Non-contact in-pipeline liquid temperature control system and chip reagent detection system

Abstract

The utility model discloses a non-contact temperature control system for liquid in a pipeline and a chip reagent detection system. The non-contact temperature control system for the liquid in the pipeline comprises a reagent supply device and a temperature control device, the reaction device comprises a reaction container and an injection pump; the fluid pipeline is arranged between the reagent supply device and the reaction device, one end of the fluid pipeline is connected with the reagent supply device, and the other end of the fluid pipeline is connected with the reaction device; the pipe wrapping device comprises a sealing assembly arranged on the outer side of the fluid pipeline in a sleeving mode, a first connector and a second connector. The preset temperature gas supply device comprises a temperature control device communicated with the first connector through a gas inlet pipeline, a gas backflow device communicated with the second connector and a power device communicated with an outlet of the gas backflow device, and an air outlet of the power device is communicated with the temperature control device. The device can provide non-contact heating or cooling temperature control for the reagent in the pipeline, the pipeline pollution risk is avoided, the reaction time is saved, and the reaction effect of the reagent can be effectively guaranteed through reliable temperature control.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of in-vitro diagnostic devices, in particular to a non-contact liquid temperature control system in pipeline and a chip reagent detection system. BACKGROUND

[0002] In the prior art, taking nucleic acid detection as an example, a nucleic acid detection chip is usually composed of glass, silicon wafer and the like, and has a chemical modification on the silicon wafer substrate, so that the sample to be detected (nucleic acid sample, processed DNA or RNA fragment) can be fixed to the silicon wafer substrate, and biochemical reactions such as sample amplification (PCR) and detection (probe or complementary base excision and synthesis on nucleic acid single strand, and then optical quantification) are completed in the chip.

[0003] During the amplification and detection of the nucleic acid detection chip, the reaction process in the chip needs to be controlled within a suitable temperature range according to the biochemical reaction requirements. In the reaction process, the more the number of amplification rounds, the more the number of nucleic acid copies generated; the more the number of detection rounds, the longer the base sequence sequencing. In the process of amplification and sequencing, each new round of amplification or detection needs to complete the process of cooling and heating, which requires that the nucleic acid detection instrument (such as a gene sequencer) using the nucleic acid detection chip as a detection carrier can control the temperature of the chip reaction environment, that is, the chip, the sample and biochemical reaction reagents in the liquid state in the chip can be refrigerated or heated to achieve the purpose of amplification or detection. In the prior art, a direct temperature rising and falling method is generally used for the chip carrier to control the reaction temperature required for nucleic acid amplification and detection.

[0004] The existing technical solution has the following problems: the reagent is connected from the reagent bin to the reaction container by a pipeline, and the pipeline is exposed to the ambient temperature. Since the amount of reagent required for each reaction is small, the reagent in the pipeline is exposed to the ambient temperature for a long time, which may cause the activity of the reagent to decrease and affect the reaction efficiency and stability.

[0005] The reaction efficiency of the reagent is related to the temperature, and the higher the temperature, the higher the reaction efficiency. Therefore, the reagent needs to be heated after reaching the reaction container. Since the number of reaction rounds is large, the heating time is long. CONTENT OF THE INVENTION

[0006] Therefore, the present disclosure provides a non-contact liquid temperature control system in pipeline and a chip reagent detection system, which at least partially solve the problem of inaccurate reagent detection results caused by unstable and uncontrollable ambient temperature of the reagent in the prior art.

[0007] In a first aspect, the present disclosure provides a non-contact liquid temperature control system in pipeline, comprising:

[0008] a reagent supply device;

[0009] A reaction device comprising a reaction vessel, an injection pump connected to each other;

[0010] A fluid pipeline arranged between the reagent supply device and the reaction device, one end of the fluid pipeline is connected to the reagent supply device through a first fluid joint, and the other end is connected to the reaction device through a second fluid joint;

[0011] A pipe wrapping device comprising a sealing assembly wrapped outside the fluid pipeline and a first joint and a second joint mounted on the sealing assembly;

[0012] A preset temperature gas supply device comprising a temperature control device in communication with the first joint through an air inlet pipeline, a gas return device in communication with the second joint, and a power device in communication with the outlet of the gas return device through a connecting pipe, and the air outlet of the power device is in communication with the temperature control device through a connecting pipe.

[0013] Optionally, the temperature control device comprises a box body and a water cooling assembly, a semiconductor refrigeration sheet and a temperature control reaction assembly arranged in the box body from bottom to top;

[0014] The open side of the box body is covered with a cover plate;

[0015] The water cooling assembly comprises a water cooling plate, a first water cooling interface and a second water cooling interface arranged on the side of the water cooling plate and penetrating through the side wall of the box body, and the water cooling plate has a plurality of flow channels; the first water cooling interface and the second water cooling interface are connected to a water cooling device through a first water cooling pipeline and a second water cooling pipeline respectively;

[0016] The temperature control reaction assembly comprises a temperature control reaction disc, an air inlet interface, a first air outlet interface and a second air outlet interface arranged on the side of the temperature control reaction disc and penetrating through the side wall of the box body; the bottom of the temperature control reaction disc is arranged in close contact with the top of the semiconductor refrigeration sheet.

[0017] Optionally, the sealing assembly comprises:

[0018] An air pipe, the two ends of the air pipe are respectively provided with a first pipe wrapping joint and a second pipe wrapping joint;

[0019] The first pipe wrapping joint has a first connecting port, a second connecting port and a first pipe portion in communication with each other, a first sealing gasket is arranged in the first connecting port, and the first joint is arranged on the second connecting port;

[0020] The second pipe wrapping joint has a third connecting port, a fourth connecting port and a second pipe portion in communication with each other, a second sealing gasket is arranged in the third connecting port, and the second joint is arranged on the fourth connecting port;

[0021] The trachea is in interference fit with the first pipe part and the second pipe part at two ends respectively.

[0022] Optionally, the first fluid joint is mounted at the first end of the fluid pipe;

[0023] The second end of the fluid pipe is connected with the second fluid joint in sequence through the first sealing pad, the first pipe joint, the trachea, the second sealing pad and the second pipe joint.

[0024] Optionally, the distance between the first fluid joint and the first pipe joint is not greater than 3 mm, and the distance between the second fluid joint and the second pipe joint is not greater than 3 mm.

[0025] Optionally, the inner diameter of the trachea is D1, and the outer diameter of the fluid pipe is D2, and 2≤D1 / D2≤2.5.

[0026] The distance from the first sealing pad to the outside of the first connecting port is H1, and the distance from the second sealing pad to the outside of the second connecting port is H2, and 0.2mm≤H1≤0.4mm; 0.2mm≤H2≤0.4mm.

[0027] The length of the first pipe part is L1, and the length of the second pipe part is L2, and 6mm≤L1≤8mm; 6mm≤L2≤8mm.

[0028] Optionally, the fluid pipe is provided with N, and N fluid pipes are independently provided.

[0029] The pipe wrapping device is provided with N, and N pipe wrapping devices are correspondingly provided with N fluid pipes.

[0030] The gas return device is provided with N gas return ports and a gas outlet, and the N gas return ports are correspondingly communicated with the second joints in the N pipe wrapping devices; and the gas outlet is communicated with the air inlet of the power device through a pipe.

[0031] Optionally, the length of the pipe between the gas outlet of the temperature control device and the inlet of the first joint in the pipe wrapping device is not greater than 15 cm.

[0032] In a second aspect, the application discloses a non-contact liquid temperature control system in a pipe, comprising:

[0033] The sealing assembly is sleeved outside the target fluid pipeline, and the first joint and the second joint are installed on the sealing assembly; the sealing assembly comprises an air pipe, and the air pipe is provided with a first pipe joint and a second pipe joint at two ends respectively; the first pipe joint is provided with a first connecting port, a second connecting port and a first pipe portion which are communicated with each other, and a first sealing gasket is arranged in the first connecting port; the first joint is installed on the second connecting port; the second pipe joint is provided with a third connecting port, a fourth connecting port and a second pipe portion which are communicated with each other, and a second sealing gasket is arranged in the third connecting port; the second joint is installed on the fourth connecting port; the air pipe is in interference fit with the first pipe portion and the second pipe portion at two ends respectively;

[0034] The temperature control device is communicated with the first joint through an air inlet pipeline, and the temperature control device is used for providing a cold air environment or a hot air environment to cool or heat the target fluid pipeline;

[0035] The gas backflow device is communicated with the second joint;

[0036] The power device is communicated with the outlet of the gas backflow device through a connecting pipe, and the air outlet of the power device is communicated with the temperature control device through a connecting pipe.

[0037] In a third aspect, the application discloses a chip reagent detection system comprising the non-contact liquid temperature control system in the pipeline.

[0038] The non-contact liquid temperature control system in the pipeline can effectively control the temperature of the reagent pipeline from the reagent supply device to the reaction device through the sleeve of the pipe wrapping device and the preset temperature gas supply device matched with the pipe wrapping device, can effectively ensure the activity of the reagent in the fluid pipeline, and ensure the reaction efficiency and stability; specifically, the preset temperature gas supply device provides the preset temperature gas directly acting on the outside of the fluid pipeline through the temperature control device and the gas backflow device, which can more accurately control the temperature of the liquid in the pipeline, avoid the temperature fluctuation of the reagent in the transmission process, and ensure that the reagent reaches the reaction container at the best reaction temperature; since the reagent has been temperature controlled by the preset temperature gas supply device before reaching the reaction container, the reagent does not need to be temperature regulated for a long time after reaching the reaction container, and can immediately enter the reaction state, greatly shortening the temperature control time of each reaction round and improving the reaction efficiency; through accurate temperature control, the scheme can ensure that the conditions of each reaction round are consistent in the multiple rounds of amplification or detection, can effectively reduce the influence of temperature fluctuation on the reaction stability, and improve the accuracy and reliability of the detection result; the non-contact temperature control system does not need to directly contact the reagent or the reaction container, and therefore can adapt to various complex environmental conditions and reduce the interference of external factors on the reaction process.

[0039] The above description is only a summary of the technical solutions of the present disclosure, in order to more clearly understand the technical means of the present disclosure, the contents of the specification can be implemented, and in order to make the above and other purposes, characteristics and advantages of the present disclosure more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0041] Figure 1 A schematic diagram of the structure of a non-contact liquid temperature control system in a pipeline provided by the present disclosure.

[0042] Figure 2 An exploded view of the temperature control device in Figure 1

[0043] Figure 3 An assembly view of the temperature control device in Figure 1

[0044] Figure 4 An assembly view of the pipe wrapping device in Figure 1

[0045] Figure 5 An exploded view of the pipe wrapping device in Figure 1

[0046] Figure 6 A sectional view of the sealing assembly in Figure 5

[0047] Explanation of reference signs:

[0048] 100, power device; 110, air outlet; 120, air inlet;

[0049] 200, temperature control device; 210, box body; 221, water cooling plate; 222, first water cooling interface; 223, second water cooling interface; 230, semiconductor refrigeration sheet; 241, temperature control reaction disc; 242, first air outlet interface; 243, second air outlet interface; 244, air inlet interface; 250, cover plate;

[0050] 300, pipe wrapping device; 310, air pipe; 320, first pipe wrapping joint; 330, second pipe wrapping joint; 340, first joint; 350, second joint; 360, first sealing gasket; 370, second sealing gasket;

[0051] ​​​​​410, fluid line; 420, first fluid fitting; 430, second fluid fitting;

[0052] 500, water cooling device;

[0053] 600, reagent supply device;

[0054] 700, liquid distribution plate;

[0055] 800, reaction device;

[0056] 900, Y-type quick connector. DETAILED DESCRIPTION

[0057] The present disclosure will be further described in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described herein are merely exemplary and are not limiting to the disclosure. In addition, it should be noted that only parts related to the present disclosure are shown in the drawings for the purpose of description.

[0058] It should be noted that the embodiments and features in the embodiments of the present disclosure can be combined with each other without conflict. The technical solutions of the present disclosure will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0059] Unless otherwise specified, the exemplary embodiments / examples shown will be understood as providing exemplary features of various details that can implement the technical concepts of the present disclosure in practice. Therefore, unless otherwise specified, the features of various embodiments / examples can be additionally combined, separated, interchanged and / or rearranged without departing from the technical concepts of the present disclosure.

[0060] In the drawings, cross-hatching and / or shading are generally used to make the boundaries of adjacent components clear. As such, unless otherwise specified, the presence of cross-hatching or shading is not meant to imply that a particular material, material property, dimension, ratio, etc. is being represented in any way. In addition, for clarity and / or descriptive purposes, the dimensions and / or relative dimensions of the components shown in the figures can be exaggerated or otherwise not drawn to scale. When exemplary embodiments can be practiced differently, a particular order of performing the described processes can be changed. For example, two consecutively described processes can be performed substantially simultaneously or in reverse order of the described order. In addition, the same reference numerals are used to represent the same components.

[0061] When a component is referred to as being "on", "connected to", or "coupled to" another component, it can be directly on, connected, or coupled to the other component, or intervening components can be present. Where, however, two components are coupled, it is not excluded that a direct connection is made, using no intervening components. For this reason, the term "connected" can refer to physical or electrical connections, with or without intervening components.

[0062] For purposes of the description hereinafter, spatial or directional terms, such as "below", "lower", "bottom", "bottomed", "above", "upper", "top", "higher", and "side" (e.g., as in "sidewall") are used with reference to the orientation of the component as illustrated in the drawings. The spatial or directional terms are intended to encompass different orientations of the device in use, operation, and / or manufacture, in addition to the orientation depicted in the drawings. For example, if the device in the drawings is turned over, then a component described as "below" or "under" another component would then be oriented "above" the other component. Accordingly, the exemplary term "below" can encompass both an orientation of above and below. Moreover, the device can be oriented in other ways (e.g., rotated 90 degrees or at other orientations) and, as such, the spatial or directional terms used herein are intended to be interpreted accordingly.

[0063] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, to the extent that the terms "including", "includes", "having", "has", "with", or variants thereof are used in either the detailed description and / or the claims, such terms are intended to be inclusive in a manner similar to the term "comprising". It is also noted that the terms "substantial", "approximately", and other similar terms, as used herein, are used in their normal, ordinary sense and are not used in an absolute sense. Thus, they are used in a manner that is consistent with the ordinary skill in the art and are not used in a manner that is limiting.

[0064] Reference Figure 1 and Figure 4The application discloses a non-contact liquid temperature control system in a pipeline, which specifically comprises a reagent supply device 600, a reaction device 800, a fluid pipeline 410 arranged between the reagent supply device 600 and the reaction device 800, a pipeline wrapping device 300 and a preset temperature gas supply device, wherein the reagent supply device 600 is used for providing different types of reagents; the reaction device 800 comprises a reaction container (not shown in the figure) and a syringe pump (not shown in the figure) which are connected to each other, the reaction container provides a reagent reaction area, and the syringe pump is used for controlling the suction of the reagent into the reaction container and the suction of the reagent after reaction out of the reaction container.

[0065] In the embodiment, one end of the fluid pipeline 410 is connected with the reagent supply device 600 through a first fluid joint 420, and the other end is connected with the reaction device 800 through a second fluid joint 430, so as to transport the reagent output by the reagent supply device 600 into the reaction container of the reaction device 800.

[0066] Meanwhile referring to Figure 5 The pipeline wrapping device 300 comprises a sealing assembly wrapped outside the fluid pipeline 410 and a first joint 340 and a second joint 350 arranged on the sealing assembly, wherein the sealing assembly is non-contact with the reagent in the fluid pipeline 410, so that the non-contact temperature control of the liquid in the fluid pipeline 410 is realized.

[0067] The preset temperature gas supply device comprises a temperature control device 200 communicated with the first joint 340 through an air inlet pipeline, a gas backflow device communicated with the second joint 350, and a power device 100 communicated with the outlet of the gas backflow device through a connecting pipeline, and the air outlet 110 of the power device 100 is communicated with the temperature control device 200 through a connecting pipeline.

[0068] In the working state, the power device 100 is started, source air is transported from the air outlet 110 to the inside of the temperature control device 200 through the connecting pipeline, the heating or refrigeration of the source air is realized through the temperature control device 200, preset temperature air is obtained, then the preset temperature air is transmitted to the inside of the sealing assembly through the air inlet pipeline and the first joint 340, the heating or refrigeration of the fluid pipeline 410 wrapped in the sealing assembly is realized, that is, the non-contact temperature control of the liquid in the fluid pipeline 410 is realized; at present, the movement of the air is circular, the preset temperature air entering into the inside of the sealing assembly will go out from the second joint 350 and enter into the gas backflow device under the action of the power device 100, then return to the air inlet 120 of the power device 100 from the outlet of the gas backflow device, that is, a circulation is formed; in the process that the power device 100 is always started, it is ensured that the preset temperature air going out from the temperature control device 200 can continuously act on the fluid pipeline 410 in the inside of the sealing assembly, so that the precise temperature control of the liquid reagent in the fluid pipeline 410 is realized.

[0069] The length difference between the sealing assembly and the fluid pipeline 410 is within a preset range, so that the air at the preset temperature provided by the preset temperature gas supply device can effectively act on the liquid reagent in the fluid pipeline 410, and the temperature control effect is guaranteed.

[0070] Further, the pipeline length between the outlet of the temperature control device 200 and the inlet of the first joint 340 in the pipe wrapping device 300 is not greater than 15 cm, so that the temperature of the preset temperature air from the temperature control device 200 will not be lost during pipeline transmission.

[0071] When the source air is cooled by the temperature control device 200, the preset temperature air formed is preferably not higher than 8 degrees, so as to effectively maintain the low temperature of the reagent in the fluid pipeline 410; when the source air is heated by the temperature control device 200, the preset temperature air formed is preferably not lower than 50 degrees, so as to effectively maintain the high temperature of the reagent in the fluid pipeline 410.

[0072] Further, a liquid distribution plate 700 is further arranged between the second fluid joint at the other end of the fluid pipeline and the reaction device 800. The liquid inlet of the liquid distribution plate 700 communicates with the second fluid joint. The liquid distribution plate includes one or more liquid outlets. When the liquid outlets are multiple, the multiple liquid outlets can be respectively connected with multiple reaction vessels, for respectively providing corresponding reagents for the multiple reaction vessels.

[0073] The non-contact liquid temperature control system in the pipeline disclosed in the present application can effectively control the temperature of the reagent pipeline from the reagent supply device to the reaction device through the sleeve of the pipe wrapping device and the preset temperature gas supply device matched with the pipe wrapping device, so as to effectively ensure the activity of the reagent in the fluid pipeline and ensure the reaction efficiency and stability. Specifically, the preset temperature gas supply device provides the gas at the preset temperature directly acting on the outside of the fluid pipeline through the temperature control device and the gas return device, so as to more accurately control the temperature of the liquid in the pipeline, avoid the temperature fluctuation of the reagent during the transmission process, and ensure that the reagent has reached the optimal reaction temperature when reaching the reaction vessel. Since the reagent has been temperature controlled by the preset temperature gas supply device before reaching the reaction vessel, the reagent can immediately enter the reaction state after reaching the reaction vessel without long-term temperature regulation, which greatly shortens the temperature control time of each reaction round and improves the reaction efficiency. Through accurate temperature control, the present application can ensure that the conditions of each reaction round are consistent during multiple rounds of amplification or detection, which can effectively reduce the influence of temperature fluctuation on the reaction stability and improve the accuracy and reliability of the detection result. The non-contact temperature control system does not need to directly contact the reagent or the reaction vessel, so it can adapt to various complex environmental conditions and reduce the interference of external factors on the reaction process.

[0074] Referring to Figure 2 and Figure 3 The temperature control device 200 comprises a box body 210 and, from bottom to top, a water cooling assembly, a semiconductor refrigeration sheet 230 and a temperature control reaction assembly arranged in the box body 210, wherein the open side of the box body 210 is covered with a cover plate 250.

[0075] The temperature control reaction assembly comprises a temperature control reaction disc 241, an air inlet interface 244 arranged on the side of the temperature control reaction disc 241 and penetrating the side wall of the box body 210, a first air outlet interface 242 and a second air outlet interface 243; the bottom of the temperature control reaction disc 241 is arranged in close contact with the top of the semiconductor refrigeration sheet 230.

[0076] In this embodiment, the air outlet 110 of the power device 100 is in communication with the air inlet interface 244, that is, the source air delivered by the power device 100 enters the inside of the temperature control reaction disc 241 to realize temperature rise or drop, and then is output from the air outlet interface to the corresponding pipe device 300 to realize temperature control of the reagent in the corresponding fluid pipeline 410.

[0077] It should be noted that the number of air outlet interfaces of the power device 100 corresponds to the number of pipe devices 300 and the number of fluid pipelines 410.

[0078] The water cooling assembly comprises a water cooling plate 221, a first water cooling interface 222 and a second water cooling interface 223 arranged on the side of the water cooling plate 221 and penetrating the side wall of the box body 210, and the water cooling plate 221 has a plurality of flow channels therein; the first water cooling interface 222 and the second water cooling interface 223 are connected with a water cooling device 500 through a first water cooling pipeline and a second water cooling pipeline respectively.

[0079] When the temperature control device 200 is used for refrigeration, that is, for temperature drop of the fluid pipeline 410, the upper side of the semiconductor refrigeration sheet 230 is refrigerated and the lower side is heated, and the water cooling plate 221 located at the lower side of the semiconductor refrigeration sheet 230 absorbs heat through the water in the flow channels; the externally arranged water cooling device 500 is used to draw out the water in the water cooling plate 221 which has absorbed the heat of the semiconductor refrigeration sheet 230, and then provide cold water into the flow channels of the water cooling plate 221 to cool the semiconductor refrigeration sheet 230 and protect the semiconductor refrigeration sheet 230.

[0080] When the temperature control device 200 is used for heating the source air, that is, for keeping a high temperature (temperature rise) of the fluid pipeline 410, the upper side of the semiconductor refrigeration sheet 230 is heated and the lower side is refrigerated, and the water cooling plate 221 located at the lower side of the semiconductor refrigeration sheet 230 absorbs cold air through the water in the flow channels; the externally arranged water cooling device 500 is used to draw out the water in the water cooling plate 221 which has absorbed the cold air of the semiconductor refrigeration sheet 230, and then provide normal temperature water into the flow channels of the water cooling plate 221 to absorb the cold air of the semiconductor refrigeration sheet 230.

[0081] The gas backflow device is preferably a Y-type quick connector 900, which is preferably fixed to the side of the box 210.

[0082] The gas backflow device is preferably a Y-type quick connector 900, which is preferably fixed to the side of the box 210.

[0083] Further, the fluid pipeline is provided with N pieces of fluid pipelines which are independently arranged; the pipe wrapping device is provided with N pieces of pipe wrapping devices which are correspondingly arranged with the N pieces of fluid pipelines; the gas backflow device is provided with N pieces of gas backflow ports and one gas outlet, the N pieces of gas backflow ports are correspondingly communicated with the second joints in the N pieces of pipe wrapping devices; the gas outlet is communicated with the air inlet of the power device through a pipeline.

[0084] In this embodiment, referring to Figure 1 , the fluid pipeline 410 is preferably provided with two pieces of fluid pipelines 410 which are independently arranged; the pipe wrapping device 300 is provided with two pieces of pipe wrapping devices 300 which are correspondingly arranged with the two pieces of fluid pipelines 410; the gas backflow device is provided with two pieces of gas backflow ports and one gas outlet, the two pieces of gas backflow ports are correspondingly communicated with the second joints 350 in the two pieces of pipe wrapping devices 300; the gas outlet is communicated with the air inlet of the power device 100 through a pipeline.

[0085] Referring to Figure 4 and Figure 5 , the sealing assembly comprises: an air pipe 310, two ends of the air pipe 310 are respectively provided with a first pipe joint 320 and a second pipe joint 330.

[0086] The first pipe joint 320 is provided with a first connecting port, a second connecting port and a first pipe portion which are communicated with each other, the first connecting port is internally provided with a first sealing gasket 360, and a first joint 340 is arranged in the second connecting port.

[0087] The second pipe joint 330 is provided with a third connecting port, a fourth connecting port and a second pipe portion which are communicated with each other, the third connecting port is internally provided with a second sealing gasket 370, and a second joint 350 is arranged in the fourth connecting port; the two ends of the air pipe 310 are respectively in interference fit with the first pipe portion and the second pipe portion to ensure air tightness.

[0088] The first fluid joint 420 is installed at the first end of the fluid pipe 410; the second end of the fluid pipe 410 is sequentially connected with the first sealing gasket 360, the first pipe joint 320, the air pipe 310, the second sealing gasket 370, the second pipe joint 330 and the second fluid joint 430, and the first sealing gasket 360 and the second sealing gasket 370 are in interference fit with the fluid pipe 410, so as to ensure the sealing effect in the penetration area of the sealing gasket, and ensure that the preset temperature air entering from the first joint 340 will not leak from the connection between the first sealing gasket 360, the second sealing gasket 370 and the fluid pipe 410 after entering the air pipe 310; inside the sealing assembly, the first sealing gasket 360, the second sealing gasket 370, the first joint 340, the second joint 350 and the air pipe 310 ensure that the preset temperature air entering the air pipe 310 can fully and effectively act on the circumferential side of the fluid pipe 410, thereby forming effective temperature control.

[0089] Further, the distance between the first fluid joint 420 and the first pipe joint 320 is not greater than 3 mm, and the distance between the second fluid joint 430 and the second pipe joint 330 is not greater than 3 mm, so as to ensure the wrapping effect of the sealing assembly on the fluid pipe 410, ensure the contact area with the fluid pipe 410, and effectively ensure the effective temperature control of the liquid reagent in the fluid pipe 410.

[0090] Further, the inner diameter of the air pipe 310 is D1, and the outer diameter of the fluid pipe 410 is D2, and 2≤D1 / D2≤2.5, so as to ensure that the preset temperature air entering the air pipe 310 can fully contact the outer surface of the fluid pipe 410, provide a stable and reliable temperature control environment, and further realize reliable temperature control of the reagent in the fluid pipe 410.

[0091] Referring to Figure 6 The distance from the first sealing gasket 360 to the outside of the first connecting port on the first pipe joint 320 is H1, and the distance from the second sealing gasket 370 to the outside of the second connecting port on the second pipe joint 330 is H2, and 0.2mm≤H1≤0.4mm; 0.2mm≤H2≤0.4mm, so as to ensure the installation reliability of the first sealing gasket 360 and the second sealing gasket 370 and the sealing effectiveness of the air pipe 310.

[0092] The length of the first pipe part of the first pipe joint 320 is L1, and the length of the second pipe part of the second pipe joint 330 is L2, and 6mm≤L1≤8mm; 6mm≤L2≤8mm, so as to ensure the connection tightness of the first pipe joint 320 and the second pipe joint 330 with the air pipe 310, and ensure the sealing effect.

[0093] In the prior art, the reagent is exposed to ambient temperature in the pipeline between the reagent bin and the reaction container, and temperature instability leads to a decrease in reagent activity; and the present application wraps the fluid pipeline with the sealing assembly in the pipe wrapping device, effectively preventing the reagent from being exposed to ambient temperature for a long time, thereby maintaining the activity of the reagent and ensuring the reaction efficiency and stability.

[0094] The second aspect of the present application discloses a non-contact liquid temperature control system in the pipeline, specifically comprising:

[0095] The sealing assembly is sleeved outside the target fluid pipeline, and the first joint and the second joint are installed on the sealing assembly; the sealing assembly comprises an air pipe, and the two ends of the air pipe are respectively provided with a first pipe wrapping joint and a second pipe wrapping joint; the first pipe wrapping joint has a first connecting port, a second connecting port and a first pipe portion which are in communication with each other, a first sealing gasket is installed in the first connecting port, and the first joint is installed on the second connecting port; the second pipe wrapping joint has a third connecting port, a fourth connecting port and a second pipe portion which are in communication with each other, a second sealing gasket is installed in the third connecting port, and the second joint is installed on the fourth connecting port; the two ends of the air pipe are in interference fit with the first pipe portion and the second pipe portion, respectively;

[0096] The temperature control device is in communication with the first joint through the air inlet pipeline, and the temperature control device is used to provide a cold air environment or a hot air environment to cool or heat the target fluid pipeline;

[0097] The gas return device is in communication with the second joint;

[0098] The power device is in communication with the outlet of the gas return device through the connecting pipe, and the air outlet of the power device is in communication with the temperature control device through the connecting pipe.

[0099] In the non-contact liquid temperature control system in the pipeline disclosed in the second aspect of the present application, the temperature control device directly acts on the sealing assembly sleeved outside the target fluid pipeline by providing cold air or hot air, which can quickly adjust the temperature of the liquid in the pipeline in a short time, so that the reagent has reached the optimal reaction temperature before reaching the reaction container, reducing the time required for temperature rise or fall and improving the overall reaction efficiency; the design of the air pipe of the sealing assembly and the sealing gasket inside ensures the close contact between the air pipe and the pipeline, making the temperature control more uniform and avoiding local temperature fluctuations, which helps to ensure the stability of the temperature during the entire reaction process and improves the reliability and accuracy of the reaction; the design of the first sealing gasket and the second sealing gasket effectively prevents the influence of the external environment on the temperature of the liquid in the pipeline, which reduces the influence of external temperature fluctuations on the activity of the reagent and ensures the stability and activity of the reagent during the entire transmission process; the connection design of the gas return device and the power device enables the temperature control gas to be recycled, effectively saving energy, and at the same time, recycling the gas can also reduce the fluctuations of the environmental temperature, further improving the accuracy and stability of the temperature control.

[0100] The design of the system makes it adaptable to different environmental conditions, whether high or low temperature environments, effectively controlling the temperature of the liquid in the pipeline, which is a great advantage for biochemical reactions that need to be carried out under various environmental conditions.

[0101] The connection design between components (such as the first joint, the second joint, the first pipe joint, the second pipe joint, etc.) makes the system have good modular characteristics, which not only facilitates the installation and maintenance of the system, but also makes it more simple and efficient when it needs to be replaced or repaired.

[0102] Through precise temperature control and circulating gas design, the system can effectively avoid temperature fluctuations during the reaction process, ensuring consistent conditions for each round of reaction, which helps to improve the accuracy and reliability of the detection results, especially in multiple rounds of amplification or detection processes.

[0103] In summary, the non-contact liquid temperature control system in the pipeline disclosed in the second aspect of the application reduces the influence of the external environment through efficient and accurate temperature control, improves the reaction efficiency and stability, saves energy, and reduces maintenance costs. These advantages make it have wide application prospects in the fields of biochemical reactions, especially nucleic acid detection, etc.

[0104] It should be noted that the specific devices in the non-contact liquid temperature control system in the pipeline disclosed in the second aspect of the application are consistent with the structure description in the non-contact liquid temperature control system in the pipeline disclosed in the first aspect of the application, so they will not be described here.

[0105] In the third aspect, the application discloses a chip reagent detection system, which comprises the non-contact liquid temperature control system in the pipeline, and can realize detection of different chip reagents at a controllable temperature.

[0106] In the description of the present specification, the description of the terms "one embodiment / way", "some embodiments / ways", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment / way or example are included in at least one embodiment / way or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment / way or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments / ways or examples. In addition, the skilled in the art can combine and combine the different embodiments / ways or examples described in the present specification and the features of the different embodiments / ways or examples without contradiction.

[0107] In addition, the terms "first", "second", etc. are used only for the purpose of description, and should not be understood as indicating or implying relative importance or a specific number of the technical features indicated. Thus, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly and specifically limited.

[0108] Those skilled in the art will understand that the above-mentioned embodiments are only for the purpose of clearly illustrating the present disclosure, and are not intended to limit the scope of the present disclosure. Other changes or modifications can be made on the basis of the above disclosure, and these changes or modifications are still within the scope of the present disclosure.

Claims

1. A non-contact in-line liquid temperature control system, comprising: include: Reagent supply device; The reaction apparatus includes interconnected reaction vessels and an injection pump; A fluid pipeline is provided between the reagent supply device and the reaction device, with one end of the fluid pipeline connected to the reagent supply device via a first fluid connector and the other end connected to the reaction device via a second fluid connector; A sealing device, comprising a sealing assembly sleeved on the outside of the fluid pipeline and a first connector and a second connector installed on the sealing assembly; A preset temperature gas supply device includes a temperature control device connected to the first connector via an air inlet pipe, a gas return device connected to the second connector, and a power device connected to the outlet of the gas return device via a connecting pipe. The air outlet of the power device is connected to the temperature control device via a connecting pipe.

2. The non-contact in-line fluid temperature control system of claim 1, wherein, The temperature control device includes a housing and, from bottom to top, a water-cooling component, a semiconductor refrigeration chip, and a temperature control reaction component arranged sequentially inside the housing. The open side of the box is covered with a cover plate; The water-cooling assembly includes a water-cooling plate, a first water-cooling interface and a second water-cooling interface disposed on the side of the water-cooling plate and penetrating the side wall of the housing, and the water-cooling plate has a plurality of flow channels; the first water-cooling interface and the second water-cooling interface are respectively connected to the water-cooling device through a first water-cooling pipe and a second water-cooling pipe; The temperature-controlled reaction assembly includes a temperature-controlled reaction plate, an air inlet located on the side of the temperature-controlled reaction plate and penetrating the side wall of the housing, a first air outlet, and a second air outlet; the bottom of the temperature-controlled reaction plate is fitted to the top of the semiconductor refrigeration chip.

3. The non-contact in-line fluid temperature control system of claim 2, wherein, The sealing assembly includes: The trachea has a first tube fitting and a second tube fitting installed at its two ends, respectively. The first tube connector has a first connection port, a second connection port and a first tube section that are interconnected. A first sealing gasket is installed inside the first connection port and the first connector is installed at the second connection port. The second tube fitting has a third connection port, a fourth connection port, and a second tube section that are interconnected. A second sealing gasket is installed inside the third connection port, and the second fitting is installed at the fourth connection port. The two ends of the trachea are respectively press-fitted into the first tube section and the second tube section.

4. The non-contact inline fluid temperature control system of claim 3, wherein, The first fluid connector is installed at the first end of the fluid pipeline; The second end of the fluid pipeline passes through the first sealing gasket, the first tube fitting, the air tube, the second sealing gasket, the second tube fitting, and connects to the second fluid fitting in sequence.

5. The non-contact inline fluid temperature control system of claim 4, wherein, The distance between the first fluid connector and the first tubing connector is no greater than 3mm, and the distance between the second fluid connector and the second tubing connector is no greater than 3mm.

6. The non-contact inline fluid temperature control system of claim 4, wherein, The inner diameter of the trachea is D1, and the outer diameter of the fluid conduit is D2, where 2 ≤ D1 / D2 ≤ 2.5; The distance from the first sealing gasket to the outer side of the first connection port is H1, and the distance from the second sealing gasket to the outer side of the second connection port is H2, where 0.2mm≤H1≤0.4mm; 0.2mm≤H2≤0.4mm; The length of the first pipe part is L1, the length of the second pipe part is L2, 6mm≤L1≤8mm; 6mm≤L2≤8mm.

7. The non-contact inline fluid temperature control system of claim 6, wherein, The fluid pipeline is provided with N, N, the fluid pipeline is independently provided; The pipe wrapping device is provided with N, N, the pipe wrapping device is respectively provided with N, the fluid pipeline corresponds; The gas backflow device is provided with N gas backflow ports and a gas outlet, N, the gas backflow port respectively communicates with the second joint in N, the pipe wrapping device; The gas outlet and the air inlet of the power device are communicated by pipeline.

8. The non-contacting in-line fluid temperature control system of claim 1, wherein, The length of the pipeline between the gas outlet of the temperature control device and the inlet of the first joint in the pipe wrapping device is not more than 15cm.

9. A non-contact in-line liquid temperature control system, comprising: Comprising: The sealing assembly is sleeved on the outside of the target fluid pipeline, and the first joint and the second joint are installed on the sealing assembly; The sealing assembly comprises an air pipe, and the two ends of the air pipe are respectively provided with a first pipe wrapping joint and a second pipe wrapping joint; The first pipe wrapping joint has a first connecting port, a second connecting port and a first pipe part which are in communication with each other, a first sealing gasket is installed in the first connecting port, and the first joint is installed on the second connecting port; The second pipe wrapping joint has a third connecting port, a fourth connecting port and a second pipe part which are in communication with each other, a second sealing gasket is installed in the third connecting port, and the second joint is installed on the fourth connecting port; The two ends of the air pipe are respectively in interference fit with the first pipe part and the second pipe part; The temperature control device communicated with the first joint through the air inlet pipeline, the temperature control device is used for providing cold air environment or hot air environment, so as to cool or heat the target fluid pipeline; The gas backflow device communicated with the second joint; The power device communicated with the outlet of the gas backflow device through the connecting pipe, and the air outlet of the power device is communicated with the temperature control device through the connecting pipe.

10. A chip reagent detection system, characterized by, The non-contact pipeline liquid temperature control system of any one of claims 1-8 or the non-contact pipeline liquid temperature control system of claim 9.

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