insulating cover layer 102, respectively. However, the above example is only one possible embodiment and is not intended to limit the present disclosure.
[0035] It is noted that, for example, the flat surrounding structure 11 can be formed by Figure 1 and Figure 2 As shown, a lower surface 1110 of each of the filler material layers 111 of the flat surrounding structure 11 and a lower surface 1020 of each of the second cover portions 102B of the insulating cover layer 102 can be substantially (or completely) level with each other, and the lower surface 1110 of each of the filler material layers 111 of the flat surrounding structure 11 and the lower surface 2002 of the image sensing chip 2 can be substantially (or completely) level with each other. Thus, when a temporary carrier substrate C (e.g., a flexible tape or any kind of carrier) is attached to the lower surface 1110 of each of the filler material layers 111 of the flat surrounding structure 11 and the lower surface 1020 of each of the second cover portions 102B of the insulating cover layer 102 (as shown in FIG. 1C), the temporary carrier substrate C can be substantially (or completely) level with the lower surface 2002 of the image sensing chip 2. Figure 1As shown, at this time, the lower surface 2002 of the image sensing chip 2 is also attached to the temporary carrier substrate C by the adhesive material, and during the process of filling the insulating connecting structure 3 into the through opening 1003 of the circuit substrate 1, the insulating connecting structure 3 is only filled into the through opening 1003 of the circuit substrate 1 without overflowing out from "between the temporary carrier substrate C and the lower surface 1110 of each of the filling material layers 111 of the flat surrounding structure 11" or "between the temporary carrier substrate C and the lower surface 1020 of each of the second covering portions 102B of the insulating covering layer 102" (that is, no gap is generated between the temporary carrier substrate C and the lower surface 1110 of each of the filling material layers 111 of the flat surrounding structure 11, and no gap is generated between the temporary carrier substrate C and the lower surface 1020 of each of the second covering portions 102B of the insulating covering layer 102), thereby avoiding the generation of glue overflow or residual glue on the bottom end (or back surface) of the circuit substrate 1 of the image acquisition module M. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present application.
[0036] Therefore, in combination with Figure 3 and Figure 4 As shown, after the temporary carrier substrate C is detached from the circuit substrate 1 by "direct irradiation of laser light generated by a laser generator" or "indirect heating of heat source generated by a heater", the lower surrounding surface 3000 of the insulating connecting structure 3 is exposed without being covered, and the lower surrounding surface 3000 of the insulating connecting structure 3, the lower surface of the flat surrounding structure 11 (that is, the lower surface 1110 of each of the filling material layers 111 and the lower surface 1020 of each of the second covering portions 102B of the insulating covering layer 102), and the lower surface 2002 of the image sensing chip 2 can be substantially (or completely) flush with each other. For example, when the temporary carrier substrate C is detached from the circuit substrate 1 by "direct irradiation of laser light generated by a laser generator" or "indirect heating of heat source generated by a heater", the lower surrounding surface 3000 of the insulating connecting structure 3 will generate a glue deformation mark (not shown in the figure) formed after being heated by the heat source generated by the laser generator or the heater. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present application.
[0037] For example, as Figure 1 or Figure 3As shown, in one embodiment, the thickness of the insulating connecting structure 3 can be less than or equal to the thickness of the image sensing chip 2, and the thickness of the insulating connecting structure 3 can be less than or equal to the thickness of the circuit substrate 1, and the insulating connecting structure 3 can be closely connected between a peripheral surrounding surface 2000 of the image sensing chip 2 and an inner surrounding surface 1004 of the through opening 1003 of the circuit substrate 1. In addition, in one embodiment, when the inner surrounding surface 1004 of the through opening 1003 of the circuit substrate 1 can be configured as a roughened surrounding surface, the roughened surrounding surface can be used to increase the adhesion force or contact area between the insulating connecting structure 3 and the circuit substrate 1. In addition, in one embodiment, all or a portion of the peripheral surrounding surface 2000 of the image sensing chip 2 can be covered by the insulating connecting structure 3, thereby adjusting the adhesion force or contact area between the insulating connecting structure 3 and the image sensing chip 2 (i.e., the greater the area of the peripheral surrounding surface 2000 of the image sensing chip 2 covered by the insulating connecting structure 3, the greater the adhesion force or contact area between the insulating connecting structure 3 and the image sensing chip 2). However, the above examples are only one possible embodiment and are not intended to limit the present application.
[0038] For example, in one embodiment, the insulating connecting structure 3 can have an extended connecting portion (not shown) extending to the upper surface 1001 of the circuit substrate 1, thereby increasing the adhesion force or contact area between the insulating connecting structure 3 and the circuit substrate 1. That is, the insulating connecting structure 3 can be extended by the extended connecting portion to overlap the upper surface 1001 of the circuit substrate 1, so there is more contact area between the insulating connecting structure 3 and the circuit substrate 1 (or the insulating connecting structure 3 can receive more support from the circuit substrate 1), which makes the insulating connecting structure 3 less likely to be separated from the through opening 1003 of the circuit substrate 1 due to external forces (e.g., the external forces generated when the temporary carrier substrate C is removed from the circuit substrate 1). However, the above examples are only one possible embodiment and are not intended to limit the present application. Figure 4 As shown, in order to remove the temporary carrier substrate C from the circuit substrate 1. However, the above examples are only one possible embodiment and are not intended to limit the present application.
[0039] It is worth noting that, for example, as shown in FIG. 1, the temporary carrier substrate C can be a glass substrate, a plastic substrate, a silicon substrate, or the like. Figure 1 or Figure 3As shown, the image acquisition module M provided by the first embodiment of the present application further comprises a filter assembly 5. The filter assembly 5 can be disposed above the image sensing chip 2 by being supported by a plurality of support bodies (not numbered) or a surrounding support member (not numbered). The filter assembly 5 can be surrounded by a plurality of metal leads W. The height of the filter assembly 5 relative to the image sensing chip 2 can be higher or lower than the height of the plurality of metal leads W relative to the image sensing chip 2. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present application.
[0040] Second embodiment
[0041] Referring to Figures 5 to 8 As shown, the image acquisition module M provided by the second embodiment of the present application. By Figure 6 Compared with Figure 2 and compared with Figure 8 and compared with Figure 4 The main difference between the second embodiment and the first embodiment is that in the second embodiment, the flat surrounding structure 11 of the circuit substrate 1 can include a plurality of filling material layers 111 and a thickening material layer 112 (or a material thickening layer). The plurality of filling material layers 111 of the flat surrounding structure 11 (such as conductive material that does not electrically conduct with the circuit layout layer 101, or non-conductive material that is the same as or different from the material of the insulating cover layer 102) can be filled (completely filled) in the plurality of recessed spaces 102C of the insulating cover layer 102, respectively, and the thickening material layer 112 can be used to cover the plurality of filling material layers 111 and the plurality of second cover portions 102B. It is worth noting that the thickening material layer 112 of the flat surrounding structure 11 has a flat surface 1120, and the flat surface 1120 of the thickening material layer 112 of the flat surrounding structure 11 and the lower surface 2002 of the image sensing chip 2 can be substantially (or completely) flush with each other. Therefore, when the temporary carrier substrate C (such as a flexible tape or any kind of carrier) is attached to the flat surface 1120 of the thickening material layer 112 of the flat surrounding structure 11 (as shown in FIG. 2B), the plurality of metal leads W of the image acquisition module M can be protected by the temporary carrier substrate C, and the plurality of metal leads W of the image acquisition module M can be prevented from being damaged by external forces. Figure 5As shown, at this time, the lower surface 2002 of the image sensing chip 2 is also attached to the temporary carrier substrate C by the adhesive material, and during the process of filling the insulating connecting structure 3 into the through opening 1003 of the circuit substrate 1, the insulating connecting structure 3 is only filled into the through opening 1003 of the circuit substrate 1 without overflowing out from between the temporary carrier substrate C and the flat surface 1120 of the thickened material layer 112 of the flat surrounding structure 11 (that is, no gap is formed between the temporary carrier substrate C and the flat surface 1120 of the thickened material layer 112 of the flat surrounding structure 11), thereby avoiding the occurrence of glue overflow or residual glue on the bottom end (or back surface) of the circuit substrate 1 of the image acquisition module M. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present application.
[0042] Therefore, in combination with Figure 7 and Figure 8 As shown, after the temporary carrier substrate C is detached from the circuit substrate 1 by the direct irradiation of laser light generated by the laser generator or the indirect heating of heat source generated by the heater, the lower surrounding surface 3000 of the insulating connecting structure 3 is exposed without being covered, and the lower surrounding surface 3000 of the insulating connecting structure 3, the lower surface of the flat surrounding structure 11 (that is, the flat surface 1120 of the thickened material layer 112 of the flat surrounding structure 11), and the lower surface 2002 of the image sensing chip 2 are substantially (or completely) flush with each other. For example, when the temporary carrier substrate C is detached from the circuit substrate 1 by the direct irradiation of laser light generated by the laser generator or the indirect heating of heat source generated by the heater, the lower surrounding surface 3000 of the insulating connecting structure 3 will form a glue deformation trace (not shown) after being heated by the heat source generated by the laser generator or the heater. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present application.
[0043] Third embodiment
[0044] Referring to Figure 9 and Figure 10As shown, the third embodiment of this utility model provides an image acquisition module M. The main difference between the third embodiment and the first and second embodiments is that, in the third embodiment, the insulating connection structure 3 may have a main filling layer 30A (or a first surrounding filling layer) disposed in the through opening 1003 of the circuit board 1 and a surrounding filling layer 30B (or a second surrounding filling layer, the maximum width of which may be any positive integer between 100μm and 150μm) surrounding and connected (e.g., integrally formed or non-integral formed) to the main filling layer 30A. The surrounding filling layer 30B may be configured as a flat surrounding structure 11, and the surrounding filling layer 30B may be disposed on the lower surface 1002 of the circuit board 1 and cover the plurality of conductive lines 1010 of the circuit layout layer 101. Therefore, when the temporary carrier substrate C (e.g., flexible tape or any kind of carrier) is flatly attached to the bottom surface of the circuit board 1 (at this time, the lower surface 2002 of the image sensing chip 2 is also flatly attached to the temporary carrier substrate C by adhesive material), during the process of the insulating connection structure 3 being filled into the through opening 1003 of the circuit board 1, the insulating connection structure 3 will only be filled into the through opening 1003 of the circuit board 1 and will not overflow from between the temporary carrier substrate C and the insulating cover layer 102 (that is, no gap will be generated between the temporary carrier substrate C and the insulating cover layer 102), thereby avoiding glue overflow / overfill or residual glue on the bottom (or back) of the circuit board 1 of the image acquisition module M. However, the above example is only one possible embodiment and is not intended to limit the present invention.
[0045] In this way, to cooperate Figure 10 As shown, when the temporary support substrate C is detached from the circuit board 1 by "direct irradiation by laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater", the lower surface 3001 of the main filling layer 30A, the lower surface 3002 of the surrounding filling layer 30B (which serves as the flat surrounding structure 11), and the lower surface 2002 of the image sensing chip 2 can be substantially (or completely) flush with each other. For example, when the temporary support substrate C is detached from the circuit board 1 by "direct irradiation by laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater", the lower surrounding surface of the insulating connection structure 3 (that is, the lower surface 3001 of the main filling layer 30A and the lower surface 3002 of the surrounding filling layer 30B) will have a colloidal deformation mark (not shown) formed after being heated by the heat source generated by the laser generator or the heater. However, the above example is only one possible embodiment and is not intended to limit the present invention.
[0046] Fourth embodiment
[0047] Referring to Figures 11 to 13 As shown in FIG. 4, the fourth embodiment of the present application provides an image acquisition module M. The most important difference between the fourth embodiment and the first, second and third embodiments is that, in the fourth embodiment, the lower surface 1002 of the circuit substrate 1 can have a wireless circuit layout area 10020 (or a substrate clearance area, the maximum width of which can be any positive integer between 100 μm and 150 μm), the wireless circuit layout area 10020 of the circuit substrate 1 can be surrounded by the circuit layout layer 101 and the insulating cover layer 102, and the wireless circuit layout area 10020 of the circuit substrate 1 can be configured as a flat surrounding structure 11. Therefore, when the temporary carrier substrate C (such as a flexible adhesive tape or any kind of carrier) is attached to the bottom surface of the circuit substrate 1 (at this time, the lower surface 2002 of the image sensing chip 2 is also attached to the temporary carrier substrate C by the adhesive material), during the process of filling the insulating connecting structure 3 in the through opening 1003 of the circuit substrate 1, the insulating connecting structure 3 will only be filled in the through opening 1003 of the circuit substrate 1 and will not overflow from "between the temporary carrier substrate C and the wireless circuit layout area 10020 of the circuit substrate 1" (that is, no gap will be generated between the temporary carrier substrate C and the wireless circuit layout area 10020 of the circuit substrate 1), thereby avoiding the generation of glue overflow or residual glue on the bottom end (or back surface) of the circuit substrate 1 of the image acquisition module M. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present application.
[0048] Therefore, when the temporary carrier substrate C can be separated from the circuit substrate 1 by "direct irradiation of laser light generated by a laser generator" or "indirect heating of heat source generated by a heater", the lower surrounding surface 3000 of the insulating connecting structure 3 will generate a glue deformation mark (not shown in the figure) formed after being heated by the heat source generated by the laser generator or the heater. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present application. Figure 13 As shown in FIG. 4, the fourth embodiment of the present application provides an image acquisition module M. The most important difference between the fourth embodiment and the first, second and third embodiments is that, in the fourth embodiment, the lower surface 1002 of the circuit substrate 1 can have a wireless circuit layout area 10020 (or a substrate clearance area, the maximum width of which can be any positive integer between 100 μm and 150 μm), the wireless circuit layout area 10020 of the circuit substrate 1 can be surrounded by the circuit layout layer 101 and the insulating cover layer 102, and the wireless circuit layout area 10020 of the circuit substrate 1 can be configured as a flat surrounding structure 11. Therefore, when the temporary carrier substrate C (such as a flexible adhesive tape or any kind of carrier) is attached to the bottom surface of the circuit substrate 1 (at this time, the lower surface 2002 of the image sensing chip 2 is also attached to the temporary carrier substrate C by the adhesive material), during the process of filling the insulating connecting structure 3 in the through opening 1003 of the circuit substrate 1, the insulating connecting structure 3 will only be filled in the through opening 1003 of the circuit substrate 1 and will not overflow from "between the temporary carrier substrate C and the wireless circuit layout area 10020 of the circuit substrate 1" (that is, no gap will be generated between the temporary carrier substrate C and the wireless circuit layout area 10020 of the circuit substrate 1), thereby avoiding the generation of glue overflow or residual glue on the bottom end (or back surface) of the circuit substrate 1 of the image acquisition module M. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present application.
[0049] Fifth embodiment
[0050] Referring to Figure 14 The fifth embodiment of the present application provides a portable electronic device P, which can be configured to use any of the image acquisition modules M provided by the first, second, third and fourth embodiments. For example, the portable electronic device P can be a smart phone, a desktop computer, a notebook computer, a tablet computer or any kind of electronic device. However, the above examples are only one possible embodiment and are not intended to limit the present application.
[0051] It is worth noting that, for example, in the first to fifth embodiments of the present application, the present application can further provide a method for manufacturing an image acquisition module M, which can include: first, the circuit board 1 and a temporary carrier substrate C are close to each other, so that the circuit board 1 is arranged on the temporary carrier substrate C (or until the circuit board 1 and the temporary carrier substrate C are in complete contact), wherein the bottom end of the through opening 1003 of the circuit board 1 is closed by the temporary carrier substrate C; then, an image sensing chip 2 is accommodated in the through opening 1003 of the circuit board 1 and arranged on the temporary carrier substrate C, and then an insulating connection structure 3 is formed in the through opening 1003 of the circuit board 1 and connected between the image sensing chip 2 and the circuit board 1; then, the temporary carrier substrate C is removed from the circuit board 1; next, the image sensing chip 2 is electrically connected to the circuit board 1 by a plurality of metal leads W; then, a lens assembly 4 is arranged on the circuit board 1, wherein the lens assembly 4 includes a lens carrier 41 arranged on the circuit board 1 and a lens module 42 carried by the lens carrier 41. Further, according to different processing requirements, the temporary carrier substrate C can be removed from the circuit board 1 after the step of "forming an insulating connection structure 3 in the through opening 1003 of the circuit board 1", or the temporary carrier substrate C can be removed from the circuit board 1 after the step of "electrically connecting the image sensing chip 2 to the circuit board 1 by a plurality of metal leads W", or the temporary carrier substrate C can be removed from the circuit board 1 after the step of "arranging the lens assembly 4 on the circuit board 1". However, the above examples are only one possible embodiment and are not intended to limit the present application.
[0052] It is worth noting that, for example, in the first to fifth embodiments of the present application, the present application can further provide an M manufacturing method of an image acquisition module, which can include: first, the circuit board 1 and a temporary bearing substrate C are close to each other, so that the circuit board 1 is arranged on the temporary bearing substrate C (or until the circuit board 1 and the temporary bearing substrate C are completely contacted), wherein the bottom end of the through opening 1003 of the circuit board 1 is closed by the temporary bearing substrate C; then, an image sensing chip 2 is accommodated in the through opening 1003 of the circuit board 1 and arranged on the temporary bearing substrate C through an adhesive layer (such as double-sided adhesive or any kind of adhesive layer); then, the image sensing chip 2 is electrically connected to the circuit board 1 through a plurality of metal leads W (or also can include supporting a light filtering component 5 above the image sensing chip 2 through a plurality of supports or a surrounding support); next, an insulating connecting structure 3 is formed in the through opening 1003 of the circuit board 1 and connected between the image sensing chip 2 and the circuit board 1; then, the temporary bearing substrate C is removed from the circuit board 1; then, a lens assembly 4 is arranged on the circuit board 1, wherein the lens assembly 4 includes a lens bearing 41 arranged on the circuit board 1 and a lens module 42 carried by the lens bearing 41. It is worth noting that, according to different needs, the "wire bonding step (or chip electrical connection step)" of electrically connecting the image sensing chip 2 to the circuit board 1 through a plurality of metal leads W and the "glue filling step (chip limiting step)" of forming an insulating connecting structure 3 in the through opening 1003 of the circuit board 1 and connecting between the image sensing chip 2 and the circuit board 1 can be two steps executed in sequence (that is, the glue filling step is performed first and then the wire bonding step is performed) or two steps executed in reverse (that is, the wire bonding step is performed first and then the glue filling step is performed).
[0053] Advantages of the embodiments
[0054] One of the advantages of the present application is that the image acquisition module M and the portable electronic device P provided by the present application can be substantially (or completely) flush with each other through the technical solutions of "the image sensing chip 2 is arranged in the through opening 1003 of the circuit board 1 and electrically connected to the circuit board 1", "the insulating connecting structure 3 is arranged in the through opening 1003 of the circuit board 1 and connected between the image sensing chip 2 and the circuit board 1", "the lower surface 2002 of the image sensing chip 2 is not covered by the insulating connecting structure 3 and exposed to the outside" and "the circuit board 1 has a flat surrounding structure 11 close to and surrounding the through opening 1003".
[0055] Therefore, during the process of filling the insulating connecting structure 3 in the through opening 1003 of the circuit substrate 1, the insulating connecting structure 3 will not overflow from between the temporary supporting substrate C and the flat surrounding structure 11, thereby avoiding the glue overflow or residual glue on the bottom end (or back surface) of the circuit substrate 1 of the image acquisition module M.
[0056] The above disclosed is only the preferred feasible embodiment of the present application, and does not limit the protection scope of the claims of the present application, so that any equivalent technical change made by applying the content of the present application specification and drawings is included in the protection scope of the claims of the present application.
Claims
1. An image acquisition module, characterized by, The image acquisition module comprises: a circuit substrate having an upper surface, a lower surface, and a through opening connected between the upper surface and the lower surface; an image sensing chip disposed in the through opening of the circuit substrate and electrically connected to the circuit substrate; and an insulating connecting structure disposed in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate; wherein a lower surface of the image sensing chip is exposed and uncovered by the insulating connecting structure; wherein the circuit substrate has a flat surrounding structure close to and surrounding the through opening, and a lower surface of the flat surrounding structure is flush with the lower surface of the image sensing chip.
2. The image acquisition module according to claim 1, wherein: wherein the circuit substrate comprises a circuit layout layer disposed on the lower surface of the circuit substrate, and an insulating cover layer for covering the circuit layout layer, and the circuit layout layer has a plurality of conductive circuit portions close to and surrounding the through opening; wherein the insulating cover layer comprises a plurality of first cover portions disposed on the lower surface of the circuit substrate, a plurality of second cover portions each for covering a corresponding one of the conductive circuit portions, and a plurality of recessed spaces each between a corresponding one of the first cover portions and two adjacent ones of the second cover portions.
3. The image acquisition module according to claim 2, wherein: wherein, the flat surrounding structure of the circuit substrate comprises a plurality of filling material layers, and each of the filling material layers of the flat surrounding structure is filled in a corresponding one of the recessed spaces of the insulating cover layer; wherein a lower surface of each of the filling material layers of the flat surrounding structure is flush with a lower surface of each of the second cover portions of the insulating cover layer, and the lower surface of each of the filling material layers of the flat surrounding structure is flush with the lower surface of the image sensing chip; wherein the insulating connecting structure has a lower surrounding surface exposed and uncovered, and the lower surrounding surface of the insulating connecting structure, the lower surface of the flat surrounding structure, and the lower surface of the image sensing chip are flush with each other.
4. The image acquisition module according to claim 2, wherein: wherein the flat surrounding structure of the circuit substrate comprises a plurality of filling material layers and a thickening material layer, each of the filling material layers of the flat surrounding structure is filled in a corresponding one of the recessed spaces of the insulating cover layer, and the thickening material layer is for covering the filling material layers and the second cover portions; wherein the thickening material layer of the flat surrounding structure has a flat surface, and the flat surface of the thickening material layer of the flat surrounding structure is flush with the lower surface of the image sensing chip. The insulation connecting structure has a lower surrounding surface exposed without being covered, and the lower surrounding surface of the insulation connecting structure, the lower surface of the flat surrounding structure, and the lower surface of the image sensing chip are flush with each other.
5. The image acquisition module of claim 1, wherein: wherein the circuit substrate includes a circuit layout layer disposed on the lower surface of the circuit substrate and an insulating cover layer for covering the circuit layout layer, and the circuit layout layer has a plurality of conductive circuit portions proximate to and surrounding the through opening.
6. The image acquisition module of claim 5, wherein: wherein the insulation connecting structure has a main filling layer disposed in the through opening of the circuit substrate and a surrounding filling layer connected to the main filling layer, the surrounding filling layer is configured as the flat surrounding structure, and the surrounding filling layer is disposed on the lower surface of the circuit substrate and covers a plurality of the conductive circuit portions of the circuit layout layer; wherein a lower surface of the main filling layer, a lower surface of the surrounding filling layer as the flat surrounding structure, and the lower surface of the image sensing chip are flush with each other.
7. The image acquisition module of claim 5, wherein: wherein the lower surface of the circuit substrate has a non-circuit layout area, the non-circuit layout area of the circuit substrate is surrounded by the circuit layout layer and the insulating cover layer, and the non-circuit layout area of the circuit substrate is configured as the flat surrounding structure; wherein the maximum width of the non-circuit layout area of the circuit substrate is between 100 μm and 150 μm; wherein the insulation connecting structure has a lower surrounding surface exposed without being covered, and the lower surrounding surface of the insulation connecting structure, the non-circuit layout area of the circuit substrate, and the lower surface of the image sensing chip are flush with each other.
8. The image acquisition module of claim 1, wherein: wherein the upper surface of the circuit substrate has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are respectively electrically connected to the plurality of substrate conductive pads of the circuit substrate through a plurality of metal leads; wherein the insulation connecting structure is tightly connected between a peripheral surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate; wherein the inner surrounding surface of the through opening of the circuit substrate is configured as a roughened surrounding surface, thereby increasing the adhesion or contact area between the insulation connecting structure and the circuit substrate; wherein all or a portion of the peripheral surrounding surface of the image sensing chip is covered by the insulation connecting structure, thereby adjusting the adhesion or contact area between the insulation connecting structure and the image sensing chip; The thickness of the insulating connecting structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit substrate.
9. The image acquisition module of claim 1, wherein, The image acquisition module further includes a lens assembly including a lens carrier disposed on the circuit substrate and a lens module carried by the lens carrier, and an upper surface of the image sensing chip has an image sensing area corresponding to the lens module.
10. The image acquisition module of claim 1, wherein, The image acquisition module further includes a filter assembly disposed above the image sensing chip by support of a plurality of support bodies or a surrounding support member, and the filter assembly is surrounded by a plurality of metal leads.