Heat dissipation type vacuum generator shell assembly and vacuum generator

Abstract

The utility model provides a heat dissipation type vacuum generator shell assembly and a vacuum generator, and relates to the technical field of vacuum generators. The heat dissipation type vacuum generator shell assembly comprises a shell and a cavity, the cavity is formed in the shell, and a cooling groove is formed in the position, located on one side of the cavity, in the shell. The cooling groove and the backflow groove are formed in the shell, the air guide assembly is used in cooperation with the cooling assembly, high-temperature gas generated in the cavity can be continuously guided into the cooling groove, the cooling assembly is used for cooling the high-temperature gas, and then the backflow groove is used for guiding the high-temperature gas into the cavity; and meanwhile, due to the fact that a circulating air channel can be formed, cold air in the equipment cannot leak out, the temperature of gas circulated every time is not too high, the equipment can complete cooling operation without repeatedly reducing high-temperature gas to low-temperature gas, and energy consumption is greatly reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to vacuum generator technical field, concretely is a kind of heat dissipation type vacuum generator shell subassembly and vacuum generator. BACKGROUND

[0002] Chip mounter is a kind of equipment for accurately placing surface mount components on PCB pads. When mounting electronic components, a vacuum generator needs to be opened and closed to achieve. And the existing vacuum generator of chip mounter is scalded when used continuously for 1-2 hours in high-frequency state, the temperature reaches 40-50 degrees Celsius, so that the vacuum generator is prone to failure and cannot be used normally, thereby generating chip mounting defects and other conditions. Therefore, the traditional vacuum generator of chip mounter is generally equipped with heat dissipation measures.

[0003] And the heat dissipation inside the traditional vacuum generator of chip mounter is generally through the import of low-temperature gas from the outside to carry out cooling operation, such as the heat dissipation type vacuum generator shell subassembly and vacuum generator disclosed in the Chinese patent with the authorization announcement No. CN204305554U. Although this method can achieve the effect of cooling, it still needs to continuously input low-temperature gas into the vacuum generator of chip mounter, and the continuous production of low-temperature gas still needs to consume a lot of energy, and the low-temperature gas from the outside also needs to be manufactured by equipment, so that the vacuum generator of chip mounter needs to be equipped with a refrigeration device to be used when working, which is not conducive to practical application.

[0004] Therefore, the technical personnel in the art provides a kind of heat dissipation type vacuum generator shell subassembly and vacuum generator to solve the problems raised in the above background art. INVENTION CONTENTS

[0005] In view of the deficiencies of the prior art, the utility model provides a kind of heat dissipation type vacuum generator shell subassembly and vacuum generator, solve the problem that the low-temperature gas is continuously produced in the prior art mentioned in the above background art needs to consume a lot of energy.

[0006] To achieve the above purpose, the utility model is realized by the following technical scheme: a kind of heat dissipation type vacuum generator shell subassembly, including shell and cavity, the cavity is set up in the inside of shell, the inside of shell and located in the bottom between cavity and cooling groove is set up with backflow groove;

[0007] The inside of shell and located between the top of cavity and cooling groove is provided with air guide assembly, the inside of cooling groove is provided with cooling assembly, the air guide assembly is used to guide the air in the inside of cavity into the inside of cooling groove, and the cooling assembly is used to cool the air in the inside of cooling groove.

[0008] By the above technical scheme, the high-temperature gas generated in the cavity is continuously introduced into the inside of the cooling groove, and is cooled by the cooling assembly, and then is introduced into the inside of the cavity by the backflow groove, so that the purpose of cooling the equipment is achieved, and at the same time, the circulating air duct is formed, and the cold air in the equipment cannot be leaked, and the temperature of the gas in each cycle is not too high, so that the equipment can complete the cooling operation without repeatedly reducing the high-temperature gas to low-temperature gas, greatly reducing the energy consumption.

[0009] Preferably, the air guide assembly comprises a mounting groove and an air guide fan, the mounting groove is arranged in the inside of the shell and between the top of the cavity and the cooling groove, and the air guide fan is installed in the inside of the mounting groove.

[0010] By the above technical scheme, the air in the cavity is introduced into the inside of the cooling groove through the mounting groove by the working of the air guide fan, and at the same time, the air in the cooling groove can enter the inside of the cavity again through the backflow groove due to the existence of air pressure, so that a circulating cooling air duct is formed.

[0011] Preferably, the cooling assembly comprises a strip-shaped groove and a semiconductor refrigeration sheet, the strip-shaped grooves are equidistantly arranged on the outside of the shell, the strip-shaped grooves are communicated with the inside of the cooling groove, and the semiconductor refrigeration sheet is installed in the inside of the strip-shaped groove.

[0012] Preferably, the semiconductor refrigeration sheet is composed of a condensing sheet and a heat dissipation sheet, the condensing sheet is located in the inside of the cooling groove, and the heat dissipation sheet is located on the outside of the shell.

[0013] By the above technical scheme, the air entering the inside of the cooling groove is cooled by the cold air generated by the condensing sheet, and the heat is dissipated by the heat dissipation sheet, so as to ensure the cooling effect.

[0014] Preferably, the top and the bottom of the shell are fixedly installed with mounting plates, mounting holes are arranged at both ends of the mounting plates, and a cover plate is installed on the outside of the shell and located outside the cavity by screws.

[0015] By the above technical scheme, the mounting holes on the mounting plates can be used to install the equipment at a specified position for use.

[0016] Preferably, a filter baffle is installed in the inside of the backflow groove, and air guide holes are equidistantly arranged on the outside of the filter baffle.

[0017] By the above technical scheme, the air guide holes can better form a circulating air duct.

[0018] The utility model also provides a vacuum generator, including electromagnetic valve and above-mentioned heat dissipation type vacuum generator shell subassembly.

[0019] The utility model provides a heat dissipation type vacuum generator shell subassembly and vacuum generator, have beneficial effect as follows:

[0020] 1, the utility model discloses a cooling tank and backflow groove are established to the inside of casing, and utilize air -guiding subassembly cooperation cooling assembly and use, can the high temperature gas that generates in the inside of cavity is guided into the inside of cooling tank constantly, and utilizes cooling assembly to carry out cooling treatment to it, then utilizes backflow groove and guides into the inside of cavity, thereby reaches the purpose of cooling equipment, simultaneously because can form circulating air duct, and the cold air in the equipment inside does not leak, and the gas temperature of each cycle is not too high, makes equipment and need not repeatedly reduce high temperature gas to low temperature gas can complete cooling operation, greatly reduces the consumption of energy;

[0021] 2, the utility model discloses the corresponding cooling assembly is set up in the inside of casing, makes equipment when using need not again with the help of external equipment and forms low temperature gas, saves the equipment of matched use, is favorable to the practical application. DRAWINGS

[0022] Figure 1 It is the whole structure schematic view of the utility model;

[0023] Figure 2 It is the cover split structure schematic view of the utility model;

[0024] Figure 3 It is the air -guiding subassembly and cooling assembly split structure schematic view of the utility model;

[0025] Figure 4 It is the casing cutaway schematic view of the utility model.

[0026] In the drawing: 1, casing;2, cavity;3, cooling tank;4, backflow groove;5, installation groove;6, air -guiding fan;7, strip groove;8, semiconductor refrigeration piece;81, condensation piece;82, radiating fin;9, mounting plate;10, mounting hole;11, cover;12, filter baffle. CONCRETE IMPLEMENTING METHOD

[0027] The utility model is further elaborated in detail below by the drawings and examples.

[0028] Refer to Figure 1 , Figure 2 , Figure 3 And Figure 4The utility model discloses a heat dissipation type vacuum generator shell assembly, including casing 1 and cavity 2, cavity 2 is set up in the inside of casing 1, the outside of casing 1 and located the outside of cavity 2 is equipped with the cover plate 11 through screw, can seal the cavity 2 in the inside of casing 1 with cover plate 11. The top and bottom of casing 1 are fixedly installed with mounting plate 9, and mounting holes 10 are formed in the both ends of mounting plate 9, and the equipment can be installed on the specified position for use by the mounting hole 10 on mounting plate 9. The inside of casing 1 and located the one side of cavity 2 are equipped with cooling groove 3. The inside of casing 1 and located between the bottom of cavity 2 and cooling groove 3 are equipped with backflow groove 4, and the backflow groove 4 can keep the intercommunication between cavity 2 and cooling groove 3. The inside of backflow groove 4 is installed with filter baffle 12, and air guide holes are equidistantly formed in the outside of filter baffle 12, and the circulating air duct is better formed by the air guide holes.

[0029] The inside of casing 1 and located between the top of cavity 2 and cooling groove 3 are provided with air guide assembly, and the inside of cooling groove 3 is provided with cooling assembly, the air guide assembly is used for guiding the air in the inside of cavity 2 into the inside of cooling groove 3, and the cooling assembly is used for cooling the air entering the inside of cooling groove 3. The high-temperature gas generated in the inside of cavity 2 can be continuously guided into the inside of cooling groove 3 by using the air guide assembly and cooling assembly, and the high-temperature gas is cooled by the cooling assembly, and then the high-temperature gas is guided into the inside of cavity 2 by the backflow groove 4, so that the equipment is cooled, and the circulating air duct is formed, the cold air in the equipment does not leak, the temperature of the gas in each cycle is not too high, the cooling operation of the equipment can be completed without repeatedly reducing the high-temperature gas to the low-temperature gas, and the energy consumption is greatly reduced. In addition, by arranging the corresponding cooling assembly in the inside of casing 1, the equipment does not need to form low-temperature gas by using external equipment when in use, the equipment used in cooperation is saved, and the actual application is facilitated.

[0030] Referring to Figure 3 And Figure 4 In one aspect of the embodiment, the air guide assembly includes a mounting groove 5 and an air guide fan 6. The mounting groove 5 is formed in the inside of the casing 1 and located between the top of the cavity 2 and the cooling groove 3, and the air guide fan 6 is installed in the inside of the mounting groove 5. By the working of the air guide fan 6, the air in the inside of the cavity 2 can be guided into the inside of the cooling groove 3 through the mounting groove 5, and the air in the inside of the cooling groove 3 can enter the inside of the cavity 2 again through the backflow groove 4 due to the existence of air pressure, so that the circulating cooling air duct is formed.

[0031] Referring to Figure 3 And Figure 4In one aspect of the embodiment, the cooling assembly comprises a strip-shaped groove 7 and a semiconductor refrigeration sheet 8. The strip-shaped groove 7 is equidistantly arranged on the outer side of the shell 1 and communicates with the interior of the cooling groove 3. The semiconductor refrigeration sheet 8 is installed in the interior of the strip-shaped groove 7. The semiconductor refrigeration sheet 8 is composed of a condensing sheet 81 and a heat dissipation sheet 82. The condensing sheet 81 is located in the interior of the cooling groove 3, and the heat dissipation sheet 82 is located on the outer side of the shell 1. The cold air generated by the condensing sheet 81 is used to cool the air entering the interior of the cooling groove 3, and the heat dissipation sheet 82 is used to dissipate heat, thereby ensuring the cooling effect. Meanwhile, the space on both sides of the semiconductor refrigeration sheet 8 is isolated, and the cooling and heating airflows on both sides of the semiconductor refrigeration sheet 8 do not interact, so that the cooling effect of the device on the shell 1 is more obvious. As shown in Figure 4 the bottom of the shell 1 and below the cooling groove 3, a water storage pipe is installed, the end of the water storage pipe is threadedly connected with a sealing cover, the water storage pipe communicates with the interior of the cooling groove 3, the condensate generated by the condensing sheet 81 during operation can be collected by the water storage pipe, and the condensate in the interior can be discharged by the sealing cover.

[0032] Meanwhile, a temperature sensor for detecting temperature and a controller for controlling the semiconductor refrigeration sheet 8 and the air guide fan 6 can be installed in the interior of the cavity 2. The temperature sensor detects the air temperature and transmits information to the controller, and the controller controls the semiconductor refrigeration sheet 8 and the air guide fan 6 to work, thereby starting the cooling operation.

[0033] In addition, referring to Figure 1 the utility model also provides a vacuum generator, including electromagnetic valve and above-mentioned heat dissipation type vacuum generator shell assembly. The shell assembly can cool the gas generated in the vacuum generator, thereby ensuring the normal operation of the elements in the vacuum generator.

[0034] Working principle:

[0035] In use, first, the mounting hole 10 on the mounting plate 9 is used to install the device at a specified position for use.

[0036] When the device works, heat is generated in the interior of the device, the air in the cavity 2 is guided into the interior of the cooling groove 3 through the installation groove 5 by the working of the air guide fan 6, and then the air entering the interior of the cooling groove 3 is cooled by the cold air generated by the condensing sheet 81. Due to the existence of air pressure, the air in the interior of the cooling groove 3 can re-enter the interior of the cavity 2 through the backflow groove 4, thereby forming a circulating cooling air duct, and the device is cooled in circulation, thereby ensuring the cooling effect.

[0037] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipating vacuum generator housing assembly comprising a housing (1) and a cavity (2) formed in the interior of the housing (1), characterized in that, The inside of the shell (1) and one side of the cavity (2) are provided with a cooling groove (3), and the inside of the shell (1) and between the cavity (2) and the bottom of the cooling groove (3) are provided with a backflow groove (4); The inside of the shell (1) and between the cavity (2) and the top of the cooling groove (3) are provided with an air guide assembly, and the inside of the cooling groove (3) is provided with a cooling assembly, the air guide assembly is used for guiding the air in the cavity (2) into the inside of the cooling groove (3), and the cooling assembly is used for cooling the air entering the inside of the cooling groove (3).

2. The thermally-viable vacuum generator housing assembly of claim 1, wherein: The air guide assembly comprises a mounting groove (5) and an air guide fan (6), the mounting groove (5) is provided in the inside of the shell (1) and between the cavity (2) and the top of the cooling groove (3), and the air guide fan (6) is mounted in the inside of the mounting groove (5).

3. The thermally-viable vacuum generator housing assembly of claim 1, wherein: The cooling assembly comprises a strip-shaped groove (7) and a semiconductor refrigeration sheet (8), the strip-shaped grooves (7) are equidistantly provided on the outside of the shell (1), the strip-shaped grooves (7) are communicated with the inside of the cooling groove (3), and the semiconductor refrigeration sheet (8) is mounted in the inside of the strip-shaped groove (7).

4. The thermally-viaable vacuum generator housing assembly of claim 3, wherein: The semiconductor refrigeration sheet (8) is composed of a condensation sheet (81) and a heat dissipation sheet (82), the condensation sheet (81) is located in the inside of the cooling groove (3), and the heat dissipation sheet (82) is located on the outside of the shell (1).

5. The thermally-viaable vacuum generator housing assembly of claim 1, wherein: The top and the bottom of the shell (1) are fixedly provided with mounting plates (9), both ends of the mounting plate (9) are provided with mounting holes (10), and the outside of the shell (1) and the outside of the cavity (2) are provided with a cover plate (11) through screws.

6. The thermally-viable vacuum generator housing assembly of claim 1, wherein: The inside of the backflow groove (4) is provided with a filter baffle (12), and the outside of the filter baffle (12) is equidistantly provided with air guide holes.

7. A vacuum generator, characterized by: The electromagnetic valve and the heat dissipation type vacuum generator shell assembly of any one of claims 1-6 are included.

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