Temperature measurement sensor and induction cooker

Abstract

The utility model provides a temperature measurement sensor and an induction cooker, the temperature measurement sensor comprises a sleeve and a sensor assembly, the upper surface of the sleeve sinks to form a first mounting groove and a second mounting groove, and the first mounting groove and the second mounting groove are arranged side by side; the sensor comprises a first temperature measuring element mounted in the first mounting groove and a second temperature measuring element mounted in the second mounting groove; wherein the wavelength of the infrared wave which can be transmitted by the first temperature measuring element is different from the wavelength of the infrared wave which can be transmitted by the second temperature measuring element. By using the two temperature measuring elements capable of penetrating through different infrared wavelengths, the temperature of the microcrystal panel can be monitored in real time, it is guaranteed that the temperature of the microcrystal panel does not exceed the use temperature, the actual temperature of the pot bottom can be monitored through the microcrystal panel, and the induction cooker host can monitor the actual temperature of the pot bottom according to the temperature change trend of the microcrystal panel and the pot bottom. The temperature change of the pot bottom in the next step is predicted, the heating power of the microwave oven is adjusted, accurate pot bottom temperature control is achieved, and the requirement for high-end cooking is met.

Description

TECHNICAL FIELD

[0001] The utility model relates to infrared temperature measurement technical field, especially a kind of temperature sensor and electromagnetic range. BACKGROUND

[0002] Existing electromagnetic range uses NTC (contact type thermistor) in the lower part of microcrystalline panel to monitor the temperature of the bottom of microcrystalline panel, or uses thermoelectric pile sensor to detect pot bottom temperature, because the material of microcrystalline panel and pot bottom is different, and the thermal conductivity is also different, so the temperature of the two is not synchronized, especially in the process of rapid heating, single detection microcrystalline panel or pot bottom temperature cannot realize pot bottom accurate temperature control. INVENTION CONTENTS

[0003] Therefore, the utility model discloses a kind of temperature sensor and electromagnetic range, to solve the technical problem mentioned in the above background art.

[0004] The utility model provides a kind of temperature sensor, comprising:

[0005] Sleeve, the upper surface of the sleeve is sunk and is formed with first installation groove and second installation groove, the first installation groove and the second installation groove are side by side arranged;

[0006] Sensor assembly, the sensor includes the first temperature measuring element installed in the first installation groove, and the second temperature measuring element installed in the second installation groove;

[0007] Wherein, the first temperature measuring element can be distinguished from the second temperature measuring element by the wavelength of the infrared wave that can be penetrated.

[0008] Further, the temperature sensor, wherein the first temperature measuring element includes tube base, pipe cap, filter sheet and thermoelectric pile sensing unit, the thermoelectric pile sensing unit is electrically connected with the tube base, the pipe cap cooperates and connects the tube base, and covers the thermoelectric pile sensing unit, the pipe cap is equipped with the field of view hole corresponding with the thermoelectric pile sensing unit, the filter sheet is installed at the field of view hole, the bottom surface of the tube base is equipped with multiple pins;

[0009] The second temperature measuring element is different from the first temperature measuring element in that the wavelength of the infrared wave that can be penetrated by the filter sheet of the two is different.

[0010] Further, the temperature sensor, wherein the inner wall of the first installation groove is equipped with first step, the first step is used to stop the tube base, the bottom surface of the first installation groove is equipped with through hole, and the through hole is used to connect the pin through PCB board.

[0011] Further, the temperature sensor, wherein the inner wall of the first step is equipped with second step.

[0012] Further, the temperature sensor, wherein the inner wall of the first mounting slot is provided with a bayonet in the radial direction, and the side wall of the tube base is provided with a protrusion matched with the bayonet.

[0013] Further, the temperature sensor, wherein the field of view angle of the field of view hole is controlled between 10°-40°.

[0014] Further, the temperature sensor, wherein the tube cap and the tube base are both made of zinc or copper.

[0015] Further, the temperature sensor, wherein the sleeve is made of copper or aluminum.

[0016] Further, the temperature sensor, wherein the bottom surface of the sleeve is provided with a groove corresponding to the positions of the first mounting slot and the second mounting slot.

[0017] The utility model discloses another aspect an electromagnetic oven, including the temperature sensor in the technical scheme of the above.

[0018] Compared with the prior art, the utility model has the advantages of:

[0019] By using two temperature measuring elements that can penetrate different infrared wavelengths, the temperature of the microcrystalline panel can be monitored in real time, the temperature of the microcrystalline panel is ensured to be not more than the use temperature, the actual temperature of the pot bottom can be penetrated to monitor, the electromagnetic oven host can predict the temperature change of the pot bottom next step according to the temperature change trend of the microcrystalline panel and the pot bottom, adjust the heating power of the microwave oven, realize accurate pot bottom temperature control, and meet the demand of high-end cooking. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is the perspective view of the temperature sensor in the utility model;

[0021] Figure 2 It is the perspective view of the sleeve under the first visual angle in the utility model;

[0022] Figure 3 It is the perspective view of the sleeve under the second visual angle in the utility model;

[0023] Figure 4 It is the sectional view of the sleeve in the utility model;

[0024] Figure 5 It is the specific structure schematic diagram of the first temperature measuring element in the utility model;

[0025] Figure 6 It is the peripheral processing circuit diagram of the first temperature measuring element in the utility model;

[0026] Figure 7 Peripheral processing circuit diagram of second temperature measuring element in the utility model;

[0027] Main element symbol explanation:

[0028] 10, sleeve; 11, first installation groove; 12, second installation groove; 21, first temperature measuring element; 22, second temperature measuring element; 211, pipe base; 212, pipe cap; 213, filter piece; 214, pin; 31, first step; 32, through hole; 33, second step; 41, bayonet; 42, protrusion; 50, recess.

[0029] The following detailed description will further illustrate the utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0030] In order to facilitate the understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. The drawings show several embodiments of the utility model. However, the utility model can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can be a middle element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be a middle element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs. The terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0033] Please refer to Figures 1 to 5 The temperature measuring sensor in the utility model, including sleeve 10 and sensor assembly, the upper surface of sleeve 10 is sunken and formed with first installation groove 11 and second installation groove 12, first installation groove 11 and second installation groove 12 are arranged side by side; the sensor includes first temperature measuring element 21 installed in first installation groove 11 and second temperature measuring element 22 installed in second installation groove 12;

[0034] The infrared wavelength that the first temperature measuring element 21 can pass through is different from the infrared wavelength that the second temperature measuring element 22 can pass through.

[0035] By using two temperature measuring elements that can pass through different infrared wavelengths, the temperature of the microcrystalline panel can be monitored in real time (that is, the NTC function is replaced), so that the temperature of the microcrystalline panel does not exceed the use temperature, and the actual temperature of the pot bottom can be monitored through the microcrystalline panel. The electromagnetic oven host can predict the next change of the temperature of the pot bottom according to the change trend of the temperature of the microcrystalline panel and the pot bottom, adjust the heating power of the microwave oven, realize accurate control of the temperature of the pot bottom, and meet the needs of high-end cooking.

[0036] Referring to Figure 5 The first temperature measuring element 21 includes a tube base 211, a tube cap 212, a filter 213, and a thermoelectric pile sensing unit (not shown in the figure). The thermoelectric pile sensing unit is electrically connected to the tube base 211. The tube cap 212 is connected to the tube base 211 and covers the thermoelectric pile sensing unit. The tube cap 212 is provided with a field of view hole corresponding to the thermoelectric pile sensing unit. The filter 213 is installed at the field of view hole. The bottom surface of the tube base 211 is provided with a plurality of pins 214.

[0037] It should be noted that the thermoelectric pile sensing unit can convert the temperature of the object in the field of view into a corresponding voltage signal, and then convert it through an external amplification acquisition circuit to realize non-contact temperature measurement. In this embodiment, the first temperature measuring element 21 and the second temperature measuring element 22 have basically the same structure, except that the structures of the filters 213 of the two are different. By changing the structure of the filter 213 above the thermoelectric pile sensing unit, the filter 213 can pass through infrared signals of different wavelengths, thereby achieving different temperature measurement purposes. Specifically, the first temperature measuring element 21 can only accept infrared radiation emitted by the microcrystalline panel itself, and is a sensor for monitoring the temperature of the microcrystalline panel. The second temperature measuring element 22 can only accept infrared radiation that penetrates the microcrystalline panel, and is a sensor for monitoring the temperature of the pot bottom. The two temperature measuring elements are connected through a sleeve 10 to ensure that the temperature measuring elements are arranged side by side and have the same height.

[0038] In addition, in this embodiment, the sleeve 10 is made of metal material, preferably copper or aluminum or other high thermal conductivity materials, to ensure that the environment temperature received by the two temperature measuring elements is completely consistent. At the same time, the use of the metal sleeve 10 increases the heat capacity of the thermoelectric pile sensing unit, reduces the environmental temperature fluctuation of the temperature measuring element itself, and improves the overall heat shock resistance of the sensor during microwave heating, thereby making the temperature measuring element measure the temperature of the object more accurately.

[0039] Further, in the embodiment, the pipe cap 212 and the pipe base 211 are made of zinc or copper, and the electrical resistance is relatively low, so that the thermoelectric sensor unit wrapped therein is not easily affected by the heating of the IH vortex field, and the thermoelectric sensor unit obtains the ambient temperature more truly and reliably.

[0040] Further, in the embodiment, the field of view angle of the field of view hole is controlled to be between 10° and 40°, and can be adjusted according to the actual application distance and the installation height of the microcrystalline panel.

[0041] Referring to Figure 6 , it is a peripheral processing circuit diagram of the first temperature measuring element 21, wherein ACM1 is an external bias voltage provided by the main control MCU, C05 is a filter capacitor of two pins of the thermoelectric sensor unit, TH2+ is an ambient temperature collection signal of the thermoelectric sensor unit itself in the first temperature measuring element 21, the differential signal output by the first temperature measuring element 21 is subjected to preliminary filter processing to form signals SEN1+ and SEN1-, and then the main control MCU amplifies to collect the voltage AD value TA1 of the first temperature measuring element 21.

[0042] Referring to Figure 7 , it is a peripheral processing circuit diagram of the second temperature measuring element 22, and the difference from the above circuit is that capacitors C07 and C08 are added, and the two capacitors are designed to increase the anti-interference ability. TH+ is an ambient temperature collection of the thermoelectric sensor unit itself in the second temperature measuring element 22, the differential signal output by the second temperature measuring element 22 is subjected to preliminary filter processing to form signals SEN+ and SEN-, and then the main control MCU amplifies to collect the voltage AD value TA2 of the second temperature measuring element 22.

[0043] The formula for calculating the voltage TA1 of the first temperature measuring element 21 to obtain the microcrystalline panel temperature TW is as follows:

[0044]

[0045] Among them,

[0046]

[0047] ADT_40 is the voltage AD value measured by the thermoelectric sensor to the 40℃ standard black body;

[0048] ADT_35 is the voltage AD value measured by the thermoelectric sensor to the 35℃ standard black body.

[0049] In the embodiment, the calculation formula of the second temperature measuring element 22 is the same as TW, and thus is not described again.

[0050] Referring to Figure 4The inner wall of the first installation slot 11 is provided with a first step 31 for stopping the pipe base 211, and the bottom surface of the first installation slot 11 is provided with a through hole 32 for the lead 214 to pass through the connecting PCB board.

[0051] Further, referring to Figure 1 、 Figure 2 and Figure 5 , the inner wall of the first installation slot 11 is provided with a clamping opening 41 in the radial direction, and the side wall of the pipe base 211 is provided with a protrusion 42 matched with the clamping opening 41. By matching the protrusion 42 with the clamping opening 41, the pipe base 211 can be installed in the first installation slot 11 at a correct angle, ensuring that the thermoelectric element in the pipe base 211 is at a suitable angle, thereby ensuring that the orientation of the field-of-view hole is accurate and can effectively receive infrared signals.

[0052] Further, referring to Figure 4 , the inner wall of the first step 31 is provided with a second step 33 for supporting the installation of small-size temperature measuring elements in the sleeve 10, which improves the compatibility of the sleeve 10 for different sizes of temperature measuring elements, so that the sleeve 10 can flexibly install different sizes of temperature measuring elements according to specific conditions, thereby improving the versatility of the sleeve 10.

[0053] In addition, it should be noted that in the embodiment, the structure of the second installation slot 12 is the same as that of the first installation slot 11, and the structure and function of the second installation slot 12 can be referred to the description of the first installation slot 11, and thus will not be described again.

[0054] Further, the bottom surface of the sleeve 10 is provided with a recess 50 corresponding to the positions of the first installation slot 11 and the second installation slot 12.

[0055] In summary, the temperature measuring sensor in the above embodiment of the utility model can monitor the temperature of the microcrystalline panel in real time, ensure that the temperature of the microcrystalline panel does not exceed the use temperature, and monitor the actual temperature of the pot bottom through the microcrystalline panel, so that the main machine of the electromagnetic oven can predict the change of the temperature of the pot bottom in the next step according to the trend of the temperature change of the microcrystalline panel and the pot bottom, adjust the heating power of the microwave oven, realize accurate control of the temperature of the pot bottom, and meet the needs of high-end cooking.

[0056] The utility model discloses a second embodiment further proposes a kind of electromagnetic stove, including the temperature sensor described in above technical scheme.

[0057] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0058] The above-described embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be pointed out that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A temperature measuring sensor, characterized by The application relates to a temperature sensor, comprising: a sleeve, the upper surface of the sleeve being concave and provided with a first installation groove and a second installation groove; a sensor assembly, the sensor comprising a first temperature measuring element installed in the first installation groove and a second temperature measuring element installed in the second installation groove; wherein the infrared wavelength that can be transmitted by the first temperature measuring element is different from the infrared wavelength that can be transmitted by the second temperature measuring element.

2. The temperature measuring sensor according to claim 1, characterized in that The first temperature measuring element comprises a tube base, a tube cap, a filter and a thermocouple sensing unit, the thermocouple sensing unit being electrically connected with the tube base, the tube cap being connected with the tube base and covering the thermocouple sensing unit, the tube cap being provided with a field of view hole corresponding to the thermocouple sensing unit, the filter being installed at the field of view hole, and the bottom surface of the tube base being provided with a plurality of pins. The second temperature measuring element is different from the first temperature measuring element in that the filter of the second temperature measuring element can transmit infrared waves of a wavelength different from that of the first temperature measuring element.

3. The temperature sensor according to claim 2, wherein The inner wall of the first installation groove is provided with a first step for limiting the position of the tube base, and the bottom surface of the first installation groove is provided with a through hole for the pins to pass through a PCB.

4. The temperature sensor according to claim 3, characterized in that The inner wall of the first step is provided with a second step.

5. The temperature sensor of claim 2, wherein The inner wall of the first installation groove is provided with a clamping opening in the radial direction, and the side wall of the tube base is provided with a protrusion matched with the clamping opening.

6. The temperature sensor according to claim 2, wherein The field of view angle of the field of view hole is controlled to be between 10 DEG and 40 DEG.

7. The temperature sensor of claim 2, wherein The tube cap and the tube base are made of zinc or copper.

8. The temperature sensor of claim 1, wherein, The sleeve is made of copper or aluminum.

9. The temperature sensor of claim 1, wherein, The bottom surface of the sleeve is provided with a groove corresponding to the positions of the first installation groove and the second installation groove.

10. An electromagnetic cooker, characterized by comprising: The application further relates to a temperature sensor comprising any one of the temperature sensors in claims 1-9.

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