Directional sound production folding device and electronic equipment

Abstract

The utility model discloses a directional sound production folding device and electronic equipment, the directional sound production folding device comprises a vibration layer, a substrate layer and a micro-pattern layer, the frame of the vibration layer and the frame of the substrate layer are attached, and an air gap is formed between the vibration layer and the substrate layer through the micro-pattern layer; the vibration layer vibrates and produces sound in the direction close to or away from the substrate layer under the action of an externally loaded ultrasonic signal; the directional sound production folding device comprises a plurality of sound production parts distributed in the first direction and at least one folding part, every two adjacent sound production parts are connected through one folding part, and the sound production parts are folded in the direction away from or close to the client till the sound production parts adjacent to the sound production parts are stacked in the second direction. According to the utility model, the UTG is adopted as the base layer of the vibration layer and the substrate layer, and the combination design of other functional structures of the directional sound production device is adopted, so that the directional sound production folding device which can be completely folded in at least one folding direction is prepared, and the advantages of small size, convenience in carrying and the like are realized while the large-screen sound production of the directional sound production device is realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to screen directional sound production technical field, concretely relates to a directional sound production folding device and electronic equipment. BACKGROUND

[0002] With the development of display technology, consumers not only require picture quality and definition of display devices, but also gradually pay attention to the output effect of sound, and more prefer display devices that can realize sound and picture integration and perfectly integrate display pictures and playing sound.

[0003] The existing screen sound production technology realizes sound and picture integration of display devices, and the principle is to use a vibrating element to push the screen to vibrate and produce sound. For example, a resonant screen sound production scheme is to attach a device with vibration characteristics to the lower part of the screen or the middle frame of the whole machine. The device produces vibration when working, and finally drives the screen to vibrate and produce sound. For another example, a direct pushing screen sound production scheme mainly consists of two parts. One part is directly attached to the screen, and the other part is fixed to the middle frame. When the device works, the two parts will produce mutual attractive or repulsive force, thereby pushing the screen to vibrate and produce sound. Compared with the resonant screen sound production scheme, the conversion efficiency is improved.

[0004] When the display screen on the electronic device is a foldable display screen, the area for display on the electronic device can be greatly increased to provide better visual experience for the user. Nowadays, foldable display screens are increasingly applied to various types of terminal devices and have good application prospects.

[0005] That is, the market demand for foldable screens is becoming more and more explicit. Therefore, how to make the directional sound production screen foldable to better combine with the foldable display screen is a problem to be solved at present. INVENTION CONTENTS

[0006] The utility model aims at providing a directional sound production folding device and electronic equipment.

[0007] To achieve the above-mentioned purpose, on the one hand, the utility model provides a directional sound production folding device, which comprises: a vibration layer, a substrate layer and a micro-pattern layer located between the vibration layer and the substrate layer, the frames of the vibration layer and the substrate layer are attached, and an air gap is formed between the two through the micro-pattern layer, the vibration layer vibrates and produces sound in the direction of approaching or moving away from the substrate layer under the action of externally loaded ultrasonic signals; the directional sound production folding device comprises a plurality of sound production parts distributed along a first direction and at least one folding part, each adjacent two sound production parts are connected through a folding part, and the sound production part is folded in the direction of moving away from or approaching the client to be stacked with the adjacent sound production part in a second direction.

[0008] In a preferred embodiment, the directional sound folding device comprises a first sound emitting part, a first folding part, a second sound emitting part, a second folding part and a third sound emitting part arranged in sequence along a first direction, the first sound emitting part is folded inwardly away from the client, the third sound emitting part is folded outwardly towards the client, and the first sound emitting part, the second sound emitting part and the third sound emitting part are arranged in sequence and stacked in a second direction after folding.

[0009] In a preferred embodiment, the substrate layer comprises a first UFG substrate layer and a first conductive layer, the first UFG substrate layer comprises at least one first folding area corresponding to the folding part and a plurality of first non-folding areas corresponding to the sound emitting part, the thickness of the first folding area is smaller than the thickness of the first non-folding area, and a first groove is formed between the first folding area and its adjacent two first non-folding areas on the folding direction; the first conductive layer is formed on the upper end surface of the first UFG substrate layer close to the vibration layer and covers at least the first non-folding area of the first UFG substrate layer; and / or, the vibration layer comprises a second UFG substrate layer and a second conductive layer, the second UFG substrate layer comprises at least one second folding area corresponding to the folding part and a plurality of second non-folding areas corresponding to the sound emitting part, the thickness of the second folding area is smaller than the thickness of the second non-folding area, and a second groove is formed between the second folding area and its adjacent two second non-folding areas on the folding direction; the second conductive layer is formed on the lower end surface of the second UFG substrate layer close to the substrate layer and covers at least the second non-folding area of the second UFG substrate layer.

[0010] In a preferred embodiment, the substrate layer further comprises a first conductive trace, a first insulating layer and a first hardened buffer layer, the first conductive trace is formed around the four edges of the upper end surface of the first conductive layer close to the vibration layer, the first insulating layer is formed on the upper end surface of the first conductive layer close to the vibration layer and covers the first conductive trace, the first conductive layer and the first folding area in its entirety, and the first hardened buffer layer is formed on the lower end surface of the first UFG substrate layer away from the vibration layer; and / or, the vibration layer further comprises a second conductive trace, a second insulating layer, a second hardened buffer layer and an optical film layer, the second conductive trace is formed around the four edges of the lower end surface of the second conductive layer close to the substrate layer, the second insulating layer is formed on the lower end surface of the second conductive layer close to the substrate layer and covers the second conductive trace, the second conductive layer and the second folding area in its entirety, the second hardened buffer layer is formed on the upper end surface of the second UFG substrate layer away from the substrate layer, and the optical film layer is formed on the upper end surface of the second hardened buffer layer away from the substrate layer.

[0011] In a preferred embodiment, the first and second folding regions are not covered by a conductive layer, or the corresponding conductive layer at the first and second folding regions is in a grid shape, and / or the grid lines of the grid-shaped conductive layer are in solid lines or in dashed lines, and / or the line width of the grid lines of the grid-shaped conductive layer is 6-10 um, and the line spacing is greater than 1 mm.

[0012] In a preferred embodiment, the micro-pattern layer is formed on the upper end surface of the first insulating layer close to the vibration layer, the micro-pattern layer includes a first micro-pattern layer corresponding to the folding part and a second micro-pattern layer corresponding to the sound generating part, the pattern of the first micro-pattern layer is different from the pattern of the second micro-pattern layer; and / or the micro-patterns of the first micro-pattern layer are arranged in a grid shape, and the center points of the micro-patterns are located at the lattice points.

[0013] In a preferred embodiment, the total thickness of the vibration layer is 52-138 um, and / or the total thickness of the substrate layer is 38-116 um, and / or the total thickness of the directional sound generating folding device is 90-254 um, and / or the thickness of the first and second UFG substrate layers is 30-100 um; and / or the thickness of the first folding region is 30-70 um, and / or the thickness of the second folding region is 30-70 um, and / or the thickness of the first folding region folded outward toward the client is greater than the thickness of the first folding region folded inward away from the client, and / or the thickness of the second folding region folded outward toward the client is greater than the thickness of the second folding region folded inward away from the client, and / or the thickness of the second folding region folded outward toward the client is greater than the thickness of the first folding region folded outward toward the client, and / or the thickness of the first folding region folded inward away from the client is greater than the thickness of the second folding region folded inward away from the client.

[0014] In a preferred embodiment, the thickness of the second hardened buffer layer is 15-25 um, and / or the thickness of the optical film layer is less than 5 um, and / or the total thickness of the first and second insulating layers is 6-12 um, and / or the thickness of the second conductive layer is less than 100 nm, and / or the thickness of the second conductive trace is less than 1 um; and / or the thickness of the first hardened buffer layer is 2-4 um, and / or the thickness of the first conductive layer is less than 100 nm, and / or the thickness of the first conductive trace is less than 1 um.

[0015] In another aspect, the utility model provides an electronic equipment including the directional sound generating folding device.

[0016] In a preferred embodiment, the electronic device comprises the directional sound folding device and a foldable display screen, and the directional sound folding device is arranged on the outermost side of the display screen or integrated inside the display screen.

[0017] Compared with the prior art, the utility model has the following beneficial effects:

[0018] 1、The utility model discloses a UTG is used as the base layer of vibration layer and substrate layer, and is supplemented with the combination design of other functional structures of directional sound device, and the directional sound folding device that can be completely folded in at least one folding direction is prepared, which realizes the sound of the large screen of the directional sound device, and also realizes the advantages of small size, convenient to carry and the like.

[0019] 2、The utility model discloses a UTG is used as the base layer of vibration layer and substrate layer, and the overall thickness of the directional sound device is greatly reduced, and the thinness is realized.

[0020] 3、The utility model discloses the pattern of the conductive layer, the pattern of the micro -pattern layer, the thickness of the folding area of vibration layer and substrate layer on the folding area are designed, and the flexibility of the folding area is improved, so that the folding area is not easy to break under the condition of uneven stress when folding, in addition, the utility model discloses a hardening buffer layer and optical film layer are additionally arranged on the base layer of vibration layer, and a hardening buffer layer is additionally arranged on the base material layer of substrate layer, which prevents the directional sound device from being easily broken and easily scratched under the action of external force, and increases the friction resistance of the sound screen surface, and improves the reliability of the directional sound folding device as a whole. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is the folding state schematic view of the directional sound folding device in an embodiment of the utility model;

[0022] Figure 2 It is the laminated structure schematic view of the directional sound folding device after folding in an embodiment of the utility model;

[0023] Figure 3 It is the laminated structure schematic view of the directional sound folding device in an embodiment of the utility model;

[0024] Figure 4 It is the laminated schematic view of the UTG raw material covered with corrosion -resistant protective film in an embodiment of the utility model;

[0025] Figure 5a 、 Figure 5b It is two kinds of pattern schematic views that the conductive layer of the folding area is in grid shape respectively;

[0026] Figure 6a 、 Figure 6b It is the arrangement schematic view of the micro -pattern layer that square and round dot shape micro -pattern arrangement is in grid shape respectively;

[0027] Figure 7 Figure 1 is a schematic view of a stacked structure of an electronic device according to an embodiment of the present application.

[0028] Reference signs are:

[0029] 1, directional sound emitting folding device, 11, sound emitting part, 111, first sound emitting part, 112, second sound emitting part, 113, third sound emitting part, 12, folding part, 121, first folding part, 122, second folding part, 2, substrate layer, 21, first UFG base material layer, 211, first folding area, 212, first non-folding area, 213, first groove, 22, first conductive layer, 23, first conductive trace, 24, first insulating layer, 25, first hardened buffer layer, 3, micro-pattern layer, 31, second micro-pattern layer, 32, first micro-pattern layer, 4, vibration layer, 41, second UFG base material layer, 411, second folding area, 412, second non-folding area, 413, second groove, 42, second conductive layer, 43, second conductive trace, 44, second insulating layer, 45, second hardened buffer layer, 46, optical film layer, 5, air gap, 6, thinned UTG raw material, 7, corrosion-resistant protective film, 8, area to be etched, 10, electronic device, 20, display screen, 30, OCA optical adhesive. DETAILED DESCRIPTION

[0030] The specific embodiments of the present application will be described in detail below, but it should be understood that the scope of protection of the present application is not limited by the specific embodiments.

[0031] Unless otherwise explicitly indicated, throughout the specification and claims, the term "comprise" or its variants such as "comprises" or "comprising" will be understood to encompass the stated elements or components, without excluding the presence of other elements or components.

[0032] In combination Figures 1 to 3 As shown in the drawings, the directional sound emitting folding device 1 disclosed by the present application comprises a plurality of sound emitting parts 11 and at least one folding part 12 distributed along a first direction (such as a transverse direction), each adjacent two sound emitting parts 11 are connected by a folding part 12, and the sound emitting part 11 is folded away from or close to the client in a second direction (such as a longitudinal direction) to be stacked with the adjacent sound emitting part 11. That is, a directional sound emitting folding device 1 is divided into a plurality of sound emitting parts 11 for directional sound emitting by at least one folding part 12, and a plurality of sound emitting parts 11 can be folded by the corresponding folding part 12, and finally folded into a stacked state.

[0033] In a specific embodiment, the directional sound emitting folding device 1 comprises three sound emitting parts 11 and two folding parts 12, for the convenience of description, defined as the first sound emitting part 111, the first folding part 121, the second sound emitting part 112, the second folding part 122 and the third sound emitting part 113 arranged in sequence along the transverse direction, wherein the first sound emitting part 111 is folded inwardly away from the client, the third sound emitting part 113 is folded outwardly close to the client, and the first sound emitting part 111, the second sound emitting part 112 and the third sound emitting part 113 are arranged in sequence in the longitudinal direction after folding, that is, the three-folded directional sound emitting screen. Of course, in other embodiments, it can also be a two-folded screen, that is, comprising two sound emitting parts 11 and one folding part 12, or it can be expanded to more than four folding screens. When folding, the adjacent sound emitting parts 11 can be alternately folded inwardly and outwardly, for example, one sound emitting part 11 is folded inwardly, and the adjacent sound emitting part 11 is folded outwardly, and so on.

[0034] In a specific embodiment, the directional sound emitting folding device 1 also comprises a substrate layer 2, a micro-pattern layer 3 and a vibration layer 4, the micro-pattern layer 3 is located between the substrate layer 2 and the vibration layer 4, the frame of the vibration layer 4 and the substrate layer 2 are matched, and an air gap 5 is formed between them through the micro-pattern layer 3, and the vibration layer 4 vibrates and emits sound in the direction close to or away from the substrate layer 2 under the action of the externally loaded ultrasonic signal.

[0035] In order to realize the multi-directional folding of the directional sound screen, the structure, material and processing technology of the substrate layer 2, the micro-pattern layer 3 and the vibration layer 4 are different from the existing directional sound screen. In a specific embodiment, the substrate layer 2 specifically comprises a first UFG base material layer 21, a first conductive layer 22, a first conductive trace 23, a first insulating layer 24 and a first hardening buffer layer 25, wherein the first UFG base material layer 21 adopts UFG (unequal thickness flexible glass) material, and specifically comprises at least one first folding area 211 and a plurality of first non-folding areas 212, wherein the thickness of the first folding area 211 is less than that of the first non-folding area 212, specifically one side of the first folding area 211 is flush with one side of the first non-folding area 212, and the other side is lower than the other side of the first non-folding area 212. The thickness of the first folding area 211 is thin, so the flexibility is higher, and the first non-folding area 212 is thick, so the strength is high. In a specific embodiment, the thickness of the first non-folding area 212 is 30um-100um, and the thickness of the first folding area 211 is reduced to 30um-70um. According to different design of the R angle of folding, the thickness of the first folding area 211 is different. Generally speaking, the smaller the R angle, the smaller the thickness of the first folding area 211. For example, when the R angle is between 4mm-5mm, the thickness of the first folding area 211 can be between 50um-70um. If the R angle is less than 4mm, the thickness of the first folding area 211 is between 30um-50um. In a specific embodiment, when the thickness of the first folding area 211 is 30um, the R angle can be 1.5mm.

[0036] The first folding area 211 and the two first non-folding areas 212 adjacent to the two sides thereof form a first groove 213 with an opening facing the folding direction. If folded inward (i.e. away from the client), the opening of the first groove 213 faces inward, i.e. the first groove 213 is outwardly concave. Conversely, if folded outward (i.e. towards the client), the opening of the first groove 213 faces outward, i.e. the first groove 213 is inwardly concave. The depth of the first groove 213 is generally the height difference between the first non-folding area 212 and the first folding area 211.

[0037] In addition, preferably, the thickness of the first folding area 211 folded outward toward the client is greater than the thickness of the first folding area 211 folded inward away from the client, because when the directional sound emitting folding device is combined with the folding display screen, the first folding area 211 folded outward generally has a lower thickness and is easier to fold because the inner side is wrapped with a non-folding backboard, a folding display screen, etc., so the thickness of this area can be kept higher after thinning, such as 50 um, to increase the strength; while the first folding area 211 folded inward generally has a higher thickness and is more difficult to fold because the inner side is wrapped with a folding backboard and a folding display screen, etc., so the thickness of this area can be kept lower after thinning, such as 30 um, or even thinner. Of course, if the thicknesses of the outward folded and inward folded wrapped parts are the same, the thicknesses of the first folding areas 211 corresponding to the outward folded and inward folded can also be set to be the same. For example, in the above-mentioned three-folded embodiment, two first folding areas 211 are formed on the first UFG base material layer 21, and the openings of the two first grooves 213 corresponding to the two first folding areas 211 face in opposite directions, i.e., one faces inward and the other faces outward, and the thicknesses of the two first folding areas 211 are also different, i.e., the thickness of the first folding area 211 folded inward is smaller than the thickness of the first folding area 211 folded outward.

[0038] In implementation, the first UFG base material layer 21 is formed by processing a UTG raw material. In specific preparation, the preparation process of the first UFG base material layer 21 includes: first thinning the UTG raw material (such as 230 um in thickness) to 30 um to 100 um as a whole, and further thinning the folding area of the thinned UTG raw material 6. In a specific embodiment, the process of further thinning the folding area of the thinned UTG raw material 6 includes: covering an anti-corrosion protective film 7 on at least one surface of the thinned UTG raw material 6 and exposing a to-be-etched area 8, immersing the UTG raw material 6 covered with the anti-corrosion protective film 7 in an etching liquid as a whole, etching and thinning the to-be-etched area 8, controlling the thickness of the finally formed first folding area 211 by controlling the time of immersion in the etching liquid, and then removing the anti-corrosion protective film 7. In implementation, the anti-corrosion protective film 7 here can adopt a laser debonding adhesive protective film or a UV debonding adhesive protective film, and the anti-corrosion protective film 7 is preferably printed on the surface of the UTG raw material 6 by a non-contact 3D printing method to prevent the UTG raw material 6 from breaking. The etching liquid can be a hydrofluoric acid (HF) etching liquid. For example, in the above-mentioned three-folded embodiment, because two first folding areas 211 are to be formed on the first UFG base material layer 21, and the openings of the two first grooves 213 corresponding to the two first folding areas 211 face in opposite directions, in preparation, the anti-corrosion protective film 7 needs to be covered on the upper and lower surfaces of the UTG raw material and each expose the folding area to be thinned, and the two folding areas are arranged staggered left and right, as shown in FIG. 6. Figure 4 In implementation, the first UFG base material layer 21 is formed by processing a UTG raw material. In specific preparation, the preparation process of the first UFG base material layer 21 includes: first thinning the UTG raw material (such as 230 um in thickness) to 30 um to 100 um as a whole, and further thinning the folding area of the thinned UTG raw material 6. In a specific embodiment, the process of further thinning the folding area of the thinned UTG raw material 6 includes: covering an anti-corrosion protective film 7 on at least one surface of the thinned UTG raw material 6 and exposing a to-be-etched area 8, immersing the UTG raw material 6 covered with the anti-corrosion protective film 7 in an etching liquid as a whole, etching and thinning the to-be-etched area 8, controlling the thickness of the finally formed first folding area 211 by controlling the time of immersion in the etching liquid, and then removing the anti-corrosion protective film 7. In implementation, the anti-corrosion protective film 7 here can adopt a laser debonding adhesive protective film or a UV debonding adhesive protective film, and the anti-corrosion protective film 7 is preferably printed on the surface of the UTG raw material 6 by a non-contact 3D printing method to prevent the UTG raw material 6 from breaking. The etching liquid can be a hydrofluoric acid (HF) etching liquid. For example, in the above-mentioned three-folded embodiment, because two first folding areas 211 are to be formed on the first UFG base material layer 21, and the openings of the two first grooves 213 corresponding to the two first folding areas 211 face in opposite directions, in preparation, the anti-corrosion protective film 7 needs to be covered on the upper and lower surfaces of the UTG raw material and each expose the folding area to be thinned, and the two folding areas are arranged staggered left and right, as shown in FIG. 6.

[0039] The first conductive layer 22 is formed on the upper end surface of the first UFG substrate layer 21 close to the vibration layer 4 and covers at least the first non-folded region 212 of the first UFG substrate layer 21. In a specific implementation, the thickness of the first conductive layer 22 is generally less than 100 nm. Since the formed folded part is preferably designed to not emit sound, the first folded region 211 can be covered without a conductive layer, or the conductive layer of the first folded region 211 is designed in a grid shape. In preparation, a conductive layer (such as an indium tin oxide ITO conductive layer) can be first plated on the first UFG substrate layer 21, and then the conductive layer corresponding to the first folded region 211 is directly etched or etched in a grid shape to form the first conductive layer 22. Preferably, in an embodiment, the grid lines of the grid-shaped conductive layer are in solid or dashed lines, as shown in Figure 5a and Figure 5b The grid lines of the grid-shaped conductive layer have a line width of 6-10 um and a line spacing of more than 1 mm. This design can avoid the problem of unstable structure of the folded part caused by the vibration of the vibration layer 4 of the sound emitting part 11, and can weaken the appearance etching lines.

[0040] The first conductive trace 23 is formed on the four peripheral edges of the first conductive layer 22 close to the upper end surface of the vibration layer 4, for increasing the conductivity of the first conductive layer 22. In preparation, a mask can be used to directly magnetron sputter or evaporate metal on the trace area of the first conductive layer 22, or the entire first conductive layer 22 can be magnetron sputtered or evaporated with metal, and then the metal except the trace area is etched to form. In implementation, the first conductive trace 23 can be a copper trace or a silver paste layer, and the thickness is preferably less than 1 um, so that the formed step difference is low, and the fragmentation of the first UFG substrate layer 21 is low. In a specific implementation case, if the first conductive trace 23 is a copper trace, the thickness is generally less than 0.9 um. The adhesion of the copper trace with a thickness higher than 0.9 um to the first conductive layer 22 on the surface of the first UFG substrate layer 21 is poor, but the line resistance of the copper trace with a thickness lower than 0.9 um is increased, and the load power of the directional sound emitting folded device is increased. In another specific implementation case, the first conductive trace 23 can be a composite laminated structure, specifically including a decorative layer (not shown in the figure) and a conductive trace layer (not shown in the figure) laminated with the decorative layer. The conductive trace layer is arranged on the four peripheral edges of the first conductive layer 22 close to the upper end surface of the vibration layer 4, and the decorative layer is laminated on the conductive trace layer close to the upper end surface of the vibration layer 4 (i.e. close to the client side). In implementation, the decorative layer can be black ink, which can be conductive or non-conductive, used for decorating the first conductive layer 22, and can be used as a cover frame to increase the appearance beauty, and can realize the design of narrow frame or even no frame when combined with the display screen.

[0041] The first insulating layer 24 is formed on the upper end surface of the first conductive layer 22 close to the vibration layer 4 and covers the first conductive trace 23, the first conductive layer 22 and the first folding area 211. In preparation, the first insulating layer 24 can be formed on the first conductive layer 22 by printing or silk printing or coating. The thickness is generally preferably designed between 6um-12um, and the material is preferably low resistance and low thickness.

[0042] The first hardening buffer layer 25 is formed on the lower end surface of the first UFG substrate layer 21 away from the vibration layer 4. In preparation, the first hardening buffer layer 25 can be formed on the first UFG substrate layer 21 by printing or silk printing or coating, like the first insulating layer 24.

[0043] In a specific embodiment, the vibration layer 4 specifically includes a second UFG substrate layer 41, a second conductive layer 42, a second conductive trace 43, a second insulating layer 44, a second hardening buffer layer 45 and an optical film layer 46. The substrate layer of the vibration layer 4, i.e. the second UFG substrate layer 41, is also made of UFG (unequal thickness flexible glass) material, which specifically includes at least one second folding area 411 and a plurality of second non-folding areas 412. The structure, material and preparation process of the second UFG substrate layer 41 are the same as those of the first UFG substrate layer 21 described above, so the description of the first UFG substrate layer 21 can be referred to here.

[0044] In addition, preferably, the thickness of the second folding area 411 folded outward toward the client is greater than the thickness of the first folding area 211 folded outward toward the client, and / or the thickness of the first folding area 211 folded inward away from the client is greater than the thickness of the second folding area 411 folded inward away from the client. The advantage of this design is that the R angle of the folding is designed to be smaller, which is not easy to cause the folding of the folding part caused by the uneven stress.

[0045] The second conductive layer 42 is formed on the lower end surface of the second UFG substrate layer 41 close to the substrate layer 2 and covers at least the second non-folded region 412 of the second UFG substrate layer 41. The second conductive trace 43 is formed on the periphery of the second conductive layer 42 close to the lower end surface of the substrate layer 2 for increasing the conductivity of the second conductive layer 42. The second insulating layer 44 is formed on the lower end surface of the second conductive layer 42 close to the substrate layer 2 and covers the second conductive trace 43, the second conductive layer 42 and the second folded region 411. The second hardened buffer layer 45 is formed on the upper end surface of the second UFG substrate layer 41 away from the substrate layer 2. Again, the structure, material and preparation process of the second conductive layer 42, the second conductive trace 43, the second insulating layer 44 and the second hardened buffer layer 45 are the same as those of the first conductive layer 22, the first conductive trace 23, the first insulating layer 24 and the first hardened buffer layer 25, so the corresponding descriptions above can be referred to and will not be repeated here.

[0046] Preferably, the thickness of the second hardening buffer layer 45 and the second insulating layer 44 is set to be different, because compared with the second insulating layer 44, the main role of the second hardening buffer layer 45 is to prevent splashing when the second UFG substrate layer 41 is broken, and at the same time, the drop test or the heavy object hitting the screen close to the client, this layer plays a buffering role. Therefore, the thickness of the above-mentioned second hardening buffer layer 45 is set to be between 15um and 25um, the higher the thickness, the stronger the impact resistance, and the larger the pencil hardness, but higher than 25um, the folding R angle will be limited. The second insulating layer 44 is the dielectric layer of the parallel-plate capacitor, and its main role is insulation. The thickness of this layer of material is generally preferably designed to be between 6um and 12um, which is lower than 6um, and the voltage resistance is weak, which will cause a certain probability of breakdown, but if the thickness is too thick, the system power will increase, and the relative loss of energy of the medium will increase. In addition, the roles of the second hardening buffer layer 45 and the first hardening buffer layer 25 are also different, because the second hardening buffer layer 45 is close to the client and is a hardening layer, its role is to prevent scratching and increase the surface friction resistance, while the first hardening buffer layer 25 is away from the client and is a buffer layer, and its Young's modulus is generally between 100Pa and 1000Pa, the lower the Young's modulus, the better the buffering effect. The first insulating layer 24 and the second insulating layer 44 are both dielectric layers in the dielectric layer, and the total thickness of the two layers is preferably 6um to 12um, and most of the thickness is preferably designed in the second insulating layer 44, such as the thickness of the second insulating layer 44 is 10um and the thickness of the first insulating layer 24 is 2um. The advantage of such design is that the second insulating layer 44 is in the vibration layer 4, and the first insulating layer 24 is in the substrate layer 2. In the process of device sound emission, there is a probability that the maximum amplitude of the vibration layer 4 touches the surface of the substrate layer 2. With the increase of working time, the surface of the substrate layer 2 that is touched is easy to break. Therefore, if the thickness of the second insulating layer 44 is greater than that of the first insulating layer 24, the probability of breaking the surface of the substrate layer 2 can be reduced. If the directional sound emission folding device 1 is combined with a display screen, since the substrate layer 2 as a whole is attached to the display screen, the thickness of the second hardening buffer layer 45 is preferably low, and in an embodiment, the thickness of the second hardening buffer layer 45 is preferably between 2um and 4um.

[0047] The optical film layer 46 is formed on the upper end face of the second hardening buffer layer 45 away from the substrate layer 2. In implementation, the optical film layer 46 is specifically an anti-glare (AG) / anti-reflection (AR) / anti-fingerprint (AF) layer, and its thickness is less than 5um, generally about 1um. The thickness is related to the process, and generally the thickness is greater than 5um, which will affect the folding R angle.

[0048] Preferably, the second hardening buffer layer 45 and the second UFG substrate layer 41 herein do not contain optical adhesive, and the second hardening buffer layer 45 of the utility model is a layer of material, integrally formed, after curing, the surface layer of the second hardening buffer layer 45 has hardening characteristics, and the surface hardness can reach at least 750g 2H, and can reach up to 750g 7H. In other alternative embodiments, the second hardening buffer layer 45 can also use traditional OCA sheet to adhere TPU (thermoplastic polyurethane rubber) or PET (polyethylene terephthalate) or CPI (transparent polyimide film) and other materials with hardening layer Hardcoating.

[0049] In addition, since the first insulating layer 24, the first hardening buffer layer 25, the second insulating layer 44 and the second hardening buffer layer 45 all need to fill the folding area, the refractive index thereof is preferably close to the refractive index of the UFG substrate, such as the refractive index between 1.5-1.7, which has the advantages that the folding area corner has no corner reflection mark, and when the whole screen is unfolded, no obvious light and shadow is seen in the original designed folding area.

[0050] The micro-pattern layer 3 is formed on the upper end face of the first insulating layer 24 close to the vibration layer 4, and specifically includes the first micro-pattern layer 32 corresponding to the folding part and the second micro-pattern layer 31 corresponding to the sound generating part 11. Since the first micro-pattern layer 32 only plays a process role and does not need to be used as a sound generating functional layer, the pattern design of the first micro-pattern layer 32 can be different from that of the second micro-pattern layer 31. In a specific embodiment, the micro-pattern arrangement of the first micro-pattern layer 32 can be grid-shaped, and the center point of the micro-pattern is located at the lattice point, and the spacing between the adjacent two micro-patterns of the first micro-pattern layer 32 can be set to be different, which can be set according to the requirements of folding flexibility and other parameters. In other alternative embodiments, the micro-pattern layer 3 can also be formed on the lower end face of the second insulating layer 44 close to the substrate layer 2, and the utility model does not limit this, as long as the micro-pattern layer 3 is located between the substrate layer 2 and the vibration layer 4 after being attached. In implementation, the micro-pattern layer 3 can be formed by silk printing or 3D printing. In implementation, the single micro-pattern of the micro-pattern layer can be but is not limited to circular, rectangular and the like, and the grid-shaped arrangement is preferably a diamond-shaped grid formed by diagonal crossing, such as Figure 6a and Figure 6b as shown.

[0051] Compared with the existing vibration layer 4 adopting PET or other base film materials, the substrate layer 2 adopts PET or tempered glass CG or other base film materials, the overall thickness of the directional sound emitting screen is greatly reduced, and the light and thin design is realized. Specifically, the thickness of the first UFG base material layer 21 and the second UFG base material layer 41 is 30um-100um, the total thickness of the vibration layer 4 is 52um-138um, the total thickness of the substrate layer 2 is 38um-116um, and the total thickness of the directional sound emitting folding device 1 formed is 90um-254um. Compared with the total thickness of the existing directional sound emitting screen of 375um-525um, the thickness is greatly reduced.

[0052] As shown in Figure 7 The utility model discloses still disclose an electronic equipment 10, the electronic equipment 10 includes at least the directional sound emitting folding device 1, or including the directional sound emitting folding device 1 and foldable display screen 20, when combining with display screen 20, can directly whole pasting directional sound emitting folding device 1 here to display screen 20, such as through OCA optical cement 30 pasting to the display surface of display screen 20, pasting, can first with display screen 20 pasting above-mentioned substrate layer 2 first, then substrate layer 2 and vibration layer 4 are pasted, or first substrate layer 2 and vibration layer 4 are pasted, then substrate layer 2 and display screen 20 are pasted, how to paste specifically can refer to the description in the preparation process of electronic equipment. Or in other embodiments, above-mentioned directional sound emitting folding device 1 can be integrated into the inside of display screen 20. The display screen 20 here can be but not limited to OLED, LED, LCD display screen etc., and the electronic equipment 10 can be but not limited to computer, mobile device such as mobile phone.

[0053] The utility model discloses the advantages lie in, 1, the utility model discloses a UTG as the base layer of vibration layer and substrate layer, and the combination design of other functional structure of directional sound device is supplemented, preparation forms the directional sound folding device of at least one folding direction complete folding, realizes directional sound device big screen sound emission simultaneously, and realizes its small, portable etc. advantage. 2, the utility model discloses a UTG as the base layer of vibration layer and substrate layer, greatly reduces the overall thickness of directional sound device, realizes its light and thin. 3, the utility model discloses the pattern of the conductive layer of the folding area corresponding on vibration layer and substrate layer, the pattern of micro -pattern layer, folding area thickness etc. design, improve the flexibility of folding area, so that folding area is not easy to break under the condition of uneven stress when folding, in addition, the utility model discloses a hardening buffer layer and optical film layer are additionally arranged on the base layer of vibration layer and the base material layer of substrate layer, prevent directional sound device under the action of external force easy to break and easy to scratch, and increase the friction resistance of the sound screen surface, improve the reliability of directional sound folding device whole.

[0054] The foregoing description of specific exemplary embodiments of the present application is intended to be illustrative only and is not intended to limit the present application to the precise forms disclosed. Many modifications and variations are possible in light of the above teachings without departing from the spirit or essential characteristics of the present application. The particular exemplary embodiments were chosen and described in order to explain the principles of the present application and its practical application to thereby enable others skilled in the art to best utilize the present application and various embodiments with various modifications as are suited to the particular use contemplated. It is intended that the scope of the present application be defined by the claims and their equivalents.

Claims

1. A directional sound producing folding device, characterized by, The device comprises a vibration layer, a substrate layer and a micro-pattern layer between the vibration layer and the substrate layer, the frame of the vibration layer and the substrate layer are matched, and an air gap is formed between the two layers through the micro-pattern layer, the vibration layer vibrates to the direction of approaching or moving away from the substrate layer under the action of an externally loaded ultrasonic signal; the device comprises a plurality of sound-emitting parts and at least one folding part distributed along a first direction, each adjacent two sound-emitting parts are connected by a folding part, and the sound-emitting part is folded to the adjacent sound-emitting part in a second direction.

2. A directional sound emitting folding device as claimed in claim 1, characterized in that The device comprises a first sound-emitting part, a first folding part, a second sound-emitting part, a second folding part and a third sound-emitting part distributed along a first direction, the first sound-emitting part is folded inwardly away from the client, the third sound-emitting part is folded outwardly towards the client, and the first sound-emitting part, the second sound-emitting part and the third sound-emitting part are arranged in a second direction.

3. A directional sound emitting folding device as claimed in claim 1, characterized in that The substrate layer comprises a first UFG substrate layer and a first conductive layer, the first UFG substrate layer comprises at least one first folding area corresponding to the folding part and a plurality of first non-folding areas corresponding to the sound-emitting part, the thickness of the first folding area is smaller than that of the first non-folding area, and the first folding area and the two first non-folding areas adjacent to the two sides of the first folding area form a first groove with an opening facing the folding direction; the first conductive layer is formed on the upper end surface of the first UFG substrate layer close to the vibration layer and covers at least the first non-folding area of the first UFG substrate layer; and / or the vibration layer comprises a second UFG substrate layer and a second conductive layer, the second UFG substrate layer comprises at least one second folding area corresponding to the folding part and a plurality of second non-folding areas corresponding to the sound-emitting part, the thickness of the second folding area is smaller than that of the second non-folding area, and the second folding area and the two second non-folding areas adjacent to the two sides of the second folding area form a second groove with an opening facing the folding direction; the second conductive layer is formed on the lower end surface of the second UFG substrate layer close to the substrate layer and covers at least the second non-folding area of the second UFG substrate layer.

4. A directional sound emitting folding device as claimed in claim 3, characterized in that The substrate layer further comprises a first conductive trace, a first insulating layer and a first hardening buffer layer, the first conductive trace is formed on the four peripheral edges of the first conductive layer close to the upper end surface of the vibration layer, the first insulating layer is formed on the first conductive layer close to the upper end surface of the vibration layer and covers the first conductive trace, the first conductive layer and the first folding area, and the first hardening buffer layer is formed on the lower end surface of the first UFG substrate layer away from the vibration layer; and / or the vibration layer further comprises a second conductive trace, a second insulating layer, a second hardening buffer layer and an optical film layer, the second conductive trace is formed on the four peripheral edges of the second conductive layer close to the lower end surface of the substrate layer, the second insulating layer is formed on the second conductive layer close to the lower end surface of the substrate layer and covers the second conductive trace, the second conductive layer and the second folding area, the second hardening buffer layer is formed on the upper end surface of the second UFG substrate layer away from the substrate layer, and the optical film layer is formed on the upper end surface of the second hardening buffer layer away from the substrate layer.

5. A directional sound emitting folding device as claimed in claim 3, characterized in that The first folding area and the second folding area are not covered by the conductive layer, or the corresponding conductive layer at the first folding area and the second folding area is in a grid shape, and / or the grid lines of the grid-shaped conductive layer are in a solid line shape or a dashed line shape, and / or the line width of the grid lines of the grid-shaped conductive layer is 6um-10um, and the line spacing is more than 1mm.

6. A directional sound emitting folding device as claimed in claim 4, characterized in that The micro-pattern layer is formed on the first insulating layer close to the upper end surface of the vibration layer, the micro-pattern layer comprises a first micro-pattern layer corresponding to the folding part and a second micro-pattern layer corresponding to the sound generating part, the pattern of the first micro-pattern layer is different from the pattern of the second micro-pattern layer; and / or the micro-patterns of the first micro-pattern layer are arranged in a grid shape, and the center points of the micro-patterns are located at the grid points.

7. A directional sound emitting folding device as claimed in claim 3, characterized in that The total thickness of the vibration layer is 52um-138um, and / or the total thickness of the substrate layer is 38um-116um, and / or the total thickness of the directional sound generating folding device is 90um-254um, and / or the thickness of the first UFG substrate layer and the second UFG substrate layer is 30um-100um; and / or the thickness of the first folding area is 30um-70um, and / or the thickness of the second folding area is 30um-70um, and / or the thickness of the first folding area folded outwardly towards the client is greater than the thickness of the first folding area folded inwardly away from the client, and / or the thickness of the second folding area folded outwardly towards the client is greater than the thickness of the second folding area folded inwardly away from the client, and / or the thickness of the second folding area folded outwardly towards the client is greater than the thickness of the first folding area folded outwardly towards the client, and / or the thickness of the first folding area folded inwardly away from the client is greater than the thickness of the second folding area folded inwardly away from the client.

8. A directional sound emitting folding device as claimed in claim 4, characterized in that The thickness of the second hardening buffer layer is 15um-25um, and / or the thickness of the optical film layer is less than 5um, and / or the total thickness of the first and second insulation layers is 6um-12um, and / or the thickness of the second conductive layer is less than 100nm, and / or the thickness of the second conductive track is less than 1um; and / or the thickness of the first hardening buffer layer is 2um-4um, and / or the thickness of the first conductive layer is less than 100nm, and / or the thickness of the first conductive track is less than 1um.

9. An electronic device, comprising: The electronic device at least comprises the directional sound folding device according to any one of claims 1-8.

10. An electronic device as claimed in claim 9, characterized in that The electronic device comprises the directional sound folding device and a foldable display screen, and the directional sound folding device is arranged on the outermost side of the display screen or integrated in the inside of the display screen.

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