Flow divider
By designing a shunt that makes the sampling needles formed by cutting at an angle to the PCB board, the problem of sampling needle displacement after solder paste melting was solved, thus improving the accuracy and stability of the sampling results.
Patent Information
- Application Number
- CN202423131913.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-17
AI Technical Summary
In new energy vehicle battery packs, the PCB board floats on the molten solder paste, causing a relative displacement between the sampling pins on the shunt board and the voltage acquisition point, resulting in poor sampling accuracy.
A shunt was designed, including a first shunt plate and a second shunt plate. The sampling needle was formed by cutting and set at an angle to the contact surface of the PCB board to ensure that there is no solder paste between the sampling needle and the vertical section when the solder paste melts at high temperature, thereby enhancing the connection strength, avoiding displacement, and improving the accuracy of the sampling results.
The sampling needle, formed by cutting, makes stable contact with the PCB board, reducing the possibility of deformation, ensuring the accurate positioning of the sampling needle and the voltage acquisition point, and improving the accuracy and stability of the sampling results.
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Figure CN223711690U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to high voltage electrical field, specifically, relate to a shunt. BACKGROUND
[0002] In the battery pack of new energy automobile, the scheme of using low-cost PCBA combined shunt to detect main loop current is also a precision resistor for measuring direct current, and its working principle is to indirectly measure current by using voltage drop of resistance. This shunt is usually connected with PCB circuit board for use to realize current measurement. In actual application, the PCBA combined shunt can be integrated with intelligent shunt, and the high-precision measurement of current can be realized by connecting the PCBA integrated module with the shunt body.
[0003] In the current mainstream shunt preparation process, manganese copper alloy and copper material are connected through vacuum electron beam welding technology first, and then the PCB circuit board with voltage collection points is placed on the shunt plate of the shunt coated with tin paste for patch welding. Because the tin paste between the shunt plate and the PCB plate will melt into a molten state at high temperature in the process of patch welding, and under the interference of some external environmental factors, such as the mixing of air during tin paste coating, which causes the existence of cavities in the tin paste, etc., the height and welding quality of the welding points at different positions exist deviation; if there is some impurity on the surface of the shunt plate and the PCB plate, the sampling needle on the shunt plate and the voltage collection point will exist relative displacement after the PCB plate floats on the molten tin paste, so that the accuracy of the sampling result is poor. UTILITY MODEL CONTENTS
[0004] The main purpose of the utility model is to provide a shunt to solve the problem that the PCB plate floats on the molten tin paste, causing the sampling needle on the shunt plate and the voltage collection point to exist relative displacement, and the accuracy of the sampling result is poor.
[0005] In order to achieve the above purpose, the utility model provides a shunt, which comprises: a first shunt plate, comprising a first horizontal section and a first vertical section arranged at an angle with the first horizontal section, a first current connection hole is arranged on the first horizontal section, the first horizontal section has a first contact surface for contacting with a PCB plate, and a first sampling needle is cut on the first vertical section; a second shunt plate, comprising a second horizontal section and a second vertical section arranged at an angle with the second horizontal section, the second vertical section is conductively connected with the first vertical section, a second current connection hole is arranged on the second horizontal section, the second horizontal section has a second contact surface for contacting with the PCB plate, and a second sampling needle is cut on the second vertical section.
[0006] Further, a first arc-shaped transition section is formed at the connection between the first horizontal section and the first vertical section, and the sampling end of the first sampling needle is away from the inner side of the first arc-shaped transition section.
[0007] Further, a second arc-shaped transition section is formed at the joint of the second horizontal section and the second vertical section, and a sampling end of the second sampling needle is opposite to an inner side of the second arc-shaped transition section.
[0008] Further, the second vertical section is electrically connected to the first vertical section through a manganese-copper alloy layer.
[0009] Further, the first sampling needle extends in the vertical direction of the first vertical section.
[0010] Further, the second sampling needle extends in the vertical direction of the second vertical section, and the second horizontal section and the second vertical section jointly form a second L-shaped structure.
[0011] Further, a first cutting hole forming the first sampling needle is arranged at the joint of the first horizontal section and the first vertical section.
[0012] Further, a second cutting hole forming the second sampling needle is arranged at the joint of the second horizontal section and the second vertical section.
[0013] Further, an end point of the sampling end of the first sampling needle is flush with the first contact surface.
[0014] Further, an end point of the sampling end of the second sampling needle is flush with the second contact surface.
[0015] The technical scheme of the utility model discloses: shunt includes: first shunt board and second shunt board. First shunt board includes first horizontal section and first vertical section of angle setting with first horizontal section, is provided with first current connection hole on first horizontal section, first horizontal section has first contact surface for contacting with PCB board, first vertical section is cut with first sampling needle. Second shunt board includes second horizontal section and second vertical section of angle setting with second horizontal section, second vertical section is electrically connected with first vertical section, is provided with second current connection hole on second horizontal section, second horizontal section has second contact surface for contacting with PCB board, second vertical section is cut with second sampling needle. First current connection hole and second current connection hole can be electrically connected with main circuit respectively. In the process of SMT welding, first contact surface and second contact surface contact with PCB board respectively, and the shunt can stably contact with the PCB board, when the tin paste between first shunt board and second shunt board and PCB board melts under high temperature, since first sampling needle and second sampling needle are formed by cutting, there is no tin paste between first sampling needle and first vertical section, and there is no tin paste between second sampling needle and second vertical section. And, first vertical section is arranged at an angle with first horizontal section, so that the fixed end of first sampling needle connected with first vertical section is away from the sampling end of first sampling needle, second vertical section is arranged at an angle with second horizontal section, so that the fixed end of second sampling needle connected with second vertical section is away from the sampling end of second sampling needle, further ensure the connection strength of the fixed end of first sampling needle connected with first vertical section and the connection strength of the fixed end of second sampling needle connected with second vertical section, reduce the possibility of deformation of first sampling needle and second sampling needle, and the structural strength of first sampling needle and second sampling needle and the position of voltage collection point on respective PCB board are accurate, avoid the relative displacement between sampling needle on shunt board and voltage collection point, and further improve the accuracy of sampling result. Therefore, the technical scheme of the application effectively solves the problem that the PCB board floats on the molten tin paste, which causes the relative displacement between the sampling needle on the shunt board and the voltage collection point, and the accuracy of the sampling result is poor. BRIEF DESCRIPTION OF DRAWINGS
[0016] The drawings accompanying the specification of this application form a part thereof, serve to provide further understanding of the application, and together with the description, make up an embodiment of the application. The embodiment of the application and its description are used to explain the application, and do not constitute an improper limitation on the application. In the drawings:
[0017] Figure 1 A perspective structural schematic view of an embodiment of the shunt according to the utility model is shown;
[0018] Figure 2 A perspective structural schematic view of another view of an embodiment of the shunt according to the utility model is shown.
[0019] In the above drawings, the following reference signs are used:
[0020] 10. First shunt plate; 11. First horizontal section; 111. First contact surface; 112. First current connection hole; 12. First vertical section; 13. First sampling needle; 14. First arc-shaped transition section; 15. First cutting hole;
[0021] 20. Second shunt plate; 21. Second horizontal section; 211. Second contact surface; 212. Second current connection hole; 22. Second vertical section; 23. Second sampling needle; 24. Second arc-shaped transition section; 25. Second cutting hole;
[0022] 30. Manganese-copper alloy layer. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.
[0024] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0025] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.
[0026] like Figure 1and Figure 2 As shown in the drawings, the present application provides a shunt, and an embodiment of the shunt comprises a first shunt plate 10 and a second shunt plate 20. The first shunt plate 10 comprises a first horizontal section 11 and a first vertical section 12 arranged at an angle with the first horizontal section 11, the first horizontal section 11 is provided with a first current connection hole 112, the first horizontal section 11 has a first contact surface 111 for contacting a PCB, and the first vertical section 12 is cut with a first sampling needle 13. The second shunt plate 20 comprises a second horizontal section 21 and a second vertical section 22 arranged at an angle with the second horizontal section 21, the second vertical section 22 is conductively connected with the first vertical section 12, the second horizontal section 21 is provided with a second current connection hole 212, the second horizontal section 21 has a second contact surface 211 for contacting the PCB, and the second vertical section 22 is cut with a second sampling needle 23.
[0027] By applying the technical scheme of the embodiment, the first current connection hole 112 and the second current connection hole 212 can be conductively connected with the main circuit, respectively. In the process of SMT welding, the first contact surface 111 and the second contact surface 211 contact the PCB, respectively, and the shunt can stably contact the PCB. When the tin paste between the first shunt plate 10 and the second shunt plate 20 and the PCB melts at high temperature, since the first sampling needle 13 and the second sampling needle 23 are both formed by cutting, there is no tin paste between the first sampling needle 13 and the first vertical section 12, and there is no tin paste between the second sampling needle 23 and the second vertical section 22. Moreover, the first vertical section 12 is arranged at an angle with the first horizontal section 11, so that the fixed end of the first sampling needle 13 connected with the first vertical section 12 is away from the sampling end of the first sampling needle 13, and the second vertical section 22 is arranged at an angle with the second horizontal section 21, so that the fixed end of the second sampling needle 23 connected with the second vertical section 22 is away from the sampling end of the second sampling needle 23, which further ensures the connection strength of the fixed end of the first sampling needle 13 connected with the first vertical section 12 and the connection strength of the fixed end of the second sampling needle 23 connected with the second vertical section 22, reduces the possibility of deformation of the first sampling needle 13 and the second sampling needle 23, and thus the structural strength of the first sampling needle 13 and the second sampling needle 23 and the positions of the voltage collection points on the respective PCBs are accurate, which avoids the relative displacement between the sampling needle on the shunt plate and the voltage collection point, and thus improves the accuracy of the sampling result. Therefore, the technical scheme of the embodiment effectively solves the problem in the related art that the PCB floating on the molten tin paste causes the relative displacement between the sampling needle on the shunt plate and the voltage collection point, and thus the accuracy of the sampling result is poor.
[0028] In the present application, the shunt can output the sampling signal through the connector after the PCB is welded with the first sampling needle 13 and the second sampling needle 23, or output the sampling signal through the high-voltage wire harness after the high-voltage wire harness is welded with the first sampling needle 13 and the second sampling needle 23.
[0029] As shown in Figure 1 and Figure 2 , the connection between the first horizontal section 11 and the first vertical section 12 forms a first arc-shaped transition section 14, and the sampling end of the first sampling needle 13 is away from the inner side of the first arc-shaped transition section 14. The formation of the first arc-shaped transition section 14 can effectively distribute the current path, reduce the concentration of current at the turning point, avoid local overheating, and at the same time enhance the mechanical strength of the structure to prevent damage caused by stress concentration. The sampling end of the first sampling needle 13 is away from the inner side of the first arc-shaped transition section 14, which can ensure that the first sampling needle 13 will not displace or deform due to stress during the welding process after being cut and formed, thereby ensuring the stable position of the first sampling needle 13 and the voltage collection point on the PCB board, and improving the sampling accuracy.
[0030] As shown in Figure 1 and Figure 2 , the connection between the second horizontal section 21 and the second vertical section 22 forms a second arc-shaped transition section 24, and the sampling end of the second sampling needle 23 is away from the inner side of the second arc-shaped transition section 24, and the first horizontal section 11 and the first vertical section 12 together form a first L-shaped structure. The formation of the second arc-shaped transition section 24 can effectively distribute the current path, reduce the concentration of current at the turning point, avoid local overheating, and at the same time enhance the mechanical strength of the structure to prevent damage caused by stress concentration. The sampling end of the second sampling needle 23 is away from the inner side of the second arc-shaped transition section 24, which can ensure that the second sampling needle 23 will not displace or deform due to stress during the welding process after being cut and formed, thereby ensuring the stable position of the second sampling needle 23 and the voltage collection point on the PCB board, and improving the sampling accuracy.
[0031] As shown in Figure 1 and Figure 2 , the second vertical section 22 is conductively connected to the first vertical section 12 through a manganese-copper alloy layer 30. The manganese-copper alloy layer 30 has good electrical conductivity and thermal stability, and connecting the first vertical section 12 and the second vertical section 22 through the manganese-copper alloy layer 30 can ensure the stability and reliability of the welding connection between the first shunt plate 10 and the second shunt plate 20, reduce the contact resistance, and avoid affecting the accuracy of current measurement due to the change of resistance at the connection.
[0032] As shown in Figure 1 and Figure 2 , the first sampling needle 13 extends in the vertical direction of the first vertical section 12. The vertically extended first sampling needle 13 can minimize its interference with the main loop path, ensure the stability of the sampling current, and at the same time facilitate accurate alignment with the corresponding voltage collection point on the PCB board, thereby improving the sampling accuracy.
[0033] As shown in Figure 1 and Figure 2As shown, the second sampling needle 23 extends in the vertical direction of the second vertical section 22, and the second horizontal section 21 and the second vertical section 22 jointly form a second L-shaped structure. The vertically extending second sampling needle 23 can minimize its interference with the main loop path, ensure the stability of the sampling current, and facilitate accurate alignment with the corresponding voltage collection point on the PCB board, thereby improving the sampling accuracy.
[0034] As shown in Figure 1 and Figure 2 , the connection between the first horizontal section 11 and the first vertical section 12 is provided with a first cutting hole 15 forming a first sampling needle 13. By forming the first sampling needle 13 on the first shunt plate 10 and leaving the first cutting hole 15, the accurate position and size of the sampling needle can be ensured, and the sampling accuracy can be affected by the positional deviation in the welding process. At the same time, the cutting process is more stable than welding, and does not introduce additional resistance, thereby improving the overall measurement accuracy.
[0035] As shown in Figure 1 and Figure 2 , the connection between the second horizontal section 21 and the second vertical section 22 is provided with a second cutting hole 25 forming a second sampling needle 23. By forming the second sampling needle 23 on the second shunt plate 20 and leaving the second cutting hole 25, the accurate position and size of the sampling needle can be ensured, and the sampling accuracy can be affected by the positional deviation in the welding process. At the same time, the cutting process is more stable than welding, and does not introduce additional resistance, thereby improving the overall measurement accuracy.
[0036] As shown in Figure 1 and Figure 2 , the end point of the sampling end of the first sampling needle 13 is flush with the first contact surface 111. Ensuring that the sampling end of the first sampling needle 13 can accurately contact the voltage collection point on the PCB board, since the end point of the sampling needle is flush with the contact surface, the unevenness of the contact surface affects the sampling accuracy, and improves the stability and reliability of the sampling signal.
[0037] As shown in Figure 1 and Figure 2 , the end point of the sampling end of the second sampling needle 23 is flush with the second contact surface 211. Ensuring that the sampling end of the second sampling needle 23 can accurately contact the voltage collection point on the PCB board, since the end point of the sampling needle is flush with the contact surface, the unevenness of the contact surface affects the sampling accuracy, and improves the stability and reliability of the sampling signal.
[0038] In the description of the utility model, it is understood that the orientation words such as '' front, back, up, down, left, right '' '' horizontal, vertical, perpendicular, horizontal '' and '' top, bottom '' and the like indicated orientation or positional relationship is usually based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the utility model and simplifying the description, in the absence of the opposite statement, these orientation words do not indicate and imply that the device or element indicated must have a particular orientation or be constructed and operated in a particular orientation, therefore can not be understood as the limitation of the protection scope of the utility model;The orientation words '' inside, outside '' refer to the inside and outside relative to the contour of each component.
[0039] For the convenience of description, spatial relative terms such as '' above'', '' above'', '' upper surface'', '' upper '' and the like can be used here to describe the spatial position relationship of one device or feature with other devices or features as shown in the drawing. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the device described in the drawing. For example, if the device in the drawing is inverted, the device described as '' above '' or '' above '' other devices or structures will be positioned '' below '' or '' below '' other devices or structures. Thus, the exemplary term '' above '' can include both '' above '' and '' below '' orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative description used here is interpreted accordingly.
[0040] In addition, it should be noted that the use of '' first'', '' second '' and the like to limit parts is only for the convenience of distinguishing the corresponding parts, and the above words have no special meaning unless otherwise stated, therefore can not be understood as the limitation of the protection scope of the utility model.
[0041] The above only describes the preferred embodiments of the utility model, and is not used to limit the utility model, for those skilled in the art, the utility model can have various changes and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the utility model should be included in the protection scope of the utility model.
Claims
1. A shunt, characterized in that, include: The first shunt plate (10) includes a first horizontal section (11) and a first vertical section (12) arranged at an angle to the first horizontal section (11). The first horizontal section (11) is provided with a first current connection hole (112). The first horizontal section (11) has a first contact surface (111) for contacting the PCB board. The first vertical section (12) is cut with a first sampling needle (13). The second shunt plate (20) includes a second horizontal section (21) and a second vertical section (22) arranged at an angle to the second horizontal section (21). The second vertical section (22) is electrically connected to the first vertical section (12). A second current connection hole (212) is provided on the second horizontal section (21). The second horizontal section (21) has a second contact surface (211) for contacting the PCB board. A second sampling needle (23) is cut on the second vertical section (22).
2. The shunt according to claim 1, characterized in that, A first arc-shaped transition section (14) is formed at the connection between the first horizontal segment (11) and the first vertical segment (12), and the sampling end of the first sampling needle (13) is opposite to the inner side of the first arc-shaped transition section (14).
3. The shunt according to claim 1, characterized in that, A second arc-shaped transition section (24) is formed at the connection between the second horizontal segment (21) and the second vertical segment (22). The sampling end of the second sampling needle (23) is opposite to the inner side of the second arc-shaped transition section (24). The first horizontal segment (11) and the first vertical segment (12) together form a first L-shaped structure.
4. The shunt according to claim 1, characterized in that, The second vertical segment (22) is electrically connected to the first vertical segment (12) through a manganese copper alloy layer (30).
5. The shunt according to claim 1, characterized in that, The first sampling needle (13) extends in the vertical direction of the first vertical segment (12).
6. The shunt according to claim 1, characterized in that, The second sampling needle (23) extends in the vertical direction of the second vertical segment (22), and the second horizontal segment (21) and the second vertical segment (22) together form a second L-shaped structure.
7. The shunt according to claim 1, characterized in that, A first cutting hole (15) for forming the first sampling needle (13) is provided at the connection between the first horizontal segment (11) and the first vertical segment (12).
8. The shunt according to claim 1, characterized in that, A second cutting hole (25) for forming the second sampling needle (23) is provided at the connection between the second horizontal segment (21) and the second vertical segment (22).
9. The shunt according to claim 1, characterized in that, The sampling end of the first sampling needle (13) is flush with the first contact surface (111).
10. The shunt according to claim 1, characterized in that, The sampling end of the second sampling needle (23) is flush with the second contact surface (211).