Heat dissipation back splint and electronic equipment assembly

Abstract

The utility model discloses a heat dissipation back clamp and an electronic equipment assembly, and belongs to the technical field of electronic equipment heat dissipation, and the heat dissipation back clamp comprises a back clamp shell, an equipment installation part, a refrigeration sheet and a first fan; the back splint shell is connected with the equipment mounting part, the equipment mounting part is provided with a mounting space, and the mounting space is used for mounting electronic equipment; the back splint shell is provided with an inner cavity, and the refrigeration sheet is arranged in the inner cavity to form a first flow guide cavity; the cold surface of the refrigeration sheet faces the first diversion cavity, and the hot surface of the refrigeration sheet deviates from the first diversion cavity; the back splint shell is provided with a first air inlet and a first air outlet, the first air inlet and the first air outlet both communicate with the first flow guide cavity, and the first fan is used for guiding air in the external environment to enter the first flow guide cavity through the first air inlet. And after heat exchange in the first flow guide cavity, the air is blown to the electronic equipment mounted in the mounting space from the first air outlet.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electronic device heat dissipation, and particularly relates to a heat dissipation back clamp and an electronic device assembly. BACKGROUND

[0002] With the increasing configuration and performance of electronic devices, more and more heat is generated by various electronic components during work, which will have more and more serious influence on the electronic devices, and therefore heat dissipation of the electronic devices becomes more and more important. In order to better dissipate heat of the electronic devices, a heat dissipation back clamp is usually installed on the electronic devices at present, which can assist the electronic devices in heat dissipation, thereby improving the heat dissipation performance of the electronic devices.

[0003] In the related art, the heat dissipation back clamp usually adopts a heat dissipation mode of contact conduction refrigeration, and includes a back clamp shell and a refrigeration sheet. The refrigeration sheet is arranged on the back clamp shell. A cold surface of the refrigeration sheet faces a side of the back clamp shell on which the electronic device is installed. At this time, in a specific heat dissipation process, the cold surface of the refrigeration sheet is in contact with the electronic device, the cold surface of the refrigeration sheet can absorb heat of the electronic device, and a hot surface of the refrigeration sheet transfers the absorbed heat to an external environment, thereby realizing heat dissipation of the electronic device.

[0004] However, when the heat dissipation back clamp dissipates heat of the electronic device, the heat dissipation back clamp can only quickly dissipate heat of the area of the electronic device in contact with the refrigeration sheet, and the heat dissipation performance of the area of the electronic device not in contact with the refrigeration sheet is poor. Therefore, the heat dissipation range of the heat dissipation back clamp in the related art is small, thereby resulting in poor heat dissipation performance of the electronic device. CONTENT OF THE INVENTION

[0005] The purpose of the embodiments of the application is to provide a heat dissipation back clamp and an electronic device assembly, which can solve the problem of small heat dissipation range of the heat dissipation back clamp.

[0006] The application discloses a heat dissipation back clamp, which comprises a back clamp shell, a device mounting part, a refrigeration sheet and a first fan.

[0007] The back clamp shell is connected with the device mounting part. The device mounting part has a mounting space for mounting an electronic device. The back clamp shell has an inner cavity, and the refrigeration sheet is arranged in the inner cavity to form a first flow guide cavity.

[0008] The cold surface of the refrigeration sheet faces the first flow guide cavity, the hot surface of the refrigeration sheet faces away from the first flow guide cavity, and the first fan is located in the first flow guide cavity; the back clamping shell is provided with a first air inlet and a first air outlet, the first air inlet and the first air outlet are in communication with the first flow guide cavity, and the first fan is used to guide air in the external environment to enter the first flow guide cavity through the first air inlet and blow to the electronic device installed in the mounting space from the first air outlet after heat exchange in the first flow guide cavity.

[0009] The application discloses an electronic device, which comprises an electronic device and the above-mentioned heat dissipation back clamping, the electronic device is installed in the mounting space of the heat dissipation back clamping, and the heat dissipation back clamping is used for heat dissipation of the electronic device.

[0010] In the embodiment of the application, the back clamping shell has an inner cavity, and the refrigeration sheet is arranged in the inner cavity to form the first flow guide cavity. The cold surface of the refrigeration sheet faces the first flow guide cavity, and the hot surface of the refrigeration sheet faces away from the first flow guide cavity. The first fan guides air in the external environment to enter the first flow guide cavity through the first air inlet and blows to the electronic device installed in the mounting space from the first air outlet after heat exchange in the first flow guide cavity. In this scheme, the air entering the first flow guide cavity is cooled after heat exchange with the cold surface, and then the low-temperature air is blown to the electronic device. Compared with the heat dissipation back clamping in the related art, the heat dissipation back clamping disclosed in the application blows the cooled air to the electronic device by the first fan to cool and dissipate heat of the electronic device. At this time, the electronic device is cooled by the low-temperature air convection cooling method, and the flow area of the air is large. Therefore, the heat dissipation back clamping disclosed in the application has a large heat dissipation range, thereby improving the heat dissipation performance of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 is a structural schematic diagram of a heat dissipation back clamping disclosed in the embodiment of the application;

[0012] Figure 2 is an exploded view of a heat dissipation back clamping disclosed in the embodiment of the application;

[0013] Figure 3 is a sectional view of a heat dissipation back clamping disclosed in the embodiment of the application;

[0014] Figures 4 to 6 is a structural schematic diagram of part of components of a heat dissipation back clamping disclosed in the embodiment of the application;

[0015] Figure 7 and Figure 8 is a local enlarged view of a heat dissipation back clamping disclosed in the embodiment of the application;

[0016] Figure 9is an assembly schematic view of a clamping piece and a back clamp shell of a heat dissipation back clamp disclosed by the embodiment of the present application;

[0017] Figure 10 is a structural schematic view of a clamping piece of a heat dissipation back clamp disclosed by the embodiment of the present application;

[0018] Figure 11 and Figure 12 is a structural schematic view of another heat dissipation back clamp disclosed by the embodiment of the present application.

[0019] Legend of reference signs:

[0020] 100-heat dissipation back clamp, 110-back clamp shell, 1101-top wall, 1102-bottom wall, 1103-first side wall, 1104-second side wall, 111-first flow guide cavity, 112-second flow guide cavity, 113-first air inlet, 114-first air outlet, 115-second air inlet, 116-second air outlet, 117-sliding clamping groove, 1171-insertion end, 1172-limiting end, 118-limiting piece, 1181-first limiting part, 1182-second limiting part, 1183-first elastic piece, 118a-connecting rod, 118b-buckling part, 118b1-first guide inclined surface, 118c-limiting groove, 120-equipment mounting part, 1201-first clamping piece, 1202-second clamping piece, 1201a-connecting part, 1201b-clamping part, 1201c-second elastic piece, 121-mounting space, 122-guide convex part, 1221-limiting buckle, 1221a-first limiting buckle, 1221b-second limiting buckle, 1221c-second guide inclined surface, 123- accommodating groove, 1231-through hole, 1232-supporting protrusion, 1233-air outlet, 130-refrigeration piece, 140-first fan, 150-first heat dissipation fin, 160-second fan, 170-second heat dissipation fin. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art are within the scope of protection of the present application.

[0022] The terms "first", "second", and the like in the description and in the claims of the present application are used for distinguishing between similar objects and not necessarily for describing a specific sequential or chronological order. It is to be understood that the use of such terms is arbitrary and made solely for the sake of providing a clear and consistent reading of the specification and the claims. Furthermore, the terms "comprising", "including", "containing", and / or "having" as used herein are specifically intended to be construed as open-ended terms i.e., the use of such terms does not preclude the use of other terms or additional terms that are synonymous with "comprising", "including", "containing", and / or "having". Moreover, the use of the term "or" is meant to encompass both "and" and "or" unless specifically stated otherwise.

[0023] The heat dissipation back clip and the electronic device assembly provided by the embodiments of the present application will be described in detail below with reference to the specific embodiments and application scenarios thereof, in combination with the accompanying drawings.

[0024] Reference is made to Figures 1 to 12 The disclosed heat dissipation back clip 100 is applied to an electronic device and is used for auxiliary heat dissipation of the electronic device, thereby improving the heat dissipation effect of the electronic device. The disclosed heat dissipation back clip 100 comprises a back clip shell 110, a device mounting portion 120, a refrigeration fin 130, and a first fan 140.

[0025] The back clip shell 110 provides a mounting basis for other constituent components of the heat dissipation back clip 100. The back clip shell 110 is connected with the device mounting portion 120, and the device mounting portion 120 has a mounting space 121 for mounting an electronic device. The back clip shell 110 has an inner cavity, and the refrigeration fin 130 is arranged in the inner cavity to form a first flow guide cavity 111.

[0026] The refrigeration fin 130 is a main scattering component. Optionally, the refrigeration fin 130 can be a ThermoElectric Cooler (TEC), which is made by using the Peltier effect of semiconductor materials. For example, heavily doped N-type bismuth telluride and P-type bismuth telluride constitute two semiconductor materials of the TEC, the P-type bismuth telluride and the N-type bismuth telluride form a pair of combination, multiple groups are connected in series to form an array, and then they are connected together through electrodes and clamped between two ceramic electrodes, one of which is a cold face and the other is a hot face.

[0027] Specifically, when there is current flowing through the refrigeration sheet 130, heat is transferred from one side of the refrigeration sheet 130 to the other side, thus generating a hot side and a cold side on the refrigeration sheet 130. The specific structure and working principle of the TEC are known technologies. The cold side of the refrigeration sheet 130 faces the first flow cavity 111, and the hot side of the refrigeration sheet 130 faces away from the first flow cavity 111. At this time, the cold side of the refrigeration sheet 130 faces the first flow cavity 111, so the temperature of the air in the first flow cavity 111 is low. While the hot side of the refrigeration sheet 130 faces away from the first flow cavity, so the hot side dissipates heat to the outside. Of course, the refrigeration sheet 130 in the present application is not limited to TEC, but can also be made of materials such as uniform temperature plate and heat pipe.

[0028] The first fan 140 is located in the first flow cavity 111. The back clamping shell 110 is provided with a first air inlet 113 and a first air outlet 114, both of which are in communication with the first flow cavity 111. The first fan 140 is arranged opposite to the first air outlet 114. At this time, the first fan 140 is used to guide the air in the external environment to enter the first flow cavity 111 through the first air inlet 113, and then blow to the electronic device installed on the device mounting portion 120 after heat exchange in the first flow cavity 111.

[0029] In the specific heat dissipation process of the electronic device, the electronic device is first assembled with the heat dissipation back clamping 100, and the electronic device is mounted on the device mounting portion 120. Then the first fan 140 is started. At this time, in the process of rotating the first fan 140, the air in the first flow cavity 111 is discharged through the first air outlet 114, so that the pressure in the first flow cavity 111 becomes smaller. At this time, the pressure in the external environment is larger, so the air in the external environment is sucked into the first flow cavity 111 through the first air inlet 113, and then exchanges heat with the cold side in the first flow cavity 111. Because the temperature of the cold side is low, the temperature of the airflow is reduced, and the low-temperature airflow is discharged through the first air outlet 114 and blown to the electronic device, which mainly refers to the back of the electronic device, that is, the battery cover.

[0030] In the embodiment disclosed in the present application, the air entering the first flow cavity 111 exchanges heat with the cold side and then the temperature is reduced, and then the low-temperature air is blown to the electronic device. Compared with the heat dissipation back clamping 100 in the related art, the heat dissipation back clamping 100 disclosed in the present application blows the cooled air to the electronic device by the first fan 140 to cool and dissipate heat from the electronic device. At this time, the present application adopts the low-temperature air convection heat dissipation method to cool and dissipate heat from the electronic device. The flow area of the air is large, so the heat dissipation back clamping 100 disclosed in the present application has a large heat dissipation range, thereby improving the heat dissipation performance of the electronic device.

[0031] In addition, in order to improve the heat dissipation range, the heat dissipation back holder 100 in the related art needs to increase the area of the refrigerating sheet 130, which will inevitably increase the volume of the entire heat dissipation back holder 100, so that the volume of the heat dissipation back holder 100 is large, thereby occupying a large holding area of the electronic device, and further affecting the holding operation of the user on the electronic device. The heat dissipation back holder 100 disclosed in the present application blows the low-temperature airflow to the electronic device for heat dissipation through the first fan 140. At this time, the area of the refrigerating sheet 130 can be set to be small, so that the overall volume of the heat dissipation back holder 100 is small, and thus the holding area of the electronic device is small, so as not to easily affect the holding operation of the electronic device.

[0032] In addition, the low-temperature airflow is guided at the back of the electronic device and can be blown to the hand of the user through the flow guiding gap between the heat dissipation back holder and the electronic device, so that the hand area has a cool feeling. Therefore, the heat dissipation back holder 100 disclosed in the present application can also dissipate heat for the hand of the user, which is beneficial to avoid the generation of sweat during long-time holding of the user to affect the operation of the user.

[0033] In another optional scheme, the heat dissipation back holder 100 can further include a first heat dissipation fin 150, which can be located in the first flow guiding cavity 111 and attached to the cold face. The first heat dissipation fin 150 can be located between the first fan 140 and the refrigerating sheet 130. In this scheme, the first heat dissipation fin 150 can improve the heat exchange efficiency in the first flow guiding cavity 111, thereby further improving the heat dissipation efficiency and heat dissipation performance of the heat dissipation back holder 100.

[0034] In the above scheme, the refrigerating sheet 130 can separate the inner cavity into the first flow guiding cavity 111 and the second flow guiding cavity 112 which are stacked. At this time, the first flow guiding cavity 111 is located between the mounting space 121 and the second flow guiding cavity 112. The second flow guiding cavity 112, the first flow guiding cavity 111 and the mounting space 121 are sequentially stacked. The stacking direction of the second flow guiding cavity 112, the first flow guiding cavity 111 and the mounting space 121 can be the thickness direction of the back holder shell 110. The hot face of the refrigerating sheet 130 can face the second flow guiding cavity 112. The back holder shell 110 can further be provided with a second air outlet 116 which is in communication with the second flow guiding cavity 112. At this time, the airflow with a higher temperature in the second flow guiding cavity 112 is discharged through the second air outlet 116.

[0035] In order to improve the heat dissipation efficiency in the second flow guiding cavity 112, in another optional scheme, the second fan 160 can be arranged in the second flow guiding cavity 112. The second fan 160 can make the hot airflow in the second flow guiding cavity 112 quickly discharged from the second air outlet 116, thereby improving the heat exchange efficiency of the hot face of the refrigerating sheet 130, and further improving the heat dissipation efficiency of the heat dissipation back holder 100.

[0036] However, the air flow discharged from the second air outlet 116 has a high temperature, and thus the user will feel hot when the air flow discharged from the second air outlet 116 flows to the holding area of the electronic device, thereby reducing the user experience.

[0037] Based on this, in another alternative embodiment, the back clip shell 110 can also be provided with a second air inlet 115, which is in communication with the second flow guide cavity 112. The second fan 160 is used to guide the air in the external environment to enter the second flow guide cavity 112 through the second air inlet 115, and then blow to the external environment from the second air outlet 116 after heat exchange in the second flow guide cavity 112. At this time, the pressure in the external environment is relatively large during the rotation of the second fan 160, and thus the air flow with a low temperature in the external environment will be sucked into the second flow guide cavity 112 through the second air inlet 115, and then discharged to the external environment from the second air outlet 116 after convection heat exchange in the second flow guide cavity 112.

[0038] In this scheme, the cold air flow in the external environment can perform convection heat dissipation on the hot air flow in the second flow guide cavity 112, thereby reducing the temperature of the air flow discharged to the external environment as a whole, and thus the air flow discharged from the second air outlet 116 is not easy to cause the user to feel hot when flowing to the holding area of the electronic device, thereby improving the user experience.

[0039] In another alternative scheme, the heat dissipation back clip 100 can also include a second heat dissipation fin 170, which can be located in the second flow guide cavity 112 and attached to the hot surface. The second heat dissipation fin 170 can be located between the second fan 160 and the refrigeration fin 130. In this scheme, the second heat dissipation fin 170 can improve the heat exchange efficiency in the second flow guide cavity 112, thereby further improving the heat dissipation efficiency and heat dissipation performance of the heat dissipation back clip 100.

[0040] In another alternative embodiment, the back clip shell 110 can have a top wall 1101 and a bottom wall 1102 arranged opposite to each other, and the top wall 1101 and the bottom wall 1102 can be arranged along the stacking direction of the second flow guide cavity 112 and the first flow guide cavity 111. The bottom wall 1102 can be located on the side of the back clip shell 110 facing the mounting space 121. The top wall 1101 can be provided with the second air outlet 116, and the bottom wall 1102 can be provided with the first air outlet 114. In this scheme, since the first air outlet 114 needs to blow cold air flow to the electronic device, the first air outlet 114 is arranged on the bottom wall 1102 closer to the electronic device and the user's hand, while the second air outlet 116 needs to discharge hot air flow, and thus is arranged on the top wall 1101 farther away from the electronic device and the user's hand, thereby achieving better heat dissipation performance and user experience.

[0041] Further, the back clamping shell 110 can further have a first side wall 1103 and a second side wall 1104 arranged oppositely, and both the first side wall 1103 and the second side wall 1104 can be located adjacent to the bottom wall 1102 and the top wall 1101. Here, the first side wall 1103 can be arranged along the length direction or the width direction of the back clamping shell 110. Both the first side wall 1103 and the second side wall 1104 can be provided with the second air inlet 115 and the first air inlet 113 arranged along the stacking direction of the second flow guide cavity 112 and the first flow guide cavity 111.

[0042] In this scheme, the first air inlet 113 and the second air inlet 115 are arranged on both sides of the back clamping shell 110, so that the air flow enters the back clamping shell 110 on both sides at the same time for heat exchange, thereby further improving the heat dissipation efficiency and heat dissipation performance of heat dissipation.

[0043] In an alternative scheme, the device mounting portion 120 can include a first clamping piece 1201 and a second clamping piece 1202, both of which can be connected to the back clamping shell 110. The first clamping piece 1201 and the second clamping piece 1202 are arranged oppositely at both ends of the back clamping shell 110 and are located on the same side of the back clamping shell 110 to form a clamping space. Specifically, both the first clamping piece 1201 and the second clamping piece 1202 are located on the side of the bottom wall 1102. Here, the clamping space serves as the mounting space 121. When the electronic device is mounted in the mounting space 121, the electronic device and the bottom wall 1102 can have a first flow gap, and the first flow gap can be in communication with the first air outlet 114. In this scheme, the device mounting portion 120 has a clamping structure, so that the structure of the device mounting portion 120 is relatively simple.

[0044] Further, the outer surface of the back clamping shell 110 can be provided with a sliding clamping groove 117, which can be understood as the outer surface of the bottom wall 1102 being provided with the sliding clamping groove 117. Both the first clamping piece 1201 and the second clamping piece 1202 are provided with a guide protrusion 122, and the sliding clamping groove 117 can be slidably matched with the guide protrusion 122 along the extension direction of the sliding clamping groove 117, and is limitedly matched along the extension direction of the sliding clamping groove 117. Here, it can be understood that the guide protrusion 122 only has the freedom of sliding along the extension direction of the sliding clamping groove 117, and the freedom along the groove width and groove depth directions is limited.

[0045] The sliding clamping groove 117 has an insertion end 1171 and a limiting end 1172 along the extension direction thereof, and the guide protrusion 122 can be inserted into the sliding clamping groove 117 from the insertion end 1171 and slide towards the limiting end 1172. The guide protrusion 122 can be provided with a limiting buckle 1221, and the limiting end 1172 can be provided with a limiting piece 118. When the guide protrusion 122 slides to the limiting end 1172, the limiting buckle 1221 and the limiting piece 118 can be limited in cooperation along the extension direction of the sliding clamping groove 117.

[0046] Taking the assembly of the first clamping piece 1201 and the back clamping shell 110 as an example, the guide protrusion 122 on the first clamping piece 1201 is inserted into the sliding clamping groove 117 from the insertion end 1171 of the corresponding sliding groove, and then the first clamping piece 1201 is pushed in the direction towards the limiting end 1172 until the limiting buckle 1221 and the limiting piece 118 are limited in cooperation, at this time, the sliding freedom of the first clamping piece 1201 along the extension direction of the sliding clamping groove 117 is limited by the limiting buckle 1221 and the limiting piece 118, so that the first clamping piece 1201 is fixed on the back clamping shell 110. Similarly, the second clamping piece 1202 can also be assembled with the corresponding sliding clamping groove 117 and limiting piece 118 in this way, and this paper does not limit this.

[0047] In this scheme, the assembly structure of the first clamping piece 1201 and the second clamping piece 1202 and the back clamping shell 110 is simple, so as to reduce the assembly difficulty.

[0048] Further, the limiting piece 118 can include a first limiting part 1181, a second limiting part 1182 and a first elastic piece 1183, the first limiting part 1181 and the second limiting part 1182 are both in sliding connection with the back clamping shell 110, and the first limiting part 1181 and the second limiting part 1182 are elastically connected through the first elastic piece 1183. The moving direction of the first limiting part 1181 and the second limiting part 1182 intersects with the extension direction of the sliding clamping groove 117. The number of the limiting buckle 1221 is at least two, which are a first limiting buckle 1221a and a second limiting buckle 1221b. In the case that the guide protrusion 122 slides to the limiting end 1172, the first limiting buckle 1221a and the first limiting part 1181 are limited in cooperation along the extension direction of the sliding clamping groove 117, and the second limiting buckle 1221b and the second limiting part 1182 are limited in cooperation along the extension direction of the sliding clamping groove 117.

[0049] In the specific assembly process, the first limiting part 1181 and the second limiting part 1182 are driven to move to a position not interfering with the first limiting buckle 1221a and the second limiting buckle 1221b, while the first limiting buckle 1221a and the second limiting buckle 1221b are pushed to a position cooperating with the first limiting part 1181 and the second limiting part 1182. Finally, the force on the first limiting part 1181 and the second limiting part 1182 is removed, and the first limiting part 1181 and the second limiting part 1182 return to the position cooperating with the first limiting buckle 1221a and the second limiting buckle 1221b under the action of the first elastic member 1183.

[0050] This scheme can avoid rigid buckling between the first limiting part 1181 and the second limiting part 1182 and the first limiting buckle 1221a and the second limiting buckle 1221b, thereby avoiding the risk of breakage of the first limiting part 1181, the second limiting part 1182, the first limiting buckle 1221a, and the second limiting buckle 1221b, thereby improving the installation reliability and safety of the back clamping shell 110 and the clamping member.

[0051] In another alternative scheme, the first limiting part 1181 and the second limiting part 1182 can each include a connecting rod 118a and a buckle part 118b, the buckle part 118b can be provided at one end of the connecting rod 118a away from the first elastic member 1183 and located on the side facing the insertion end 1171. The connecting rod 118a and the buckle part 118b can enclose a limiting groove 118c. In the case where the guide protrusion 122 slides to the limiting end 1172, the first limiting buckle 1221a and the second limiting buckle 1221b can be located in the corresponding limiting groove 118c. This scheme further simplifies the limiting structure of the back clamping shell 110 and the clamping member, thereby facilitating the reduction of the manufacturing cost of the heat dissipation back clamp 100.

[0052] Further, the side of the buckle part 118b away from the connecting rod 118a can be provided with a first guide slope 118b1, and the first limiting buckle 1221a and the second limiting buckle 1221b can each be provided with a second guide slope 1221c corresponding to the first guide slope 118b1. During the sliding process of the guide protrusion 122 along the insertion end 1171 to the limiting end 1172, the first guide slope 118b1 can guide and cooperate with the corresponding second guide slope 1221c, and drive the first limiting part 1181 and the second limiting part 1182 to approach each other.

[0053] As Figure 6As shown, in the sliding process of the guide protrusion 122 from the insertion end 1171 to the limiting end 1172, first, the second guide slope 1221c of the limiting buckle 1221 is in contact with the first guide slope 118b1 of the buckle portion 118b, then the guide protrusion 122 continues to move, the limiting buckle 1221 pushes the buckle portion 118b to move, of course, when the buckle head of the limiting buckle 1221 passes the buckle head of the buckle portion 118b, the first elastic member 1183 restores the deformation and drives the buckle portion 118b to return to the original position, at this time, the buckle head of the limiting buckle 1221 is in engagement with the buckle head of the buckle portion 118b, so the buckle head of the limiting buckle 1221 is located in the limiting groove 118c, thereby realizing the limiting cooperation.

[0054] In this scheme, the limiting buckle 1221 and the buckle portion 118b are both provided with guide slopes, so in the installation process, the user only needs to move the clamping piece, thereby reducing the assembly difficulty, which is beneficial to realize the quick assembly of the clamping piece and the back clamping shell 110.

[0055] In the above scheme, the first clamping piece 1201 can be provided with a guide protrusion 122, at this time, the first limiting buckle 1221a and the second limiting buckle 1221b can be arranged on the two sides of the guide protrusion 122. Alternatively, in another optional scheme, the first clamping piece 1201 can be provided with at least two guide protrusions 122, the first limiting buckle 1221a can be arranged on one of the guide protrusions 122, and the other limiting buckle 1221 can be arranged on the other guide protrusion 122. Of course, the structure of the second clamping piece 1202 is the same as that of the first clamping piece 1201, which will not be described herein.

[0056] In another optional scheme, the first clamping piece 1201 and the second clamping piece 1202 can each include a connecting portion 1201a, a clamping portion 1201b and a second elastic member 1201c, the connecting portion 1201a is connected with the back clamping shell 110, and the above-mentioned guide protrusion 122 is arranged on the connecting portion 1201a. The clamping portion 1201b and the connecting portion 1201a can be elastically connected through the second elastic member 1201c. The clamping portion 1201b of the first clamping piece 1201 and the clamping portion 1201b of the second clamping piece 1202 can be oppositely arranged to form an installation space 121. In this scheme, the clamping portion 1201b is connected with the connecting portion 1201a through the second elastic member 1201c, so the position of the clamping portion 1201b can be adjusted through the second elastic member 1201c, at this time, the two clamping portions 1201b can be relatively far away or close to each other, so the distance of the installation space 121 formed by the first clamping piece 1201 and the second clamping piece 1202 can be adjusted, thereby improving the compatibility of the installation space 121.

[0057] In order to ensure that the airflow is not blocked, in another alternative, the width of the first air guiding gap can range from 2mm to 5mm. At this time, a gap of 2mm to 5mm can be maintained between the first air outlet and the back of the electronic device, so as to ensure that the airflow is not blocked, while a higher flow rate of airflow can be generated to impact the surface of the electronic device, forming a higher jet heat exchange performance and bringing a good cooling effect.

[0058] In another alternative embodiment, the device mounting portion 120 can be a protective shell, and the protective shell can be provided with a receiving groove 123 which can serve as the mounting space 121. A through hole 1231 can be provided on the groove bottom of the receiving groove 123, facing one side of the back clamping shell 110. The first air outlet 114 is arranged opposite to the through hole 1231 and communicates with each other. At this time, the airflow blown by the first air outlet 114 is blown into the gap between the groove bottom and the back of the electronic device through the through hole 1231, so as to cool the electronic device.

[0059] In this scheme, the device mounting portion 120 is a protective shell, which can improve the protection performance of the electronic device, thereby reducing the risk of damage caused by the falling of the electronic device. In addition, the cold airflow is more concentrated in the protective shell and has a higher wind speed, so the cooling effect on the electronic device is better.

[0060] Further, the groove bottom of the receiving groove 123 can be provided with a supporting protrusion 1232, which can be used to form a second air guiding gap between the groove bottom of the receiving groove 123 and the electronic device when the electronic device is loaded into the receiving groove 123. In this scheme, the supporting protrusion 1232 can support the electronic device to a certain height, so as to avoid the back of the electronic device being attached to the groove bottom, and thus a second air guiding gap can be formed between the back of the electronic device and the groove bottom, so that the cold airflow can flow to the entire back of the electronic device, thereby further improving the heat dissipation performance of the electronic device.

[0061] The supporting protrusion 1232 here can be a strip-shaped structure, or a point-shaped, columnar structure, etc., as long as it can support the electronic device. The specific structure of the supporting protrusion 1232 is not limited herein.

[0062] Further, the width of the second air guiding gap can range from 2mm to 5mm. At this time, a gap of 2mm to 5mm can be maintained between the through hole 1231 and the back of the electronic device, so as to ensure that the airflow is not blocked, while a higher flow rate of airflow can be generated to impact the surface of the electronic device, forming a higher jet heat exchange performance and bringing a good cooling effect.

[0063] In another alternative, the frame of the protective shell is provided with an air outlet 1233, which is in communication with the second flow gap. At this time, the cold air flow is discharged from the air outlet 1233 after heat exchange at the back of the electronic device, thereby avoiding the risk of temperature rise caused by the gathering of the high-temperature air flow in the second flow gap after heat exchange.

[0064] In the above scheme, the air outlet 1233 can be provided on the short side of the protective shell, which can also be understood as being provided on the wide side. At this time, when the user holds the device horizontally, the air flow can also blow on the hand to reduce the temperature of the user's hand.

[0065] The embodiments of the present application also disclose an electronic device assembly, which comprises an electronic device and the heat dissipation back clip 100 described in any of the above embodiments.

[0066] Specifically, the electronic device is installed in the installation space 121 of the heat dissipation back clip 100, and the heat dissipation back clip 100 is used for heat dissipation of the electronic device. The present application adopts the low-temperature air convection heat dissipation mode to dissipate heat of the electronic device, and the flow area of the air is large. Therefore, the heat dissipation back clip disclosed in the present application has a large heat dissipation range, thereby improving the heat dissipation performance of the electronic device.

[0067] The electronic device disclosed in the embodiments of the present application can be a smart phone, a tablet computer, an electronic book reader, a wearable device (such as a smart watch), an electronic game console, etc. The embodiments of the present application do not limit the specific types of electronic devices.

[0068] The embodiments of the present application are described above in combination with the accompanying drawings, but the present application is not limited to the above specific embodiments, and the above specific embodiments are only illustrative but not limiting. Those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the scope protected by the claims, which are all within the protection of the present application.

Claims

1. A heat dissipation back clip, characterized in that, It includes a back clip housing (110), an equipment mounting section (120), a cooling plate (130), and a first fan (140). The back clip housing (110) is connected to the device mounting part (120), the device mounting part (120) has a mounting space (121) for mounting electronic equipment; the back clip housing (110) has an inner cavity, and the cooling chip (130) is disposed in the inner cavity to form a first flow guide cavity (111). The cold side of the cooling chip (130) faces the first flow guide cavity (111), and the hot side of the cooling chip (130) faces away from the first flow guide cavity (111). The first fan (140) is located inside the first flow guide cavity (111). The back clip housing (110) is provided with a first air inlet (113) and a first air outlet (114). The first air inlet (113) and the first air outlet (114) are both connected to the first flow guide cavity (111). The first fan (140) is used to guide air from the external environment into the first flow guide cavity (111) through the first air inlet (113), and after heat exchange in the first flow guide cavity (111), it is blown from the first air outlet (114) to the electronic device installed in the installation space (121).

2. The heat dissipation back clip according to claim 1, characterized in that, The heat dissipation back clip (100) also includes a first heat dissipation fin (150), which is located in the first airflow cavity (111) and attached to the cold surface. The first heat dissipation fin (150) is located between the first fan (140) and the cooling plate (130).

3. The heat dissipation back clip according to claim 1, characterized in that, The cooling chip (130) divides the inner cavity into a first flow guide cavity (111) and a second flow guide cavity (112) that are stacked together. The first flow guide cavity (111) is located between the mounting space (121) and the second flow guide cavity (112), and the hot surface of the cooling chip (130) faces the second flow guide cavity (112). The heat dissipation back clip (100) also includes a second fan (160), which is disposed in the second flow guide cavity (112). The back clip housing (110) is also provided with a second air inlet (115) and a second air outlet (116), both of which are connected to the second guide cavity (112); the second fan (160) is used to guide air from the external environment into the second guide cavity (112) through the second air inlet (115), and blow it out to the external environment from the second air outlet (116) after heat exchange in the second guide cavity (112).

4. The heat dissipation back clip according to claim 3, characterized in that, The heat dissipation back clip (100) also includes a second heat dissipation fin (170), which is located in the second flow guide cavity (112) and attached to the hot surface. The second heat dissipation fin (170) is located between the second fan (160) and the cooling chip (130).

5. The heat dissipation back clip according to claim 3, characterized in that, The back clamp housing (110) has a top wall (1101) and a bottom wall (1102) arranged opposite to each other. The top wall (1101) and the bottom wall (1102) are arranged along the stacking direction of the second guide cavity (112) and the first guide cavity (111). The bottom wall (1102) is located on the side of the back clamp housing (110) facing the installation space (121). The top wall (1101) has a second air outlet (116), and the bottom wall (1102) has a first air outlet (114). The back clamp housing (110) also has a first side wall (1103) and a second side wall (1104) arranged opposite to each other. The first side wall (1103) and the second side wall (1104) are both located on the adjacent side of the bottom wall (1102) and the top wall (1101). The first side wall (1103) and the second side wall (1104) are both provided with a second air inlet (115) and a first air inlet (113) arranged along the stacking direction of the second guide cavity (112) and the first guide cavity (111).

6. The heat dissipation back clip according to claim 1, characterized in that, The device mounting section (120) includes a first clamping member (1201) and a second clamping member (1202). The first clamping member (1201) and the second clamping member (1202) are both connected to the back clamp housing (110). The first clamping member (1201) and the second clamping member (1202) are arranged opposite to each other at both ends of the back clamp housing (110) and are both located on the same side of the back clamp housing (110) to form the mounting space (121). When the electronic device is installed in the mounting space (121), there is a first flow guiding gap between the electronic device and the heat dissipation back clamp (100). The first flow guiding gap is connected to the first air outlet (114).

7. The heat dissipation back clip according to claim 6, characterized in that, The outer surface of the back clamp housing (110) is provided with a sliding groove (117). The first clamping member (1201) and the second clamping member (1202) are both provided with guide protrusions (122). The sliding groove (117) and the guide protrusions (122) slide in cooperation along the extension direction of the sliding groove (117) and are limited in cooperation along the direction perpendicular to the extension direction of the sliding groove (117). The sliding slot (117) has an insertion end (1171) and a limiting end (1172) along its extension direction. The guide protrusion (122) can be inserted into the sliding slot (117) through the insertion end (1171) and slide towards the limiting end (1172). The guide protrusion (122) is provided with a limiting buckle (1221), and the limiting end (1172) is provided with a limiting member (118). When the guide protrusion (122) slides to the limiting end (1172), the limiting buckle (1221) and the limiting member (118) are limited and engaged along the extension direction of the sliding slot (117).

8. The heat dissipation back clip according to claim 7, characterized in that, The limiting member (118) includes a first limiting part (1181), a second limiting part (1182), and a first elastic member (1183). The first limiting part (1181) and the second limiting part (1182) are slidably connected to the back clip housing (110). The first limiting part (1181) and the second limiting part (1182) are elastically connected through the first elastic member (1183). The moving direction of the first limiting part (1181) and the second limiting part (1182) is parallel to the extension direction of the sliding slot (117). The limiting buckles (1221) are at least two in number, namely a first limiting buckle (1221a) and a second limiting buckle (1221b). When the guide protrusion (122) slides to the limiting end (1172), the first limiting buckle (1221a) and the first limiting part (1181) are limited and engaged along the extension direction of the sliding groove (117), and the second limiting buckle (1221b) and the second limiting part (1182) are limited and engaged along the extension direction of the sliding groove (117).

9. The heat dissipation back clip according to claim 8, characterized in that, Both the first limiting part (1181) and the second limiting part (1182) include a connecting rod (118a) and a latching part (118b). The latching part (118b) is disposed at the end of the connecting rod (118a) away from the first elastic member (1183) and is located on the side facing the insertion end (1171). The connecting rod (118a) and the latching part (118b) form a limiting groove (118c). When the guide protrusion (122) slides to the limiting end (1172), the first limiting latch (1221a) and the second limiting latch (1221b) are located in the corresponding limiting groove (118c). The buckle portion (118b) is provided with a first guide slope (118b1) on the side opposite to the connecting rod (118a). The first limiting buckle (1221a) and the second limiting buckle (1221b) are each provided with a second guide slope (1221c). During the process of the guide protrusion (122) sliding from the insertion end (1171) to the limiting end (1172), the first guide slope (118b1) can guide and cooperate with its corresponding second guide slope (1221c), and drive the first limiting portion (1181) and the second limiting portion (1182) to move closer to each other.

10. The heat dissipation back clip according to claim 6, characterized in that, Both the first clamping member (1201) and the second clamping member (1202) include a connecting part (1201a), a clamping part (1201b), and a second elastic member (1201c). The connecting part (1201a) is connected to the back clamp housing (110), and the clamping part (1201b) is elastically connected to the connecting part (1201a) through the second elastic member (1201c). The clamping part (1201b) of the first clamping member (1201) and the clamping part (1201b) of the second clamping member (1202) are disposed opposite to each other at both ends of the back clamp housing (110) to form the mounting space (121).

11. The heat dissipation back clip according to claim 6, characterized in that, The width of the first guide gap ranges from 2 mm to 5 mm.

12. The heat dissipation back clip according to any one of claims 1 to 5, characterized in that, The device mounting part (120) is a protective shell, and the protective shell has a receiving groove (123). The receiving groove (123) serves as the installation space (121). The bottom of the receiving groove (123) facing the back clamp housing (110) has a through hole (1231). The first air outlet (114) is opposite to the through hole (1231) and they are connected to each other.

13. The heat dissipation back clip according to claim 12, characterized in that, The bottom of the receiving groove (123) is provided with a support protrusion (1232), which is used to form a second flow guide gap between the bottom of the receiving groove (123) and the electronic device when the electronic device is installed in the receiving groove (123); an exhaust port (1233) is provided on the frame of the protective shell, and the exhaust port (1233) is connected to the second flow guide gap.

14. The heat dissipation back clip according to claim 13, characterized in that, The width of the second flow guide gap ranges from 2 mm to 5 mm.

15. An electronic device, characterized in that, The device includes an electronic device and a heat dissipation back clip (100) according to any one of claims 1 to 14, wherein the electronic device is mounted in the mounting space (121) of the heat dissipation back clip (100) for heat dissipation of the electronic device.

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