Pressure detection module

Abstract

The utility model provides a pressure detection module, and relates to the technical field of pressure detection, the pressure detection module comprises a shell, a circuit board and a sealant, the shell is internally provided with a sealant pouring cavity for pouring the sealant, the circuit board is provided with a pressure sensor, the circuit board is arranged in the shell, the shell is provided with a cavity on at least one side of the circuit board, and the cavity is provided with a pressure sensor. The shell is internally provided with a blocking piece, the blocking piece is used for separating the glue filling cavity and the cavity, and the pressure detection module can reduce the difficulty of pressure detection.

Description

Technical Field

[0001] This application relates to the field of pressure detection technology, and more specifically, to a pressure detection module. Background Technology

[0002] The pressure detection module has a built-in circuit board with a pressure sensor. By applying pressure to the pressure detection module, the circuit board deforms, and the strain on different pins of the pressure sensor varies. The pressure sensor identifies this strain difference and thus achieves pressure detection.

[0003] To meet waterproofing requirements, existing pressure detection modules require potting adhesive inside. However, the adhesive hinders the deformation of the circuit board, increasing the difficulty of pressure detection. Utility Model Content

[0004] The purpose of this application includes, for example, providing a pressure detection module that can reduce the difficulty of pressure detection.

[0005] The embodiments of this application can be implemented as follows:

[0006] An embodiment of this application provides a pressure detection module, which includes a housing, a circuit board, and a sealant. The housing has a filling cavity for filling the sealant. A pressure sensor is disposed on the circuit board, which is located inside the housing. The housing has a cavity on at least one side of the circuit board. A barrier is disposed inside the housing to separate the filling cavity and the cavity.

[0007] Optionally, the barrier is provided on at least one side of the circuit board, or the barrier is provided on at least one surface of the housing facing the circuit board.

[0008] Optionally, the side surface of the barrier member facing away from the circuit board is attached to the inner wall of the housing, and the side surface of the barrier member facing away from the inner wall of the housing is attached to the surface of the circuit board.

[0009] Optionally, the barrier is an elastomer.

[0010] Optionally, the elastomer is a silicone elastomer or a double-sided adhesive.

[0011] Optionally, the housing has a barrier rib protruding from at least one surface facing the circuit board, and the barrier and the barrier rib are used to jointly separate the potting cavity and the cavity.

[0012] Optionally, the housing includes a first cover plate and a second cover plate connected to each other, the circuit board is disposed between the first cover plate and the second cover plate, and the pressure sensor is disposed on the side of the circuit board facing the first cover plate.

[0013] Optionally, a first chamber is provided between the circuit board and the first cover plate, and a second chamber is provided between the circuit board and the second cover plate, wherein at least one of the first chamber and the second chamber is the cavity.

[0014] Optionally, the first chamber is an empty cavity, and the barrier includes a first barrier disposed between the first cover plate and the circuit board to separate the potting cavity and the first chamber.

[0015] Optionally, the second chamber is an empty cavity, and the barrier includes a second barrier disposed between the second cover plate and the circuit board to separate the potting cavity and the second chamber.

[0016] Optionally, the second cover plate has a thinning region on its surface facing the first cover plate, wherein the thickness of the second cover plate in the thinning region is less than the thickness of the second cover plate in the non-thinning region; a second chamber is formed between the circuit board and the second cover plate in the thinning region.

[0017] Optionally, the second cover plate has a thinning region on its surface facing the first cover plate, wherein the thickness of the second cover plate in the thinning region is less than the thickness of the second cover plate in the non-thinning region.

[0018] Optionally, a force transmission post is provided on the surface of the second cover plate facing the first cover plate, the force transmission post abuts against the circuit board, and at least a portion of the thinning area is arranged around the force transmission post.

[0019] Optionally, an elastic element is provided on the side of the second cover plate opposite to the first cover plate.

[0020] Optionally, the circuit board has at least two support points, and the distance between any two support points is greater than or equal to 50 mm.

[0021] The beneficial effects of the pressure detection module provided in this application include, for example, reducing the difficulty of pressure detection. The pressure detection module includes a housing, a circuit board, and sealant. The housing has a filling cavity for injecting sealant. A pressure sensor is mounted on the circuit board, which is disposed within the housing. The housing has a cavity on at least one side of the circuit board. A barrier is provided within the housing to separate the filling cavity and the cavity. By providing a barrier within the housing to separate the filling cavity and the cavity, when sealant is injected into the filling cavity, the sealant will not fill the cavity. Due to the presence of the cavity, the circuit board is easily deformed when the housing is pressed, thereby reducing the difficulty of pressure detection. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the pressure detection module from a first-view perspective in an embodiment of this application;

[0024] Figure 2 This is an exploded view of the pressure detection module in an embodiment of this application;

[0025] Figure 3 This is a cross-sectional view of the first pressure detection module in the embodiments of this application;

[0026] Figure 4 This is a cross-sectional view of the second pressure detection module in the embodiments of this application;

[0027] Figure 5 This is a cross-sectional view of the third pressure detection module in the embodiments of this application;

[0028] Figure 6 This is a cross-sectional view illustrating the positional relationship between the pressure detection module and the faceplate in an embodiment of this application;

[0029] Figure 7 This is a schematic diagram showing the support points on the circuit board in an embodiment of this application;

[0030] Figure 8 This is a schematic diagram of the pressure detection module from a second perspective in an embodiment of this application;

[0031] Figure 9 This is a schematic diagram showing the cross-sectional position of the pressure detection module in an embodiment of this application;

[0032] Figure 10 for Figure 9 Sectional view along the middle AA direction;

[0033] Figure 11 for Figure 9 Sectional view along the BB direction.

[0034] Icons: 100-Housing; 110-First cover plate; 120-Second cover plate; 121-Thinning area; 122-Force transmission column; 123-Elastic element; 130-Pouring cavity; 140-First chamber; 150-Second chamber; 160-Pouring hole; 170-Overflow hole; 180-Barrier rib; 200-Circuit board; 210-Pressure sensor; 300-Sealant; 400-First barrier element; 500-Second barrier element; 600-Wire harness; 700-Face cover. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0037] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0038] In the description of this application, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0039] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0040] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0041] As disclosed in the background section, existing pressure detection modules contain a circuit board with a pressure sensor mounted on it. To achieve IP67 waterproof rating, adhesive is required to fill the inside of the pressure detection module. However, the adhesive hinders the circuit board from deforming, increasing the difficulty of pressure detection. Embodiments of this application provide a pressure detection module that at least addresses the aforementioned technical problems.

[0042] Please refer to Figure 1 , Figure 2 The pressure detection module provided in the embodiments of this application includes a housing 100, a circuit board 200 and a sealant 300. The housing 100 is provided with a potting cavity 130 for potting the sealant 300. A pressure sensor 210 is provided on the circuit board 200. The circuit board 200 is disposed inside the housing 100. The housing 100 has a cavity on at least one side of the circuit board 200. A barrier is provided inside the housing 100 to separate the potting cavity 130 and the cavity.

[0043] It should be noted that during the pressure detection process, the pressure detection module presses the housing 100, causing the housing 100 to deform and thus compress the circuit board 200. When the circuit board 200 deforms, the pressure sensor 210 can detect the pressure.

[0044] The pressure sensor 210 can be a high-sensitivity, strain-type pressure sensor capable of detecting strain at the 10E-6 level. A wiring harness 600 is connected to the circuit board 200, with one end of the wiring harness 600 extending from the side of the housing 100 away from the circuit board 200.

[0045] The housing 100 has a cavity on at least one side of the circuit board 200, including the housing 100 having a cavity on one side of the circuit board 200 and the housing 100 having cavities on both sides of the circuit board 200.

[0046] By providing a barrier inside the housing 100, the barrier separates the potting cavity 130 and the cavity. When the sealant 300 is poured into the potting cavity 130, the cavity will not be filled with sealant 300. Due to the presence of the cavity, the circuit board 200 is easy to deform when the housing 100 is pressed, thereby reducing the difficulty of pressure detection.

[0047] In some embodiments, a barrier is provided on at least one side of the circuit board 200.

[0048] It should be noted that the barrier is disposed on the circuit board 200, and the position of the barrier corresponds to the position of the cavity. The barrier is disposed on at least one side of the circuit board 200, including the barrier being disposed on one side of the circuit board 200 and the barrier being disposed on both sides of the circuit board 200.

[0049] When there is a cavity on one side of the circuit board 200, a barrier is provided on the side of the circuit board 200 corresponding to the cavity; and when there are cavities on both sides of the circuit board 200, a barrier is provided on both sides of the circuit board 200.

[0050] In other embodiments, at least one of the surfaces of the housing 100 facing the circuit board 200 is provided with a barrier member, the barrier member being disposed on the housing 100. The circuit board 200 includes two opposing surfaces, and the barrier member being provided on at least one surface of the housing 100 facing the circuit board 200 includes the housing 100 having a barrier member on one of the surfaces facing the circuit board 200, and the housing 100 having barrier members on both opposing surfaces, the two surfaces facing the two surfaces of the circuit board 200 respectively.

[0051] Furthermore, the side surface of the barrier member facing away from the circuit board 200 is attached to the inner wall of the housing 100, and the side surface of the barrier member facing away from the inner wall of the housing 100 is attached to the surface of the circuit board 200.

[0052] It should be noted that, along the thickness direction of the circuit board 200, the two opposing surfaces of the barrier are respectively attached to one side surface of the circuit board 200 and the inner wall of the housing 100, thereby serving to separate the potting cavity 130 from the cavity.

[0053] In some embodiments, the barrier is an elastomer, which can stably adhere to the inner wall of the circuit board 200 and the housing 100 under stress, thereby separating the potting cavity 130 from the cavity.

[0054] The barrier can be a silicone elastomer or a double-sided adhesive. When the barrier is a double-sided adhesive, the surface of the double-sided adhesive away from the circuit board 200 is bonded to the inner wall of the housing 100, and the double-sided adhesive away from the inner wall of the housing 100 is bonded to the circuit board 200. For example, a double-sided adhesive whose performance does not change significantly at -40 to 90° can be selected.

[0055] In other embodiments, the barrier can also be other components that serve a separating function, as long as the two opposing surfaces of the barrier can abut and adhere tightly to the inner walls of the circuit board 200 and the housing 100, so that the sealant 300 does not easily enter the cavity from the potting cavity 130 during the potting process.

[0056] In some embodiments, at least one surface of the housing 100 facing the circuit board 200 is provided with a barrier rib 180, and the barrier and the barrier rib 180 are used to jointly separate the potting cavity 130 and the cavity.

[0057] In an optional embodiment, a barrier rib 180 is provided on one of the surfaces of the housing 100 facing the circuit board 200, and a barrier member is located between the barrier rib 180 and the circuit board 200, and the barrier member is simultaneously attached to the surfaces of the barrier rib 180 and the circuit board 200.

[0058] In another optional embodiment, the housing 100 has two protruding barrier ribs 180 on opposite sides facing the circuit board 200, and a barrier member is provided between any barrier rib 180 and the circuit board 200. A single barrier member is simultaneously attached to the corresponding barrier rib 180 and one side surface of the circuit board 200.

[0059] Please refer to Figures 3-5 In this embodiment, the housing 100 includes a first cover plate 110 and a second cover plate 120 connected to each other, a circuit board 200 is disposed between the first cover plate 110 and the second cover plate 120, and a pressure sensor 210 is disposed on the side of the circuit board 200 facing the first cover plate 110.

[0060] When the pressure sensor 210 is located on the side of the circuit board 200 facing the first cover plate 110, pressure detection is performed by pressing the second cover plate 120. The second cover plate 120 deforms and squeezes the circuit board 200. When the circuit board 200 deforms, the pressure sensor 210 can realize pressure detection.

[0061] In other embodiments, the pressure sensor 210 may also be disposed on the side of the circuit board 200 facing the second cover plate 120. When pressure detection is performed, the second cover plate 120 is pressed, and the second cover plate 120 deforms and squeezes the circuit board 200. When the circuit board 200 deforms, the pressure sensor 210 can also realize pressure detection.

[0062] In some embodiments, a first chamber 140 is provided between the circuit board 200 and the first cover plate 110, and a second chamber 150 is provided between the circuit board 200 and the second cover plate 120, wherein at least one of the first chamber 140 and the second chamber 150 is a cavity.

[0063] In an optional embodiment, the first chamber 140 is an empty cavity, and the barrier includes a first barrier 400, which is disposed between the first cover plate 110 and the circuit board 200 to separate the potting cavity 130 and the first chamber 140.

[0064] When the pressure sensor 210 is located on the side of the circuit board 200 facing the first cover plate 110, the pressure sensor 210 is located in the first chamber 140, and the first chamber 140 provides space for the pressure sensor 210 to move when the circuit board 200 deforms.

[0065] Because a first barrier 400 is provided between the first cover plate 110 and the circuit board 200, when the sealant 300 is injected into the potting cavity 130, the sealant 300 will not fill the first chamber 140. Due to the presence of the first chamber 140, when the second cover plate 120 is pressed, the second cover plate 120 squeezes the circuit board 200, and the circuit board 200 is easily deformed, thereby reducing the difficulty of pressure detection.

[0066] In an optional embodiment, the second chamber 150 is an empty cavity, and the barrier includes a second barrier 500, which is disposed between the second cover plate 120 and the circuit board 200 to separate the potting cavity 130 and the second chamber 150.

[0067] Because a second barrier 500 is provided between the second cover plate 120 and the circuit board 200, when the sealant 300 is injected into the potting cavity 130, the sealant 300 will not fill the second chamber 150. Due to the presence of the second chamber 150, the second cover plate 120 is easy to deform when pressed, so that the circuit board 200 is also easy to deform when the second cover plate 120 squeezes the circuit board 200, thereby reducing the difficulty of pressure detection.

[0068] In some embodiments, the second cover plate 120 has a thinning region 121 on its surface facing the first cover plate 110, wherein the thickness of the second cover plate 120 in the thinning region 121 is less than the thickness of the second cover plate 120 in the non-thinning region.

[0069] It should be noted that the second cover plate 120 has a thinning area 121 on the surface facing the first cover plate 110. The thinning area 121 is formed by material reduction. The area of ​​the second cover plate 120 facing the first cover plate 110 outside the thinning area 121 is a non-thinning area.

[0070] By providing a thinning region 121 on the surface of the second cover plate 120 facing the first cover plate 110, the second cover plate 120 is more likely to deform when pressed, and the circuit board 200 is also more likely to deform when the second cover plate 120 squeezes the circuit board 200.

[0071] The shape of the second cover plate 120 within the thinning region 121 can be determined according to actual needs. For example, the inner surface of the second cover plate 120 facing the first cover plate 110 in the thinning region 121 is a plane, and the plane is parallel to the circuit board 200; or, the inner surface of the second cover plate 120 facing the first cover plate 110 in the thinning region 121 is a plane, and the plane is inclined relative to the circuit board 200; or, the inner surface of the second cover plate 120 facing the first cover plate 110 in the thinning region 121 is an arc surface.

[0072] In other embodiments, the thinning region 121 may also be formed of a material that replaces part of the structure of the second cover plate 120. The stiffness of the replaced material is reduced compared to the original material, which can also increase the deformation of the second cover plate 120.

[0073] In some alternative embodiments, a second chamber 150 is formed between the circuit board 200 and the second cover plate 120 in the thinning region 121.

[0074] It should be noted that when the surface of the second cover plate 120 facing the first cover plate 110 is not provided with a thinning area 121, the surface of the second cover plate 120 facing the first cover plate 110 can be attached to the circuit board 200. At this time, there is no second chamber 150 between the circuit board 200 and the second cover plate 120, and the second barrier 500 does not need to be provided.

[0075] Since the second cover plate 120 has a thinning area 121 facing the first cover plate 110, a second chamber 150 is formed between the circuit board 200 and the second cover plate 120 in the thinning area 121. At this time, a second barrier 500 needs to be provided between the circuit board 200 and the second cover plate 120 to separate the second chamber 150 and the potting cavity 130.

[0076] It is understandable that when the surface of the second cover plate 120 facing the first cover plate 110 is not provided with a thinning area 121, a gap can also be provided between the surface of the second cover plate 120 facing the first cover plate 110 and the circuit board 200. However, if a thinning area 121 is provided on the surface of the second cover plate 120 facing the first cover plate 110, the thinning area 121 and the gap together form a second cavity 150 between the circuit board 200 and the second cover plate 120. At this time, a second barrier 500 also needs to be provided between the circuit board 200 and the second cover plate 120 to separate the second cavity 150 and the potting cavity 130.

[0077] In some embodiments, a force transmission post 122 is provided on the surface of the second cover plate 120 facing the first cover plate 110, the force transmission post 122 abuts against the circuit board 200, and the thinning region 121 is at least partially disposed around the force transmission post 122.

[0078] The force transmission post 122 protrudes from the surface of the second cover plate 120 facing the first cover plate 110, and the force transmission post 122 abuts against the circuit board 200. When the second cover plate 120 is pressed, the pressing force generated by the deformation of the second cover plate 120 is transmitted to the circuit board 200 through the force transmission post 122, thereby improving the pressure transmission efficiency.

[0079] The thinning area 121 can be arranged around the force transmission column 122, or it can be arranged on both sides of the force transmission column 122. Alternatively, multiple thinning areas 121 can be arranged at intervals on the surface of the second cover plate 120 facing the first cover plate 110, which can also make the second cover plate 120 easily deformable when pressed.

[0080] Please refer to Figure 6 In some embodiments, an elastic element 123 is provided on the side of the second cover plate 120 opposite to the first cover plate 110, and the elastic element 123 deforms when subjected to external pressure.

[0081] It should be noted that when the second cover plate 120 is deformed, a face cover 700 is generally provided on the side of the second cover plate 120 away from the first cover plate 110. The second cover plate 120 is deformed by pressing the face cover 700 by hand, and the elastic element 123 is located between the face cover 700 and the second cover plate 120.

[0082] The elastic element 123 can balance the force transmission efficiency and the fluctuation requirements of assembly tolerance. By selecting an elastic element 123 of appropriate thickness, it can be ensured that the preload can cover the fluctuation of the part size, and that the preload is not too large and will damage the pressure sensor 210 or other electronic components on the circuit board 200.

[0083] The choice of hardness of the elastic element 123 also has a certain impact on the pressure transmission efficiency. In this embodiment, the hardness of the elastic element 123 can be selected as 50 to 70A, and the elastic element 123 can be made of silicone rubber.

[0084] In some embodiments, the thickness of the circuit board 200 is 0.4 to 1.2 mm.

[0085] It should be noted that circuit boards 200 with a thickness of 0.4 to 1.2 mm are considered thin circuit boards 200, and are more prone to deformation when subjected to pressure.

[0086] For example, the thickness of the circuit board 200 can be selected as 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 1.0mm, 1.1mm or 1.2mm. It is understood that the thickness of the circuit board 200 can be selected within the above range according to actual needs, and there is no limitation thereto.

[0087] Please refer to Figure 7In some embodiments, the circuit board 200 has at least two support points, and the distance D between any two support points is greater than or equal to 50 mm.

[0088] It should be noted that the support points on the circuit board 200 can be formed by the first barrier 400 supporting the circuit board 200, or by the second barrier 500 supporting the circuit board 200, or by the first barrier 400 and the second barrier 500 jointly supporting the circuit board 200, or by fasteners such as screws inside the housing 100 supporting the circuit board 200.

[0089] Any two support points are set opposite each other along the length or width of the circuit board 200, and the distance D between the two support points must be greater than or equal to 50mm.

[0090] When the distance D between any two support points on the circuit board 200 is greater than or equal to 50 mm, the circuit board 200 is more prone to deformation when pressure is applied to the center of the circuit board 200. For example, the distance D between any two support points can be 50 mm, 60 mm, or 70 mm. It is understood that the distance D between any two support points can be selected within the above range according to actual needs.

[0091] In an optional embodiment, the support points are formed by the first barrier 400 and the second barrier 500 jointly clamping the circuit board 200 to fix the circuit board 200. Both the first barrier 400 and the second barrier 500 are annular, and each is arranged in a circle around the circumference of the circuit board 200. The first barrier 400 and the second barrier 500 are supported at two support points along the length direction of the circuit board 200 and at two support points along the width direction of the circuit board 200. In this case, the distance between the two support points along the length direction of the circuit board 200 must be greater than or equal to 50 mm, and the distance between the two support points along the width direction of the circuit board 200 must also be greater than or equal to 50 mm.

[0092] Please refer to Figures 8-11 In this embodiment, the housing 100 is provided with a glue-filling hole 160 and a glue-overflowing hole 170, both of which are connected to the glue-filling cavity 130.

[0093] When the housing 100 includes a first cover plate 110 and a second cover plate 120, the glue filling hole 160 can be opened in the first cover plate 110 or the second cover plate 120, and the glue overflow hole 170 can also be opened in the first cover plate 110 or the second cover plate 120. When performing glue filling, sealant 300 is injected into the glue filling hole 160, the sealant 300 fills the glue filling cavity 130, and the excess sealant 300 overflows from the glue overflow hole 170.

[0094] In an optional embodiment, the glue-filling cavity 130 may be an annular cavity, and correspondingly, the barrier is also annular and located inside the glue-filling cavity 130 to separate the glue-filling cavity 130 from the cavity. The glue-filling hole 160 and the glue overflow hole 170 are both opened on the second cover plate 120.

[0095] When both the first chamber 140 and the second chamber 150 are empty cavities, and the barrier includes the first barrier 400 and the second barrier 500, during the potting process, sealant 300 is injected into the potting hole 160. The sealant 300 will fill the annular potting cavity 130. The first barrier 400 prevents the sealant 300 from entering the first chamber 140, and the second barrier 500 prevents the sealant 300 from entering the second chamber 150. Finally, the excess sealant 300 will overflow from the overflow hole 170.

[0096] When the first chamber 140 is an empty cavity and the barrier includes the first barrier 400, during the potting process, sealant 300 is injected into the potting hole 160. The sealant 300 will fill the annular potting cavity 130 and the second chamber 150. The first barrier 400 prevents the sealant 300 from entering the first chamber 140. Finally, the excess sealant 300 will overflow from the overflow hole 170.

[0097] When the second chamber 150 is an empty cavity and the barrier includes the second barrier 500, during the potting process, sealant 300 is injected into the potting hole 160. The sealant 300 will fill the annular potting cavity 130 and the first chamber 140. The second barrier 500 prevents the sealant 300 from entering the second chamber 150. Finally, the excess sealant 300 will overflow from the overflow hole 170.

[0098] This pressure detection module can be applied to vehicles. For example, the pressure detection module can be installed on the front trunk switch, rear trunk switch, charging switch, or door handle of the vehicle. A faceplate 700 can be installed on the front trunk switch, rear trunk switch, charging switch, and door handle. Pressing the faceplate 700 will apply pressure to the pressure detection module.

[0099] The working principle of the pressure detection module provided in this application embodiment is as follows: A first barrier 400 is provided between the first cover plate 110 and the circuit board 200, and the first barrier 400 separates the potting cavity 130 and the first chamber 140; or, a second barrier 500 is provided between the second cover plate 120 and the circuit board 200, and the second barrier 500 separates the potting cavity 130 and the second chamber 150; when sealant 300 is poured into the potting cavity 130, the sealant 300 will not fill the first chamber 140 or the second chamber 150, and the chamber without sealant 300 is an empty cavity. Due to the existence of the empty cavity, the circuit board 200 is easy to deform when the second cover plate 120 applies pressure to the circuit board 200, thereby reducing the difficulty of pressure detection.

[0100] The beneficial effects of the pressure detection module provided in this application embodiment include at least the following: Because a first barrier 400 is provided between the first cover plate 110 and the circuit board 200, when sealant 300 is injected into the potting cavity 130, the sealant 300 will not fill into the first chamber 140. When the second cover plate 120 is pressed, the second cover plate 120 compresses the circuit board 200, making the circuit board 200 more prone to deformation. Because a second barrier 500 is provided between the second cover plate 120 and the circuit board 200, when sealant 300 is injected into the potting cavity 130, the sealant 300 will not fill into the second chamber 150. When the second cover plate 120 is pressed, the second cover plate 120 more prone to deformation. The increased deformation of cover plate 120 makes circuit board 200 more prone to deformation when the second cover plate 120 presses against it. By providing a thinning area 121 on the surface of the second cover plate 120 facing the first cover plate 110, the second cover plate 120 is more prone to deformation when pressed. The increased deformation of the second cover plate 120 makes circuit board 200 more prone to deformation when the second cover plate 120 presses against it. The elastic element 123 can balance the force transmission efficiency and the fluctuation requirements of assembly tolerance, ensuring that the preload can cover the fluctuation of part size without generating excessive preload that could damage the pressure sensor 210 or other electronic components on the circuit board 200.

[0101] In summary, this application provides a pressure detection module, which includes a housing 100, a circuit board 200, and sealant 300. By providing a barrier inside the housing 100 to separate the potting cavity 130 and the cavity, when sealant 300 is poured into the potting cavity 130, the sealant 300 will not fill the cavity. Due to the presence of the cavity, the circuit board 200 is easily deformed when the housing 100 is pressed, thereby reducing the difficulty of pressure detection.

[0102] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A pressure detection module, characterized in that, The device includes a housing (100), a circuit board (200), and a sealant (300). The housing (100) has a filling cavity (130) for filling the sealant (300). The circuit board (200) is provided with a pressure sensor (210). The circuit board (200) is disposed inside the housing (100). The housing (100) has a cavity on at least one side of the circuit board (200). A barrier is provided inside the housing (100) to separate the filling cavity (130) and the cavity.

2. The pressure detection module according to claim 1, characterized in that, The barrier is disposed on at least one side of the circuit board (200), or the barrier is disposed on at least one surface of the housing (100) facing the circuit board (200).

3. The pressure detection module according to claim 2, characterized in that, The side surface of the barrier that is away from the circuit board (200) is attached to the inner wall of the housing (100), and the side surface of the barrier that is away from the inner wall of the housing (100) is attached to the surface of the circuit board (200).

4. The pressure detection module according to claim 1, characterized in that, The barrier is an elastomer.

5. The pressure detection module according to claim 4, characterized in that, The elastomer is a silicone elastomer or a double-sided adhesive.

6. The pressure detection module according to claim 1, characterized in that, The housing (100) has at least one protruding barrier rib (180) on its surface facing the circuit board (200), and the barrier and the barrier rib (180) are used to jointly separate the potting cavity (130) and the cavity.

7. The pressure detection module according to claim 1, characterized in that, The housing (100) includes a first cover plate (110) and a second cover plate (120) connected to each other. The circuit board (200) is disposed between the first cover plate (110) and the second cover plate (120). The pressure sensor (210) is disposed on the side of the circuit board (200) facing the first cover plate (110).

8. The pressure detection module according to claim 7, characterized in that, A first chamber (140) is provided between the circuit board (200) and the first cover plate (110), and a second chamber (150) is provided between the circuit board (200) and the second cover plate (120), wherein at least one of the first chamber (140) and the second chamber (150) is the cavity.

9. The pressure detection module according to claim 8, characterized in that, The first chamber (140) is the cavity, and the barrier includes a first barrier (400), which is disposed between the first cover plate (110) and the circuit board (200) to separate the potting cavity (130) and the first chamber (140).

10. The pressure detection module according to claim 8 or 9, characterized in that, The second chamber (150) is the cavity, and the barrier includes a second barrier (500), which is disposed between the second cover plate (120) and the circuit board (200) to separate the potting cavity (130) and the second chamber (150).

11. The pressure detection module according to claim 10, characterized in that, The second cover plate (120) has a thinning region (121) on its surface facing the first cover plate (110), wherein the thickness of the second cover plate (120) in the thinning region (121) is less than the thickness of the second cover plate (120) in the non-thinning region; the circuit board (200) and the second cover plate (120) form the second chamber (150) in the thinning region (121).

12. The pressure detection module according to claim 7, characterized in that, The second cover plate (120) has a thinning region (121) on its surface facing the first cover plate (110), wherein the thickness of the second cover plate (120) in the thinning region (121) is less than the thickness of the second cover plate (120) in the non-thinning region.

13. The pressure detection module according to claim 12, characterized in that, The second cover plate (120) has a force transmission post (122) on its surface facing the first cover plate (110), the force transmission post (122) abuts against the circuit board (200), and at least a portion of the thinning region (121) is arranged around the force transmission post (122).

14. The pressure detection module according to claim 7, characterized in that, An elastic element (123) is provided on the side of the second cover plate (120) opposite to the first cover plate (110).

15. The pressure detection module according to claim 1, characterized in that, The circuit board (200) has at least two support points, and the distance between any two support points is greater than or equal to 50 mm.

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