Power-on test structure, power-on test tool and chip test equipment

Abstract

The utility model discloses a power-up test structure, a power-up test tool and a chip test device, and relates to the field of chip test.The power-up test structure comprises a heat conduction mounting seat and a plurality of probes, and the heat conduction mounting seat is provided with a plurality of mounting holes penetrating along a first direction; the plurality of probes are respectively arranged in the plurality of mounting holes in a penetrating manner, the probes are in heat conduction connection with the heat conduction mounting seat and are arranged in an insulating manner, the plurality of probes comprise a plurality of first probes, and the plurality of first probes are respectively used for being electrically connected to a positive electrode and a negative electrode of an output terminal of a test power supply. According to the technical scheme provided by the utility model, the heat generated by the probe can be timely dissipated through the heat conduction connection between the heat conduction mounting seat and the probe, the aging process of the probe is delayed, and the problem that the probe in the existing power-on test structure needs to be frequently replaced is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip test technical field, especially a kind of power-on test structure, power-on test tooling and chip test equipment. BACKGROUND

[0002] In the field of semiconductor laser, COS (Chip-On-Substrate, chip mounted on substrate) test is an important link to ensure the performance and reliability of laser chip. COS test usually refers to mounting an unpackaged laser chip directly on a test substrate, and performing a series of electrical, optical and thermal property evaluations on it through a power-on test structure.

[0003] However, in a high-current test environment, the service life of the probes on the existing power-on test structure is relatively low, and the probes often need to be replaced frequently. UTILITY MODEL CONTENT

[0004] The main purpose of the utility model is to provide a power-on test structure, a power-on test tooling and a chip test equipment, aiming at improving the problem that the probes in the existing power-on test structure need to be replaced frequently.

[0005] To achieve the above-mentioned purpose, the power-on test structure provided by the utility model comprises:

[0006] A heat-conducting mounting seat is formed with a plurality of mounting holes penetrating in the first direction; and

[0007] A plurality of probes are respectively arranged in the plurality of mounting holes, and the probes are in thermal conduction connection with the heat-conducting mounting seat and are insulated, the plurality of probes comprise a plurality of first probes, and the plurality of first probes are respectively electrically connected to the positive and negative poles of the output terminals of the test power supply.

[0008] In an embodiment, the material of the heat-conducting mounting seat is metal.

[0009] In an embodiment, the surface of the heat-conducting mounting seat is formed with an insulating heat-conducting layer, and the insulating heat-conducting layer is at least arranged on the inner wall surface of the mounting hole.

[0010] The needle cylinder of the probe is in contact with the insulating heat-conducting layer.

[0011] In an embodiment, the material of the heat-conducting mounting seat is ceramic.

[0012] In an embodiment, the material of the heat-conducting mounting seat is metal.

[0013] The insulating heat-conducting layer is a metal oxide layer.

[0014] In an embodiment, the plurality of probes includes two second probes, and the two second probes are respectively connected to a positive electrode and a negative electrode of a monitoring terminal of the test power supply.

[0015] In an embodiment, the heat-conducting mounting base has a main body part and a mounting part, the main body part has a connecting end in the second direction, and the mounting part is arranged at the connecting end and extends towards the first direction;

[0016] The mounting hole is formed in the mounting part.

[0017] In an embodiment, the connecting end has a first side end and a second side end in the first direction.

[0018] The mounting part is connected to the first side end and extends away from the second side end.

[0019] To achieve the above object, the power-on test tool includes the power-on test structure.

[0020] To achieve the above object, the chip test device includes the power-on test tool.

[0021] In the technical scheme, the heat-conducting mounting base provides mounting bases for the plurality of probes through the plurality of mounting holes formed by the heat-conducting mounting base, and the plurality of probes are insulatedly connected to the heat-conducting mounting base, so that short circuit between the plurality of probes is prevented. On this basis, the heat-conducting mounting base is thermally conductively connected to the probes, so that heat generated by the probes in a high-current test environment can be continuously transferred to the heat-conducting mounting base and dissipated by the heat-conducting mounting base, that is, the probes have an efficient heat dissipation channel, and the heat accumulation of the probes is improved, and the service life is greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed in the embodiment or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained from the structures shown in the drawings without creative labor.

[0023] Figure 1 The structural schematic diagram of an embodiment of the power-on test structure provided by the present application;

[0024] Figure 2 The structural schematic diagram of an embodiment of the power-on test structure provided by the present application; Figure 1 The exploded structural schematic diagram of the power-on test structure.

[0025] Explanation of reference numerals:

[0026] 100, power-on test structure;

[0027] 1, heat-conducting mounting seat; 11, main body part; 111, connecting end; 111a, first side end; 111b, second side end; 12, mounting part; 121, mounting hole; 2, probe; 21, first probe; 22, second probe; X, first direction; Y, second direction.

[0028] The implementation, functional features and advantages of the utility model will be further described with reference to the drawings in combination with embodiments. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0030] It should be noted that if the embodiments of the utility model involve directional indications, the directional indications are only used to explain the relative positional relationship, movement condition and the like between components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0031] In addition, if the embodiments of the utility model involve descriptions such as "first", "second" and the like, the descriptions of "first", "second" and the like are only for description purposes, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one feature. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of those skilled in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the utility model.

[0032] In the field of semiconductor lasers, COS (Chip-On-Substrate) testing is an important link to ensure the performance and reliability of laser chips. COS testing usually refers to directly mounting an unpackaged laser chip on a test substrate and performing a series of electrical, optical and thermal property evaluations on it through a power-on test structure. This testing method can effectively screen out unqualified products, improve the yield of the final product, and provide important data support for subsequent packaging.

[0033] The existing power-on test structure is usually composed of a test support made of glass fiber and a probe installed on the test support, however, in a high current test environment, the probe on the existing power-on test structure is prone to heat, and due to the low heat conduction efficiency of the test support made of glass fiber, the probe accumulates heat, and the increase of the heat of the probe accelerates the aging of the probe contact and the internal spring, and even burns the probe, which makes the service life of the probe in the high current test environment lower, and the probe usually needs to be frequently replaced.

[0034] In view of this, the utility model provides a power-on test structure, aiming at improving the problem that the probe 2 needs to be frequently replaced in the existing power-on test structure, for the convenience of understanding the power-on test structure, the following will be described in combination with the accompanying drawings Figure 1 Figure 1 The structure schematic diagram of the power-on test structure one embodiment provided by the utility model; Figure 2 Figure 1 The exploded structure schematic diagram of the power-on test structure.

[0035] In an embodiment, the power-on test structure 100 provided by the utility model includes a heat-conducting mounting seat 1 and a plurality of probes 2, the heat-conducting mounting seat 1 is formed with a plurality of mounting holes 121 through in the first direction X; a plurality of probes 2 are respectively arranged in the plurality of mounting holes 121, the probe 2 and the heat-conducting mounting seat 1 are in thermal conduction connection and are insulated, the plurality of probes 2 include a plurality of first probes 21, and the plurality of first probes 21 are respectively used for electrically connecting to the positive and negative poles of the output terminal of the test power supply.

[0036] The main role of the heat-conducting mounting seat 1 is to open the mounting hole 121 to serve as the installation basis of the probe 2, and secondly, the heat-conducting mounting seat 1 should also have a certain heat conduction capacity, and the selectable material has a plurality of kinds, for example, metal material (copper, aluminum, etc.), or non-metal material (graphite, silicon carbide, etc.), generally, the heat conduction coefficient of the heat-conducting mounting seat 1 should be at least greater than 10 W / m·K, and the specific material of the embodiment is not limited;

[0037] ​​The "probe 2" is a conductive structure, and its basic structure generally comprises a needle, a needle cylinder and a spring, the needle is retractably arranged in the needle cylinder through the spring, and the specific structure of the probe 2 is not limited in the utility model; the "heat-conducting connection between the probe 2 and the heat-conducting mounting seat 1 and the insulation setting" means that the probe 2 and the heat-conducting mounting seat 1 are directly or indirectly in contact, so that a heat-conducting path can be formed, and the probe 2 and the heat-conducting mounting seat 1 are insulated from each other, so that the current on the probe 2 is difficult to flow into the heat-conducting mounting seat 1, and there are various ways to achieve this purpose, for example, the heat-conducting mounting seat 1 has the insulation property while having the heat-conducting property, the material of the heat-conducting mounting seat 1 can be aluminum oxide, aluminum nitride, boron nitride and the like, or the heat-conducting mounting seat 1 and the probe 2 further have an insulation isolation structure (the insulation isolation structure at this time should also have a certain heat-conducting capacity), and the embodiment is not limited in this regard.

[0038] The "multiple probes 2 comprise multiple first probes 21" includes that the multiple probes 2 can all be arranged as the first probes 21, or can comprise second probes 22 in addition to the first probes 21, and the embodiment is not limited in this regard; wherein the two first probes 21 are respectively used for electrically connecting to the positive and negative poles of the output terminals of the test power supply, and the "output terminal" is the main output interface of the test power supply, and is responsible for providing the set current to the chip to be tested.

[0039] In the technical scheme of the utility model, the heat-conducting mounting seat 1 provides the installation basis for the multiple probes 2 through multiple installation holes 121 formed by the heat-conducting mounting seat 1 itself, since the probe 2 and the heat-conducting mounting seat 1 are insulatedly connected, the short circuit between the multiple probes 2 can be prevented, and on this basis, since the heat-conducting mounting seat 1 and the probe 2 are heat-conductingly connected, the heat generated by the probe 2 in the high-current test environment can be continuously transmitted to the heat-conducting mounting seat 1 and dissipated outward by the heat-conducting mounting seat 1, that is, the probe 2 obtains an efficient heat dissipation channel, the heat accumulation condition of the probe 2 is improved, and the service life is greatly improved.

[0040] In an embodiment, the material of the heat-conducting mounting seat 1 is a metal material.

[0041] It should be noted that there are various types of metal materials, for example, silver (the heat-conducting coefficient is 429 W / m·K), copper (the heat-conducting coefficient is 401 W / m·K), gold (the heat-conducting coefficient is 317 W / m·K), aluminum (the heat-conducting coefficient is 237 W / m·K), nickel (the heat-conducting coefficient is 91 W / m·K), and steel (the heat-conducting coefficient is between 50 and 60 W / m·K), and the specific material is not limited in the embodiment.

[0042] Compared with inorganic materials, the heat-conducting mounting seat 1 made of metal material has good heat-conducting performance and good mechanical performance, and it is easier to process the mounting hole 121 with stable size on the heat-conducting mounting seat 1.

[0043] In an embodiment, the surface of the heat-conducting mounting seat 1 is formed with an insulating heat-conducting layer, and the insulating heat-conducting layer is arranged at least on the inner wall surface of the mounting hole 121; and the needle cylinder of the probe 2 contacts the insulating heat-conducting layer.

[0044] The "insulating heat-conducting layer" refers to a surface layer structure with both insulating and heat-conducting properties. The insulating heat-conducting layer can be formed on the surface of the heat-conducting mounting seat 1 by spraying or by oxidation-reduction. The material of the insulating heat-conducting layer is related to the forming method. For example, when the material of the insulating heat-conducting layer is a colloidal structure, it can be formed on the surface of the heat-conducting mounting seat 1 by spraying. This embodiment does not limit the above.

[0045] According to the above technical solution, by arranging the insulating heat-conducting layer on the inner wall surface of the mounting hole 121, the needle cylinder of the probe 2 indirectly contacts the heat-conducting mounting seat 1 through the insulating heat-conducting layer. By forming a heat dissipation channel, the material selection of the heat-conducting mounting seat 1 has more possibilities. For example, the heat-conducting mounting seat 1 can be made of metal material to obtain good mechanical performance. If the insulating heat-conducting layer is also arranged on the outer surface of the heat-conducting mounting seat, the insulating heat-conducting layer can play a role in electric shock protection.

[0046] In an embodiment, the material of the heat-conducting mounting seat 1 is metal material; and the insulating heat-conducting layer is a metal oxide layer.

[0047] The "metal oxide layer" can be formed on the surface of the heat-conducting mounting seat 1 by oxidation-reduction. That is, in the initial state, the insulating heat-conducting layer and the heat-conducting mounting seat 1 are made of the same metal material. After the oxidation-reduction reaction of the insulating heat-conducting layer on the surface, it is converted into an inert metal oxide layer, thereby losing the heat-conducting property.

[0048] According to the above technical solution, the metal oxide layer is formed on the surface of the heat-conducting mounting seat 1 made of metal material by oxidation-reduction. The forming method is simple and reliable, and there is no heat-conducting gap between the heat-conducting mounting seat 1 and the insulating heat-conducting layer, so the heat conduction efficiency is higher.

[0049] In an embodiment, the material of the heat-conducting mounting seat 1 is ceramic material.

[0050] The ceramic material includes alumina, aluminum nitride, silicon carbide, beryllium oxide, etc., which not only has good insulation characteristics, but also has good thermal conductivity characteristics, so that the heat-conducting mounting seat 1 can be in direct contact with the probe 2 without the need for additional insulation structure.

[0051] Generally, the probe 2 needs to be connected to the test power supply through a wire. In the high-current test process, the wire may heat up, which may cause the wire resistance to increase, resulting in large voltage test fluctuations and affecting the voltage test accuracy. Therefore, in an embodiment, the plurality of probes 2 includes two second probes 22, which are respectively connected to the positive and negative poles of the monitoring terminal of the test power supply.

[0052] It should be noted that the "monitoring terminal of the current source" also refers to the sense terminal. Since the sense terminal does not need to output a large current, the temperature change of the second probe 22 itself and the wire between the second probe 22 and the monitoring terminal is small. The sense terminal can directly measure the voltage on the chip under test through the second probe 22, reducing the influence of current output and voltage monitoring on the same line, and making the voltage monitoring on the chip under test more accurate.

[0053] In an embodiment, the heat-conducting mounting seat 1 has a main body part 11 and a mounting part 12. The main body part 11 has a connecting end 111 in the second direction Y, and the mounting part 12 is arranged at the connecting end 111 and extends in the first direction X. The mounting hole 121 is formed in the mounting part 12.

[0054] It should be noted that the extension of the mounting part 12 in the first direction X is relative to the main body part 11, that is, the size of the mounting part 12 in the first direction X should be greater than that of the main body part 11. Generally, the power-on test structure 100 needs to be used with a driving assembly. During the driving of the heat-conducting mounting seat 1 to move close to the chip under test, the main body part 11 is always farther away from the chip under test than the mounting part 12.

[0055] According to the above technical solution, the mounting part 12 is arranged at the connecting end 111 of the main body part 11 and extends in the first direction X, which can provide a sufficient and stable mounting basis for the probe 2 to position the needle of the probe 2 as close to the chip under test as possible, which is beneficial to improve the position accuracy of the probe 2 test, and the main body part 11 is farther away from the chip under test than the mounting part 12, which is beneficial to reduce the possibility of interference between the main body part 11 and the external structure.

[0056] Please refer to Figure 2 In an embodiment, the connecting end 111 has a first side end 111a and a second side end 111b in the first direction X. The mounting part 12 is connected to the first side end 111a and extends away from the second side end 111b.

[0057] It should be noted that the head of the probe 2 is usually arranged on the mounting portion 12 close to the side of the chip to be tested, that is, arranged away from the main body portion 11.

[0058] Compared with the scheme that the mounting portion 12 is connected to the first side end 111a and the second side end 111b at the same time, in the above technical scheme, the mounting portion 12 is connected to the first side end 111a and is arranged away from the second side end 111b in extension, which can reduce the hole depth of the mounting hole 121 in the first direction X on the premise of ensuring that the probe 2 can obtain stable connection at the position where the needle head is located, so that the probe 2 has more exposed parts, which is beneficial to heat dissipation of the probe 2.

[0059] The utility model also proposes a power-on test tool, the power-on test tool includes power-on test structure 100, the specific structure of power-on test structure 100 refers to the above embodiment, because the power-on test tool adopts all the technical schemes of the above all embodiments, therefore at least has all the beneficial effects brought by the technical scheme of the above embodiment, here will not repeat one by one. In addition, the power-on test tool can also include a substrate structure for placing the chip to be tested, and a driving assembly for driving the power-on test structure 100 to approach or move away from the substrate structure, and the embodiments of the utility model do not limit this.

[0060] The utility model also proposes a chip test equipment, the chip test equipment includes power-on test tool, the specific structure of power-on test tool refers to the above embodiment, because the chip test equipment adopts all the technical schemes of the above all embodiments, therefore at least has all the beneficial effects brought by the technical scheme of the above embodiment, here will not repeat one by one. In addition, the chip test equipment can also include a test power supply and a current source with a monitoring terminal, and the embodiments of the utility model do not limit this.

[0061] In a specific embodiment, the power-on test structure 100 includes a heat-conducting mounting seat 1 and a plurality of probes 2, the heat-conducting mounting seat 1 is made of metal and is formed with a plurality of mounting holes 121 penetrating along the first direction X, the surface of the heat-conducting mounting seat 1 is formed with a metal oxide layer, the metal oxide layer has the characteristics of insulation and heat conduction, the plurality of probes 2 include a plurality of first probes 21 and two second probes 22, the plurality of first probes 21 are respectively electrically connected to the positive and negative poles of the output terminals of the test power supply, and the two second probes 22 are respectively electrically connected to the positive and negative poles of the monitoring terminals of the test power supply.

[0062] The above merely describes preferred embodiments of the present application, and is not intended to limit the patent scope of the present application, and any equivalent structural transformation, direct / indirect application in other related technical fields, or the like, within the concept of the present application, using the content of the present application specification and drawings, are included in the patent protection scope of the present application.

Claims

1. A power-on test structure, characterized by, Comprising: A heat-conductive mounting base formed with a plurality of mounting holes through in a first direction; and A plurality of probes respectively penetrating in the plurality of mounting holes, the probes being in thermal conduction connection with the heat-conductive mounting base and being insulated, the plurality of probes comprising a plurality of first probes respectively used to electrically connect to positive and negative poles of output terminals of a test power supply.

2. The power-on test structure of claim 1, wherein, The heat-conductive mounting base is made of metal material.

3. A power-on test structure as claimed in claim 1 or 2, wherein A surface of the heat-conductive mounting base is formed with an insulating and heat-conductive layer, the insulating and heat-conductive layer being at least coated on inner wall surfaces of the mounting holes; A needle cylinder of the probe is in contact with the insulating and heat-conductive layer.

4. The power-on test structure of claim 3, wherein, The heat-conductive mounting base is made of metal material. The insulating and heat-conductive layer is a metal oxide layer.

5. The power-on test structure of claim 1, wherein, The heat-conductive mounting base is made of ceramic material.

6. The power-on test structure of claim 1, wherein, The plurality of probes comprise two second probes respectively used to connect to positive and negative poles of monitoring terminals of the test power supply.

7. The power-on test structure of claim 1, wherein, The heat-conductive mounting base has a main body part and a mounting part, the main body part has a connection end in a second direction, the mounting part is arranged at the connection end and extends in the first direction; Wherein, the mounting holes are formed in the mounting part.

8. The power-on test structure of claim 7, wherein, The connection end has a first side end and a second side end in the first direction; The mounting part is connected to the first side end and extends away from the second side end.

9. A power-on test fixture, characterized by, A power-on test structure as claimed in any one of claims 1 to 8.

10. A chip testing apparatus characterized by comprising: A power-on test tool as claimed in claim 9.

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