Gluing device for LED lamp bead chip processing

Abstract

The utility model discloses a gluing device for LED lamp bead chip processing, which relates to the technical field of LED lamp bead chips and comprises a base, a support frame is fixedly mounted at the top of the base, the bottom of the support frame is connected with a glue dispenser in a sliding manner, a turnover mechanism is arranged at the top of the base, and the turnover mechanism is connected with the glue dispenser in a sliding manner. A drying mechanism is arranged on the top of the base and located outside the turnover mechanism, and the turnover mechanism comprises a rotating unit and a fixing unit. Through cooperation of the rotating shaft, the fixing frame, the limiting inserting rod, the first through hole, the upper fixing plate, the lower fixing plate and the U-shaped elastic piece, the fixing frame can be conveniently rotated through the handle and the rotating shaft, an LED lamp bead chip after gluing is turned over, meanwhile, when the limiting inserting rod is inserted into the first through hole, the rotating shaft after rotation can be limited, and the LED lamp bead chip is prevented from being damaged. And through cooperation between the upper fixing plate and the lower fixing plate, the placed LED lamp bead chips can be fixed conveniently.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp chip technology, and specifically to a gluing device for processing LED lamp chips. Background Technology

[0002] An LED chip is a solid-state semiconductor device. The heart of an LED is a semiconductor chip. One end of the chip is attached to a support, which is the negative electrode, and the other end is connected to the positive electrode of the power supply. The entire chip is encapsulated in epoxy resin.

[0003] The prior art includes a Chinese patent with publication number CN214378340U, which discloses the following technical solution: a novel LED chip processing and gluing mechanism, comprising a housing, a worktable, and an operating chassis. The worktable is fixedly connected to the bottom of the housing, and the operating chassis is fixedly connected to one side of both the worktable and the housing.

[0004] To address the issue of LED chip panels easily becoming loose and falling off during movement, existing technologies employ structures such as transport devices, suction plates, air extraction chambers, and air extraction machines to adhere the panel to the suction plate. However, this approach still presents the problem of difficulty in applying adhesive to the other side of the LED chip panel during the adhesive application process. Utility Model Content

[0005] The purpose of this invention is to provide a gluing device for processing LED lamp bead chips, so as to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0007] An adhesive applicator for processing LED lamp bead chips includes a base, a support frame fixedly mounted on the top of the base, an adhesive applicator slidably connected to the bottom of the support frame, a flipping mechanism provided on the top of the base, and a drying mechanism provided on the top of the base and outside the flipping mechanism.

[0008] The flipping mechanism includes a rotating unit and a fixing unit, and the drying mechanism includes a heat-gathering unit and a drying unit.

[0009] The rotating unit includes two upright plates fixedly connected to the top of the base, and a fixed frame is rotatably connected between the two upright plates.

[0010] A further improvement of the present invention is that: a rotating shaft is provided on the side of the upright plate, one end of the rotating shaft passes through the outer wall of the upright plate and is fixedly connected to the outer wall of the fixed frame, a handle is fixedly installed on the other end of the rotating shaft, and a first through hole is provided on the outer wall of the rotating shaft.

[0011] Using the above technical solution, the handle enables the rotating shaft to drive the fixed frame to rotate, thereby flipping the LED lamp bead chip after it has been coated with glue.

[0012] A further improvement of this utility model is that a fixing block is fixedly connected to the top edge of the upright plate, a second through hole is opened on the top of the fixing block, a limiting rod is movably connected to the inner wall of the second through hole, and the outer wall of the limiting rod is movably connected to the inner wall of the first through hole.

[0013] Using the above technical solution, when the limiting rod is inserted into the first through hole, it can limit the rotation of the shaft.

[0014] A further improvement of the present invention is that the fixing unit includes a lower fixing plate fixedly connected to the inner wall edge of the upright plate, and an upper fixing plate is provided on the inner wall of the upright plate and directly above the lower fixing plate. The outer walls of the upper fixing plate and the lower fixing plate are provided with multiple rectangular through holes. The left and right sides of the upper fixing plate are provided with grooves. The inner wall of each groove is fixedly connected with a U-shaped spring piece. The outer wall of the U-shaped spring piece is movably connected to the inner wall of the fixing frame.

[0015] The above technical solution facilitates the fixing of the placed LED chips by means of the cooperation between the upper and lower fixing plates.

[0016] A further improvement of the present invention is that the heat-gathering unit includes an electric telescopic rod fixedly connected to the top of the base, a protrusion is fixedly connected to the telescopic end of the electric telescopic rod, a movable frame is fixedly connected to the side of the protrusion, a heat-insulating cloth is fixedly connected to the bottom of the movable frame, and the bottom of the heat-insulating cloth is fixedly connected to the top of the base.

[0017] Using the above technical solution, the electric telescopic rod can push the protrusion and the movable frame upward, thereby allowing the heat insulation cloth to cover the drying unit, which facilitates the drying of the LED lamp chip after gluing.

[0018] A further improvement of the present invention is that the drying unit includes a heating chamber fixedly installed on the top of the base, a plurality of electric heating wires are fixedly installed on the inner wall of the heating chamber, a cover plate is fixedly installed on the top of the heating chamber, and a plurality of ventilation slots are provided on the top of the cover plate.

[0019] Using the above technical solution, the electric heating wire can heat the gas inside the heating chamber.

[0020] A further improvement of the present invention is that a fan is fixedly installed on the top of the base and on the outer wall of the heat insulation cloth, and an air supply pipe is fixedly connected to the output end of the fan. The other end of the air supply pipe passes through the inner wall of the heating chamber and extends into the interior of the heating chamber.

[0021] Using the above technical solution, the fan can transport outside air to the interior of the heating chamber through the air supply pipe.

[0022] Due to the adoption of the above technical solution, the technological progress achieved by this utility model compared to the prior art is as follows:

[0023] 1. This utility model provides a gluing device for processing LED lamp bead chips. Through the cooperation of the set rotating shaft, fixed frame, limiting insert, first through hole, upper fixed plate, lower fixed plate, and U-shaped spring, the fixed frame can be rotated by the handle and rotating shaft, so that the glued LED lamp bead chip can be flipped. At the same time, when the limiting insert is inserted into the first through hole, it can limit the rotating shaft after rotation, so that the fixed frame can be kept stable. Through the cooperation between the upper fixed plate and the lower fixed plate, the placed LED lamp bead chip can be fixed. At the same time, under the action of the U-shaped spring, the upper fixed plate can be installed or removed.

[0024] 2. This utility model provides a gluing device for processing LED lamp bead chips. Through the cooperation between the electric telescopic rod, the protrusion and the movable frame, the electric telescopic rod pushes the protrusion and the movable frame to move upward, which facilitates the movable frame to drive the heat insulation cloth to move upward, thereby shielding the drying unit and concentrating the heat generated by the drying unit, which is convenient for drying the LED lamp bead chips after gluing.

[0025] 3. This utility model provides a gluing device for processing LED lamp bead chips. Through the cooperation of a fan, air supply pipe, heating chamber, electric heating wire, and ventilation slot, the fan delivers outside air to the interior of the heating chamber through the air supply pipe, so that the gas can be continuously delivered to the interior of the heating chamber. The electric heating wire can heat the gas inside the heating chamber, and the ventilation slot facilitates the blowing of the heated gas onto the surface of the glued LED lamp bead chips, which is convenient for drying. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of this utility model;

[0027] Figure 2 This utility model Figure 1 Enlarged view of point A in the middle;

[0028] Figure 3 This is a cross-sectional view showing the structural connection between the fixed frame and the lower fixed plate of this utility model.

[0029] Figure 4 This is a schematic diagram showing the structural connection between the base and the drying mechanism of this utility model;

[0030] Figure 5 This is a cross-sectional view showing the structural connection between the heating chamber and the cover plate of this utility model.

[0031] In the diagram: 1. Base; 2. Support frame; 3. Dispenser; 4. Tilting mechanism; 41. Vertical plate; 42. Fixing frame; 43. Rotating shaft; 44. First through hole; 45. Fixing block; 46. Second through hole; 47. Limiting rod; 48. Lower fixing plate; 481. Upper fixing plate; 482. Groove; 483. U-shaped spring; 5. Drying mechanism; 51. Electric telescopic rod; 52. Protrusion; 53. Movable frame; 54. Heat insulation cloth; 55. Heating chamber; 551. Electric heating wire; 552. Cover plate; 553. Ventilation slot; 554. Fan; 555. Air supply pipe. Detailed Implementation

[0032] The present invention will be further described in detail below with reference to embodiments:

[0033] Example 1

[0034] like Figure 1-5 As shown, this utility model provides a gluing device for LED lamp bead chip processing, including a base 1, a support frame 2 fixedly installed on the top of the base 1, a glue applicator 3 slidably connected to the bottom of the support frame 2, a flipping mechanism 4 provided on the top of the base 1, and a drying mechanism 5 provided on the top of the base 1 and outside the flipping mechanism 4. The flipping mechanism 4 includes a rotating unit and a fixing unit, and the drying mechanism 5 includes a heat-gathering unit and a drying unit. The rotating unit includes two upright plates 41 fixedly connected to the top of the base 1, and a fixing frame 42 rotatably connected between the two upright plates 41.

[0035] like Figure 1-5As shown, preferably, a rotating shaft 43 is provided on the side of the upright plate 41. One end of the rotating shaft 43 passes through the outer wall of the upright plate 41 and is fixedly connected to the outer wall of the fixing frame 42. A handle is fixedly installed on the other end of the rotating shaft 43. A first through hole 44 is opened on the outer wall of the rotating shaft 43. A fixing block 45 is fixedly connected to the top edge of the upright plate 41. A second through hole 46 is opened on the top of the fixing block 45. A limiting rod 47 is movably connected to the inner wall of the second through hole 46. The outer wall of the limiting rod 47 is movably connected to the inner wall of the first through hole 44. The fixing unit includes a lower fixing plate 48 fixedly connected to the edge of the inner wall of the upright plate 41. An upper fixing plate 481 is provided on the inner wall of the upright plate 41 and directly above the lower fixing plate 48. Both the outer walls of the upper fixing plate 481 and the lower fixing plate 48 are provided with... There are multiple rectangular through holes. Grooves 482 are provided on both the left and right sides of the upper fixing plate 481. A U-shaped spring piece 483 is fixedly connected to the inner wall of each groove 482. The outer wall of the U-shaped spring piece 483 is movably connected to the inner wall of the fixing frame 42. The LED chip is placed on the lower fixing plate 48, and the upper fixing plate 481 is inserted into the fixing frame 42. Under the action of the U-shaped spring piece 483, the LED chip is fixed. The LED chip is glued by the dispensing device 3. The handle is turned by hand, and the fixing frame 42 is rotated by the rotating shaft 43, thereby flipping the glued LED chip. Then, the limiting rod 47 is inserted into the first through hole 44 to limit the rotating shaft 43 after rotation, so that the fixing frame 43 remains stable.

[0036] Example 2

[0037] like Figure 1-5 As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, the heat-gathering unit includes an electric telescopic rod 51 fixedly connected to the top of the base 1. A protrusion 52 is fixedly connected to the telescopic end of the electric telescopic rod 51. A movable frame 53 is fixedly connected to the side of the protrusion 52. A heat-insulating cloth 54 is fixedly connected to the bottom of the movable frame 53. The bottom of the heat-insulating cloth 54 is fixedly connected to the top of the base 1. By pushing the protrusion 52 and the movable frame 53 upward through the electric telescopic rod 51, the heat-insulating cloth 54 is unfolded, thereby shielding the drying unit and gathering heat, which facilitates the drying of the LED lamp bead chips after gluing.

[0038] Example 3

[0039] like Figure 1-5As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, the drying unit includes a heating chamber 55 fixedly installed on the top of the base 1. Several electric heating wires 551 are fixedly installed on the inner wall of the heating chamber 55. A cover plate 552 is fixedly installed on the top of the heating chamber 55. Multiple ventilation slots 553 are opened on the top of the cover plate 552. A fan 554 is fixedly installed on the top of the base 1 and on the outer wall of the heat insulation cloth 54. The output end of the fan 554 is fixedly connected to an air supply pipe 555. The other end of the air supply pipe 555 passes through the inner wall of the heating chamber 55 and extends into the interior of the heating chamber 55. When the fan 554 is started, outside air is transported into the interior of the heating chamber 55 through the air supply pipe 555. The gas inside the heating chamber 55 is heated by the electric heating wires 551. The heated gas is blown through the ventilation slots 553 onto the glued side of the LED chip to dry it.

[0040] The working principle of the gluing device used for processing LED lamp chip will be explained in detail below.

[0041] like Figure 1-5 As shown, the LED chip is placed on the lower fixing plate 48, and the upper fixing plate 481 is inserted into the fixing frame 42. Under the action of the U-shaped spring 483, the LED chip is fixed. The LED chip is glued by the dispensing device 3. The fixing frame 42 is rotated by the handle and the rotating shaft 43 to flip the glued LED chip. Then, the limiting rod 47 is inserted into the first through hole 44 to limit the rotating shaft 43 after rotation, so that the fixing frame 42 remains stable, thereby applying glue to the other side of the LED chip. The protrusion 52 and the movable frame 53 are pushed upward by the electric telescopic rod 51, so that the movable frame 53 drives the heat insulation cloth 54 upward, which can concentrate heat. The fan 554 is started, and gas is continuously delivered into the heating chamber 55 through the air supply pipe 555. The electric heating wire 551 heats the gas inside the heating chamber 55, and the heated gas is blown out through the ventilation slot 553, thereby drying the surface of the glued LED chip.

[0042] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. A gluing device for processing LED lamp bead chips, comprising a base (1), a support frame (2) fixedly mounted on the top of the base (1), and a glue applicator (3) slidably connected to the bottom of the support frame (2), characterized in that: The top of the base (1) is provided with a turnover mechanism (4), and the top of the base (1) and outside the turnover mechanism (4) is provided with a drying mechanism (5); The turnover mechanism (4) comprises a rotating unit and a fixing unit, and the drying mechanism (5) comprises a heat collecting unit and a drying unit; The rotating unit comprises two vertical plates (41) fixedly connected to the top of the base (1), and a fixed frame (42) rotatably connected between the two vertical plates (41).

2. The device according to claim 1, characterized in that: The side surface of the vertical plate (41) is provided with a rotating shaft (43), one end of the rotating shaft (43) penetrates through the outer wall of the vertical plate (41) and is fixedly connected with the outer wall of the fixed frame (42), the other end of the rotating shaft (43) is fixedly installed with a handle, and the outer wall of the rotating shaft (43) is provided with a first through hole (44).

3. The device according to claim 1, characterized in that: The top edge of the vertical plate (41) is fixedly connected with a fixed block (45), the top of the fixed block (45) is provided with a second through hole (46), the inner wall of the second through hole (46) is movably connected with a limiting plug rod (47), and the outer wall of the limiting plug rod (47) is movably connected with the inner wall of the first through hole (44).

4. The glue applying device for LED lamp bead chip processing according to claim 1, characterized in that: The fixing unit comprises a lower fixed plate (48) fixedly connected to the inner wall edge of the vertical plate (41), an upper fixed plate (481) provided on the inner wall of the vertical plate (41) and directly above the lower fixed plate (48), and a plurality of rectangular through holes are formed in the outer walls of the upper fixed plate (481) and the lower fixed plate (48), recesses (482) are formed in the left and right sides of the upper fixed plate (481), a U-shaped elastic sheet (483) is fixedly connected to the inner wall of each recess (482), and the outer wall of the U-shaped elastic sheet (483) is movably connected with the inner wall of the fixed frame (42).

5. The device according to claim 1, characterized in that: The heat collecting unit comprises an electric telescopic rod (51) fixedly connected to the top of the base (1), the telescopic end of the electric telescopic rod (51) is fixedly connected with a protruding block (52), the side surface of the protruding block (52) is fixedly connected with a movable frame (53), the bottom of the movable frame (53) is fixedly connected with a heat insulation cloth (54), and the bottom of the heat insulation cloth (54) is fixedly connected with the top of the base (1).

6. The device according to claim 1, characterized in that: The drying unit comprises a heating cavity (55) fixedly installed on the top of the base (1), a plurality of electric heating wires (551) fixedly installed on the inner wall of the heating cavity (55), a cover plate (552) fixedly installed on the top of the heating cavity (55), and a plurality of ventilation grooves (553) formed in the top of the cover plate (552).

7. The device according to claim 1, characterized in that: The top of the base (1) and outside the heat insulation cloth (54) is fixedly installed with a fan (554), the output end of the fan (554) is fixedly connected with a gas conveying pipe (555), and the other end of the gas conveying pipe (555) penetrates through the inner wall of the heating cavity (55) and extends into the inside of the heating cavity (55).

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