Monocrystalline silicon wafer lifting type boron source spin-coating device

Abstract

The utility model belongs to the technical field of monocrystalline silicon wafer processing, and discloses a monocrystalline silicon wafer lifting type boron source spin coating device which comprises a shell, the surface of the shell is in sliding connection with a placing plate, the outer end of the shell is fixedly provided with a first hydraulic cylinder, and an output shaft of the first hydraulic cylinder is fixedly provided with a push plate. A push plate is arranged in the shell, a placing plate is arranged in the shell, one end of the push plate is fixedly mounted with the bottom of the placing plate, a bottom plate is propped against the bottom of the inner wall of the shell, and the surface of the bottom plate is rotatably connected with a rotating disc. A second hydraulic cylinder is started to drive a sliding plate to move upwards, so that a bottom plate drives a rotating disc to move upwards, the monocrystalline silicon wafer is supported and dragged, a motor is started to drive the rotating disc to rotate at a high speed, other areas of the monocrystalline silicon wafer can be conveniently coated with a spray head, and an operator does not need to coat the monocrystalline silicon wafer with a liquid boron source while coating the monocrystalline silicon wafer; and the heating time and temperature are continuously checked, so that the working efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to monocrystal silicon wafer processing technical field, concretely relates to a kind of monocrystal silicon wafer lifting type boron source spin coating device. BACKGROUND

[0002] Monocrystal silicon wafer: the single crystal of silicon, is a kind of crystal with substantially complete lattice structure.Different directions have different properties, it is a kind of good semi-conductive material.Purity requirement reaches 99.9999%, even reaches 99.9999999% or more.Used to manufacture semiconductor devices, solar cells and the like.Using high-purity polycrystalline silicon is drawn into in single crystal furnace.

[0003] In prior art, monocrystal silicon wafer needs to be sent into heating equipment for heating treatment after being coated with liquid boron source, nitrogen is used as protective gas in heating treatment, constant temperature regulation needs to be carried out at different time periods, so that operator needs to coat monocrystal silicon wafer with liquid boron source, generally check heating time and temperature, or another operator carries out double-station operation, and work efficiency is not high.

[0004] Therefore, a kind of monocrystal silicon wafer lifting type boron source spin coating device is provided, which is upgraded and reformed based on the device to solve these deficiencies. CONTENT OF UTILITY MODEL

[0005] The utility model aims at: to solve the problem of background art, the utility model provides a kind of monocrystal silicon wafer lifting type boron source spin coating device.

[0006] The utility model discloses a kind of monocrystal silicon wafer lifting type boron source spin coating device to achieve the above-mentioned purposes specifically using the following technical solutions:

[0007] A kind of monocrystal silicon wafer lifting type boron source spin coating device, including shell, the surface of the shell is slidably connected with placing plate, the outer end of the shell is fixedly installed with hydraulic cylinder one, the output shaft of the hydraulic cylinder one is fixedly installed with push plate, the one end of the push plate is fixedly installed with the bottom of the placing plate, the inner wall bottom of the shell is abutted with bottom plate, the surface of the bottom plate is rotatably connected with rotating disc, the inner wall of the bottom plate is fixedly installed with motor one, the output shaft of the motor one is fixedly installed with the bottom of the rotating disc, the inner wall of the rotating disc is fixedly installed with vacuum pump, the output shaft of the vacuum pump is fixedly installed with connecting pipe, the surface of the rotating disc is equipped with hole, the one end of the hole is connected with the one end of the connecting pipe, the inner wall of the shell is fixedly installed with hydraulic cylinder two, the output shaft of the hydraulic cylinder two is fixedly installed with sliding plate, the outer end of the sliding plate is fixedly connected with connecting block, the one end of the connecting block is fixedly connected with the outer end of the bottom plate, the upper side of the inner wall of the shell is slidably connected with sliding block, the one end of the sliding block is fixedly installed with nozzle, the outer end of the shell is provided with adjusting mechanism.

[0008] Further, the outer end of the sliding block is fixedly installed with a liquid inlet pipe, one end of the liquid inlet pipe is fixedly installed with the outer end of the shell, and the other end of the liquid inlet pipe is connected with the inner wall of the spray head.

[0009] Further, the inner wall of the shell is fixedly connected with an L-shaped positioning block, and the outer end of the L-shaped positioning block is in abutment with the bottom of the placement plate.

[0010] Further, the inner wall of the sliding plate is slidingly connected with a limiting rod, and the two ends of the limiting rod are fixedly installed with the inner wall of the shell.

[0011] Further, the adjusting mechanism comprises a second motor, the outer end of the shell is fixedly installed with the second motor, the output shaft of the second motor is fixedly installed with a threaded rod, the outer end of the threaded rod is threadedly connected with a threaded block, and one end of the threaded block is fixedly installed with one end of the sliding block.

[0012] Further, the inner wall of the threaded block is slidingly connected with a guide rod, and the two ends of the guide rod are fixedly installed with the inner wall of the shell.

[0013] The beneficial effects of the utility model are as follows:

[0014] The utility model discloses a hydraulic cylinder one is started to drive the push plate to move, makes the placement plate to deliver monocrystalline silicon wafer to the inside of the shell, and the hydraulic cylinder two is started to drive the sliding plate to move upwards, and the bottom plate drives the rotating disc to move upwards, and monocrystalline silicon wafer is supported and dragged, and the vacuum pump is started to make the inside of the connecting pipe produce negative pressure, and monocrystalline silicon wafer is adsorbed on the rotating disc, and the motor is started to drive the rotating disc to rotate at high speed, and the second motor is started to drive the threaded rod to rotate, and the threaded block drives the spray head to move, and it is convenient to coat other areas of monocrystalline silicon wafer, and personnel need not one side to monocrystalline silicon wafer coating liquid boron source, and the other side constantly checks heating time and temperature, and improves work efficiency. ACCURATE DRAWINGS

[0015] Figure 1 It is the schematic diagram of the whole structure of the utility model;

[0016] Figure 2 It is the internal structure schematic diagram of the shell of the utility model;

[0017] Figure 3 It is the sliding plate structure schematic diagram of the utility model;

[0018] Figure 4 It is the shell overhead internal section view of the utility model.

[0019] Label: 1, shell; 10, liquid inlet pipe; 11, hydraulic cylinder one; 12, placing plate; 13, push plate; 14, spray head; 15, rotating disc; 16, hole; 17, connecting pipe; 18, vacuum pump; 19, bottom plate; 2, adjusting mechanism; 21, motor two; 22, threaded rod; 23, guide rod; 24, threaded block; 25, sliding block; 30, motor one; 31, hydraulic cylinder two; 32, sliding plate; 33, connecting block; 34, limiting rod; 35, L-shaped positioning block. DETAILED DESCRIPTION

[0020] To make the objects, technical solutions, and advantages of the embodiments of the present application clearer, the following will be a clear and complete description of the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0022] It should be noted that: similar labels and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0023] In the description of the embodiments of the present application, it should be noted that the directions or position relationships indicated by the terms "inner", "outer", "upper", etc. are based on the directions or position relationships shown in the drawings, or the directions or position relationships of the product of the present application when it is usually placed, which are only for the convenience of describing the present application and simplifying the description, and cannot be understood as indicating or implying that the indicated device or element must have a particular direction, be constructed and operated in a particular direction, therefore, cannot be understood as a limitation on the present application.

[0024] As Figures 1 to 4As shown in, a single crystal silicon wafer lifting type boron source spin coating device, including the shell 1, the surface of the shell 1 is slidably connected with the placement plate 12, the outer end of the shell 1 is fixedly installed with hydraulic cylinder one 11, the output shaft of hydraulic cylinder one 11 is fixedly installed with the push plate 13, one end of the push plate 13 is fixedly installed with the bottom of the placement plate 12, the inner wall of the bottom plate 19 is abutted, the surface of the bottom plate 19 is rotatably connected with the rotating disc 15, the inner wall of the bottom plate 19 is fixedly installed with motor one 30, the output shaft of motor one 30 is fixedly installed with the bottom of the rotating disc 15, the inner wall of the rotating disc 15 is fixedly installed with the vacuum pump 18, the output shaft of the vacuum pump 18 is fixedly installed with the connecting pipe 17, the surface of the rotating disc 15 is provided with the hole 16, one end of the hole 16 is connected with one end of the connecting pipe 17, the inner wall of the shell 1 is fixedly installed with hydraulic cylinder two 31, the output shaft of hydraulic cylinder two 31 is fixedly installed with the sliding plate 32, the outer end of the sliding plate 32 is fixedly connected with the connecting block 33, one end of the connecting block 33 is fixedly connected with the outer end of the bottom plate 19, the inner wall of the shell 1 is slidably connected with the sliding block 25, one end of the sliding block 25 is fixedly installed with the nozzle 14, the outer end of the shell 1 is provided with the adjusting mechanism 2;

[0025] Specifically, by starting hydraulic cylinder one 11 to drive the push plate 13 to move, the placement plate 12 transports the single crystal silicon wafer to the inside of the shell 1, by starting hydraulic cylinder two 31 to drive the sliding plate 32 to move upwards, the bottom plate 19 drives the rotating disc 15 to move upwards, the single crystal silicon wafer is lifted up, by starting the vacuum pump 18 to make the connecting pipe 17 inside produce negative pressure, the single crystal silicon wafer is adsorbed on the rotating disc 15, by starting the motor 30 to drive the rotating disc 15 to rotate at high speed, the nozzle 14 sprays the boron source on the single crystal silicon wafer.

[0026] As shown in Figure 1 and Figure 2 , the outer end of the sliding block 25 is fixedly installed with the liquid inlet pipe 10, one end of the liquid inlet pipe 10 is fixedly installed with the outer end of the shell 1, one end of the liquid inlet pipe 10 is connected with the inner wall of the nozzle 14; Specifically, the external equipment transports the boron source into the nozzle 14 through the connecting pipe 10.

[0027] As shown in Figure 1 , Figure 3 and Figure 4 , the inner wall of the sliding plate 32 is slidably connected with the limiting rod 34, both ends of the limiting rod 34 are fixedly installed with the inner wall of the shell 1; Specifically, the sliding plate 32 moves stably.

[0028] As shown in Figure 2 and Figure 4 , the inner wall of the shell 1 is fixedly connected with the L-shaped positioning block 35, the outer end of the L-shaped positioning block 35 is abutted with the bottom of the placement plate 12; Specifically, the placement plate 12 stops moving after reaching the area, so that the single crystal silicon wafer is just on the upper side of the rotating disc 15.

[0029] As Figure 1 and Figure 2 shown, the adjusting mechanism 2 includes motor two 21, the outer end of the shell 1 is fixedly installed with motor two 21, the output shaft of motor two 21 is fixedly installed with threaded rod 22, the outer end of threaded rod 22 is threadedly connected with threaded block 24, one end of threaded block 24 is fixedly installed with one end of sliding block 25;Specifically, by starting motor two 21 to drive threaded rod 22 to rotate, make threaded block 24 drive shower head 14 to move, facilitate to other areas of monocrystalline silicon wafer coating.

[0030] As Figure 1 and Figure 2 shown, the inner wall of threaded block 24 is slidably connected with guide rod 23, both ends of guide rod 23 are fixedly installed with the inner wall of shell 1;Specifically, facilitate threaded block 24 to move stably.

[0031] Summarize: when monocrystalline silicon wafer needs to be coated with boron source, place monocrystalline silicon wafer on (adapted) placing plate 12, drive push plate 13 to move by starting hydraulic cylinder one 11, make placing plate 12 transport monocrystalline silicon wafer to the inside of shell 1, drive sliding plate 32 to move upwards by starting hydraulic cylinder two 31, make bottom plate 19 drive rotating disc 15 to move upwards, lift monocrystalline silicon wafer, make connecting pipe 17 inside produce negative pressure by starting vacuum pump 18, adsorb monocrystalline silicon wafer on rotating disc 15, drive rotating disc 15 to rotate at high speed by starting motor 30, make threaded rod 22 rotate by starting motor two 21, make threaded block 24 drive shower head 14 to move, facilitate shower head 14 to coat other areas of monocrystalline silicon wafer;

[0032] Reverse operation, make monocrystalline silicon wafer fall on placing plate 12 again, make placing plate 12 move outside shell 1 by starting hydraulic cylinder one 11, facilitate staff to take out silicon wafer from the side.

[0033] The above shows and describes the basic principle, main features and advantages of the present application. The skilled person in the art should understand that the present application is not limited to the above examples, and the above examples and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements fall within the scope of the claimed present application. The scope of protection required by the present application is defined by the appended claims and their equivalents.

Claims

1. A single-crystal silicon wafer lifting boron source spin coating device, comprising a housing (1), characterized in that: A placement plate (12) is slidably connected to the surface of the outer shell (1). A hydraulic cylinder (11) is fixedly installed at the outer end of the outer shell (1). A push plate (13) is fixedly installed on the output shaft of the hydraulic cylinder (11). One end of the push plate (13) is fixedly installed to the bottom of the placement plate (12). A base plate (19) abuts against the bottom of the inner wall of the outer shell (1). A rotating disk (15) is rotatably connected to the surface of the base plate (19). A motor (30) is fixedly installed on the inner wall of the base plate (19). The output shaft of the motor (30) is fixedly installed to the bottom of the rotating disk (15). A vacuum pump (18) is fixedly installed on the inner wall of the rotating disk (15). The output of the vacuum pump (18) is... A connecting pipe (17) is fixedly installed on the output shaft. A hole (16) is opened on the surface of the rotating disk (15). One end of the hole (16) is connected to one end of the connecting pipe (17). A hydraulic cylinder (31) is fixedly installed on the inner wall of the outer shell (1). A sliding plate (32) is fixedly installed on the output shaft of the hydraulic cylinder (31). A connecting block (33) is fixedly connected to the outer end of the sliding plate (32). One end of the connecting block (33) is fixedly connected to the outer end of the base plate (19). A sliding block (25) is slidably connected to the upper side of the inner wall of the outer shell (1). A nozzle (14) is fixedly installed on one end of the sliding block (25). An adjustment mechanism (2) is provided on the outer end of the outer shell (1).

2. The single-crystal silicon wafer lifting boron source spin coating device as described in claim 1, characterized in that: The outer end of the sliding block (25) is fixedly installed with an inlet pipe (10), one end of the inlet pipe (10) is fixedly installed with the outer end of the outer shell (1), and one end of the inlet pipe (10) is connected to the inner wall of the nozzle (14).

3. The single-crystal silicon wafer lifting boron source spin coating device as described in claim 1, characterized in that: An L-shaped positioning block (35) is fixedly connected to the inner wall of the outer shell (1), and the outer end of the L-shaped positioning block (35) abuts against the bottom of the placement plate (12).

4. The single-crystal silicon wafer lifting boron source spin coating device as described in claim 1, characterized in that: The inner wall of the sliding plate (32) is slidably connected to a limiting rod (34), and the two ends of the limiting rod (34) are fixedly installed to the inner wall of the outer shell (1).

5. The single-crystal silicon wafer lifting boron source spin coating device as described in claim 1, characterized in that: The adjustment mechanism (2) includes a second motor (21). The second motor (21) is fixedly installed on the outer end of the outer shell (1). A threaded rod (22) is fixedly installed on the output shaft of the second motor (21). A threaded block (24) is threadedly connected to the outer end of the threaded rod (22). One end of the threaded block (24) is fixedly installed with one end of the sliding block (25).

6. The single-crystal silicon wafer lifting boron source spin coating device as described in claim 5, characterized in that: The inner wall of the threaded block (24) is slidably connected to a guide rod (23), and the two ends of the guide rod (23) are fixedly installed to the inner wall of the outer shell (1).

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