Swing magnetic polishing device using magnetic polishing medium

Abstract

The utility model discloses a swinging magnetic polishing device using a magnetic polishing medium. The swinging magnetic polishing device comprises a rack, a swing mechanism and a magnetic polishing mechanism are arranged on the rack, and the swing mechanism can drive the magnetic polishing mechanism to swing. According to the magnetic polishing device, the strength of a magnetic field is enhanced by arranging the annular Halbach array magnets, and the polishing efficiency and effect are improved; meanwhile, by means of the swing mechanism, a workpiece polishing area can be continuously and randomly disturbed during polishing, the polishing angle is changed, the phenomenon of incomplete polishing is avoided, complex and precise small parts can be polished, and the polishing efficiency and quality are further improved; in addition, a magnetic polishing mode is adopted, the safety is higher while the workpiece is not damaged, a physical polishing mode is adopted, the health of workers cannot be threatened, and the explosion accident caused by polishing dust is avoided.

Description

Technical Field

[0001] This utility model relates to the technical field of polishing equipment, specifically to an oscillating magnetic polishing device using a magnetic polishing medium. Background Technology

[0002] In modern manufacturing, surface treatment of metal parts is crucial for their overall performance and appearance quality. Traditional polishing methods rely heavily on manual labor, which is time-consuming, labor-intensive, and can delay production schedules in mass production. From a quality perspective, manual polishing is prone to damaging the part's structure with the slightest mistake, compromising workpiece quality. Furthermore, it easily leads to over-polishing or under-polishing in certain areas, resulting in poor surface finish and making it difficult to polish complex, precision small parts, thus failing to meet the requirements of high-end applications. From a safety perspective, polishing generates a large amount of dust, threatening worker health and posing a potential explosion hazard. Therefore, manual polishing methods cannot meet the demands of efficient, high-precision, and safe modern industry. Utility Model Content

[0003] To overcome the shortcomings of existing technologies, this invention provides an oscillating magnetic polishing device using a magnetic polishing medium. This magnetic polishing device enhances the strength and stability of the magnetic field by setting up a ring-shaped Hellbeck array magnet, thereby improving polishing efficiency and ensuring the surface quality of the polished workpiece. Simultaneously, it continuously oscillates the polishing area during polishing, randomly disrupting the polishing angle of the workpiece to avoid incomplete polishing. This allows for the polishing of complex and precise small parts, ensuring polishing quality. Furthermore, the magnetic polishing method is safer than the workpiece itself. Polishing workpieces using this device does not pose a threat to worker health and avoids accidents caused by polishing dust explosions.

[0004] The technical solution of this utility model is as follows:

[0005] A swinging magnetic polishing device using a magnetic polishing medium includes a frame; the frame is equipped with a swinging mechanism and a magnetic polishing mechanism, the swinging mechanism being able to drive the magnetic polishing mechanism to swing; the swinging mechanism includes a fixed frame, a power motor, a transmission rod, a slider, a sliding groove plate, and a swing shaft; the fixed frame is connected to the frame, and the power motor is mounted on the fixed frame; the transmission rod is horizontally arranged, one end of which is connected to the output shaft of the power motor, and the other end is connected to the slider; there are two sliding groove plates, respectively located at both ends of the slider, each with an arc groove, and correspondingly, both ends of the slider have protrusions located within the arc grooves, allowing them to slide within the arc grooves; The upper end of the swing shaft is fixedly connected to two sliding plates, and the middle part is hinged to the fixed frame. The magnetic polishing mechanism includes a swing frame, a magnetic disk, a polishing motor, a polishing basin, and a mounting frame. The two sides of the upper end of the swing frame are hinged to the frame, and its lower end is connected to the lower end of the swing shaft, enabling it to swing under the drive of the swing shaft. The mounting frame is fixed on the swing frame, and the polishing motor is mounted on the mounting frame, with its output shaft fixedly connected to the center of the magnetic disk. Correspondingly, the polishing basin is positioned above the magnetic disk. The magnetic disk contains a ring-shaped Helbeck array magnet, which can generate a Helbeck array magnetic field. After the magnetic disk rotates, it can drive the magnetic polishing medium in the polishing basin to move, removing the material from the surface of the workpiece.

[0006] Compared with the prior art, the oscillating magnetic polishing device using a magnetic polishing medium of this invention has achieved significant progress, as detailed below:

[0007] 1) The oscillating magnetic polishing device using magnetic polishing medium of this utility model is equipped with a ring-shaped Heilbeck array magnet on the magnetic disk, which can generate a strong magnetic field, so that the magnetic polishing medium in the polishing basin can obtain greater polishing force and efficiently remove the surface of the workpiece; at the same time, the magnetic polishing device of this utility model also introduces an oscillating mechanism, which can make the magnetic polishing mechanism oscillate when polishing the workpiece, randomly disturb the polishing angle of the workpiece, shorten the polishing time of a single workpiece, and improve the efficiency of batch workpieces.

[0008] 2) The oscillating magnetic polishing device of this utility model using magnetic polishing media adopts a flexible contact polishing method, which avoids the workpiece deformation and damage caused by polishing pressure in traditional polishing methods. The ring-shaped Helbeck array magnet used can generate a higher magnetic field in the polishing area and rotate relative to the polishing basin to control the movement of the magnetic polishing media in the polishing basin, ensuring the efficiency and quality of polishing. At the same time, the oscillating mechanism changes the polishing angle of the workpiece during polishing, avoiding the phenomenon of incomplete polishing. It can complete the polishing of relatively complex and precise small parts, ensuring the surface quality of the workpiece after polishing and improving the polishing effect.

[0009] 3) Polishing workpieces using the oscillating magnetic polishing device with magnetic polishing medium of this utility model will not pose a threat to the health of workers and will avoid accidents caused by explosions due to polishing dust.

[0010] Furthermore, in the aforementioned oscillating magnetic polishing device using a magnetic polishing medium, the top edge of the polishing basin is provided with a lug, and the mounting frame supports the polishing basin by pressing against the lug; the mounting frame contacts the side of the polishing basin, thus limiting its position. This structure facilitates the placement and removal of the polishing basin, simplifying the processing procedure.

[0011] Furthermore, in the aforementioned oscillating magnetic polishing device using a magnetic polishing medium, the middle part of the oscillating shaft is connected to the fixed frame via a connecting pin.

[0012] Furthermore, in the aforementioned oscillating magnetic polishing device using a magnetic polishing medium, the annular Hellbeck array magnets are uniformly distributed around the axis of the magnet disk along the circumference, and the number can be 2-6. By uniformly arranging multiple annular Hellbeck array magnets, the strength and stability of the generated magnetic field can be improved, ensuring the polishing effect.

[0013] Furthermore, in the aforementioned oscillating magnetic polishing device using a magnetic polishing medium, the radius of the magnet disk is larger than that of the polishing basin. This is more conducive to the arrangement of the annular Heilbeck array magnets, ensuring the quality of polishing.

[0014] Furthermore, in the aforementioned oscillating magnetic polishing device using a magnetic polishing medium, the protrusion is cylindrical, with its outer circumferential surface tangent to the side of the arc groove. This structure ensures a tight fit between the protrusion and the arc groove, resulting in more stable movement of the protrusion within the arc groove and improving the accuracy of the oscillation.

[0015] Furthermore, in the aforementioned oscillating magnetic polishing device using a magnetic polishing medium, the oscillating shaft is connected to the oscillating frame via a connecting rod. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the oscillating magnetic polishing device using a magnetic polishing medium according to this utility model;

[0017] Figure 2 This is a schematic diagram of the swing mechanism in the swing magnetic polishing device using a magnetic polishing medium according to this utility model;

[0018] Figure 3 This is a schematic diagram of the slide plate and swing shaft in the oscillating magnetic polishing device using magnetic polishing medium of this utility model;

[0019] Figure 4This is a schematic diagram of the slider in the oscillating magnetic polishing device using a magnetic polishing medium according to this utility model;

[0020] Figure 5 This is a schematic diagram of the transmission shaft in the oscillating magnetic polishing device using a magnetic polishing medium according to this utility model;

[0021] Figure 6 This is a schematic diagram of the swing frame and the machine frame in the swing magnetic polishing device using magnetic polishing medium of this utility model;

[0022] Figure 7 This is a schematic diagram of the magnetic polishing mechanism in the oscillating magnetic polishing device using a magnetic polishing medium according to this utility model (the oscillating frame and mounting frame are hidden in the figure to clearly show the structure).

[0023] Figure 8 This is a diagram showing the distribution of the annular Helbeck array magnets on the magnet disk in the oscillating magnetic polishing device using magnetic polishing media according to this utility model.

[0024] The markings in the attached diagram are as follows: 1-Frame; 2-Fixed frame; 3-Power motor; 4-Transmission rod; 5-Slider; 501-Protrusion; 6-Slide plate; 601-Circular groove; 7-Swing shaft; 8-Swing frame; 9-Magnetic disk; 901-Annular Heilbeck array magnet; 10-Polishing motor; 11-Polishing basin; 1101-Lug; 12-Mounting bracket; 13-Connecting rod; 14-Connecting pin. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments, but this should not be construed as the basis for determining the present invention. Contents not described in detail in the following embodiments are all common knowledge in the art.

[0026] Example (see) Figure 1-8 ):

[0027] The oscillating magnetic polishing device using a magnetic polishing medium includes a frame 1; the frame 1 is provided with an oscillating mechanism and a magnetic polishing mechanism, the oscillating mechanism being able to drive the magnetic polishing mechanism to oscillate.

[0028] In this embodiment, the swing mechanism includes a fixed frame 2, a power motor 3, a transmission rod 4, a slider 5, a sliding groove plate 6, and a swing shaft 7. The fixed frame 2 is connected to the frame 1, and the power motor 3 is mounted on the fixed frame 2. The transmission rod 4 is horizontally arranged, with one end connected to the output shaft of the power motor 3 and the other end connected to the slider 5. There are two sliding groove plates 6, respectively located at both ends of the slider 5. The sliding groove plates 6 are provided with arc grooves 601. Correspondingly, both ends of the slider 5 are provided with protrusions 501, which are located in the arc grooves 601 and can slide within the arc grooves 601. The upper end of the swing shaft 7 is fixedly connected to the two sliding groove plates 6, and its middle part is hinged to the fixed frame 2. When the motor drives the transmission rod 4 to rotate, the transmission rod 4 will drive the slider 5 to rotate. Since the sliding groove plate 6 is limited and cannot rotate, the slider 5 will slide within the arc grooves 601 of the sliding groove plate 6. At the same time, the sliding groove plate 6 and the swing shaft 7 swing, driving the magnetic polishing mechanism to swing.

[0029] In this embodiment, the magnetic polishing mechanism includes a swing frame 8, a magnetic disk 9, a polishing motor 10, a polishing basin 11, and a mounting frame 12. The upper two sides of the swing frame 8 are hinged to the frame 1, and its lower end is connected to the lower end of the swing shaft 7, allowing it to swing under the drive of the swing shaft 7. The mounting frame 12 is fixed on the swing frame 8, and the polishing motor 10 is mounted on the mounting frame 12, with its output shaft fixedly connected to the center of the magnetic disk 9. Correspondingly, the polishing basin 11 is positioned above the magnetic disk 9. The magnetic disk 9 contains an annular Halebeck array magnet 901, which generates a Halebeck array magnetic field. After the magnetic disk 9 rotates, it can drive the magnetic polishing medium in the polishing basin 11 to move, removing material from the surface of the workpiece.

[0030] In this embodiment, the polishing basin 11 has a lug 1101 on its top edge, and the mounting bracket 12 supports the polishing basin 11 by pressing against the lug 1101; the mounting bracket 12 contacts the side of the polishing basin 11 and limits its movement. This structure facilitates the placement and removal of the polishing basin 11, simplifying the processing procedure.

[0031] In this embodiment, the middle part of the swing shaft 7 is connected to the fixed frame 2 by a connecting pin 14.

[0032] In this embodiment, four annular Hellbeck array magnets 901 are evenly distributed around the axis of the magnet disk 9 along the circumference. By evenly arranging multiple annular Hellbeck array magnets 901, the strength and stability of the magnetic field generated can be improved, ensuring the polishing effect.

[0033] In this embodiment, the radius of the magnet disk 9 is larger than that of the polishing basin 11. This is more conducive to the arrangement of the annular Heilbeck array magnets 901 on the magnet disk 9, ensuring the quality of polishing.

[0034] In this embodiment, the protrusion 501 is cylindrical, and its outer circumferential surface is tangent to the side surface of the arc groove 601. With this structure, the protrusion 501 and the arc groove 601 fit tightly together, making the movement of the protrusion 501 within the arc groove 601 more stable and improving the accuracy of the oscillation.

[0035] In this embodiment, the pendulum shaft 7 is connected to the pendulum frame 8 via a connecting rod 13.

[0036] When using the polishing device of this invention for polishing, the polishing fluid can be prepared by adding cleaning agent, defoamer, hydrogen peroxide solution, and deionized water, using magnetic needles and / or silicone-coated magnetic sensitive particles as the magnetic polishing medium. Polishing workpieces using magnetic needles and silicone-coated magnetic sensitive particles is environmentally friendly and generates little dust. The high flexibility of the magnetic needles allows them to reach hard-to-reach areas such as inner corners and grooves, while the silicone layer on the magnetic sensitive particles prevents scratches on the workpiece and dust generation from medium abrasion. Simultaneously, the magnetic needles and magnetic sensitive particles can be recycled using a matching recovery device. Utilizing the principle of magnetic attraction, the magnetic needles and silicone-coated magnetic sensitive particles are recovered after polishing, cleaned, and screened to remove impurities, and then recycled to the next process, reducing waste generated during processing.

[0037] The foregoing general description of the utility model and its specific embodiments should not be construed as limiting the technical solution of the utility model. Those skilled in the art, based on the disclosure of this application, can add, reduce, or combine the disclosed technical features in the foregoing general description and / or specific embodiments (including examples) without departing from the constituent elements of the utility model, to form other technical solutions within the protection scope of this application.

Claims

1. An oscillating magnetic polishing device using a magnetic polishing medium, characterized in that: Includes a frame (1); the frame (1) is provided with a swing mechanism and a magnetic polishing mechanism, the swing mechanism being able to drive the magnetic polishing mechanism to swing; The swing mechanism includes a fixed frame (2), a power motor (3), a transmission rod (4), a slider (5), a sliding plate (6), and a swing shaft (7); the fixed frame (2) is connected to the frame (1), and the power motor (3) is mounted on the fixed frame (2); the transmission rod (4) is horizontally arranged, with one end connected to the output shaft of the power motor (3) and the other end connected to the slider (5); there are two sliding plates (6), which are respectively located at both ends of the slider (5), and the sliding plates (6) are provided with arc grooves (601). Correspondingly, both ends of the slider (5) are provided with protrusions (501), which are located in the arc grooves (601) and can slide in the arc grooves (601); the upper end of the swing shaft (7) is fixedly connected to the two sliding plates (6), and the middle part is hinged to the fixed frame (2); The magnetic polishing mechanism includes a swing frame (8), a magnetic disk (9), a polishing motor (10), a polishing basin (11), and a mounting frame (12). The upper two sides of the swing frame (8) are hinged to the frame (1), and its lower end is connected to the lower end of the swing shaft (7), so that it can swing under the drive of the swing shaft (7). The mounting frame (12) is fixed on the swing frame (8), and the polishing motor (10) is mounted on the mounting frame (12), with its output shaft fixedly connected to the center of the magnetic disk (9). Correspondingly, the polishing basin (11) is located above the magnetic disk (9). The magnetic disk (9) is provided with a ring-shaped Heilbeck array magnet (901), which can generate a Heilbeck array magnetic field. After the magnetic disk (9) rotates, it can drive the magnetic polishing medium in the polishing basin (11) to move and remove the material on the surface of the workpiece.

2. The oscillating magnetic polishing device using a magnetic polishing medium according to claim 1, characterized in that: The polishing basin (11) has a lug (1101) on its top edge. The mounting bracket (12) supports the polishing basin (11) by pressing against the lug (1101). The mounting bracket (12) contacts the side of the polishing basin (11) and limits its movement.

3. The oscillating magnetic polishing device using a magnetic polishing medium according to claim 1, characterized in that: The middle part of the swing shaft (7) is connected to the fixed frame (2) by a connecting pin (14).

4. The oscillating magnetic polishing device using a magnetic polishing medium according to claim 1, characterized in that: The annular Heilbeck array magnets (901) are evenly distributed around the axis of the magnet disk (9) along the circumference, with a quantity of 2-6.

5. The oscillating magnetic polishing device using a magnetic polishing medium according to claim 1, characterized in that: The radius of the magnet disk (9) is larger than that of the polishing basin (11).

6. The oscillating magnetic polishing apparatus using a magnetic polishing medium according to claim 1, characterized in that: The protrusion (501) is cylindrical, and its outer circumferential surface is tangent to the side surface of the arc groove (601).

7. The oscillating magnetic polishing apparatus using a magnetic polishing medium according to claim 1, characterized in that: The swing shaft (7) is connected to the swing frame (8) via a connecting rod (13).

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