Cylinder pressing device and wafer bonding chuck assembly
By introducing an elastic buffer, displacement sensor, and pressure detection device into the cylinder pressing device, combined with gas connection pipeline and flow control components, the problem of inaccurate pressure control during wafer bonding was solved, achieving higher bonding accuracy and stability.
Patent Information
- Application Number
- CN202423193069.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-23
AI Technical Summary
In the wafer bonding process, the pressure control of the cylinder pressing device affects the wafer bonding accuracy and the risk of slippage, and existing technologies are difficult to achieve precise control.
It employs a combination of elastic buffer, displacement sensor and pressure detection device to monitor and control the pressure inside the cylinder in real time. This, combined with the lifting and lowering of the piston rod, ensures uniform and stable downward pressure. The piston rod height is precisely adjusted through gas connection pipeline and flow control component.
This improved wafer bonding accuracy, reduced the risk of wafer slippage, enabled stable and precise control of the piston rod, and enhanced bonding performance.
Smart Images
Figure CN223712714U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a cylinder pressing device and a wafer bonding chuck assembly. BACKGROUND
[0002] With the continuous development of semiconductor technology, wafer bonding has been widely used. In the bonding process, the middle part of the upper chuck is pressed downward by the cylinder pressing device on the wafer of the upper chuck, and the wafer on the upper chuck is bonded to the wafer on the lower chuck by the adsorption force on the upper chuck. However, the pressure control in the cylinder of the cylinder pressing device directly affects the wafer bonding accuracy and whether the wafer slips or not. SUMMARY
[0003] To solve the above technical problems, the present application provides a cylinder pressing device, which comprises:
[0004] a cylinder;
[0005] a piston assembly, which is arranged in the cylinder in a liftable manner and has a piston rod capable of extending out of the cylinder;
[0006] a resilient buffer member, which is sleeved on the piston rod and is used to provide an upward buffer force to the piston rod when the piston rod is pressed downward;
[0007] a displacement sensor, which is used to monitor the lifting height of the piston rod;
[0008] a pressure detection device, which is used to detect the pressure value in the cylinder in real time, so that the pressure value in the cylinder can be controlled to a preset pressure corresponding to the preset height to which the piston rod is lowered.
[0009] In some embodiments, the piston assembly comprises a piston body, which is arranged in the cylinder in a liftable manner, and the piston rod is fixedly connected to the piston body.
[0010] In some embodiments, the cylinder has a cylinder side wall, the displacement sensor is arranged outside the cylinder side wall, a detection stopper opposite to the displacement sensor is arranged outside the cylinder side wall, one of the detection stopper and the displacement sensor is fixedly connected to the piston body, and the other is fixed to the outside of the cylinder side wall; wherein the cylinder side wall is provided with a side wall opening extending along the lifting direction of the piston rod, the structure of the detection stopper and the displacement sensor fixedly connected to the piston body extends out of the cylinder side wall through the side wall opening, and a sealing member capable of preventing air leakage of the side wall opening is arranged at the side wall opening.
[0011] In some embodiments, the cylinder has a cylinder side wall, the displacement sensor is arranged in the cylinder side wall, a detection block opposite to the displacement sensor is arranged in the cylinder side wall, one of the detection block and the displacement sensor is fixedly connected to the piston body, and the other is fixed to the cylinder side wall.
[0012] In some embodiments, the cylinder has a cylinder bottom wall at the bottom end, the cylinder bottom wall is provided with a through hole for the piston rod to pass through, and the elastic buffer is arranged between the piston body and the cylinder bottom wall.
[0013] In some embodiments, the elastic buffer is a compression spring.
[0014] In some embodiments, the cylinder pressing device is further provided with a gas connection pipeline in communication with the cylinder, for introducing gas into the cylinder and discharging gas out of the cylinder, so as to control the lifting of the piston rod.
[0015] In some embodiments, the gas connection pipeline is provided with a gas flow control assembly electrically connected to the pressure detection device, for controlling the gas flow rate and the flow direction of the gas flow between the gas connection pipeline and the cylinder according to the pressure value in the cylinder detected by the pressure detection device.
[0016] In some embodiments, the gas flow control assembly includes a flow valve and a control valve, the pressure detection device is electrically connected to the flow valve, the flow valve is used to control the flow rate in the gas connection pipeline according to the pressure detection device, and the control valve is used to control the flow direction of the gas flow.
[0017] The application further provides a wafer bonding chuck assembly, which includes an upper chuck, a lower chuck, and the cylinder pressing device as described above, the upper chuck is provided with a piston through hole in the middle for the piston rod to pass through, the piston rod can be lowered below the lower surface of the upper chuck to provide a downward driving force for the wafer arranged on the upper chuck, and the wafer arranged on the upper chuck is bonded with the wafer arranged on the lower chuck.
[0018] In some embodiments, the upper chuck is provided with a plurality of adsorption holes arranged at intervals, and when the wafer arranged on the upper chuck and the wafer arranged on the lower chuck are bonded, the upper chuck is arranged to gradually reduce the adsorption force on the wafer arranged on the upper chuck from the center to the outer circle.
[0019] The technical scheme provided by the embodiments of the application can have the following beneficial effects:
[0020] From the above embodiments, the cylinder pressing device and the wafer bonding chuck assembly in the application, the buffering of the elastic buffer in the cylinder pressing device, the real-time detection of the matching pressure detection device and the detection of the displacement sensor, so that the piston rod can be pressed more uniformly and stably, the risk of wafer sliding sheet can be well avoided, and the pressing height of the piston rod can be more accurately controlled, and the wafer bonding precision is improved.
[0021] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the application. BRIEF DESCRIPTION OF DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.
[0023] Figure 1 A sectional view of the cylinder pressing device provided in an embodiment of the application.
[0024] Figure 2 A schematic view of a wafer bonding by a wafer bonding chuck assembly provided in an embodiment of the application.
[0025] Figure 3 A bottom view of the upper chuck provided in an embodiment of the application. DETAILED DESCRIPTION
[0026] Hereinafter, the technical solutions in the embodiments (or called “embodiments”) of the application will be described clearly and completely with reference to the drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated.
[0027] If the application embodiments involve directional indications or positional relationships (such as up, down, left, right, front, back, inner, outer, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain posture; if the posture changes, the directional indication or positional relationship also changes accordingly. In addition, the terms “first”, “second”, etc. in the application embodiments are only used for convenience of description, and cannot be understood as indicating or implying relative importance.
[0028] The following will be described with reference to the drawings Figures 1 to 3Some embodiments of the present application are described in detail. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.
[0029] Please refer to Figure 1 The present application provides a cylinder pressing device 100, which comprises a cylinder 10, a piston assembly 20, an elastic buffer 30, a displacement sensor 40 and a pressure detection device 50.
[0030] As shown in Figure 1 The cylinder 10 has an inner cavity 101.
[0031] The piston assembly 20 is arranged in the cylinder 10 in a lifting manner. As shown in Figure 1 The piston assembly 20 comprises a piston body 22 and a piston rod 21. The piston body 22 is arranged in the cylinder 10 in a lifting manner (i.e. moving upward and downward along the H direction in the figure). The piston rod 21 is fixedly connected to the piston body 22 and can lift with the piston body 22. The piston rod 21 can extend out of the cylinder 10.
[0032] The cylinder pressing device can realize the lifting of the piston body 22 and the piston rod 21 by adjusting the air pressure in the space above the piston body 22 in the inner cavity 101.
[0033] The elastic buffer 30 is sleeved on the piston rod 21 and is used to provide an upward buffering force to the piston rod 21 when the piston rod 21 is pressed.
[0034] The displacement sensor 40 is used to monitor the lifting height of the piston rod 21.
[0035] The pressure detection device 50 is used to detect the pressure value in the cylinder 10 in real time, so that the pressure value in the cylinder 10 can be controlled to a preset pressure corresponding to the preset height to which the piston rod 21 is lowered.
[0036] The buffering of the elastic buffer 30, the real-time detection of the pressure detection device 50 and the detection of the displacement sensor 40 in the above-mentioned cylinder pressing device 100 make the piston rod 21 be able to be pressed more uniformly and stably, well avoid the risk of wafer slip sheet, and be able to more accurately control the pressing height of the piston rod 21, improve the wafer bonding precision.
[0037] As shown in Figure 1As shown, in some embodiments, the cylinder 10 has a cylinder side wall 11. The displacement sensor 40 is arranged outside the cylinder side wall 11. A detection stopper 60 opposite to the displacement sensor 40 is arranged outside the cylinder side wall 11. The detection stopper 60 is fixedly connected with the piston body 22, and the displacement sensor 40 is fixed outside the cylinder side wall 11. The cylinder side wall 11 is provided with a side wall opening 102 extending along the lifting direction of the piston rod 21, and the structure of the detection stopper 60 fixedly connected with the piston body 22 extends out of the cylinder side wall 11 through the side wall opening 102, and the side wall opening 102 is provided with a sealing member (not shown) capable of preventing air leakage of the side wall opening 102.
[0038] The structure of the detection stopper 60 fixedly connected with the piston body 22 can be the detection stopper 60 itself, or other connecting structures connected with the detection stopper 60, such as a connecting rod.
[0039] The displacement sensor 40 can detect the distance between the detection stopper 60 and the displacement sensor through a detection signal, and determine the lifting height of the piston rod 21 through the distance between the two.
[0040] It should be noted that, Figure 1 As shown, in the cylinder pressing device 100, the displacement sensor 40 is located below the detection stopper 60. In other embodiments, the displacement sensor can also be located above the detection stopper, as long as the detection of the lifting displacement of the piston rod can be realized during the lifting of the piston assembly.
[0041] It should be noted that, in other embodiments, the displacement sensor can also be fixedly connected with the piston body through a connecting member or other structures, and the detection stopper is fixed outside the cylinder side wall. The present application does not limit this.
[0042] In other embodiments, the cylinder 10 has a cylinder side wall 11, the displacement sensor 40 is arranged inside the cylinder side wall 11, the cylinder side wall 11 is provided with a detection stopper 60 opposite to the displacement sensor 40, one of the detection stopper 60 and the displacement sensor 40 is fixedly connected with the piston body 22, and the other is fixed on the inner wall of the cylinder side wall 11.
[0043] It should also be noted that, in other embodiments, the displacement sensor or the detection stopper fixedly connected with the piston body can also be connected with the piston rod.
[0044] In some embodiments, as shown in FIG. 1, the piston assembly 20 is arranged in the cylinder 10, and the piston assembly 20 is provided with a piston body 22 and a piston rod 21. The piston body 22 is arranged in the cylinder 10, and the piston rod 21 extends out of the cylinder 10. The piston body 22 is provided with a piston rod connecting hole 221, and the piston rod 21 is arranged in the piston rod connecting hole 221. Figure 1As shown, the cylinder 10 has a cylinder bottom wall 12 at the bottom end, and the cylinder bottom wall 12 is provided with a through hole 1201 for the piston rod 21 to pass through. The elastic buffer 30 is arranged between the piston body 22 and the cylinder bottom wall 12.
[0045] In some embodiments, as shown in Figure 1 The elastic buffer 30 is a compression spring.
[0046] It should be noted that for the elastic buffer 30 arranged between the piston body 22 and the cylinder bottom wall 12, the elastic buffer 30 can also be other elastic compression members.
[0047] As shown in Figure 1 The cylinder 10 further includes a cylinder top wall 13.
[0048] It should be noted that in other embodiments, the elastic buffer can also be arranged between the cylinder top wall and the piston body, and correspondingly, the elastic buffer is a tensile spring or other elastic member.
[0049] In some embodiments, the cylinder pressing device 100 is further provided with a gas connection pipeline 70, which is in communication with the cylinder 10, and is used for introducing gas into the cylinder 10 and discharging gas from the cylinder 10, so as to control the lifting of the piston rod 21.
[0050] As shown in Figure 1 In some embodiments, the gas connection pipeline 70 is connected to the upper part of the inner cavity 101 of the cylinder 10 above the piston body 22, so as to control the air pressure above the piston body 22 by introducing gas into the cylinder 10 and discharging gas from the cylinder 10, thereby achieving the control of the lifting of the piston body 22 and the piston rod 21.
[0051] In some embodiments, the gas connection pipeline 70 is provided with a gas flow control assembly 80, which is electrically connected with the pressure detection device 50, and is used for controlling the flow rate and the flow direction of the gas flow between the gas connection pipeline 70 and the cylinder 10 according to the pressure value in the cylinder 10 detected by the pressure detection device 50.
[0052] In some embodiments, the gas flow control assembly 80 includes a flow valve 81 and a control valve 82, the pressure detection device 50 is electrically connected with the flow valve 81, the flow valve 81 is used for controlling the flow rate in the gas connection pipeline 70 according to the pressure detection device 50, and the control valve 82 is used for controlling the flow direction of the gas flow.
[0053] As shown in Figure 1As shown, in some embodiments, the pressure detection device 50 may be electrically connected to the flow valve 81. The flow valve 81 may integrate a controller (not shown). The pressure detection device 50 may be electrically connected to this controller. The controller can determine the airflow magnitude based on the pressure value fed back by the pressure detection device 50 and control the flow valve 81 to increase or decrease the gas flow rate in real time.
[0054] The control valve 82 can be a solenoid directional valve. The controller can control the control valve 82 to adjust the gas flow direction in the gas connection pipeline 70 as needed, that is, control the gas to flow into the cylinder 10 or to discharge from the cylinder 10.
[0055] like Figure 1 In the cylinder depressor 100 shown, when the piston rod 21 needs to descend, the control valve 82 is controlled to supply airflow into the cylinder 10. When the piston rod 21 needs to rise, the control valve 82 is controlled to output airflow from the cylinder 10 outwards.
[0056] In some embodiments, the portion of pipe 701 below control valve 82 in gas connection pipe 70 may include two pipes, one serving as an intake pipe for introducing air into the cylinder, and the other as an exhaust pipe for discharging air from the cylinder. Pipe 702 above control valve 82 may be a single pipe. The pipe above flow valve 81 may also be a single pipe. Control valve 82 may be a two-position three-way valve connecting pipe 702 and the intake and exhaust pipes in pipe 701 to switch the airflow direction.
[0057] In other embodiments, the gas connection line 70 has two separate lines for supplying air to the cylinder 10 and for exhausting air from the cylinder 10. Accordingly, each of the supply and exhaust lines is equipped with a corresponding control valve. Both control valves can be two-position, two-way valves, used to open or close the fluid path in the corresponding lines to control the gas flow direction throughout the connection line 70. Accordingly, the flow valve may be located only on the supply line. Alternatively, both the supply and exhaust lines may be equipped with flow valves.
[0058] It should be noted that the controller controlling the control valve 82 may also be another controller included in the cylinder pressing device, which is not integrated into the flow valve 81.
[0059] Furthermore, it should be noted that in some other embodiments, the control valve can also be other valve structures capable of reversing the gas flow direction. The flow valve can also be other valve structures capable of controlling the gas flow rate. The gas connection pipeline can also be other pipeline structures capable of allowing air to enter the cylinder and exit from the cylinder.
[0060] Please refer to Figure 2and, if necessary, in combination with Figure 3 As shown in FIG. 1, the wafer bonding chuck assembly 1000 includes an upper chuck 200, a lower chuck 300, and a cylinder pressing device 100 or a similar cylinder pressing device as described above. The upper chuck 200 is provided with a piston through hole 201 in the middle for passing the piston rod 21, and the piston rod 21 can be lowered below the lower surface of the upper chuck 200 to provide a downward driving force to the wafer 2000 provided on the upper chuck 200, and drive the wafer 2000 provided on the upper chuck 200 to bond with the wafer 3000 provided on the lower chuck 300.
[0061] In some embodiments, the upper chuck 200 is provided with a plurality of suction holes 202 arranged at intervals. When the wafer 2000 provided on the upper chuck 200 and the wafer 3000 provided on the lower chuck 300 are bonded, the upper chuck 200 is arranged to gradually reduce the suction force on the wafer 2000 provided on the upper chuck 200 from the center to the outer circle, so that the wafer 2000 can be more smoothly bonded with the wafer 3000, and the bonding effect is improved. The reduction of the suction force on the wafer 2000 provided on the upper chuck 200 can be achieved by gradually reducing the suction force of the suction holes 202 from the center to the outer circle.
[0062] In combination with Figure 3 As shown in FIG. 1, the upper chuck 200 can have a suction area S1 for suctioning the wafer 2000 and a peripheral area S2 located on at least one side of the suction area S1. The suction area S1 matches the shape of the wafer 2000. The suction holes 202 are provided in the suction area S1. The piston through hole 201 can be provided in the central area of the suction area S1 to further improve the uniformity of the stress of the wafer 2000 during bonding. The peripheral area S2 can be used for fixing the upper chuck 200.
[0063] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of the present application is not limited to the precise structures described in the above embodiments and shown in the drawings; any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.
Claims
1. An undercylinder pressing device characterized by comprising: The cylinder lower pressing device comprises: a cylinder; a piston assembly arranged in the cylinder in a liftable manner and having a piston rod capable of extending out of the cylinder; a resilient buffer arranged on the piston rod and used for providing an upward buffering force to the piston rod when the piston rod is pressed down; a displacement sensor used for monitoring the lifting height of the piston rod; a pressure detection device used for detecting the pressure value in the cylinder in real time so that the pressure value in the cylinder can be controlled to a preset pressure corresponding to the preset height to which the piston rod is lowered.
2. The undercylinder pressing device according to claim 1, wherein The piston assembly comprises a piston body arranged in the cylinder in a liftable manner, and the piston rod is fixedly connected to the piston body.
3. The undercylinder pressing device according to claim 2, wherein The cylinder has a cylinder side wall, the displacement sensor is arranged outside the cylinder side wall, a detection stopper opposite to the displacement sensor is arranged outside the cylinder side wall, one of the detection stopper and the displacement sensor is fixedly connected to the piston body, and the other is fixed to the cylinder side wall; the cylinder side wall is provided with a side wall opening extending along the lifting direction of the piston rod, the structure of the detection stopper and the displacement sensor fixedly connected to the piston body extends out of the cylinder side wall through the side wall opening, and a sealing member capable of preventing air leakage of the side wall opening is arranged at the side wall opening.
4. The undercylinder pressing device according to claim 2, wherein The cylinder has a cylinder side wall, the displacement sensor is arranged in the cylinder side wall, a detection stopper opposite to the displacement sensor is arranged in the cylinder side wall, one of the detection stopper and the displacement sensor is fixedly connected to the piston body, and the other is fixed to the cylinder side wall.
5. The undercylinder pressing device according to claim 2, wherein The cylinder has a cylinder bottom wall at the bottom end, the cylinder bottom wall is provided with a through hole for the piston rod to pass through; the resilient buffer is arranged between the piston body and the cylinder bottom wall.
6. The undercylinder pressing device according to claim 1, wherein The resilient buffer is a compression spring.
7. The undercylinder pressing device according to claim 1, wherein The cylinder lower pressing device is further provided with a gas connection pipeline in communication with the cylinder and used for introducing gas into the cylinder and discharging gas out of the cylinder so as to control the lifting of the piston rod.
8. The undercylinder pressing device according to claim 7, wherein The gas connection pipeline is provided with a gas flow control assembly electrically connected to the pressure detection device and used for controlling the flow rate and flow direction of the gas flow between the gas connection pipeline and the cylinder according to the pressure value in the cylinder detected by the pressure detection device.
9. The undercylinder pressing device according to claim 8, wherein The gas flow control assembly comprises a flow valve and a control valve, the pressure detection device is electrically connected to the flow valve, the flow valve is used for controlling the flow rate in the gas connection pipeline according to the pressure detection device, and the control valve is used for controlling the flow direction of the gas flow.
10. A wafer bonding chuck assembly, comprising: The wafer bonding chuck assembly comprises an upper chuck, a lower chuck and the cylinder lower pressing device as claimed in any one of claims 1 to 9, the upper chuck is provided in the middle portion with a piston through hole for the piston rod to pass through, the piston rod can be lowered below the lower surface of the upper chuck to provide a downward driving force to the wafer arranged on the upper chuck, and drive the wafer arranged on the upper chuck to be bonded with the wafer arranged on the lower chuck.
11. The wafer bonding chuck assembly of claim 10, wherein, The upper chuck is provided with a plurality of adsorption holes arranged at intervals, and when the wafer arranged on the upper chuck and the wafer arranged on the lower chuck are bonded, the upper chuck is arranged to gradually reduce the adsorption force on the wafer arranged on the upper chuck from the center to the outer ring.