Heat dissipation structure and laser therapeutic instrument

Abstract

The utility model discloses a heat dissipation structure and laser therapeutic instrument relates to heat dissipation equipment technical field, wherein the heat dissipation structure includes water cooler and two radiator, water cooler includes water cooling box and two refrigeration sheet, water cooling box is equipped with water inlet and water outlet, each refrigeration sheet has the hot surface and cold surface that deviates from each other, the water cooling box is equipped with the water inlet and the water outlet, and the water cooling box is equipped with the water inlet and the water outlet. The two refrigeration pieces are arranged on the two opposite side faces of the water cooling box, the cold faces of the refrigeration pieces abut against the side faces of the water cooling box, and the two radiators are connected with the water cooling box and abut against the hot faces of the two refrigeration pieces respectively. According to the technical scheme provided by the utility model, the problem that the radiating scheme of the existing semiconductor waterway refrigeration radiator may cause overload of the radiator is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation equipment technical field, especially a heat dissipation structure and laser therapeutic instrument. BACKGROUND

[0002] In the related art, the heat dissipation scheme of the semiconductor waterway refrigeration radiator adopts connecting the same radiator on the hot surface of two refrigeration fins, and connecting a water cooler on the cold surface of each refrigeration fin. However, in this way, the hot surface of the two refrigeration fins is connected to the same radiator, and one radiator needs to handle the heat of two refrigeration fins at the same time, which may cause the radiator to be overloaded, limiting the overall heat dissipation performance. SUMMARY

[0003] The main purpose of the utility model is to provide a heat dissipation structure and laser therapeutic instrument, which aims to solve the problem that the heat dissipation scheme of the existing semiconductor waterway refrigeration radiator may cause the radiator to be overloaded.

[0004] To achieve the above-mentioned purpose, the utility model provides a heat dissipation structure, the heat dissipation structure includes: a water cooler, the water cooler includes a water cooling box and two refrigeration fins, the water cooling box is equipped with a water inlet and a water outlet, each refrigeration fin has a hot surface and a cold surface facing away from each other, two refrigeration fins are arranged on the opposite two sides of the water cooling box, and the cold surface of the refrigeration fin is in abutment with the side surface of the water cooling box;And two radiators, two radiators are connected with the water cooling box, and are in abutment with the hot surface of two refrigeration fins respectively.

[0005] In an embodiment, the heat dissipation structure further includes a heat insulating piece, the heat insulating piece is arranged around the refrigeration fin and is in abutment with the water cooling box and the radiator respectively.

[0006] In an embodiment, the radiator includes a heat pipe assembly and a fin assembly, one end of the heat pipe assembly is in contact with the hot surface of the refrigeration fin, and the other end of the heat pipe assembly is inserted into the fin assembly.

[0007] In an embodiment, the heat pipe assembly includes a plurality of heat pipes, the fin assembly is provided with a plurality of insertion slots, and a plurality of heat pipes are inserted into a plurality of insertion slots one by one.

[0008] In an embodiment, the heat pipe includes a contact section and a plurality of connection sections, the plurality of connection sections are connected to the contact section at intervals and are all connected to the contact section by bending;The insertion slot includes a plurality of connection slots, the connection slots are arranged one by one corresponding to the connection sections, the connection sections are inserted into the connection slots, and the contact section is used for contacting the hot surface of the refrigeration fin.

[0009] In an embodiment, the heat sink further comprises a heat-conducting fixing plate connected to the fin assembly, the heat-conducting fixing plate is provided with a slot, and the contact section extends out of the slot to be exposed outside the slot.

[0010] In an embodiment, the water-cooled box is provided with a water passing groove, the water inlet and the water outlet are respectively communicated with two ends of the water passing groove, and the water passing groove comprises a plurality of continuous S-shaped bending sections arranged alternately in sequence in the length direction of the water-cooled box.

[0011] In an embodiment, the heat dissipation structure further comprises a shell and a heat dissipation fan, the shell is provided with a cavity and an opening communicated with the cavity, the water-cooled box, the two refrigeration fins and the two heat sinks are arranged in the cavity, and the heat dissipation fan is arranged at the opening.

[0012] In an embodiment, the opening is provided with two openings arranged along the extension direction of the shell, and the heat dissipation fan is provided with two heat dissipation fans respectively connected to the two openings.

[0013] The utility model also provides a laser therapeutic instrument, the laser therapeutic instrument includes the heat dissipation structure as above.

[0014] Compared with the prior art, the heat dissipation structure and the laser therapeutic instrument have the following beneficial effects:

[0015] The utility model technical scheme arranges two refrigeration fins on two sides of the water cooler, the cold surface of the two refrigeration fins contacts the two sides of the water cooler, the hot surface of the two refrigeration fins is contacted and cooled by the two heat sinks, that is, the hot surface of each refrigeration fin is cooled by the independent heat sink, which can disperse the heat load, avoid the overload of the heat sink and improve the cooling efficiency. DRAWINGS

[0016] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained from the structure shown in the drawings without creative labor.

[0017] Figure 1 It is a structure schematic view of one embodiment of the heat dissipation structure of the utility model;

[0018] Figure 2 It is a structure schematic view of another embodiment of the heat dissipation structure of the utility model;

[0019] Figure 3 Figure 1 is an exploded view of one embodiment of the heat dissipation structure of the present application;

[0020] Figure 4 Figure 2 is another exploded view of one embodiment of the heat dissipation structure of the present application;

[0021] Figure 5 Figure 3 is a structural view of one embodiment of the heat radiator of the present application;

[0022] Figure 6 Figure 4 is an exploded view of one embodiment of the heat radiator of the present application;

[0023] Figure 7 Figure 5 is a structural view of one embodiment of the water cooler of the present application;

[0024] Figure 8 Figure 6 is an exploded view of one embodiment of the water cooler of the present application.

[0025] Brief Description of the Drawings:

[0026] 100, heat dissipation structure; 10, water cooler; 11, water cooling tank; 111, water passing groove; 112, water inlet pipe; 113, water outlet pipe; 114, cover plate; 115, sealing ring; 116, water inlet; 12, refrigeration fin; 121, hot surface; 122, cold surface; 20, heat radiator; 21, heat conduction pipe assembly; 211, heat conduction pipe; 2111, contact section; 2112, connecting section; 22, heat dissipation fin assembly; 221, insertion slot; 2211, connecting slot; 23, heat conduction fixing plate; 231, slot opening; 30, heat insulation piece; 40, outer shell; 41, cavity; 42, opening; 43, fixing pressing plate; 50, heat dissipation fan.

[0027] The present application is achieved, the functional features and advantages will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0029] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications will also change accordingly.

[0030] In addition, the description of "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor in the protection scope required by the present application.

[0031] Please refer to Figures 1 to 8 The utility model provides a heat dissipation structure 100, the heat dissipation structure 100 includes: water cooler 10, water cooler 10 includes water cooling box 11 and two refrigeration fin 12, water cooling box 11 is equipped with water inlet 116 and water outlet (not shown in the figure), every refrigeration fin 12 has the hot face 121 and cold face 122 of facing away, two refrigeration fin 12 are located water cooling box 11 opposite two sides, and the cold face 122 of refrigeration fin 12 is in contact with the side of water cooling box 11, and two heat sinks 20, two heat sinks 20 are connected with water cooling box 11, and are in contact with the hot face 121 of two refrigeration fin 12 respectively.

[0032] Specifically, the heat dissipation structure 100 includes water cooler 10 and two heat sinks 20, water cooler 10 includes water cooling box 11 and two refrigeration fin 12, refrigeration fin 12 includes cold face 122 and hot face 121, water cooling box 11 has water inlet 116 and water outlet, two cold faces 122 of two refrigeration fin 12 are respectively attached to two opposite faces of water cooling box 11, to refrigerate the water in water cooling box 11, and then make the water flow out to other components (such as laser), so that the cold water is cooled to other components.

[0033] In addition, the water inlet 116 and the water outlet of the water cooling box 11 are respectively connected with the water inlet pipe 112 and the water outlet pipe 113, so as to introduce the water absorbed by the heat, and then discharge the cooling water after refrigerating the water, so as to realize effective cooling circulation.

[0034] The hot face 121 of the two refrigeration fin 12 is in contact with the two heat sinks 20 respectively, which is convenient and fast for heat dissipation.

[0035] The connection mode of the refrigeration sheet 12 and the water-cooled box 11 can be directly connected to the water-cooled box 11, or can be clamped between the water-cooled box 11 and the heat sink 20 in cooperation with the water-cooled box 11. The connection mode between the heat sink 20 and the water-cooled box 11 can be directly connected by screws, or the heat sink 20 and the water-cooled box 11 can be connected by setting a fixing piece. The specific connection mode can be selected according to actual needs, as long as the cold surface 122 of the refrigeration sheet 12 and the side surface of the water-cooled box 11 are abutted, and the hot surface 121 of the refrigeration sheet 12 and the heat sink 20 are abutted.

[0036] By connecting the hot surfaces 121 of the two refrigeration sheets 12 to two independent heat sinks 20, the hot surface 121 of each refrigeration sheet 12 is cooled by an independent heat sink 20, the heat is dispersed, and the overload of a heat sink 20 is avoided. Each heat sink 20 only handles the heat of one refrigeration sheet 12, which can better control the temperature and avoid the formation of local hot spots. Meanwhile, the independent heat sink 20 can optimize the heat dissipation path to ensure that the heat is quickly and effectively dissipated to the environment. Each hot surface 121 of the refrigeration sheet 12 has an independent heat sink 20, which increases the total heat dissipation area and improves the heat dissipation efficiency.

[0037] The cold surface 122 of each refrigeration sheet 12 is in contact with the two side surfaces of the water cooler 10, which ensures uniform distribution of the temperature of the cold surface 122. By dispersing the heat load and improving the heat dissipation efficiency, the overheating of the heat sink 20 is avoided, the cooling effect of the water-cooled box 11 is improved, and the service life of the heat sink 20 and the refrigeration sheet 12 is prolonged.

[0038] The technical scheme of the utility model discloses that two refrigeration sheets 12 are arranged on the two side surfaces of the water cooler 10, the cold surfaces 122 of the two refrigeration sheets 12 are in contact with the two side surfaces of the water cooler 10, and the hot surfaces 121 of the two refrigeration sheets 12 are in contact with the two heat sinks 20 for heat dissipation. That is, the hot surface 121 of each refrigeration sheet 12 is cooled by an independent heat sink 20. This arrangement can disperse the heat load, avoid the overload of the heat sink 20, and improve the heat dissipation efficiency.

[0039] In the embodiment of the utility model, the heat insulation piece 30 is arranged around the refrigeration sheet 12 and abuts against the water-cooled box 11 and the heat sink 20 respectively.

[0040] The heat insulation piece 30 is annular and arranged around the refrigeration sheet 12. Meanwhile, the heat insulation piece 30 abuts between the water-cooled box 11 and the heat sink 20. The hot surface 121 of the refrigeration sheet 12 is surrounded by the heat insulation piece 30 and faces the heat sink 20. Therefore, the heat of the hot surface 121 can be efficiently conducted to the heat sink 20, and cannot be externally dissipated to the surface of the water-cooled box 11 to have a negative effect on the refrigeration of the water-cooled box 11.

[0041] Reference Figure 4The surface of the water-cooled box 11 is attached to the cold surface 122, and the hot surface 121 is attached to the heat sink 20. Because the refrigeration sheet 12 has a certain thickness, there is a certain space between the water-cooled box 11 and the heat sink 20. The water-cooled box 11 needs cold air to cool the water inside, and the heat sink 20 will absorb hot air to generate heat. Therefore, the space between the water-cooled box 11 and the heat sink 20 is separated by the heat insulation piece 30 to avoid the hot air of the heat sink 20 and the surface of the water-cooled box 11 to exchange air and affect the refrigeration effect of the water-cooled box 11. The surface of the water-cooled box 11 is divided into two parts, one part is attached to the cold surface 122 for refrigeration, and the other part is attached to the heat insulation piece 30 to avoid air flow with the heat sink 20 or the hot surface 121. It should be noted that because the water-cooled box 11 has two corresponding heat sinks 20 on both sides, the corresponding heat insulation piece 30 is also corresponding to two, Figure 4 Only one is shown in the figure.

[0042] The heat insulation piece 30 can be a foamed glue layer, an aerogel layer or a foamed plastic layer. In an embodiment, as shown in the figure, Figure 4 The heat insulation piece 30 is a foamed glue layer. The foamed glue has foaming and bonding properties, and is used for filling, sealing and bonding at the joints and holes. The foamed glue foam after curing has the effects of joint filling, bonding, sealing, heat insulation and sound absorption, and can be applied to sealing and plugging, filling and jointing, fixing and bonding, and heat preservation and sound insulation. That is, the foamed glue has a low thermal conductivity, which can effectively isolate the heat transfer between the cold surface and the hot surface. In use, the water-cooled plate assembly and the heat pipe heat sink are fixed by screws, and then the foamed glue layer is arranged in the gap between the two. The heat insulation foamed glue is used for sealing and isolation to prevent heat loss of the cold surface and the hot surface. Through the isolation of the heat insulation foamed glue, the temperature difference between the cold surface 122 and the hot surface 121 can be better maintained, the efficient work of the refrigeration sheet 12 is ensured, unnecessary energy loss is reduced, and the energy efficiency ratio of the equipment is improved.

[0043] In the embodiment of the utility model, the heat sink 20 includes a heat conduction pipe assembly 21 and a heat dissipation fin assembly 22. One end of the heat conduction pipe assembly 21 is in contact with the hot surface 121 of the refrigeration sheet 12, and the other end of the heat conduction pipe assembly 21 is inserted into the heat dissipation fin assembly 22.

[0044] Specifically, the heat sink 20 is provided as a heat conduction pipe assembly 21 and a heat dissipation fin assembly 22. The heat conduction pipe assembly 21 is L-shaped or U-shaped, one segment is attached to the hot surface 121 of the refrigeration sheet 12, and the other segment is inserted into the heat dissipation fin assembly 22. Through the heat conduction pipe assembly 21, the heat of the hot surface 121 of the refrigeration sheet 12 can be quickly transferred to the entire heat dissipation fin assembly 22.

[0045] The heat conduction pipe assembly 21 is made of a high-thermal-conductivity material and has very high thermal conductivity, and the heat conduction pipe assembly 21 quickly transfers heat into the fin assembly 22, optimizes a heat dissipation path, and ensures that heat can be quickly dissipated to the environment.

[0046] In another embodiment, as Figure 6 The fin assembly 22 comprises a plurality of fins, and the fins are arranged in a wave shape, so that the heat dissipation area is increased and the heat dissipation efficiency is improved. The fin assembly 22 can be made of aluminum sheets, copper sheets or ceramic sheets.

[0047] The combination of the heat conduction pipe assembly 21 and the fin assembly 22 can reduce thermal resistance, quickly transfer heat into the fin assembly 22, ensure uniform distribution of the temperature of the hot surface 121 of the refrigeration sheet 12, and improve the overall reliability of the system. Through efficient heat transfer and heat dissipation, heat accumulation in a certain area can be prevented, local overheating can be avoided, and the radiator 20 and the refrigeration sheet 12 can be protected from high-temperature damage.

[0048] In the embodiment of the utility model, the heat conduction pipe assembly 21 comprises a plurality of heat conduction pipes 211, and the fin assembly 22 is provided with a plurality of insertion grooves 221, and the plurality of heat conduction pipes 211 are inserted into the plurality of insertion grooves 221 one by one.

[0049] In detail, as Figure 6 The heat conduction pipe assembly 21 comprises a plurality of heat conduction pipes 211, and the plurality of heat conduction pipes 211 can provide more heat conduction paths, ensure that heat is quickly transferred from the hot surface 121 of the refrigeration sheet 12 to the fin assembly 22, and can significantly improve the heat transfer efficiency.

[0050] The specific number of the heat conduction pipes 211 can be selected according to the power requirement of the heat-generating element to meet different heat dissipation requirements. Each heat conduction pipe 211 can independently conduct heat, thereby improving the overall heat conduction efficiency and ensuring efficient heat conduction.

[0051] In the embodiment of the utility model, the heat conduction pipe 211 comprises a contact section 2111 and a plurality of connection sections 2112, the plurality of connection sections 2112 are connected to the contact section 2111 at intervals and are all bent and connected with the contact section 2111, the insertion groove 221 comprises a plurality of connection grooves 2211, the connection grooves 2211 are arranged in one-to-one correspondence with the connection sections 2112, the connection sections 2112 are inserted into the connection grooves 2211, and the contact section 2111 is used for contacting the hot surface of the refrigeration sheet.

[0052] In detail, the number of the connecting segments 2112 can be set according to actual needs, and can be two, three or four. By setting multiple connecting segments 2112, the connecting segments 2112 are inserted into the connecting grooves 2211, the heat transfer area can be increased, and the connection can be ensured firm to prevent loosening or displacement during use. The heat pipe 211 transfers heat from the hot surface 121 of the refrigeration fin 12 to the grooves of the heat sink assembly 22, optimizes the heat dissipation path, and ensures that heat can be quickly dissipated to the environment.

[0053] As Figure 6 In an embodiment, two connecting segments 2112 are provided, and the heat pipe 211 is arranged in a U shape, and the contact segment 2111 is in contact with the hot surface 121 of the refrigeration fin 12, and the contact area is large, so that heat can be more effectively transferred. Meanwhile, two connecting grooves 2211 are provided, and the two connecting grooves 2211 can accommodate two connecting segments 2112, so that heat can be quickly transferred and the connection is stable.

[0054] In an embodiment, as Figure 5 and Figure 6 The surface of the contact segment 2111 is designed as a plane, which can better fit the hot surface 121 of the refrigeration fin 12, facilitate increasing the contact area with the hot surface 121 of the refrigeration fin 12, and ensure good heat conduction.

[0055] In the embodiment of the utility model, the heat sink 20 further includes a heat-conducting fixing plate 23, the heat-conducting fixing plate 23 is connected on the heat sink fin assembly 22, the heat-conducting fixing plate 23 is provided with a notch 231, and the contact segment 2111 is exposed outside the notch 231 by extending from the notch 231.

[0056] It is worth noting that by providing the heat-conducting fixing plate 23, on the one hand, the contact segment 2111 of the heat pipe 211 can be in closer direct contact with the hot surface 121 of the refrigeration fin 12, reducing thermal resistance and ensuring efficient heat transfer. In addition, it can also serve as an additional heat conduction path to help evenly distribute heat.

[0057] On the other hand, the heat pipe 211 can be protected on the peripheral side, and the safety of the heat pipe 211 during use can be ensured when it is subjected to external impact or collision.

[0058] The heat-conducting fixing plate 23 can be made of red copper or ceramic or other materials with good heat conductivity. In an embodiment, the heat-conducting fixing plate 23 is made of an aluminum plate, and the heat pipe 211 directly connects the heat-conducting fixing plate 23 and the heat sink by welding, so that the heat of the hot surface 121 of the refrigeration fin 12 can be quickly transferred to the heat sink through the heat pipe 211.

[0059] In the embodiment of the utility model, the water cooling box 11 is internally provided with a water passing groove 111, the water inlet 116 and the water outlet are respectively communicated with two ends of the water passing groove 111, and the water passing groove 111 comprises a plurality of continuous S-shaped bending sections, and each bending section is sequentially and alternately arranged in the length direction of the water cooling box 11.

[0060] In detail, as Figure 8 The water inlet 116 and the water outlet are respectively arranged on the opposite sides of the water cooling box 11 and are respectively communicated with the water passing groove 111, the water passing groove 111 is designed as an S-shaped bending path, the length of the water flow path is increased, the contact area is increased, the water stays in the water cooling box 11 for a longer time, the water can be more fully cooled, and the cooling effect is improved; meanwhile, the water passing volume is also increased, and the larger water volume can absorb more heat, thereby improving the overall cooling capacity. The S-shaped bending design optimizes the water flow path, ensures that the water flow is uniformly distributed in the whole water cooling box 11, and improves the cooling efficiency.

[0061] In addition, in the embodiment, the material of the water cooling box 11 is aluminum, which has a high thermal conductivity, thereby improving the heat exchange speed between the water cooling box 11 and the refrigerating fins 12 and improving the cooling effect.

[0062] In an embodiment, the surface of the water cooling box 11 is arranged as an open mouth, a cover plate 114 is arranged to cover the open mouth, and a sealing ring 115 is arranged to seal the open mouth, so that the water in the water cooling box 11 cannot leak out.

[0063] In the embodiment of the utility model, the heat dissipation structure 100 further comprises an outer shell 40 and a heat dissipation fan 50, the outer shell 40 is provided with a containing cavity 41 and an opening 42 communicated with the containing cavity 41, the water cooling box 11, the two refrigerating fins 12 and the two heat sinks 20 are all arranged in the containing cavity 41, and the heat dissipation fan 50 is arranged at the opening 42.

[0064] Specifically, the outer shell 40 is arranged to integrate all the components in the outer shell 40, so that all the components are fixed firmly and are prevented from loosening or shifting during use, thereby improving the stability and reliability of the equipment and saving space, and the whole heat dissipation structure 100 is more compact.

[0065] The opening 42 is arranged on the outer shell 40, so that the heat dissipation fan 50 is arranged, and the heat sink 20 in the interior is cooled. The heat dissipation fan 50 improves the air flow speed in a forced convection manner, rapidly transfers the heat from the heat sink 20 to the outside air, thereby improving the heat dissipation efficiency, rapidly dissipates the heat of the hot surface 121 of the refrigerating fin 12, and realizes rapid refrigeration and heat dissipation of the water cooling box 11. The heat sink 20 is also effectively prevented from overheating, and the heat sink 20 and the refrigerating fin 12 are protected from high-temperature damage.

[0066] In addition, asFigure 4 The two sides of the shell are provided with fixed pressing plates 43 connected to the shell 40 and the two heat sinks 20 from the outside to fix the two heat sinks 20 and clamp the water cooler 10 between the two heat sinks 20, which is convenient and stable in connection.

[0067] In an embodiment, the heat dissipation structure 100 adopts the heat dissipation fan 50 in combination with the heat pipe assembly 21 and the fin assembly 22 to dissipate heat, the heat pipe assembly 21 can quickly transfer heat from the refrigeration fin 12 to the fin assembly 22, and the heat dissipation fan 50 can quickly dissipate heat to the air, forming a multi-stage heat dissipation design, which can realize efficient heat transfer and heat dissipation and meet the demand for rapid refrigeration and heat dissipation.

[0068] In the embodiment of the utility model, the opening 42 is equipped with two, two opening 42 along the extension direction of shell 40 layout, heat dissipation fan 50 is equipped with two, two heat dissipation fan 50 is connected to two opening 42 respectively.

[0069] It is worth noting that the heat dissipation fan 50 is provided with two, and the two heat sinks 20 are placed on both sides of the shell 40, and the two heat dissipation fans 50 on the top of the shell 40 dissipate heat to the heat sink 20. Two air ducts can be created by two heat dissipation fans 50, which can significantly improve the air flow speed, accelerate the heat transfer from the heat sink 20 to the air, and speed up the heat dissipation of the hot surface 121 of the refrigeration fin 12, thereby realizing rapid refrigeration and heat dissipation.

[0070] The utility model discloses a kind of laser therapy apparatus (not shown in drawing), the laser therapy apparatus includes the heat dissipation structure 100 as described above.

[0071] Specifically, the laser therapy apparatus includes a host computer (not shown in drawing), a laser (not shown in drawing) is provided in the host computer, and the heat dissipation structure 100 is used for dissipating heat for the laser, with high heat dissipation efficiency, to ensure that the laser can maintain an appropriate temperature during operation, to prevent overheating from causing performance degradation or damage.

[0072] The specific structure of the heat dissipation structure 100 is referred to the above embodiments, as the laser therapy apparatus adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0073] The above is only preferred embodiment of the utility model, and does not limit the patent range of the utility model, any equivalent structural transformation made by using the utility model specification and drawing contents, or direct / indirect application in other related technical fields is included in the patent protection range of the utility model.

Claims

1. A heat dissipating structure, characterized by comprising: The heat dissipation structure comprises: a water cooler comprising a water cooling box and two refrigeration fins, the water cooling box being provided with a water inlet and a water outlet, each of the refrigeration fins having a hot face and a cold face facing away from each other, the two refrigeration fins being arranged on opposite sides of the water cooling box, and the cold face of the refrigeration fin abutting against the side of the water cooling box; and two heat sinks, each of the heat sinks being connected with the water cooling box and abutting against the hot face of the refrigeration fin.

2. The heat dissipating structure according to claim 1, wherein The heat dissipation structure further comprises a heat insulation member, which is arranged around the refrigeration fin and abuts against the water cooling box and the heat sink.

3. The heat dissipating structure according to claim 1, wherein The heat sink comprises a heat conduction pipe assembly and a heat dissipation fin assembly, one end of the heat conduction pipe assembly being in contact with the hot face of the refrigeration fin, and the other end of the heat conduction pipe assembly being inserted into the heat dissipation fin assembly.

4. The heat dissipating structure according to claim 3, wherein The heat conduction pipe assembly comprises a plurality of heat conduction pipes, and the heat dissipation fin assembly is provided with a plurality of insertion slots, and the plurality of heat conduction pipes are inserted into the plurality of insertion slots one by one.

5. The heat dissipating structure according to claim 4, wherein The heat conduction pipe comprises a contact section and a plurality of connection sections, and the plurality of connection sections are connected to the contact section at intervals and are all bent and connected to the contact section. The insertion slot comprises a plurality of connection slots, and the connection slots are arranged one by one corresponding to the connection sections, the connection sections are inserted into the connection slots, and the contact section is used to contact the hot face of the refrigeration fin.

6. The heat dissipating structure according to claim 5, wherein The heat sink further comprises a heat conduction fixing plate, which is connected to the heat dissipation fin assembly, and the heat conduction fixing plate is provided with a slot opening, and the contact section is arranged to extend out of the slot opening to be exposed outside the slot opening.

7. The heat dissipating structure according to claim 1, wherein The water cooling box is provided with a water passing groove, and the water inlet and the water outlet are respectively communicated with two ends of the water passing groove, and the water passing groove comprises a plurality of continuous S-shaped bent sections, and each bent section is arranged alternately in sequence in the length direction of the water cooling box.

8. The heat dissipating structure according to any one of claims 1 to 7, wherein The heat dissipation structure further comprises a shell and a heat dissipation fan, the shell is provided with a containing cavity and an opening communicating with the containing cavity, the water cooling box, the two refrigeration fins and the two heat sinks are arranged in the containing cavity, and the heat dissipation fan is arranged at the opening.

9. The heat dissipating structure according to claim 8, wherein The opening is provided with two openings, and the two openings are arranged along the extension direction of the shell, and the heat dissipation fan is provided with two heat dissipation fans, and the two heat dissipation fans are respectively connected to the two openings.

10. A laser therapy apparatus, characterized by, The laser treatment instrument comprises the heat dissipation structure according to any one of claims 1 to 9.

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