Handle, vehicle door and vehicle

Abstract

The embodiment of the utility model relates to the technical field of vehicle control, and discloses a handle, a vehicle door and a vehicle. At least one semiconductor array is arranged in the handle provided by the invention. The semiconductor array includes a plurality of types of semiconductor sheets. Wherein the power of the semiconductor chips of different types is different. The semiconductor chips with different powers are arranged in the handle, so that the temperature of the handle is controlled, and energy conservation and efficiency improvement are realized on the basis of ensuring the temperature control effect.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of vehicle control, and in particular to a handle, a vehicle door and a vehicle. BACKGROUND

[0002] With the rapid development of the automobile industry and the continuous improvement of people's living standards, automobiles have not only become a means of transportation, but also an indispensable part of modern life. As the part that users contact most frequently, the use experience of the door handle will directly affect the overall experience of users. Therefore, how to improve the user experience of the handle has become a problem to be solved. CONTENT OF THE UTILITY MODEL

[0003] In view of this, embodiments of the present application provide a handle, a vehicle door and a vehicle to realize temperature control of the door handle and improve user experience.

[0004] To achieve the above purpose, the technical scheme of the embodiments of the present application is as follows:

[0005] In a first aspect, the embodiments of the present application provide a handle, the inside of the handle is provided with at least one semiconductor array.

[0006] The semiconductor array includes a plurality of types of semiconductor sheets; wherein the power of different types of semiconductor sheets is different.

[0007] The present application realizes the energy saving effect in the handle temperature control process by setting semiconductor sheets with different powers in the handle.

[0008] Optionally, the semiconductor array includes a plurality of distribution regions; the distribution regions include at least one type of semiconductor sheet; different distribution regions correspond to different position regions on the handle.

[0009] The present application realizes the distribution setting of semiconductor sheets with different powers by setting different distribution regions on the semiconductor array, and realizes the energy saving effect in the handle temperature control process.

[0010] Optionally, the plurality of distribution regions includes a first distribution region, a second distribution region, a third distribution region and a fourth distribution region.

[0011] The first distribution region corresponds to the grip region of the handle; the second distribution region corresponds to the button region of the handle; the third distribution region corresponds to the edge region of the handle; the fourth distribution region corresponds to other regions of the handle; the other regions are regions except the first distribution region, the second distribution region and the third distribution region.

[0012] The application improves the control efficiency and user experience in the temperature control process by corresponding different distribution areas arranged on the semiconductor array with different areas of the handle.

[0013] Optionally, at least one semiconductor sheet of a first power and at least one semiconductor sheet of a second power are arranged on the first distribution area.

[0014] The first power is less than the second power.

[0015] The application realizes the guarantee of the user touch temperature by arranging the semiconductor sheets of the first power and the second power on the first distribution area.

[0016] Optionally, the semiconductor sheets of the first power and the semiconductor sheets of the second power are arranged alternately on the first distribution area.

[0017] The application realizes the guarantee of the user touch temperature by arranging the semiconductor sheets of the first power and the second power alternately on the first distribution area, and further improves the user experience.

[0018] Optionally, at least one semiconductor sheet of a second power is arranged on the second distribution area.

[0019] The application realizes the guarantee of the user touch temperature by arranging the semiconductor sheets of the second power on the second distribution area.

[0020] Optionally, at least one semiconductor sheet of a third power and at least one semiconductor sheet of a third power are arranged on the third distribution area.

[0021] The application realizes the ice-breaking efficiency and the rapid cooling, and improves the temperature control efficiency by arranging the semiconductor sheets of the third power on the third distribution area.

[0022] Optionally, at least one semiconductor sheet of a first power is arranged on the fourth distribution area.

[0023] The application realizes the temperature control while reducing the energy consumption by arranging the semiconductor sheets of the first power on the fourth distribution area.

[0024] Optionally, a ceramic sheet is arranged on one side of the semiconductor sheet, and the ceramic sheet is tightly attached to the inner surface of the handle.

[0025] The application guarantees the temperature conduction and insulation effect by controlling the direction of the semiconductor sheet.

[0026] Optionally, at least one temperature sensor is arranged on the distribution area of the semiconductor array.

[0027] The temperature sensor is arranged between the ceramic sheet on the surface of the semiconductor sheet and the inner surface of the handle.

[0028] The present application realizes the acquisition of the surface temperature of the handle by setting a temperature sensor, thereby realizing automatic control and improving user experience.

[0029] Optionally, when including one semiconductor array, the semiconductor array is arranged on the inner surface of the first side surface of the handle.

[0030] The present application realizes the main function of handle temperature control by setting a semiconductor sheet on the outside of the handle, thereby improving user experience.

[0031] Optionally, when including two semiconductor arrays, one semiconductor array is arranged on the inner surface of the first side surface of the handle, and the other semiconductor array is arranged on the inner surface of the second side surface of the handle.

[0032] The present application realizes the function of handle temperature control by setting semiconductor sheets on the inner and outer sides of the handle, thereby further improving user experience.

[0033] Optionally, the inside of the handle is further provided with at least one heat conduction module, and the inside of the handle is provided with a heat exchange channel; the heat exchange channel is connected with the heat conduction module.

[0034] The present application further improves the effect of handle temperature control by setting a heat conduction module.

[0035] In a second aspect, the embodiments of the present application provide a vehicle door, wherein the vehicle door is provided with the handle as in the first aspect and any design of the first aspect.

[0036] In a third aspect, the embodiments of the present application provide a vehicle, wherein the vehicle is provided with the vehicle door as in the second aspect and any design of the second aspect. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 A structural schematic diagram of the handle provided by the embodiments of the present application;

[0038] Figure 2 A structural schematic diagram of the semiconductor array provided by the embodiments of the present application;

[0039] Figure 3 A structural schematic diagram of the handle provided by the embodiments of the present application;

[0040] Figure 4 An implementation flowchart of the semiconductor array provided by the embodiments of the present application;

[0041] Figure 5 An implementation flowchart of the temperature control method provided by the embodiments of the present application;

[0042] Figure 6A flowchart of the heating method of the semiconductor array of the first side provided in the embodiments of the present application is shown in FIG. 1.

[0043] Figure 7 A flowchart of the heating method of the semiconductor array of the second side provided in the embodiments of the present application is shown in FIG. 2.

[0044] Figure 8 A flowchart of the cooling method of the semiconductor array of the first side provided in the embodiments of the present application is shown in FIG. 3.

[0045] Figure 9 A flowchart of the cooling method of the semiconductor array of the second side provided in the embodiments of the present application is shown in FIG. 4.

[0046] Figure 10 An execution flowchart of state 1 provided in the embodiments of the present application is shown in FIG. 5.

[0047] Figure 11 An execution flowchart of state 2 provided in the embodiments of the present application is shown in FIG. 6.

[0048] Figure 12 An execution flowchart of state 3 provided in the embodiments of the present application is shown in FIG. 7.

[0049] Figure 13 An execution flowchart of state 4 provided in the embodiments of the present application is shown in FIG. 8.

[0050] Reference signs:

[0051] 100: handle; 110: semiconductor array; 111: semiconductor sheet; 120: ceramic sheet; 130: temperature sensor; 140: heat conduction module. DETAILED DESCRIPTION

[0052] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the specific technical solutions of the present application will be further described below with reference to the drawings in the embodiments of the present application. The following embodiments are used to explain the present application, but not to limit the scope of the present application.

[0053] In the embodiments of the present application, the terms "first" and "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0054] In addition, in the embodiments of the present application, the orientation terms such as "upper", "lower", "left" and "right" are defined relative to the orientation in which the components in the drawings are placed, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation in which the components in the drawings are placed.

[0055] In the embodiments of the present application, unless specifically defined and limited otherwise, the term "connection" should be understood in a broad sense, for example, the "connection" can be fixed connection, or detachable connection, or integral; can be directly connected, or indirectly connected through an intermediate medium.

[0056] In the embodiments of the present application, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or apparatus including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article or apparatus. Without more limitations, the element defined by the sentence "including a" does not exclude the presence of other identical elements in the process, method, article or apparatus including the element.

[0057] In the embodiments of the present application, the word "exemplary" or "for example" is used to mean serving as an example, instance or illustration. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or advantageous than other embodiments or design schemes. Rather, the word "exemplary" or "for example" is used to present relevant concepts in a concrete manner.

[0058] The embodiments of the present application provide a vehicle. It should be noted that the vehicle in the present application can refer to a large car, a small car, a special car and the like. For example, according to the vehicle type, the car in the present application can be a sedan type, can be a sport utility vehicle (SUV) type, can be a multi-purpose vehicle (MPV) type or other types. The vehicle described in the present application is provided with at least one door. The appearance, size, position and the like of the door are not limited in the present application. The user can enter the vehicle interior when the door is opened. The user can also close and lock the door after leaving the vehicle. The user can also drive the vehicle after closing the door.

[0059] This application provides a vehicle door. The vehicle door in this application is a door installed on a vehicle. The door can be installed in any location on the vehicle. For example, the door can be a driver's seat door, a cabin door, a truck / container door, etc. This application does not limit the type of vehicle. It should be noted that the vehicle door of this application may be provided with a handle 100. This application does not limit the appearance of the handle 100. Users can open and close the vehicle door by pulling the handle 100.

[0060] Based on this, refer to Figure 1 The handle 100 provided in this application embodiment can be as follows: Figure 1 As shown, the handle 100 has at least one semiconductor array 110 disposed inside. Optionally, the semiconductor array 110 may be as follows: Figure 1 The rectangle is filled with a grid. The semiconductor array 110 includes various types of semiconductor chips 111. Different types of semiconductor chips 111 have different power ratings. These semiconductor chips 111 can be used to implement heating or cooling functions. By controlling the multiple semiconductor chips 111 in the semiconductor array 110 inside the handle 100, the handle 100 can achieve heating or cooling functions, thus maintaining a suitable temperature in high or low environments and improving the user experience when opening or closing doors using the handle 100.

[0061] Based on this, refer to Figure 2 The semiconductor array 110 provided in this application embodiment can be as follows: Figure 2 As shown. Figure 2 The diagram shows a 5*10 semiconductor array 110. In practical use, the size of this semiconductor array 110 can be determined based on the size of the handle 100 and the size of the semiconductor chip 111.

[0062] Optionally, the semiconductor array 110 can be specifically divided into multiple distribution regions. Each distribution region may include at least one type of semiconductor wafer 111. Furthermore, different distribution regions may include different types of semiconductor wafers 111, or combinations of different types of semiconductor wafers 111. These different distribution regions may correspond to different location regions on the handle 100.

[0063] Optionally, the handle 100 comprises at least a hand holding area. Whether it is an early door that needs a key to open, or a door provided with an induction device now, the handle 100 of the door has a hand holding area. The user holds the hand holding area to open and close the door. Optionally, the semiconductor array 110 can be provided with a first distribution area corresponding to the hand holding area of the handle 100. The semiconductor array 110 can cool the hand holding area when the temperature of the hand holding area is too high, or the semiconductor array 110 can heat the hand holding area when the temperature of the hand holding area is too low, so as to ensure that the temperature of the hand holding area is suitable when the user holds the hand holding area to open the door. Optionally, the first distribution area is provided with at least one semiconductor sheet 111 of a first power and at least one semiconductor sheet 111 of a second power. Optionally, the first power can be less than the second power.

[0064] Optionally, the first distribution area can be as shown in the area filled with vertical lines in the following figure. Figure 2 Optionally, the first distribution area can be as shown in the area filled with vertical lines in the following figure.

[0065] Optionally, the handle 100 can further comprise a button area. Optionally, the button area can be an actual button, or the button area can also be an induction area provided with an icon on the handle 100. Optionally, the button area usually needs to be touched or pressed by the user's finger to realize the interaction behavior. Optionally, the semiconductor array 110 can be provided with a second distribution area corresponding to the button area of the handle 100. The semiconductor array 110 can cool the button area when the temperature of the button area is too high, or the semiconductor array 110 can heat the button area when the temperature of the button area is too low, so as to ensure that the temperature of the button area is suitable when the user's finger touches the button area. Optionally, the second distribution area is provided with at least one semiconductor sheet 111 of a second power. Optionally, the second distribution area can be as shown in the following figure. Figure 2The third distribution area is shown as a region composed of a plurality of semiconductor pieces 111 filled with diagonal lines. The third distribution area corresponds to the edge region of the handle 100. The semiconductor pieces 111 in the third distribution area can cool the button region when the temperature of the edge region of the handle 100 is too high, or the semiconductor pieces 111 in the third distribution area can heat the edge region of the handle 100 when the temperature of the edge region of the handle 100 is too low or even frozen, so as to ensure that the user can normally use the handle 100 and the temperature of the edge region of the handle 100 is appropriate. Optionally, the third distribution area is provided with at least one semiconductor piece 111 with a third power. Optionally, the third power is greater than the second power. Optionally, the third distribution area can be a region composed of a plurality of semiconductor pieces 111 filled with diagonal lines. Optionally, the third distribution area is an edge region of the semiconductor array 110. Figure 2 The second distribution area is shown as a rectangular frame filled with horizontal lines.

[0066] Optionally, when the handle 100 of the vehicle is an embedded handle 100, the handle 100 may be frozen and unable to pop out in cold conditions. Further, the inability to pop out the handle 100 will result in the inability to open the vehicle door. Therefore, the semiconductor array 110 can be provided with a third distribution area corresponding to the edge region of the handle 100. The semiconductor array 110 can cool the button region when the temperature of the edge region of the handle 100 is too high, or the semiconductor array 110 can heat the edge region of the handle 100 when the temperature of the edge region of the handle 100 is too low or even frozen, so as to ensure that the user can normally use the handle 100 and the temperature of the edge region of the handle 100 is appropriate. Optionally, the third distribution area is provided with at least one semiconductor piece 111 with a third power. Optionally, the third power is greater than the second power. Optionally, the third distribution area can be a region composed of a plurality of semiconductor pieces 111 filled with diagonal lines. Optionally, the third distribution area is an edge region of the semiconductor array 110.

[0067] Optionally, the regions of the semiconductor array 110 except the first distribution area, the second distribution area and the third distribution area can be a fourth distribution area. Optionally, the fourth distribution area can be provided with at least one semiconductor piece 111 with the first power. Optionally, the fourth distribution area can be shown as a region composed of a plurality of semiconductor pieces 111 without filling in FIG. 4B. Figure 2 Optionally, the fourth distribution area can be shown as a region composed of a plurality of semiconductor pieces 111 without filling in FIG. 4B. The fourth distribution area corresponds to other regions of the handle. The other regions are the regions except the first distribution area, the second distribution area and the third distribution area.

[0068] On this basis, referring to Figure 3 The handle 100 provided by the embodiments of the present application can further be provided with a porcelain tile 120 on one side of each semiconductor piece 111. The porcelain tile 120 is tightly attached to the inner surface of the handle 100. Specifically, the porcelain tile 120 is used to realize the conduction of the temperature of the semiconductor piece 111 and further isolate the semiconductor piece 111 from the inner surface of the handle 100. Optionally, the position of the porcelain tile 120 can be shown as a rectangular frame filled with checkers in FIG. 4B. Optionally, the porcelain tile 120 can be a part of the semiconductor piece 111. When the porcelain tile 120 is a part of the semiconductor piece 111, the semiconductor piece 111 is placed with the inner surface of the handle 100 facing away and the outer porcelain tile 120 tightly attached to the inner surface of the handle. Figure 3

[0069] ​Optionally, when including one semiconductor array 110, the semiconductor array 110 is arranged on the inner surface of the first side surface of the handle 100. Optionally, the first side surface can be the outer side surface of the handle. That is, the outer side of the first side surface faces outward of the vehicle. Optionally, when including two semiconductor arrays 110, one semiconductor array 110 is arranged on the inner surface of the first side surface of the handle 100, and the other semiconductor array 110 is arranged on the inner surface of the second side surface of the handle 100. Optionally, the second side surface is the outer side surface of the handle. That is, the outer side of the second side surface faces inward of the vehicle. Optionally, the interior of the handle 100 is further provided with at least one heat conduction module 140. And the interior of the handle 100 is provided with a heat exchange channel. The heat conduction module 140 can be connected with the heat exchange channel, and the output of the waste heat / waste cold conducted by the heat conduction module 140 is realized. Optionally, the heat conduction module can be copper.

[0070] Optionally, at least one temperature sensor 130 can also be arranged on the distribution area of the semiconductor array 110; the temperature sensor 130 can be arranged between the ceramic sheet 120 on one side of the semiconductor sheet 111 and the inner surface of the handle 100. Optionally, the temperature sensor 130 is in direct contact with the handle 100. The temperature sensor is used to obtain the temperature of the surface of the handle 100.

[0071] The temperature sensor 130 can be locally arranged in each distribution area as shown in the following figure. Figure 4 Optionally, in the first distribution area, one temperature sensor 130 can be arranged at the center position. Optionally, in the second distribution area, one temperature sensor 130 can be arranged at the center position. Optionally, in the third distribution area, a plurality of temperature sensors 130 can be arranged at intervals. Optionally, since the fourth distribution area is an area other than the first distribution area, the second distribution area and the third distribution area, the fourth distribution area can not be a whole. Therefore, for the fourth distribution area, at least one temperature sensor 130 can be arranged for each connected area.

[0072] On the basis of the above-mentioned embodiments, the handle used in the present application can realize temperature control through the semiconductor array, and can also realize temperature control with different powers for different distribution areas to improve user experience. In addition, in the present application, the use of the semiconductor array can realize the heating and cooling of the handle by changing the direction of the current, which can quickly and accurately control the temperature while being low in cost.

[0073] Based on the handle, the vehicle door and the vehicle in the above-mentioned embodiments, the present application can also realize the function of realizing zoned linkage control according to different scenes by connecting the components such as the semiconductor array and the temperature sensor in the handle with the vehicle machine, so as to realize better temperature control and energy consumption control and improve user experience.

[0074] Specifically, the semiconductor array can access the vehicle machine through the CAN, and a function switch button is set on the central control screen and the user terminal. The function switch button can realize the separate opening of the temperature control of the door handle. Alternatively, the temperature control of the door handle can also be linked with the existing functions such as rapid cooling / rapid heating / one-key vehicle preparation in the vehicle to start. The user can realize the temperature control of the door handle on the central control screen of the vehicle or the user terminal. Alternatively, the user can also select one or more door handles that need to be temperature controlled. It should be noted that when the temperature control function of the door handle is in the off state, the user will not be able to control the door handle through the central control screen or the user terminal. The user needs to manually turn on the temperature control function of the door handle first. The setting of this function can enhance the user's sense of technology and provide the user with a more perfect intelligent vehicle experience.

[0075] Specifically, the temperature sensor can transmit the temperature signal to the controller in real time through the CAN bus. The controller can control the temperature of the handle and automatically adjust according to the temperature transmitted by the temperature sensor. The controller can also obtain the handle surface temperature after adjustment in real time through the temperature sensor.

[0076] Specifically, the process of the controller controlling the semiconductor array to heat or cool the handle and adjusting the temperature through the temperature sensor can be as shown in the following steps. Figure 5

[0077] S101, the controller obtains the temperature control instruction sent by the central control screen or the user terminal.

[0078] S102, the controller executes heating or executes refrigeration according to the temperature control instruction, and stops heating when the heating is completed, or stops refrigeration after the refrigeration is completed.

[0079] S103, the controller can also end the temperature control according to the instruction sent by the central control screen or the user terminal. Alternatively, the controller can end the temperature control in response to the user's opening operation.

[0080] In S102, the controller can use different control strategies for the semiconductor arrays arranged on the first side and the second side. Alternatively, the first side can be the outer side of the door handle. The outer side of the handle can be controlled differently according to different scenes. In this embodiment, full-power function states: state 1, state 3 and regular states: state 2, state 4 can be set. State 1 is particularly applied to the situation of remote opening of heating detection and ice breaking of the handle. State 3 is particularly applied to the situation of remote and central control opening of cooling when the external temperature is too high. State 2 is applied to the ordinary heating situation, and state 4 is applied to the ordinary refrigeration situation.

[0081] ​When the heating is remotely started, if the temperature outside the handle is lower than 0℃, the door handle first performs a "try to push out" determination, if it is successful, the thermoelectric module enters state 2 heating; if it is not successful, the thermoelectric module enters state 1 and starts full power heating, in this state, a "try to push out" state determination is performed every 2 minutes, if it is successful, the user is notified by the mobile phone app that the ice breaking of the door handle is completed, and at the same time, state 1 is exited and state 2 continues to heat until the state 2 exit condition is met, and the heating is stopped. For this process, the specific process of the heating control of the semiconductor array arranged on the first side can be as shown in Figure 6 , including the following steps:

[0082] S201, control starts to execute heating.

[0083] S202, the controller determines whether it is a remote instruction. If yes, execute S203, if no, execute S207.

[0084] S203, the controller determines whether the handle temperature is lower than 0 degrees according to the detection result of the temperature sensor. If yes, execute S204. If no, execute S207.

[0085] S204, the controller tries to push out the handle.

[0086] S205, the controller determines whether the handle is successfully pushed out. If yes, execute S208. If no, execute S206.

[0087] S206, the controller enters state 1 heating, and returns to step S204 after completing state 1 heating.

[0088] S207, the controller enters state 2 heating. And after completing state 2 heating, continue to execute step S209.

[0089] S208, the controller remotely notifies the user of the completion of ice breaking, and continues to execute S207.

[0090] S209, the controller executes S210 when the exit condition of state 2 is met.

[0091] S210, stop heating.

[0092] The second side is the inside of the door handle. The controller can control the inside of the handle according to the temperature sensor. After starting heating, if the temperature inside the handle is greater than 10℃ at this time, the waiting state is maintained, and when the temperature of the door handle is lower than 10℃, the heating is started. If the waiting time exceeds 15 minutes, the heating is ended and the user is prompted that the heating has ended. According to the above process, the specific process of the heating control of the semiconductor array arranged on the second side can be as shown in Figure 7 , including the following steps:

[0093] S301, the controller starts to execute heating.

[0094] S302, the controller judges whether the handle temperature is less than 10 degrees. If yes, S306 is executed. If no, S303 is executed.

[0095] S303, the controller waits for a first duration. Optionally, the first duration can be 15 minutes.

[0096] S304, the controller judges whether the duration reaches the first duration. If yes, S305 is executed. If no, S302 is returned.

[0097] S305, the controller stops heating.

[0098] S306, the control starts heating.

[0099] S307, the controller judges whether the handle temperature reaches 20 degrees. If no, S304 is returned. If yes, S305 is executed.

[0100] Wherein, the first side is the handle outer side. If the handle outer side > 40℃, the thermoelectric module enters state 3 to start full-power refrigeration until the user's frequently touched position temperature < 30℃, exits state 3 to enter state 4 to continue refrigeration until the state 4 exit condition is met, and the refrigeration is stopped. For the above process, the semiconductor array provided on the first side, the specific process of the refrigeration control can be as shown in Figure 8 , including the following steps:

[0101] S401, the control starts to execute refrigeration.

[0102] S402, the controller judges whether the handle temperature is greater than 40 degrees. If no, S403 is executed. If yes, S405 is executed.

[0103] S403, the controller enters state 4 to refrigerate.

[0104] S404, the state 4 exit condition is met, and the controller stops refrigeration.

[0105] S405, enter state 3 to refrigerate.

[0106] S406, the controller judges whether the handle temperature is less than 30 degrees. If yes, S403 is executed. If no, S405 is returned.

[0107] The second side is the inner side of the handle. After the refrigeration is started, if the temperature of the inner side of the handle is less than 30℃ at this time, the waiting state is kept, and the refrigeration is started when the temperature of the door handle is greater than 30℃. If the waiting time exceeds 15 minutes, the refrigeration at this time is ended and the user is prompted that the refrigeration has ended. According to the above process, the specific process of the refrigeration control of the semiconductor array arranged on the second side can be as shown in the following table. Figure 9

[0108] S501, the controller starts to execute the refrigeration.

[0109] S502, the controller judges whether the temperature of the handle is greater than 30 degrees. If yes, S506 is executed. If no, S503 is executed.

[0110] S503, the controller waits for a first duration. Optionally, the first duration can be 15 minutes.

[0111] S504, the controller judges whether the duration reaches the first duration. If yes, S505 is executed. If no, S502 is returned.

[0112] S505, the controller stops the heating.

[0113] S506, the control starts to heat.

[0114] S507, the controller judges whether the temperature of the handle reaches 20 degrees. If no, S504 is returned. If yes, S505 is executed.

[0115] The execution process of the above state 1 can specifically include the following steps as shown in the following table. Figure 10

[0116] S601, state 1 is entered.

[0117] S602, the semiconductor sheet continuously heats.

[0118] S603, the handle is tried to be pushed out. If the pushing out is successful, S604 is executed. If the pushing out fails, S602 is returned.

[0119] S604, state 1 is exited.

[0120] The execution process of the above state 2 can specifically include the following steps as shown in the following table. Figure 11

[0121] S701, state 2 is entered. If the temperature of the outer side of the handle is greater than 0℃, the thermoelectric module enters state 2.

[0122] S702, it is judged whether the duration of the second state reaches 15 minutes. If yes, S706 is executed. If no, S703 is executed.​​​

[0123] S703, judge whether the handle temperature is greater than 10 degrees. If yes, execute S707. If no, execute S704.

[0124] S704, judge whether the hand holding area temperature is greater than 10 degrees. If yes, execute S705. If no, execute S708.

[0125] S705, the first power semiconductor piece continues to heat, the third power semiconductor piece intermittently works. And return to S702. When the door handle user common touch position temperature <10℃, low power, medium power semiconductor continues to heat, while the high power semiconductor piece intermittently works.

[0126] S706, exit state 2. If the duration exceeds 15 minutes, end this heating and prompt the user that the heating has ended.

[0127] S707, the first power semiconductor piece works intermittently at low frequency. And return to S702. If the door handle temperature is all >10℃ at this time, the low power semiconductor works intermittently at low frequency to maintain the handle temperature.

[0128] S708, the first power semiconductor piece works intermittently at high frequency, the second power semiconductor piece and the third power semiconductor piece work intermittently. And return to S702. When the common touch position temperature >10℃ but there is a position temperature <10℃, the low power semiconductor works intermittently at high frequency, the medium power and high power semiconductor work intermittently.

[0129] The execution flow of the above-mentioned state 3 can be as shown in Figure 12 , and specifically includes the following steps:

[0130] S801, enter state 3.

[0131] S802, the semiconductor piece continues to cool.

[0132] S803, judge whether the hand holding area temperature is less than 30 degrees. If yes, execute S804. If no, return to S802.

[0133] S804, exit state 3.

[0134] The execution flow of the above-mentioned state 4 can be as shown in Figure 13 , and specifically includes the following steps:

[0135] S901, enter state 4. If the handle outside temperature is all <40℃, the thermoelectric module enters state 4.

[0136] S902, judge whether the second state duration reaches 15 minutes. If yes, execute S906. If no, execute S903.

[0137] S903, determine whether the handle temperature is less than 30 degrees. If yes, execute S907. If no, execute S904.

[0138] S904, determine whether the hand holding area temperature is less than 30 degrees. If yes, execute S905. If no, execute S908.

[0139] S905, the first power semiconductor piece, the second power semiconductor piece continuously cools, and the third power semiconductor piece intermittently works. And return to S902. If the user's frequently touched position temperature of the door handle is greater than 30 degrees Celsius, the low-power semiconductor and the medium-power semiconductor continuously cool, and the high-power semiconductor intermittently works.

[0140] S906, exit state 4. If the duration exceeds 15 minutes, end this cooling and prompt the user that the cooling has ended.

[0141] S907, the first power semiconductor piece intermittently works at low frequency. And return to S902. If the door handle temperature is less than 30 degrees Celsius at this time, the low-power semiconductor intermittently works at low frequency to maintain the handle temperature.

[0142] S908, the first power semiconductor piece intermittently works at high frequency, the second power semiconductor piece and the third power semiconductor piece intermittently work. And return to S902. When the frequently touched position temperature is less than 30 degrees Celsius but there is a position temperature greater than 30 degrees Celsius, the low-power semiconductor intermittently works at high frequency, and the medium-power semiconductor and the high-power semiconductor intermittently work.

[0143] In the embodiment, the application adds a "try to push out" state in the door handle pop-out logic. When the state is triggered, the door handle tries to push out a small part outward with a constant force. The setting of the state can be used to detect whether the door handle is in an icing state in a cold environment. The setting of the state can better cooperate with the semiconductor array to realize automatic detection of the door handle defrosting state, and feedback to the user through the user terminal. The application realizes a more efficient handle temperature adjustment process and improves the energy saving effect in the handle temperature adjustment process through automatic regulation and control of the handle temperature control process by the temperature sensor. In addition, the application can also feedback the temperature control result to the user terminal in real time, so that the user can know the state of the vehicle.

[0144] The above embodiment numbers of the application are only for description, and do not represent the advantages and disadvantages of the embodiments. The above is only a preferred embodiment of the application, and does not limit the patent scope of the application. Any equivalent structure or equivalent flow conversion, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the application.

Claims

1. A handle, characterized in that The handle is internally provided with at least one semiconductor array; The semiconductor array comprises a plurality of types of semiconductor pieces; wherein the power of different types of semiconductor pieces is different; One side of the semiconductor piece is provided with a porcelain piece which is tightly attached to the inner surface of the handle; the interior of the handle is further provided with at least one heat conduction module, and the interior of the handle is provided with a heat exchange channel which is connected with the heat conduction module.

2. The handle of claim 1, wherein The semiconductor array comprises a plurality of distribution areas; the distribution areas comprise at least one type of semiconductor piece; different distribution areas correspond to different position areas on the handle.

3. A handle according to claim 2, characterised in that The plurality of distribution areas comprise a first distribution area, a second distribution area, a third distribution area, and a fourth distribution area; The first distribution area corresponds to the gripping area of the handle; the second distribution area corresponds to the button area of the handle; the third distribution area corresponds to the edge area of the handle; the fourth distribution area corresponds to other areas of the handle; the other areas are areas other than the first distribution area, the second distribution area, and the third distribution area.

4. A handle according to claim 3, characterised in that The first distribution area is provided with at least one semiconductor piece of a first power and at least one semiconductor piece of a second power; Wherein, the first power is less than the second power.

5. A handle according to any one of claims 1-4, characterised in that The distribution area of the semiconductor array is provided with at least one temperature sensor; The temperature sensor is arranged between the porcelain piece on the surface of the semiconductor piece and the inner surface of the handle.

6. A handle according to any one of claims 1-4, characterised in that When comprising one semiconductor array, the semiconductor array is arranged on the inner surface of the first side of the handle.

7. A handle according to any one of claims 1-4, characterised in that When comprising two semiconductor arrays, one semiconductor array is arranged on the inner surface of the first side of the handle, and the other semiconductor array is arranged on the inner surface of the second side of the handle.

8. A vehicle door, characterized by The handle as claimed in any one of claims 1-7 is arranged on the vehicle door.

9. A vehicle characterized by comprising: The vehicle door as claimed in claim 8 is arranged on the vehicle.

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