Wafer bonding force testing device
By cleaning the surface of the wafer before it enters the bonding process, the problem of wafer debris affecting measurement results is solved, resulting in higher measurement accuracy and lower wafer loss rate, and simplifying device modification and application.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUBEI XINGCHEN TECH CO LTD
- Filing Date
- 2025-06-11
- Publication Date
- 2026-05-08
AI Technical Summary
In existing methods for measuring wafer bonding force, wafer debris attached to the blade surface can cause measurement distortions and may even lead to wafer breakage.
A wafer bonding force testing device was designed, which adopts a cleaning structure in which an upper elastic cleaning part and a lower metal cleaning part are arranged opposite each other to form a horizontal gap, which is used to clean the debris on the blade surface before the blade cuts into the bonding.
It improves the accuracy and reliability of measurement results, reduces wafer loss rate, reduces production costs, and has a simple structural design that is easy to modify and apply.
Smart Images
Figure CN224218802U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor technology, and more specifically, to a wafer bonding force testing device. Background Technology
[0002] In wafer bonding technology, the bonding force between wafers is a crucial parameter reflecting the bonding condition, and accurate measurement of this bonding force is essential for product quality. Currently, wafer bonding force is measured using the crack propagation and diffusion method (also known as the blade insertion method). This involves inserting a blade into the bonding surface of the wafer, resulting in two new surfaces. Cracks appear on these new surfaces and gradually stabilize. By calculating the length of the cracks, the bonding strength between the two new surfaces can be determined.
[0003] In existing measurements, the blade is inserted directly into the bonding surface of the wafer. During repeated measurements, wafer debris will be attached to the blade surface, which will lead to distorted measurement results or even wafer breakage in subsequent measurements. Utility Model Content
[0004] The purpose of this application is to provide a wafer bonding force testing device that can clean debris from the cutting blade and improve the stability of the measurement results.
[0005] The embodiments of this application are implemented as follows:
[0006] This application provides a wafer bonding force testing device, including a wafer jig and a feed mechanism disposed on one side of the wafer jig. The wafer jig is used to horizontally hold a bonding wafer. The feed mechanism includes a blade held and fixed by a feed clamping member, and a cleaning structure disposed in front of the wafer jig in the feed direction of the blade. The cleaning structure includes an upper elastic cleaning part and a lower metal cleaning part disposed opposite to each other in a vertical direction. A horizontal gap is formed between the upper elastic cleaning part and the lower metal cleaning part. The width of the horizontal gap is less than the thickness of the blade. The horizontal gap corresponds to the horizontal height of the bonding surface of the bonding wafer. The blade is used to cut into the bonding surface of the bonding wafer after passing through the horizontal gap in the feed direction under the push of the feed clamping member.
[0007] Optionally, as an implementable method, the side of the upper elastic cleaning part facing the horizontal gap is a plane, and the side of the lower metal cleaning part facing the horizontal gap is a plane, with the two planes being parallel.
[0008] Alternatively, as an implementable method, the upper elastic cleaning portion is angled to the vertical direction so that, in the feed direction of the blade, the bottom of the upper elastic cleaning portion is offset relative to the lower metal cleaning portion toward the bonding wafer.
[0009] Alternatively, as an implementable method, the angle between the upper elastic cleaning part and the vertical direction is between 5° and 8°.
[0010] Optionally, as an implementable method, a collection groove is also provided on the side of the lower metal cleaning section facing the bonding wafer to collect debris that falls off the blade during the retraction process.
[0011] Alternatively, as an implementable method, on the feed side of the blade, the top of the upper elastic cleaning part and the lower metal cleaning part are located in the same plane in the vertical direction.
[0012] Optionally, as an implementable method, the lower metal cleaning section has a beveled or arc-shaped cutting surface on the feed side of the plane facing the horizontal slit, so that the blade is introduced into the horizontal slit through the beveled or arc-shaped cutting surface during the feed process.
[0013] Alternatively, as an implementable method, the lower metal cleaning part forms a polished metal surface facing the plane of the horizontal slit, and a track groove along the feed direction is machined on the polished metal surface.
[0014] Alternatively, as an implementable method, the bonding surface for the blade to cut into is located above the collection groove.
[0015] Alternatively, as an implementable method, the upper elastic cleaning portion protrudes from the side of the bonding wafer facing the lower metal cleaning portion on the side of the bonding wafer facing the lower metal cleaning portion.
[0016] The beneficial effects of the embodiments of this application include:
[0017] The wafer bonding force testing apparatus provided in this application includes a wafer chuck and a feed mechanism disposed on one side of the wafer chuck. The wafer chuck is used to horizontally position the bonding wafer. The feed mechanism includes a blade held and fixed by a feed clamp, and a cleaning structure disposed in front of the wafer chuck in the feed direction of the blade. The cleaning structure includes an upper elastic cleaning part and a lower metal cleaning part disposed opposite each other in a vertical direction. A horizontal gap is formed between the upper elastic cleaning part and the lower metal cleaning part. The width of the horizontal gap is less than the thickness of the blade, and the horizontal gap corresponds to the horizontal height of the bonding surface of the bonding wafer. The blade, pushed by the feed clamp, passes through the horizontal gap in the feed direction and cuts into the bonding surface of the bonding wafer. By setting up the cleaning structure, the blade is cleaned before it cuts into the bonding surface of the bonding wafer, effectively removing wafer debris attached to the blade surface. This design avoids the impact of debris on the accuracy and stability of blade insertion, ensuring that the blade is inserted into the bonding surface cleanly and accurately each time, thus guaranteeing the accuracy and reliability of the measurement results and improving the precision of wafer bonding force measurement. Because debris on the blade surface is promptly removed, wafer breakage due to debris compression during subsequent measurements is prevented, significantly reducing wafer loss during bonding force measurement, lowering production costs, and improving production efficiency. The cleaning structure employs an upper elastic cleaning section and a lower metal cleaning section arranged opposite each other to form a horizontal gap. The structural design is simple and straightforward, with low manufacturing and installation difficulty, and is easily adapted and applied to existing wafer bonding force testing equipment, demonstrating good practicality and scalability. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the wafer bonding force testing device provided in the embodiments of this application;
[0020] Figure 2 This is a schematic diagram of the lower metal cleaning section in the wafer bonding force testing device provided in this application embodiment.
[0021] Icons: 100 - Wafer bonding force testing device; 110 - Tool feed mechanism; 120 - Wafer fixture; 111 - Tool feed clamping component; 112 - Blade; 113 - Cleaning structure; 1131 - Upper elastic cleaning section; 1132 - Lower metal cleaning section; 1132a - Arc-shaped cutting surface; 1132b - Polished metal surface; 1133 - Horizontal slit; 1134 - Collection groove; 200 - Bonded wafer. Detailed Implementation
[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0023] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0024] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0025] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0026] Please refer to Figure 1This embodiment provides a wafer bonding force testing device 100, including a wafer jig 120 and a feed mechanism 110 disposed on one side of the wafer jig 120. The wafer jig 120 is used to horizontally set a bonding wafer 200. The feed mechanism 110 includes a blade 112 clamped and fixed by a feed clamping member 111, and a cleaning structure 113 disposed in the feed direction of the blade 112 in front of the wafer jig 120. The cleaning structure 113 includes vertically oriented components. The upper elastic cleaning section 1131 and the lower metal cleaning section 1132 are provided, wherein a horizontal gap 1133 is formed between the upper elastic cleaning section 1131 and the lower metal cleaning section 1132. The width of the horizontal gap 1133 is less than the thickness of the blade 112. The horizontal gap 1133 corresponds to the horizontal height of the bonding surface of the bonding wafer 200. The blade 112 is used to cut into the bonding surface of the bonding wafer 200 after passing through the horizontal gap 1133 in the cutting direction under the push of the tool holder 111.
[0027] Specifically, the blade 112 is a key component used to insert into the bonding surface of the bonding wafer 200 to induce cracks and thus measure the bonding force. The feed clamp 111 can firmly clamp the blade 112 and push the blade 112 to move according to the set feed direction and force. The cleaning structure 113 includes an upper elastic cleaning part 1131 and a lower metal cleaning part 1132 arranged opposite each other in the vertical direction, with a horizontal gap 1133 formed between the upper elastic cleaning part 1131 and the lower metal cleaning part 1132. The width of the horizontal gap 1133 is less than the thickness of the blade 112, and it corresponds to the horizontal height of the bonding surface of the bonding wafer 200. This design allows the blade 112 to accurately cut into the bonding surface of the bonding wafer 200 after passing through the horizontal gap 1133 in the feed direction under the push of the feed clamp 111. As the blade 112 passes through the horizontal slit 1133, the upper elastic cleaning part 1131 and the lower metal cleaning part 1132 effectively clean the upper and lower surfaces of the blade 112, removing wafer debris attached to the surface of the blade 112. The upper elastic cleaning part 1131 has a certain degree of elasticity, allowing it to closely conform to the surface of the blade 112 and effectively remove debris without damaging the blade 112; the lower metal cleaning part 1132 provides stable support and auxiliary cleaning, ensuring the cleaning effect and stability of the blade 112. It should be noted that the upper elastic cleaning part 1131 is made of materials such as rubber or thermoplastic elastomer. The cleaning structure 113 also includes a mounting bracket, on which the upper elastic cleaning part 1131 is mounted above and the lower metal cleaning part 1132 is mounted below.
[0028] The wafer bonding force testing apparatus 100 provided in this application includes a wafer jig 120 and a feed mechanism 110 disposed on one side of the wafer jig 120. The wafer jig 120 is used to horizontally set the bonding wafer 200. The feed mechanism 110 includes a blade 112 clamped and fixed by a feed clamping member 111, and a cleaning structure 113 disposed in the feed direction of the blade 112 in front of the wafer jig 120. The cleaning structure 113 includes an upper part arranged opposite to the blade in the vertical direction. The upper elastic cleaning section 1131 and the lower metal cleaning section 1132 are configured with a horizontal gap 1133 between them. The width of the horizontal gap 1133 is less than the thickness of the blade 112. The horizontal gap 1133 corresponds to the horizontal height of the bonding surface of the bonding wafer 200. Under the push of the infeed holder 111, the blade 112 passes through the horizontal gap 1133 along the infeed direction and cuts into the bonding surface of the bonding wafer 200. By setting the cleaning structure 113, the blade 112 is cleaned before cutting into the bonding surface of the bonding wafer 200, effectively removing wafer debris attached to the surface of the blade 112. This avoids the impact of debris on the accuracy and stability of blade 112 insertion, ensuring that the blade 112 can be inserted into the bonding surface cleanly and accurately each time, thereby guaranteeing the accuracy and reliability of the measurement results and improving the accuracy of wafer bonding force measurement. Because debris on the surface of the blade 112 is promptly removed, the wafer will not break due to the compression of debris during subsequent measurements, significantly reducing the wafer loss rate during bonding force measurement, reducing production costs, and improving production efficiency. The cleaning structure 113 adopts a structure in which the upper elastic cleaning part 1131 and the lower metal cleaning part 1132 are arranged opposite each other to form a horizontal gap 1133. The structural design is simple and clear, with low manufacturing and installation difficulty, and is easy to modify and apply to existing wafer bonding force testing equipment, thus having good practicality and scalability.
[0029] In one possible embodiment of this application, such as Figure 1 As shown, the side of the upper elastic cleaning part 1131 facing the horizontal gap 1133 is a plane, and the side of the lower metal cleaning part 1132 facing the horizontal gap 1133 is a plane, and the two planes are parallel.
[0030] Specifically, the parallel plane design allows the upper elastic cleaning section 1131 and the lower metal cleaning section 1132 to apply cleaning force evenly to the upper and lower surfaces of the blade 112 as it passes through the horizontal gap 1133. This ensures that all parts of the blade 112 surface are effectively cleaned, preventing debris residue due to uneven cleaning. This further improves the cleaning effect of the cleaning structure 113 on the blade 112, ensuring the cleanliness of the blade 112 surface and providing more reliable conditions for subsequent bonding force measurement, thus contributing to further improvement in measurement accuracy.
[0031] In one possible embodiment of this application, such as Figure 1 As shown, the upper elastic cleaning section 1131 is at an angle to the vertical direction, so that in the feed direction of the blade 112, the bottom of the upper elastic cleaning section 1131 is offset relative to the lower metal cleaning section 1132 towards the bonding wafer 200.
[0032] Furthermore, the angle between the upper elastic cleaning part 1131 and the vertical direction is between 5° and 8°.
[0033] Specifically, the bottom of the upper elastic cleaning section 1131 is offset relative to the lower metal cleaning section 1132 towards the bonding wafer 200, so that the horizontal slit 1133 forms a gradually tightening cleaning channel along the retraction direction, thereby enhancing the ability to remove debris from the surface of the blade 112.
[0034] In one possible embodiment of this application, such as Figure 1 As shown, a collection groove 1134 is also attached to the side of the lower metal cleaning section 1132 facing the bonding wafer 200, which is used to collect the debris that falls off the blade 112 during the blade retraction process.
[0035] Specifically, when the blade 112 completes insertion of the bonding surface and begins retraction, some loose debris may fall off the surface of the blade 112. The collection groove 1134 can promptly catch these debris, preventing them from falling into other parts of the testing device and interfering with subsequent tests. The collection groove 1134 effectively avoids the scattering of debris during the retraction process, maintains a clean testing environment, reduces the risk of measurement errors and equipment failures caused by debris scattering, and improves the stability and reliability of the testing device.
[0036] In one possible embodiment of this application, such as Figure 1 As shown, on the feed side of the blade 112, the top of the upper elastic cleaning part 1131 and the lower metal cleaning part 1132 are located in the same plane in the vertical direction.
[0037] Specifically, this structural design allows the blade 112 to smoothly enter the horizontal slit 1133 at the beginning of the cutting process, avoiding obstruction or scratching of the blade 112 due to the protrusion of the upper elastic cleaning part 1131 or the lower metal cleaning part 1132, thus ensuring the smoothness of the cutting process of the blade 112.
[0038] By setting the top of the upper elastic cleaning part 1131 and the lower metal cleaning part 1132 in the same vertical plane on the infeed side, the resistance and damage risk of the blade 112 during infeed are reduced, the service life of the blade 112 is extended, and the blade 112 is also ensured to enter the bonding surface of the bonding wafer 200 accurately along the predetermined path, thereby improving the accuracy of measurement.
[0039] In one possible embodiment of this application, such as Figure 1 and Figure 2 As shown, the lower metal cleaning section 1132 has a beveled or arc-shaped cutting surface 1132a on the feed side of the plane facing the horizontal slit 1133, so that the cutting tool 112 is guided into the horizontal slit 1133 through the beveled or arc-shaped cutting surface 1132a during the feed process.
[0040] This guiding structure allows the blade 112 to smoothly enter the horizontal slit 1133, preventing the blade 112 from colliding with or getting stuck in the lower metal cleaning section 1132 due to slight positional deviation during the initial cutting process, thus ensuring the smooth progress of the blade 112's cutting process. The oblique or arc-shaped entry surface 1132a improves the smoothness and accuracy of the blade 112's cutting, reduces measurement errors and equipment wear caused by poor cutting, and further enhances the performance and stability of the testing device.
[0041] In one possible embodiment of this application, such as Figure 1 and Figure 2 As shown, the lower metal cleaning section 1132 forms a polished metal surface 1132b on the plane facing the horizontal slit 1133, and a track groove along the feed direction is machined on the polished metal surface 1132b.
[0042] Specifically, the polished metal surface 1132b reduces the frictional resistance between the blade 112 and the lower metal cleaning section 1132, allowing the blade 112 to pass through the horizontal slit 1133 more smoothly. The track groove provides precise guidance for the blade 112, ensuring that the blade 112 always moves along the predetermined feed direction, improving the stability and accuracy of the blade 112's movement. The combination of the polished metal surface 1132b and the track groove reduces the resistance to the movement of the blade 112 while ensuring the accuracy of the blade 112's movement, thereby improving the cleaning effect of the cleaning structure 113 on the blade 112 and the measurement accuracy of the entire testing device.
[0043] In one possible embodiment of this application, such as Figure 1 As shown, the bonding surface for the blade 112 to cut into is located above the collection groove 1134.
[0044] Specifically, this positioning allows debris detached from the blade 112 during retraction to fall directly into the collection tank 1134 without traversing a complex path, improving debris collection efficiency and ensuring that debris does not scatter in other areas. On the other hand, if the bonded wafer 200 breaks during the bonding force test, the collection tank 1134 can collect the fragments that fall from the broken point. Positioning the bonding surface of the blade 112's cutting portion above the collection tank 1134 optimizes the debris collection path, improves the collection efficiency of the collection tank 1134, and further ensures the cleanliness of the testing environment and the accuracy of the test results.
[0045] In one possible embodiment of this application, such as Figure 1 As shown, the upper elastic cleaning portion 1131 protrudes from the side of the lower metal cleaning portion 1132 facing the bonding wafer 200. This allows the protruding portion of the upper elastic cleaning portion 1131 facing the bonding wafer 200, relative to the protruding portion of the lower metal cleaning portion 1132 facing the bonding wafer 200, to clean debris above the blade 112 during blade retraction, reducing the risk of debris entering the horizontal gap 1133 and damaging the upper elastic cleaning portion 1131. The protruding design of the upper elastic cleaning portion 1131 enhances the cleaning ability of the cleaning structure 113 on the edge of the blade 112, improving the overall cleaning effect of the blade 112.
[0046] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A wafer bonding force testing device, characterized in that, The device includes a wafer chuck and a feed mechanism disposed on one side of the wafer chuck. The wafer chuck is used to horizontally hold a bonding wafer. The feed mechanism includes a blade held and fixed by a feed clamp, and a cleaning structure disposed in front of the wafer chuck in the feed direction of the blade. The cleaning structure includes an upper elastic cleaning part and a lower metal cleaning part disposed opposite each other in a vertical direction. A horizontal gap is formed between the upper elastic cleaning part and the lower metal cleaning part. The width of the horizontal gap is less than the thickness of the blade. The horizontal gap corresponds to the horizontal height of the bonding surface of the bonding wafer. The blade is used to cut into the bonding surface of the bonding wafer after passing through the horizontal gap in the feed direction under the push of the feed clamp.
2. The wafer bonding force testing device according to claim 1, characterized in that, The upper elastic cleaning part is a plane facing the horizontal gap, and the lower metal cleaning part is a plane facing the horizontal gap; the two planes are parallel.
3. The wafer bonding force testing device according to claim 1 or 2, characterized in that, The upper elastic cleaning section forms an angle with the vertical direction, so that in the cutting direction of the blade, the bottom of the upper elastic cleaning section is offset relative to the lower metal cleaning section towards the bonding wafer.
4. The wafer bonding force testing device according to claim 3, characterized in that, The angle between the upper elastic cleaning part and the vertical direction is between 5° and 8°.
5. The wafer bonding force testing device according to claim 1 or 2, characterized in that, A collection groove is also fitted onto the side of the lower metal cleaning section facing the bonding wafer to collect debris that falls off the blade during the retraction process.
6. The wafer bonding force testing device according to claim 3, characterized in that, On the feed side of the blade, the top of the upper elastic cleaning part and the lower metal cleaning part are in the same plane in the vertical direction.
7. The wafer bonding force testing device according to claim 6, characterized in that, The lower metal cleaning section has a beveled or arc-shaped cutting surface on the feed side of the plane facing the horizontal slit, so that the blade is guided into the horizontal slit through the beveled or arc-shaped cutting surface during the feed process.
8. The wafer bonding force testing device according to claim 6, characterized in that, The lower metal cleaning part forms a polished metal surface facing the horizontal slit, and a track groove along the feed direction is machined on the polished metal surface.
9. The wafer bonding force testing device according to claim 5, characterized in that, The bonding surface for the blade to cut into is located above the collection groove.
10. The wafer bonding force testing device according to claim 1, characterized in that, The upper elastic cleaning part protrudes from the side of the bonding wafer facing the lower metal cleaning part on the side of the bonding wafer.