Wafer suction cup structure for gluing developing machine

Abstract

The utility model discloses a wafer suction cup structure for a gluing developer, which comprises a mounting seat, a wafer suction cup is arranged at the top of the mounting seat, a butt joint sleeve is fixedly connected to the bottom end of the wafer suction cup, the bottom end of the butt joint sleeve is inserted into the mounting seat, and an adjusting groove is formed in the outer surface of the mounting seat. The adjusting ring is pushed upwards to drive the fixing pin to move in the adjusting through hole, the adjusting ring is rotated after the fixing pin is stopped, so that the fixing pin moves in the adjusting through hole and the fixing groove, the adjusting ring is loosened after the fixing pin is stopped again, and the abutting ring pushes the adjusting ring to reset under the action of the abutting spring. At the moment, the fixing pins enter the communicating positions in the fixing grooves, the wafer suction cup can be directly taken down from the interior of the mounting base, rapid dismounting and replacement of the wafer suction cup are achieved, the structure is simple, dismounting is convenient, and the replacement efficiency of the wafer suction cup is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer test equipment technical field, concretely is a wafer chuck structure for gluing developing machine. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, and the material used is silicon, and the application field of wafer is very extensive, and the application field mainly has integrated circuit, optoelectronic field, microelectromechanical field and power semiconductor device field, in the processing of wafer, usually need to carry out gluing development in gluing developing machine, when gluing development is carried out, usually use chuck to drive wafer to move.

[0003] At present, most wafers can only be adsorbed and grabbed for single size wafer, when the size of crystal changes, the chuck corresponding to it needs to be replaced, since the chuck is usually fixed with the base using bolts, so that the chuck needs to spend alignment time when being replaced, so that the replacement efficiency of the chuck is low. UTILITY MODEL CONTENT

[0004] The utility model discloses a wafer chuck structure for gluing developing machine to solve the problem in the above background.

[0005] To achieve the above object, the utility model provides the following technical scheme: a wafer chuck structure for gluing developing machine, including the mounting seat, the mounting seat top is provided with wafer chuck, the wafer chuck bottom end is fixedly connected with the docking sleeve, the docking sleeve bottom end is inserted with the mounting seat inside, the mounting seat outer surface is opened in the adjusting groove, four adjusting through -holes are arranged in the adjusting groove inner surface and are penetrated, the adjusting groove inner surface is rotatably connected with the adjusting ring, the adjusting ring inner surface is fixedly connected with four fixed pins, four fixed pins outer surfaces are slidably inserted with four adjusting through -holes inside respectively, the fixed groove is set up in the docking sleeve outer surface and is located four adjusting through -hole positions, four fixed pins one end is slidably inserted with four fixed groove inner surfaces respectively.

[0006] As a further preferred embodiment of the present technical solution, the wafer chuck bottom end and the center position are fixedly connected with the docking seat, the docking seat is internally provided with a sealing groove, the mounting seat internal bottom surface is fixedly connected with the docking head, and the docking head top end is inserted into the sealing groove.

[0007] As a further preferred embodiment of the present technical solution, the sealing groove internal top surface is fixedly connected with the sealing pad, the sealing pad bottom end is abutted and pressed with the docking head top end, and the docking head top end is interference-fitted with the sealing groove inside.

[0008] As a further preferred of the technical solution, the inner surface of the adjusting groove is slidably connected with a pressing ring, the top end of the pressing ring is fixedly connected with a plurality of pressing springs, the top end of the plurality of pressing springs is fixedly connected with the inner top surface of the adjusting groove, and the bottom end of the pressing ring abuts against the top end of the adjusting ring.

[0009] As a further preferred of the technical solution, the inner top surface of the adjusting groove is provided with a plurality of positioning grooves at the positions of the plurality of pressing springs, the inner part of each of the plurality of positioning grooves is inserted with a positioning column, and the other end of the plurality of positioning columns is fixedly connected with the top end of the pressing ring.

[0010] As a further preferred of the technical solution, the top end of the mounting seat is fixedly connected with a plurality of limiting columns, the bottom end of the wafer chuck is provided with a plurality of limiting grooves, and the top end of each of the plurality of limiting columns is inserted into the inner part of each of the plurality of limiting grooves.

[0011] As a further preferred of the technical solution, one side of the mounting seat is fixedly connected with a plurality of connecting heads, and the inner part of each of the plurality of connecting heads is in communication with the inner part of the counter-connection head.

[0012] The utility model provides a kind of wafer chuck structure for gluing developing machine, with the following beneficial effects:

[0013] (1) the utility model discloses a kind of wafer chuck structures for gluing developing machine, with the following beneficial effects:

[0014] (2) the utility model discloses a kind of wafer chuck structures for gluing developing machine, with the following beneficial effects: BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is the schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is the exploded schematic diagram of structure between mounting seat and wafer chuck of the utility model;

[0017] Figure 3 It is the exploded schematic diagram of internal structure of mounting seat and wafer chuck of the utility model;

[0018] Figure 4 It is the utility model Figure 3 enlarged schematic diagram of structure of area A of the utility model.

[0019] In the diagram: 1. Mounting base; 2. Wafer chuck; 3. Docking sleeve; 4. Adjustment groove; 5. Adjustment through hole; 6. Adjustment ring; 7. Fixing pin; 8. Fixing groove; 9. Pressure ring; 10. Positioning groove; 11. Positioning post; 12. Pressure spring; 13. Limiting post; 14. Limiting groove; 15. Docking base; 16. Sealing groove; 17. Sealing gasket; 18. Connecting head; 19. Connector. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0021] This utility model provides a technical solution: such as Figures 1-3 As shown in this embodiment, a wafer chuck structure for a coating and developing machine includes a mounting base 1. A wafer chuck 2 is disposed on the top of the mounting base 1. A mating sleeve 3 is fixedly connected to the bottom of the wafer chuck 2. The bottom of the mating sleeve 3 is inserted into the interior of the mounting base 1. An adjustment groove 4 is formed on the outer surface of the mounting base 1. Four adjustment through holes 5 are formed through the inner surface of the adjustment groove 4. An adjustment ring 6 is rotatably connected to the inner surface of the adjustment groove 4. Four fixing pins 7 are fixedly connected to the inner surface of the adjustment ring 6. The outer surfaces of the four fixing pins 7 slide against the interior of the four adjustment through holes 5 respectively. The mating sleeve 3 has a fixing groove 8 on its outer surface at the position of the four adjusting through holes 5. One end of each of the four fixing pins 7 is slidably inserted into the inner surface of the four fixing grooves 8. The adjusting groove 4 can limit the adjusting ring 6. The adjusting ring 6 can drive the fixing pins 7 to move inside the adjusting through holes 5 and fixing grooves 8 during movement, which is convenient for disassembly. The adjusting through holes 5 and fixing grooves 8 are both C-shaped. One end of the fixing groove 8 is connected to the bottom end of the mating sleeve 3 to achieve the effect of installation and disassembly.

[0022] like Figure 3 and Figure 4 As shown, a docking seat 15 is fixedly connected to the bottom end of the wafer chuck 2 and located at the center position. A sealing groove 16 is provided inside the docking seat 15. A connector 18 is fixedly connected to the bottom surface inside the mounting base 1. The top of the connector 18 is inserted into the sealing groove 16. By setting the sealing groove 16, a seal can be formed by cooperating with the connector 18, thereby improving the sealing performance.

[0023] like Figure 4 As shown, a sealing gasket 17 is fixedly connected to the top surface inside the sealing groove 16. The bottom end of the sealing gasket 17 abuts against the top end of the connector 18. The top end of the connector 18 is interference-fitted with the inside of the sealing groove 16, which can further improve the sealing performance and prevent air leakage.

[0024] like Figure 3As shown, the inner surface of the adjusting groove 4 is slidingly connected with a pressing ring 9, the top end of the pressing ring 9 is fixedly connected with a plurality of pressing springs 12, the top end of the plurality of pressing springs 12 is fixedly connected with the inner top surface of the adjusting groove 4, the bottom end of the pressing ring 9 abuts against the top end of the adjusting ring 6, by arranging the pressing spring 12, a stable force can be applied to the pressing ring 9, so that the adjusting ring 6 will not shake without external force, and the tightness of the connection is improved.

[0025] As shown, Figure 3 The inner top surface of the adjusting groove 4 is provided with a plurality of positioning grooves 10 at the positions of the plurality of pressing springs 12, a plurality of positioning columns 11 are inserted into the plurality of positioning grooves 10, and the other end of the plurality of positioning columns 11 is fixedly connected with the top end of the pressing ring 9, so that the pressing ring 9 can be positioned, and the stability of the pressing ring 9 is further improved.

[0026] As shown, Figure 2 And Figure 3 The top end of the mounting seat 1 is fixedly connected with a plurality of limiting columns 13, the bottom end of the wafer suction disc 2 is provided with a plurality of limiting grooves 14, and the top end of the plurality of limiting columns 13 is respectively inserted into the plurality of limiting grooves 14, so that the wafer suction disc 2 can be positioned, and the adjusting through hole 5 and the fixing groove 8 are more easily aligned.

[0027] As shown, Figure 3 One side of the mounting seat 1 is fixedly connected with a plurality of connecting heads 19, and the inside of the plurality of connecting heads 19 is communicated with the inside of the butt joint 18, so that the connecting head 19 can be conveniently connected with the pipeline.

[0028] The utility model provides a kind of wafer suction disc structure for gluing developing machine, specific working principle is as follows:

[0029] When it needs to replace wafer suction disc 2, staff pushes adjusting ring 6 upwards to drive fixed pin 7 to move in adjusting through hole 5 and fixed groove 8, in the process that adjusting ring 6 is pushed upwards, pressing ring 9 moves along, and pressing spring 12 is elastically deformed under pressure, after fixed pin 7 is blocked, rotating adjusting ring 6 makes fixed pin 7 move horizontally in adjusting through hole 5 and fixed groove 8, after fixed pin 7 is blocked again, adjusting ring 6 is loosened, and adjusting ring 6 is reset under the action of pressing spring 12, at this time, fixed pin 7 enters into the communication of fixed groove 8 and removes the restriction to butt joint sleeve 3, at this time, wafer suction disc 2 can be directly taken off from inside mounting seat 1, wafer suction disc 2 is disassembled and replaced, and only the above operation needs to be repeated during installation, in the process of installation, butt joint 18 enters into sealing groove 16 in butt joint seat 15, under the action of pressing spring 12 and fixed pin 7, butt joint seat 15 is connected tightly with butt joint 18 by the cooperation of sealing pad 17, and air leakage is not easy to occur.

[0030] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer chuck structure for a spin coater, comprising a mounting base (1), characterized in that: The mounting seat (1) top is provided with wafer chuck (2), the wafer chuck (2) bottom end fixedly connected with the butt joint cover (3), the butt joint cover (3) bottom end is inserted with mounting seat (1) inside, the mounting seat (1) outer surface is provided with adjusting groove (4), the adjusting groove (4) inner surface is provided with four adjusting through holes (5), the adjusting groove (4) inner surface is rotatably connected with adjusting ring (6), the adjusting ring (6) inner surface is fixedly connected with four fixed pins (7), four the fixed pin (7) outer surface is respectively with four adjusting through hole (5) inside sliding insertion, the butt joint cover (3) outer surface and located four adjusting through hole (5) position is provided with fixed groove (8), four fixed pin (7) one end is respectively with four fixed groove (8) inner surface sliding insertion.

2. The wafer chuck structure for a spin coater according to claim 1, wherein: The wafer chuck (2) bottom end and located at the center position fixedly connected with the butt joint seat (15), the butt joint seat (15) is provided with sealing groove (16) inside, the mounting seat (1) inside bottom surface is fixedly connected with the butt joint (18), the butt joint (18) top end is inserted with sealing groove (16) inside.

3. The wafer chuck structure for a spin coater according to claim 2, wherein: The sealing groove (16) inside top surface is fixedly connected with sealing pad (17), the sealing pad (17) bottom end is pressed against the butt joint (18) top end, the butt joint (18) top end and sealing groove (16) inside interference fit.

4. The wafer chuck structure for a spin coater according to claim 1, wherein: The adjusting groove (4) inner surface is slidably connected with the pressing ring (9), the pressing ring (9) top end is fixedly connected with a plurality of pressing springs (12), a plurality of pressing springs (12) top end and adjusting groove (4) inside top surface are fixedly connected, the pressing ring (9) bottom end is pressed against the adjusting ring (6) top end.

5. The wafer chuck structure for a spin coater according to claim 4, wherein: The adjusting groove (4) inside top surface and located at the position of a plurality of pressing springs (12) is provided with positioning groove (10), a plurality of positioning grooves (10) are inserted with positioning column (11), a plurality of positioning columns (11) the other end is fixedly connected with the pressing ring (9) top end.

6. The wafer chuck structure for a spin coater according to claim 1, wherein: The mounting seat (1) top end is fixedly connected with a plurality of limiting columns (13), the wafer chuck (2) bottom end is provided with a plurality of limiting grooves (14), a plurality of limiting columns (13) top end is respectively inserted with a plurality of limiting grooves (14) inside.

7. The wafer chuck structure for a spin coater according to claim 2, wherein: The mounting seat (1) one side is fixedly connected with a plurality of connecting heads (19), a plurality of connecting heads (19) inside and butt joint (18) inside are communicated.

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