Modularized micro data center integrated cabinet of big data platform

Abstract

The invention is applicable to the technical field of data center cabinets, and provides a modular micro data center integrated cabinet of a big data platform, which comprises an integrated cabinet body, a cabinet inner frame is additionally arranged on the inner wall of the integrated cabinet body, and the cabinet inner frame comprises a plurality of air guide pipes and a plurality of unit cabinet inner frames. The air guide pipe is used for transferring air flow in the unit cabinet inner frame; the unit cabinet inner frame comprises a plurality of air guide plates, each air guide plate comprises a plurality of unit air guide assemblies, the two sides of each air guide plate are each provided with an air guide adjusting part, and the air guide adjusting part on one side of each air guide plate can exhaust air for one or more of the unit air guide assemblies. The air guide adjusting piece on the other side of the air guide plate can supply cold air to one or more of the multiple unit air guide assemblies. The cold air inlet point can be dynamically adjusted for a local high-heat-density element, precise regulation and control cooling for a local electronic element heat source is achieved, and energy consumption waste and hot spot accumulation are avoided.

Description

Technical Field

[0001] This invention relates to the field of data center cabinet technology, and in particular to a modular micro data center integrated cabinet for a big data platform. Background Technology

[0002] Micro data center integrated racks are compact solutions that integrate computing, storage, networking, and infrastructure components, designed to provide high-density, modular, and rapidly deployable data processing environments for big data platforms. These racks realize the concept of "rack as data center" by integrating power distribution systems, cooling units, monitoring and management functions into a standard rack, and are widely used in edge computing, enterprise branch scenarios, and high-performance computing clusters. For example, the RackDC integrated rack significantly improves space utilization and energy efficiency through its internal hot and cold aisle co-design and sealed structure optimization, but its high integration also places higher demands on the refined management of the heat dissipation system.

[0003] Currently, the heat dissipation methods of integrated micro data center cabinets are mainly divided into air cooling, liquid cooling and composite cooling. The above-mentioned heat dissipation methods generally have insufficient precise heat dissipation capabilities. Most systems adopt an overall uniform heat dissipation strategy, which cannot dynamically adjust for local high heat density components, resulting in energy waste and hot spot accumulation. For example, traditional air cooling systems only use top fan blades and slots for global air supply, which is difficult to cope with the transient high temperature in specific areas such as server motherboards.

[0004] Taking the patent "A Data Center Cabinet Heat Dissipation and Dust Removal System and Control Method" with application number 202410593130.4 as an example, although it can switch the heat dissipation mode through temperature parameters, the driving and guiding of the heat dissipation and dust removal module only responds to the overall cabinet temperature change and does not make precise control for individual servers or chip-level heat sources. When there are uneven heat sources in the cabinet, the system still operates in global mode and cannot dynamically allocate cooling resources to high-temperature areas, resulting in the risk of local overheating. Summary of the Invention

[0005] The purpose of this invention is to provide a modular micro data center integrated cabinet for a big data platform, which aims to solve the problem that most existing technologies adopt an overall uniform heat dissipation strategy, which cannot dynamically adjust for local high heat density components, resulting in energy waste and hot spot accumulation; for example, traditional air-cooling systems only use top fan blades and slots for global air supply, which is difficult to cope with the transient high temperature in specific areas such as server motherboards.

[0006] Specifically: A modular micro data center integrated cabinet for a big data platform includes an integrated cabinet body. Internal racks are installed on the inner wall of the integrated cabinet body. Each internal rack includes multiple air ducts and multiple unit internal racks. The air ducts are used to regulate the airflow inside each unit internal rack. Each unit internal rack includes multiple air guide plates, and each air guide plate includes multiple unit air guide components. These unit air guide components are arranged side-by-side at equal intervals and are independent of each other. An air guide adjustment component is located on each side of the air guide plate. Each air guide adjustment component on one side of the air guide plate can be a single... One or more of the air guide components are used to extract air, and the air guide adjustment component on the other side of the air guide plate can deliver cold air to one or more of the multiple air guide components. When an integrated cabinet with many electronic components is in operation, if some areas become hot, the air guide adjustment component on one side of the air guide plate can deliver cold air to one or more of the multiple air guide components into the integrated cabinet. The cold air entry point can be dynamically adjusted for local high heat density components, so as to achieve precise control and cooling of local electronic component heat sources, avoiding energy waste and hot spot accumulation.

[0007] In a further embodiment, the air guide plate also includes a plate body with an installation groove. Multiple unit air guide components are arranged side by side at equal intervals inside the installation groove and are independent of each other. Air guide holes are provided on both sides of the plate body of each unit air guide component. Solenoid valves are installed inside the air guide holes, and the air guide holes are connected to the unit air guide components.

[0008] In a further embodiment, the unit air guide assembly includes multiple air guide heads, which are arranged in multiple rows and columns and are fixedly connected to each other.

[0009] The air guide head includes a housing with a cavity. A connecting hole is provided around the housing and communicates with the cavity. The connecting hole is used to connect multiple air guide heads.

[0010] The air guide head also includes a guide balloon, which is hinged to the shell. A ventilation pipe is installed through the guide balloon, with one end of the ventilation pipe connected to the outside and the other end connected to the inside of the cavity.

[0011] In a further embodiment, the air guiding adjustment component includes an outer sealing shell and an air guiding telescopic component. The outer sealing shell is installed on the side wall of the air guide plate, and the outer sealing shell is open on the side facing the air guide plate.

[0012] In a further embodiment, the air-guiding telescopic component includes an air-guiding telescopic tube and an air-guiding connector. One end of the air-guiding telescopic tube is located at the end of the outer sealing shell and is connected to the air-guiding duct; the other end of the air-guiding telescopic tube is located at the air-guiding connector and is connected to the air-guiding connector.

[0013] The air-guiding telescopic tube includes a connecting pipe and an air-guiding telescopic tube body. The connecting pipe is installed at the end of the outer sealing shell, and the air-guiding connector is connected to and communicates with the air-guiding tube. The air-guiding telescopic tube body is installed on the connecting pipe and communicates with the connecting pipe. An electric telescopic rod A is installed inside the air-guiding telescopic tube body, and the electric telescopic rod A is used for the telescopic adjustment of the air-guiding telescopic tube body.

[0014] The air guide connector includes an air guide box with an assembly hole on its top. The assembly hole is used for the installation of the air guide telescopic tube, which is connected to the interior of the air guide box through the assembly hole.

[0015] The air guide box has a receiving hole on its front end and bottom respectively. A through-tube is movably inserted inside the receiving hole. The position of the through-tube inside the receiving hole is controlled by an electric telescopic rod B. The through-tube is connected to the air guide box through a flexible tube. A solenoid valve is installed inside the through-tube.

[0016] After high temperatures occur in some areas, the electric telescopic rod A is activated. During the extension and retraction of the air guide tube body driven by the electric telescopic rod A, the position of the air guide connector inside the outer sealing shell is adjusted. At this time, the electric telescopic rod B is activated to push out the through-tube on the front face of the air guide box and enter the air guide hole to connect with the unit air guide components at different positions. If the through-tube at the bottom of the air guide box is pushed out by the electric telescopic rod B and the solenoid valve is opened, air can be supplied to multiple unit air guide components below the air guide box. This allows the air guide adjustment component on one side of the air guide plate to deliver cold air to one or more of the multiple unit air guide components into the integrated cabinet.

[0017] Compared with the prior art, the present invention can achieve the following:

[0018] 1. When an integrated cabinet with numerous electronic components reaches high temperatures in some areas during operation, the air guide adjustment component on one side of the air guide plate can deliver cool air into the integrated cabinet from one or more of the multiple air guide components. The cold air entry point can be dynamically adjusted for local high heat density components, so as to achieve precise control and cooling of local electronic component heat sources, avoiding energy waste and hot spot accumulation.

[0019] That is, when the temperature sensor detects a high temperature in a certain area inside the cabinet (such as the location of a CPU or GPU), the system will dispatch the air guide plate closest to the hot spot; the air guide plate's air guiding adjustment component is activated, and one or a few unit air guiding components connected to it and facing the heat source are precisely opened to form one or more jets of cold air; this cold air is precisely guided to the surface of the high-temperature component, achieving point-to-point cooling and avoiding waste of cooling resources;

[0020] 2. Since the unit rack includes multiple air guide plates, these multiple air guide plates can be arrayed inside the integrated rack and surround numerous electronic components. When high temperatures occur in some areas, the air guide adjustment component on one side of one air guide plate can extract air from one or more of the multiple unit air guide components, while the air guide adjustment component on the other side of another air guide plate can deliver cool air to one or more of the multiple unit air guide components. This allows one air guide plate to deliver cool air and another to extract hot air. It can quickly extract hot air from electronic components in high-temperature areas and then deliver cool air, ensuring that the cool air directly reaches the heat-generating electronic components and avoiding the need for the delivered cool air to exchange with the hot air.

[0021] This "push-pull" mode artificially creates a forced, directional local airflow loop around the high-temperature components; the cold air no longer needs to undergo slow, inefficient natural convection exchange with the mixed hot air in the entire cabinet, but is directly injected into the place where it is most needed and immediately discharges the waste heat, greatly improving the heat exchange efficiency.

[0022] 3. Traditional server rack air ducts are fixed physical structures, while this invention, by controlling the opening and closing of different unit air guide components on multiple air guide plates and the combination of supply / exhaust modes, can create, modify, and eliminate virtual air ducts for specific heat sources in real time within the physical space. These air ducts are invisible and allocated on demand, giving the server rack's heat dissipation topology unprecedented dynamic adaptability, perfectly coping with the dynamic thermal challenges brought about by instantaneous fluctuations in the power consumption of electronic components inside the server and uneven business loads.

[0023] 4. Existing technologies mainly focus on remedial measures to enhance heat dissipation when the temperature exceeds the limit. However, this invention achieves predictive and on-demand cooling distribution through precise control of the local microenvironment. It can precisely allocate the required cooling amount according to the real-time power consumption of different components. This not only eliminates hot spots but also avoids overcooling of non-hot spot areas. This paradigm shift from extensive overall cooling to refined local cooling brings significant and unexpected improvements in overall energy efficiency because the energy consumption of power components such as fans is greatly reduced due to precise control.

[0024] 5. In big data platforms, different models of CPUs, GPUs, accelerator cards and other heterogeneous computing units are often used together. Their heat generation and heat generation locations vary greatly, and fixed air ducts are powerless to deal with this. However, the dynamic array design of this invention is inherently capable of dealing with this heterogeneity. No matter which location or model of the component becomes a heat source, a "mini heat dissipation team" can be quickly assembled around it to surround and dissipate heat.

[0025] 6. After the cold air enters the housing of the air guide, it is ejected through the ventilation duct. When the air encounters electronic components, it experiences a backward force, causing the air guide bulb and ventilation duct to rotate. After rotating to a new air outlet angle, it encounters electronic components again and experiences a new backward force. Because the ventilation duct runs through the air guide bulb, it ensures that the air guide bulb and ventilation duct irregularly vibrate and emit air within a certain range. This achieves precise and omnidirectional guidance of the air to the surface of high-temperature components at high-temperature points. The irregular vibration of the air cleverly breaks the static boundary air layer that hinders heat dissipation formed on the surface of high-temperature components. It allows the cold airflow to impact the hot surface at a constantly changing angle, thereby greatly enhancing the turbulent heat transfer efficiency between the fluid and the solid.

[0026] 7. The array of multiple air guides forms a macroscopic coordinate positioning system, while the vibrating air guides form a microscopic area coverage system. When a hot spot is detected, this invention can not only direct the nearest air guide to deliver air, but also automatically perform scanning heat dissipation coverage on a tiny area through the vibration of the air guides, without needing to know the precise shape of the hot spot in advance. This solves the problems of tolerance and component shape differences in precision manufacturing. Even if the position or shape of the heat source deviates slightly from the preset model, it adaptively achieves efficient full-area heat coverage, improving the system's engineering tolerance and versatility.

[0027] 8. The irregular vibration of the air guide head is driven by a purely physical feedback mechanism of airflow backlash, which does not rely on any electronic sensors or central controller. At the micro level, it achieves a decentralized and adaptive dynamic adjustment. The advanced push-pull suction mode is responsible for strategic deployment, while the basic vibration mode is responsible for tactical execution. This hybrid architecture significantly reduces the computing power requirements of the central controller and the complexity of the system software. While achieving high adaptability, it becomes simpler, more reliable, and lower in cost.

[0028] 9. The continuous, directional, and gentle breeze from the air guide head makes it difficult for static electricity to accumulate on the surface of electronic components, thus effectively preventing dust adsorption and deposition. At the same time, the negative pressure area created by the exhaust plate can quickly remove these dust particles that have been shaken off or have not yet been adsorbed. While focusing on heat dissipation, it also implicitly integrates active dust prevention and cleaning functions, extending the equipment maintenance cycle and service life, and improving the overall system reliability. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the modular micro data center integrated cabinet of the big data platform of the present invention;

[0030] Figure 2 for Figure 1 Schematic diagram of the internal frame of the central cabinet;

[0031] Figure 3 for Figure 2 Schematic diagram of the internal frame of the unit cabinet;

[0032] Figure 4 for Figure 3 Schematic diagram of the structure of the central air guide plate;

[0033] Figure 5 for Figure 4 Schematic diagram of the structure of the middle unit air guide assembly;

[0034] Figure 6 for Figure 5 Schematic diagram of the structure of the central air guide head;

[0035] Figure 7 for Figure 3 Schematic diagram of the structure of the central air guide regulating component;

[0036] Figure 8 for Figure 7 Schematic diagram of the structure of the central air guide expansion joint;

[0037] Figure 9 for Figure 8 Schematic diagram of the structure of the central gas guide telescopic pipe;

[0038] Figure 10 for Figure 8 A schematic diagram of the structure of the central air guide connector.

[0039] In the picture:

[0040] Integrated cabinet body 100, air duct 200, unit cabinet internal frame 300;

[0041] Air guide plate 310, air guide hole 311, plate body 312, unit air guide assembly 313, air guide head 314, housing 315, air guide ball 316, ventilation pipe 317, air guide adjustment component 320, outer sealing shell 321, air guide telescopic component 322, air guide telescopic pipe 323, air guide connector 324.

[0042] Connecting pipe 3231, air guide telescopic pipe body 3232, electric telescopic rod A3233; assembly hole 3241, air guide box 3242, storage hole 3243, insertion pipe 3244. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0044] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.

[0045] In one embodiment of the present invention, such as Figures 1-3 As shown: A modular micro data center integrated cabinet for a big data platform includes an integrated cabinet body 100. The inner wall of the integrated cabinet body 100 is equipped with an internal rack. The internal rack includes multiple air ducts 200 and multiple unit internal racks 300. The air ducts 200 are used to regulate the air flow inside the unit internal racks 300.

[0046] It should be further explained that: apart from the numerous electronic components of the internal rack of the integrated micro data center cabinet which are not described, which are existing technologies, their detailed structure can be found in existing literature and journals, and can also be purchased directly on the market, or can be assembled from parts purchased on the market, etc.; they are not what this invention is trying to protect, and will not be described in detail here, nor are they shown in the accompanying drawings.

[0047] Continue reading Figure 3 and Figure 4 The unit cabinet internal frame 300 includes multiple air guide plates 310, and each air guide plate 310 includes multiple unit air guide components 313. The multiple unit air guide components 313 are arranged side by side at equal intervals and are independent of each other. An air guide regulating component 320 is provided on each side of the air guide plate 310. The air guide regulating component 320 on one side of the air guide plate 310 can draw air from one or more of the multiple unit air guide components 313, and the air guide regulating component 320 on the other side of the air guide plate 310 can deliver cold air to one or more of the multiple unit air guide components 313.

[0048] Therefore, most existing technologies employ a uniform overall heat dissipation strategy, which cannot dynamically adjust for locally high-heat-density components, leading to energy waste and hotspot accumulation. For example, traditional air-cooling systems only provide global airflow through top fan blades and vents, making it difficult to cope with transient high temperatures in specific areas such as server motherboards. This application can achieve the following:

[0049] During operation, when some areas of the integrated cabinet 100 containing numerous electronic components reach high temperatures, the air guide adjustment component 320 on one side of the air guide plate 310 can deliver cool air to one or more of the multiple unit air guide components 313 into the integrated cabinet 100. The cold air entry point can be dynamically adjusted for local high heat density components, so as to achieve precise control and cooling of local electronic component heat sources, avoiding energy waste and hot spot accumulation.

[0050] Since the unit rack 300 includes multiple air guide plates 310, these multiple air guide plates 310 can be arrayed inside the integrated rack 100 and surround numerous electronic components. When high temperatures occur in some areas, the air guide adjustment component 320 on one side of one air guide plate 310 can extract air for one or more of the multiple unit air guide components 313, while the air guide adjustment component 320 on one side of another air guide plate 310 can deliver cool air for one or more of the multiple unit air guide components 313. This achieves the effect of one air guide plate 310 delivering cool air and another extracting hot air. It can quickly extract hot air from electronic components in high-temperature areas and then deliver cool air, ensuring that the cool air directly reaches the heat-generating electronic components and avoiding the need for the delivered cool air to exchange with the hot air.

[0051] In another embodiment of the present invention, an array-like air duct network consisting of multiple air guide plates 310 is constructed inside the integrated cabinet 100, surrounding numerous electronic components such as servers, hard drives, and switching modules, forming fine-grained heat dissipation zones. Each air guide plate 310 integrates multiple independently controllable unit air guide components 313 (e.g., miniaturized electric dampers or vector nozzles), and is driven by a unified air guide regulating component 320. Its operating mode can be divided into two collaborative states depending on the severity of the heat load:

[0052] 1. Precision air delivery mode (single-point enhanced cooling)

[0053] When the temperature sensor detects high temperature in a certain area of ​​the cabinet (such as the location of a CPU or GPU), the system will dispatch the air guide plate 310 closest to the hot spot; the air guide plate 310's air guide adjustment component 320 is activated, and one or a few connected air guide components 313 facing the heat source are precisely opened to form one or more cold air jets; this cold air is precisely guided to the surface of the high-temperature component, achieving point-to-point cooling and avoiding waste of cooling resources;

[0054] 2. Push-pull suction mode (synergistic and efficient heat exchange)

[0055] For a higher-power local heat source, at least two air guides 310 are grouped together, with one air guide 31 designated as an air supply plate and the other air guide 31 designated as an exhaust plate. The air supply plate delivers cold air to its specific unit air guide assembly 313, blowing it directly towards the heat source. The exhaust plate activates its exhaust function to actively and rapidly remove the heated air through its unit air guide assembly 313 on the leeward side facing the heat source.

[0056] This "push-pull" mode artificially creates a forced, directional local airflow loop around the high-temperature components; the cool air no longer needs to undergo slow, inefficient natural convection exchange with the mixed hot air in the entire cabinet, but is directly injected into the place where it is most needed and immediately exhausts the waste heat, greatly improving the heat exchange efficiency.

[0057] Furthermore, traditional server rack air ducts are fixed physical structures, while this invention, by controlling the opening and closing of different unit air guide components 313 on multiple air guide plates 310 and the combination of supply / exhaust modes, can create, modify, and eliminate virtual air ducts for specific heat sources in real time within the physical space. These air ducts are invisible and allocated on demand, giving the server rack's heat dissipation topology unprecedented dynamic adaptability, perfectly addressing the dynamic thermal challenges brought about by instantaneous fluctuations in the power consumption of electronic components inside the server and uneven business loads.

[0058] Furthermore, while existing technologies primarily focus on remedial measures to enhance heat dissipation when temperatures exceed limits, this invention achieves predictive and on-demand cooling distribution through precise control of the local microenvironment. It can precisely allocate the required cooling amount based on the real-time power consumption of different components, which not only eliminates hot spots but also avoids overcooling of non-hot spot areas. This paradigm shift from extensive overall cooling to refined local cooling brings significant and unexpected improvements in overall energy efficiency, as the energy consumption of power components such as fans is greatly reduced due to precise control.

[0059] Furthermore, in big data platforms, heterogeneous computing units such as CPUs, GPUs, and accelerator cards of different models are often used together. Their heat generation and heat dissipation locations vary greatly, and fixed airflow channels are powerless to address this. However, the dynamic array design of this invention is inherently capable of dealing with this heterogeneity. No matter which location or model of the component becomes a heat source, a "miniature heat dissipation team" can be quickly assembled around it to surround and dissipate heat.

[0060] In another embodiment of the present invention, such as Figure 4 As shown: The air guide plate 310 also includes a plate body 312, on which an installation groove is provided. Multiple unit air guide components 313 are arranged side by side at equal intervals inside the installation groove and are independent of each other. Air guide holes 311 are provided on both sides of the plate body 312 of the unit air guide component 313. Solenoid valves are installed inside the air guide holes 311 and the air guide holes 311 are connected to the unit air guide components 313.

[0061] Furthermore, such as Figures 4-6 As shown: The unit air guide assembly 313 includes multiple air guide heads 314, which are arranged in multiple rows and columns and are fixedly connected to each other.

[0062] like Figure 6As shown: The air guide head 314 includes a housing 315, a cavity is provided on the housing 315, and a connecting hole is provided on each of the four sides of the housing 315. The connecting hole communicates with the cavity and is used to connect multiple air guide heads 314.

[0063] like Figure 6 As shown: The air guide head 314 also includes a guide balloon 316, which is hinged to the housing 315. A ventilation pipe 317 is provided through the guide balloon 316, with one end of the ventilation pipe 317 connected to the outside and the other end connected to the inside of the cavity.

[0064] Therefore, after the cold air enters the housing 315 of the air guide 314, it will be ejected through the ventilation duct 317. When the air encounters the electronic components, it will be subjected to a backward force, causing the air guide balloon 316 and the ventilation duct 317 to rotate. After rotating to a new air outlet angle, it will encounter the electronic components again and be subjected to a new backward force. Since the ventilation duct 317 is installed through the air guide balloon 316, it can ensure that the air guide balloon 316 and the ventilation duct 317 irregularly vibrate and outlet within a certain range. This achieves precise guidance of the air to the surface of the high-temperature components from all directions at the high-temperature point. The irregular vibration of the air outlet cleverly breaks the static boundary air layer formed on the surface of the high-temperature components that hinders heat dissipation. It allows the cold airflow to impact the hot surface at a constantly changing angle, thereby greatly enhancing the turbulent heat transfer efficiency between the fluid and the solid.

[0065] Multiple air guide plates 310 arranged in an array form a macroscopic coordinate positioning system, while the vibrating air guide head 314 forms a microscopic area coverage system. When a hot spot is detected, this invention can not only direct the nearest air guide plate 310 to deliver air, but also automatically perform scanning heat dissipation coverage on a tiny area through the vibration of the air guide head 314, without needing to know the precise shape of the hot spot in advance. This solves the problems of tolerance and component shape differences in precision manufacturing. Even if the position or shape of the heat source deviates slightly from the preset model, it adaptively achieves efficient full-area heat coverage, improving the system's engineering tolerance and versatility.

[0066] The irregular vibration of the air guide 314 is driven by a purely physical feedback mechanism—the force of airflow after it exits—which does not rely on any electronic sensors or central controller. At the micro level, it achieves a decentralized, adaptive dynamic adjustment. The advanced push-pull suction mode is responsible for strategic deployment, while the basic vibration mode is responsible for tactical execution. This hybrid architecture significantly reduces the computing power requirements of the central controller and the complexity of the system software. While achieving a high degree of adaptability, it becomes simpler, more reliable, and lower in cost.

[0067] The continuous, directional, and gentle breeze from the 314 air guide head makes it difficult for static electricity to accumulate on the surface of electronic components, thus effectively preventing dust adsorption and deposition. At the same time, the negative pressure area created by the exhaust plate can quickly remove these dust particles that have been shaken off or have not yet been adsorbed. While focusing on heat dissipation, it also implicitly integrates active dust prevention and cleaning functions, extending the equipment maintenance cycle and service life, and improving the overall system reliability.

[0068] In another embodiment of the present invention, such as Figure 3 and Figure 7 As shown: The air guiding adjustment component 320 includes an outer sealing shell 321 and an air guiding telescopic component 322. The outer sealing shell 321 is installed on the side wall of the air guide plate 310, and the outer sealing shell 321 is open on the side facing the air guide plate 310.

[0069] Furthermore, such as Figure 7 and Figure 8 As shown: The air guiding telescopic component 322 includes an air guiding telescopic tube 323 and an air guiding connector 324. One end of the air guiding telescopic tube 323 is located at the end of the outer sealing shell 321 and is connected to the air guiding tube 200; the other end of the air guiding telescopic tube 323 is located on the air guiding connector 324 and is connected to the air guiding connector 324.

[0070] like Figures 7-9 As shown: The air-guiding telescopic tube 323 includes a connecting tube 3231 and an air-guiding telescopic tube body 3232. The connecting tube 323 is installed at the end of the outer sealing shell 321. The air-guiding connector 324 is connected to the air duct 200 and communicates with the air duct 200. The air-guiding telescopic tube body 3232 is installed on the connecting tube 323 and communicates with the connecting tube 323. An electric telescopic rod A3233 is installed inside the air-guiding telescopic tube body 3232. The electric telescopic rod A3233 is used for the telescopic adjustment of the air-guiding telescopic tube body 3232.

[0071] Therefore, during operation, when high temperatures occur in some areas, the electric telescopic rod A3233 is activated. As the electric telescopic rod A3233 drives the air guide telescopic tube 3232 to extend and retract, the position of the air guide connector 324 inside the outer sealing shell 321 is adjusted to connect with the unit air guide components 313 at different locations. The air guide adjustment component 320 on one side of the air guide plate 310 can deliver cold air to one of the multiple unit air guide components 313 into the integrated cabinet 100. The cold air entry point can be dynamically adjusted for local high heat density components, achieving precise control and cooling of local electronic component heat sources, avoiding energy waste and hot spot accumulation.

[0072] In another embodiment of the present invention, such as Figures 7-10As shown: The air guide connector 324 includes an air guide box 3242, and the air guide box 3242 has an assembly hole 3241 on its top. The assembly hole 3241 is used for the installation of the air guide telescopic tube body 3232. The air guide telescopic tube body 3232 is connected to the interior of the air guide box 3242 through the assembly hole 3241.

[0073] Figure 10 As shown: The air guide box 3242 has a receiving hole 3243 on its front end and bottom respectively. A through tube 3244 is movably inserted inside the receiving hole 3243. The position of the through tube 3244 inside the receiving hole 3243 is controlled by an electric telescopic rod B. The through tube 3244 is connected to the air guide box 3242 through a flexible hose. A solenoid valve is installed inside the through tube 3244.

[0074] Therefore, when high temperatures occur in some areas, the electric telescopic rod A3233 is activated. During the extension and retraction of the air guide telescopic pipe 3232 driven by the electric telescopic rod A3233, the position of the air guide connector 324 inside the outer sealing shell 321 is adjusted. At this time, the electric telescopic rod B is activated to push out the insertion pipe 3244 on the front end face of the air guide box 3242 and enter the air guide hole 311 so as to connect with the unit air guide assembly 313 at different positions. If the insertion pipe 3244 at the bottom of the air guide box 3242 is pushed out by the electric telescopic rod B and the solenoid valve is opened, air can be supplied to multiple unit air guide assemblies 313 below the air guide box 3242. The air guide adjustment component 320 on one side of the air guide plate 310 can deliver cold air to one or more of the multiple unit air guide assemblies 313 into the integrated cabinet 100.

[0075] If it's a ventilation system, it works on the same principle, only the direction of the airflow is different.

[0076] In the description of this invention, unless otherwise stated, "a plurality of" means two or more. It should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0077] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A modular micro data center integrated cabinet for a big data platform, comprising an integrated cabinet body (100), wherein internal racks are installed on the inner wall of the integrated cabinet body (100), and the internal racks include multiple air ducts (200) and multiple unit internal racks (300), wherein the air ducts (200) are used to regulate the airflow inside the unit internal racks (300); characterized in that, The unit cabinet inner frame (300) includes multiple air guide plates (310), and the air guide plates (310) include multiple unit air guide components (313). The multiple unit air guide components (313) are arranged side by side at equal intervals and are independent of each other. An air guide adjustment component (320) is provided on each side of the air guide plate (310). The air guide adjustment component (320) on one side of the air guide plate (310) can draw air from one or more of the multiple unit air guide components (313), and the air guide adjustment component (320) on the other side of the air guide plate (310) can deliver cold air to one or more of the multiple unit air guide components (313).

2. The modular micro data center integrated cabinet for a big data platform according to claim 1, characterized in that, The air guide plate (310) also includes a plate body (312), on which an installation groove is provided. Multiple unit air guide components (313) are distributed side by side at equal intervals inside the installation groove and are independent of each other. Air guide holes (311) are provided on the plates (312) on both sides of the unit air guide assembly (313). A solenoid valve is installed inside the air guide hole (311), and the air guide hole (311) is connected to the unit air guide assembly (313).

3. The modular micro data center integrated cabinet for a big data platform according to claim 2, characterized in that, The unit air guide assembly (313) includes multiple air guide heads (314), which are arranged in multiple rows and columns and are fixedly connected to each other.

4. The modular micro data center integrated cabinet for a big data platform according to claim 3, characterized in that, The air guide head (314) includes a housing (315), a cavity is provided on the housing (315), and a connecting hole is provided on each of the four sides of the housing (315). The connecting hole communicates with the cavity and is used to connect multiple air guide heads (314).

5. The modular micro data center integrated cabinet for a big data platform according to claim 4, characterized in that, The air guide head (314) also includes a guide balloon (316), which is hinged to the shell (315). A ventilation pipe (317) is provided through the guide balloon (316), with one end of the ventilation pipe (317) connected to the outside and the other end connected to the inside of the cavity.

6. The modular micro data center integrated cabinet for a big data platform according to claim 1, characterized in that, The air guiding adjustment component (320) includes an outer sealing shell (321) and an air guiding telescopic component (322). The outer sealing shell (321) is installed on the side wall of the air guide plate (310), and the outer sealing shell (321) is open on the side facing the air guide plate (310).

7. The modular micro data center integrated cabinet for a big data platform according to claim 6, characterized in that, The air guide telescopic component (322) includes an air guide telescopic tube (323) and an air guide connector (324). One end of the air guide telescopic tube (323) is located at the end of the outer sealing shell (321) and is connected to the air guide tube (200). The other end of the air guide telescopic tube (323) is located on the air guide connector (324) and is connected to the air guide connector (324).

8. The modular micro data center integrated cabinet for a big data platform according to claim 7, characterized in that, The air guide telescopic tube (323) includes a connecting tube (3231) and an air guide telescopic tube body (3232). The connecting tube (323) is installed at the end of the outer sealing shell (321). The air guide connector (324) is connected to the air guide tube (200) and communicates with the air guide tube (200). The air guide telescopic tube body (3232) is installed on the connecting tube (323) and communicates with the connecting tube (323). An electric telescopic rod A (3233) is installed inside the gas-conducting telescopic tube (3232). The electric telescopic rod A (3233) is used for the telescopic adjustment of the gas-conducting telescopic tube (3232).

9. A modular micro data center integrated cabinet for a big data platform according to claim 8, characterized in that, The air guide connector (324) includes an air guide box (3242), which has an assembly hole (3241) on its top. The assembly hole (3241) is used for the installation of the air guide telescopic tube (3232), which is connected to the interior of the air guide box (3242) through the assembly hole (3241).

10. A modular micro data center integrated cabinet for a big data platform according to claim 9, characterized in that, The air guide box (3242) has a receiving hole (3243) on its front end and bottom respectively. A through tube (3244) is movably inserted inside the receiving hole (3243). The position of the through tube (3244) inside the receiving hole (3243) is controlled by an electric telescopic rod B. The through tube (3244) is connected to the air guide box (3242) through a hose. A solenoid valve is installed inside the through tube (3244).

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