Circuit board electroplating device

Abstract

The utility model discloses a circuit board electroplating device which comprises a box body, a cover plate is rotatably connected to the top of the box body, an electric control device is fixedly connected to the outer wall of one end of the box body, supports are arranged at the two ends of the inner wall of the box body, a height adjusting mechanism is arranged between the supports and the box body, and a base is arranged at one end of each support. A movable connecting mechanism is arranged between the base and the support, and a plurality of springs are fixedly connected to the top of the base. By arranging the movable connecting mechanism, the bearing plate can rotate, a circuit board can be uniformly electroplated during electroplating, and the height adjusting mechanism arranged between the bracket and the box body is matched with the movable connecting mechanism, so that the bearing plate can be subjected to left-right height adjustment in the box body; and by arranging the drying treatment mechanism on the inner wall of the cover plate, the electroplated circuit board can be rapidly air-dried, and the electroplating effect is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating device technical field especially relates to a circuit board electroplating device. BACKGROUND

[0002] The management target of engineering project is to utilize controllable resources, to scientifically and rationally plan a given target under certain conditions, and to make real-time decision analysis with quantitative data information, to effectively dynamically adjust the engineering construction, and to strive to obtain the maximum benefit with the smallest input. The engineering project management system construction based on simulation technology adopts the MIS system platform mode based on B / S structure in overall design, which is a management system based on three-dimensional model entity, background data management and front-end interaction.

[0003] The utility model discloses a circuit board electroplating device, it includes main groove, auxiliary groove, the circulating water pipe of connecting main groove and auxiliary groove, the gas pipe that is located in main groove and is connected with gas supply device, and is located in the gas pipe a plurality of gas holes, main groove bottom is equipped with the buffer container that communicates with circulating water pipe, the lateral wall of buffer container is equipped with a plurality of liquid discharge holes, liquid discharge hole is opposite the lateral wall of main groove and sets up, but wherein only adopts the way of static soaking electroplating, it is difficult to carry out uniformity electroplating treatment to circuit board, in view of this, a kind of circuit board electroplating device is presented. UTILITY MODEL CONTENT

[0004] The utility model discloses a circuit board electroplating device to solve the shortcomings in prior art.

[0005] In order to achieve the above-mentioned purpose, the utility model discloses a technical scheme as follows:

[0006] A circuit board electroplating device, comprising a box body, a cover plate is rotatably connected to the top of the box body, an electric control device is fixedly connected to the outer wall of one end of the box body, supports are arranged on the inner walls of both ends of the box body, a height adjusting mechanism is arranged between the supports and the box body, a base is arranged at one end of the support, a movable connecting mechanism is arranged between the base and the support, a plurality of springs are fixedly connected to the top of the base, a bearing plate is fixedly connected to the top of the springs, a limiting mechanism is arranged on the top of the bearing plate, a liquid flushing electroplating mechanism is arranged on one side of the inner wall of the box body, and a drying treatment mechanism is arranged on the inner wall of the cover plate.

[0007] Preferably, the height adjusting mechanism comprises a first sliding block and a first motor, first sliding grooves are formed in the inner walls of both ends of the box body, the first sliding block is slidably connected to the first sliding grooves, a threaded screw rod is threadedly connected to the first sliding block, the top of the threaded screw rod is fixedly connected to the first motor, the first motor is fixedly connected to the box body, and the first sliding block is fixedly connected to the support.

[0008] Preferably, the movable connecting mechanism comprises a second motor and a device frame, the device frame is rotatably connected with the support, the second motor is fixedly connected with the inner wall of the device frame, and one end of the second motor is fixedly connected with the base.

[0009] Preferably, the limiting mechanism comprises a second sliding block and a limiting plate, the top of the bearing plate is provided with a second sliding groove, the second sliding block is slidably connected with the two ends of the inner wall of the second sliding groove, the second sliding block is threadedly connected with the double-threaded screw rod, the top of the second sliding block is fixedly connected with the limiting plate, the limiting plate is internally provided with a clamping plate, the top of the clamping plate is rotatably connected with a screw rod, and the screw rod is threadedly connected with the limiting plate.

[0010] Preferably, the drying treatment mechanism comprises a fan and an air outlet plate, the fan is fixedly connected with the top of the cover plate, the air outlet plate is fixedly connected with the inner wall of the cover plate, the air outlet plate is fixedly connected with the fan, the inner wall of the cover plate is fixedly connected with infrared heating lamps on the two sides, and the infrared heating lamps are electrically connected with the electric control equipment.

[0011] Preferably, the liquid flushing electroplating mechanism comprises a liquid guide plate and a liquid pumping pump, the bottom of the box body is fixedly connected with a bottom box, one end of the bottom box is fixedly connected with a liquid outlet pipe, the liquid pumping pump is fixedly connected with the inner wall of the bottom box, the liquid guide plate is fixedly connected with the inner wall of the box body on one side, a liquid guide pipe is fixedly connected between the liquid guide plate and the liquid pumping pump, and a plurality of liquid injection heads are fixedly connected with the outer wall of the liquid guide plate.

[0012] Preferably, a plurality of liquid conveying pipes are fixedly connected with the outer walls of the box body and the bottom box, a plurality of filter plates are arranged between the two ends of the liquid conveying pipe, and the filter plates are fixedly connected with the inner wall of the bottom box.

[0013] The utility model discloses a height adjusting mechanism is arranged between the support and the box body, and the movable connecting mechanism is arranged, so that the bearing plate can be adjusted in height left and right in the box body, and the uniformity of electroplating is further improved.

[0014] 1. The limiting mechanism arranged at the top of the bearing plate can limit and fix the circuit board, guarantee the stability of electroplating of the circuit board, the movable connecting mechanism can make the bearing plate have rotating capacity, the circuit board can be uniformly electroplated when electroplating, the height adjusting mechanism arranged between the support and the box body cooperates with the movable connecting mechanism, so that the bearing plate can be adjusted in height left and right in the box body, the uniformity of electroplating is further improved, the drying treatment mechanism arranged in the inner wall of the cover plate can promote the quick air drying of the circuit board after electroplating, and guarantee the electroplating effect.

[0015] 2. The liquid pumping pump is arranged, the electroplating solution in the bottom box is pumped into the liquid guide plate through the liquid guide pipe, and finally is sprayed out from the liquid injection head of the outer wall of the liquid guide plate, so that the circuit board in the box body is subjected to liquid electroplating treatment, the uniformity of electroplating is guaranteed, the electroplating solution is introduced into the bottom box through the liquid conveying pipe, the filter plates in the bottom box can filter the electroplating solution, and the recycling treatment is realized. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A kind of main body structure schematic diagram of circuit board electroplating device is proposed for the utility model;

[0017] Figure 2 A kind of back main body structure schematic diagram of circuit board electroplating device is proposed for the utility model;

[0018] Figure 3 A kind of section structure schematic diagram of circuit board electroplating device is proposed for the utility model;

[0019] Figure 4 A kind of bearing plate main body structure schematic diagram of circuit board electroplating device is proposed for the utility model.

[0020] In the drawing: 1 box, 2 air outlet plate, 3 infrared heating lamp, 4 cover plate, 5 electric control equipment, 6 liquid outlet pipe, 7 bottom box, 8 fan, 9 liquid guide pipe, 10 bearing plate, 11 base, 12 first sliding groove, 13 first motor, 14 threaded screw rod, 15 support, 16 first sliding block, 17 spring, 18 filter plate, 19 liquid injection head, 20 liquid pump, 21 liquid delivery pipe, 22 liquid guide plate, 23 second motor, 24 equipment rack, 25 clamping plate, 26 second sliding block, 27 bidirectional threaded screw rod, 28 through hole, 29 second sliding groove, 30 limit plate, 31 screw rod. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments.

[0022] WITH REFERENCE TO Figures 1-4The utility model discloses a circuit board electroplating device, including box 1, the top rotation is connected with the apron 4 of box 1, and the outer wall of one end of box 1 is fixedly connected with the electric control equipment 5, both ends of the inner wall of box 1 are provided with support 15, and the height adjusting mechanism is arranged between support 15 and box 1, and the bottom of support 15 is provided with base 11, and the movable connecting mechanism is arranged between base 11 and support 15, and a plurality of springs 17 are fixedly connected to the top of base 11, and the top of spring 17 is fixedly connected with the bearing plate 10, and the top of bearing plate 10 is provided with the limiting mechanism, and the inner wall of one side of box 1 is provided with the liquid washing electroplating mechanism, and the inner wall of apron 4 is provided with the drying treatment mechanism, and the limiting mechanism of bearing plate 10 top can be positioned and fixed to the circuit board, guarantees the stability of circuit board electroplating, and the movable connecting mechanism can make bearing plate 10 have the rotating ability, so that the circuit board can be evenly electroplated when being electroplated, and the height adjusting mechanism between support 15 and box 1 can make bearing plate 10 have the left and right height adjusting ability in box 1, further improves the uniformity of electroplating, and the drying treatment mechanism of apron 4 inner wall can promote the quick air drying of the circuit board after electroplating, guarantees the electroplating effect.

[0023] In the utility model, the height adjusting mechanism includes first sliding block 16 and first motor 13, and the both ends of the inner wall of box 1 are provided with first sliding slot 12, and first sliding block 16 is slidably connected with first sliding slot 12, and first sliding block 16 is threadedly connected with threaded lead screw 14, and the top of threaded lead screw 14 is fixedly connected with first motor 13, and first motor 13 is fixedly connected with box 1, and first sliding block 16 is fixedly connected with support 15, and the height adjusting mechanism between support 15 and box 1 can make bearing plate 10 have the left and right height adjusting ability in box 1, further improves the uniformity of electroplating by setting movable connecting mechanism;

[0024] The movable connecting mechanism includes second motor 23 and equipment rack 24, and equipment rack 24 is rotatably connected with support 15, and second motor 23 is fixedly connected with the inner wall of equipment rack 24, and second motor 23 is fixedly connected with one end of base 11, and the movable connecting mechanism can make bearing plate 10 have the rotating ability, so that the circuit board can be evenly electroplated when being electroplated;

[0025] The limiting mechanism includes second sliding block 26 and limiting plate 30, and the top of bearing plate 10 is provided with second sliding slot 29, and the both ends of the inner wall of second sliding slot 29 are slidably connected with second sliding block 26 respectively, and second sliding block 26 is threadedly connected with bidirectional threaded lead screw 27, and the top of second sliding block 26 is fixedly connected with limiting plate 30, and the inside of limiting plate 30 is provided with clamping plate 25, and the top of clamping plate 25 is rotatably connected with screw rod 31, and screw rod 31 is threadedly connected with limiting plate 30, and the limiting mechanism of bearing plate 10 top can be positioned and fixed to the circuit board, guarantees the stability of circuit board electroplating;

[0026] The drying treatment mechanism comprises a fan 8 and an air outlet plate 2, the fan 8 is fixedly connected to the top of the cover plate 4, the air outlet plate 2 is fixedly connected to the inner wall of the cover plate 4, the air outlet plate 2 is fixedly connected to the fan 8, the inner wall of the cover plate 4 is fixedly connected with infrared heating lamps 3 on both sides, the infrared heating lamps 3 are electrically connected with the electric control device 5, the drying treatment mechanism arranged on the inner wall of the cover plate 4 can promote the fast air drying of the circuit board after electroplating, and the electroplating effect is ensured.

[0027] The liquid flushing electroplating mechanism comprises a liquid guide plate 22 and a liquid pumping pump 20, the bottom box 7 is fixedly connected to the bottom of the box body 1, the liquid outlet pipe 6 is fixedly connected to one end of the outer wall of the bottom box 7, the liquid pumping pump 20 is fixedly connected to the inner wall of the bottom box 7, the liquid guide plate 22 is fixedly connected to one side of the inner wall of the box body 1, the liquid guide pipe 9 is fixedly connected between the liquid guide plate 22 and the liquid pumping pump 20, the liquid guide plate 22 is fixedly connected with a plurality of liquid spraying heads 19 on the outer wall, a plurality of liquid conveying pipes 21 are fixedly connected to the outer wall of the box body 1 and the bottom box 7, a plurality of filter plates 18 are arranged between the two ends of the liquid conveying pipe 21, the filter plates 18 are fixedly connected to the inner wall of the bottom box 7, the electroplating liquid in the bottom box 7 is pumped into the liquid guide plate 22 through the liquid guide pipe by the liquid pumping pump 20, and finally sprayed out from the liquid spraying heads 19 on the outer wall of the liquid guide plate 22, so that the circuit board in the box body 1 is subjected to liquid spraying electroplating treatment, the uniformity of electroplating is ensured, the electroplating liquid is guided into the bottom box 7 through the liquid conveying pipe 21, and the filter plates 18 in the bottom box 7 can filter the electroplating liquid, so that the electroplating liquid is recycled.

[0028] Working principle: in the idle place of the device, all the components are connected, the specific connection means should be referred to the working principle, the order of the components is completed, the detailed connection means is the public technical knowledge, the working principle and process are mainly introduced, the circuit board is fixed by the limiting mechanism arranged on the top of the bearing plate 10, the stability of the circuit board is ensured, the movable connection mechanism is arranged, the bearing plate 10 has the rotating ability, the circuit board can be uniformly electroplated, the height adjusting mechanism between the support 15 and the box body 1 is arranged, the movable connection mechanism is matched, the bearing plate 10 can be adjusted in height in the box body 1, the uniformity of electroplating is further improved, the drying treatment mechanism arranged on the inner wall of the cover plate 4 can promote the fast air drying of the circuit board after electroplating, and the electroplating effect is ensured.

[0029] The above is only a preferred specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the technical field according to the technical scheme and the utility model concept of the utility model within the disclosed technical range can make equivalent replacement or change, which should be covered in the protection scope of the utility model.

Claims

1. A circuit board electroplating apparatus, comprising a housing (1), wherein a cover plate (4) is rotatably connected to the top of the housing (1), and an electrical control device (5) is fixedly connected to the outer wall of one end of the housing (1), characterized in that, The inner wall of the box (1) is provided with brackets (15) at both ends. A height adjustment mechanism is provided between the brackets (15) and the box (1). A base (11) is provided at one end of the bracket (15). A movable connection mechanism is provided between the base (11) and the bracket (15). Multiple springs (17) are fixedly connected to the top of the base (11). A bearing plate (10) is fixedly connected to the top of the springs (17). A limit mechanism is provided on the top of the bearing plate (10). A flushing electroplating mechanism is provided on one side of the inner wall of the box (1). A drying treatment mechanism is provided on the inner wall of the cover plate (4).

2. The circuit board electroplating apparatus according to claim 1, characterized in that, The height adjustment mechanism includes a first slider (16) and a first motor (13). The inner walls of the housing (1) are provided with first grooves (12) at both ends. The first slider (16) and the first grooves (12) are slidably connected. The first slider (16) is threadedly connected to a threaded screw (14). The top of the threaded screw (14) is fixedly connected to the first motor (13). The first motor (13) is fixedly connected to the housing (1). The first slider (16) is fixedly connected to the bracket (15).

3. The circuit board electroplating apparatus according to claim 1, characterized in that, The movable connection mechanism includes a second motor (23) and an equipment frame (24). The equipment frame (24) and the support (15) are rotatably connected. The second motor (23) and the inner wall of the equipment frame (24) are fixedly connected. The second motor (23) and one end of the base (11) are fixedly connected.

4. The circuit board electroplating apparatus according to claim 1, characterized in that, The limiting mechanism includes a second slider (26) and a limiting plate (30). A second groove (29) is provided on the top of the bearing plate (10). The second slider (26) is slidably connected to both ends of the inner wall of the second groove (29). The second slider (26) is threadedly connected to a bidirectional threaded screw (27). The top of the second slider (26) is fixedly connected to the limiting plate (30). A clamping plate (25) is provided inside the limiting plate (30). A screw (31) is rotatably connected to the top of the clamping plate (25). The screw (31) is threadedly connected to the limiting plate (30).

5. The circuit board electroplating apparatus according to claim 1, characterized in that, The drying mechanism includes a fan (8) and an air outlet plate (2). The fan (8) and the top of the cover plate (4) are fixedly connected. The air outlet plate (2) and the inner wall of the cover plate (4) are fixedly connected. The air outlet plate (2) and the fan (8) are fixedly connected. Infrared heating lamps (3) are fixedly connected to both sides of the inner wall of the cover plate (4). The infrared heating lamps (3) and the electrical control equipment (5) are electrically connected.

6. The circuit board electroplating apparatus according to claim 1, characterized in that, The electroplating mechanism includes a liquid guide plate (22) and a liquid pump (20). A bottom box (7) is fixedly connected to the bottom of the box (1). A liquid outlet pipe (6) is fixedly connected to the outer wall of one end of the bottom box (7). The liquid pump (20) is fixedly connected to the inner wall of the bottom box (7). The liquid guide plate (22) is fixedly connected to one side of the inner wall of the box (1). A liquid guide pipe (9) is fixedly connected between the liquid guide plate (22) and the liquid pump (20). Multiple spray nozzles (19) are fixedly connected to the outer wall of the liquid guide plate (22).

7. The circuit board electroplating apparatus according to claim 6, characterized in that, Multiple infusion tubes (21) are fixedly connected to the outer walls of the box (1) and the bottom box (7). Multiple filter plates (18) are provided between the two ends of the infusion tubes (21), and the filter plates (18) are fixedly connected to the inner wall of the bottom box (7).

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