Feeding and discharging module of full-automatic wafer measuring equipment

Abstract

The utility model discloses a loading and unloading module of full-automatic wafer measuring equipment, which comprises a bottom plate extending along the X-axis direction and the Y-axis direction; the outer cover is installed on the base, the outer cover and the bottom plate form a closed feeding and discharging chamber, the outer cover is used for containing a wafer rack, and a taking and placing opening used for taking and placing the wafer rack is formed in the outer cover; the door is used for opening and closing the pick-and-place opening; the positioning mechanism is arranged on the bottom plate, the positioning mechanism comprises at least two front end positioning blocks and at least one rear end positioning block, the at least two front end positioning blocks and the at least one rear end positioning block are arranged at intervals in the Y-axis direction, and each front end positioning block is provided with a left positioning step and a right positioning step which are arranged at intervals in the X-axis direction. The positioning mechanism of the loading and unloading module of the full-automatic wafer measuring equipment can adapt to wafers of different specifications, and the adaptation range is large.

Description

Technical Field

[0001] This utility model relates to the field of measurement technology, and in particular to a loading and unloading module of a fully automatic wafer measurement device. Background Technology

[0002] The geometric parameters of a wafer (such as three-dimensional morphology and thickness) are key indicators of wafer quality, and their accurate measurement is a crucial step in the semiconductor manufacturing process. Currently, the semiconductor industry commonly uses semi-automatic measurement equipment for wafer inspection. However, the use of semi-automatic equipment presents the following problems due to the need for manual wafer handling:

[0003] 1. Wafers are easily damaged by bumps and knocks during manual handling;

[0004] 2. Manual operation increases the risk of dust pollution;

[0005] 3. Manual intervention reduces detection efficiency.

[0006] To address these issues, fully automated wafer measurement equipment has emerged. Compared to semi-automatic equipment, fully automated measurement equipment can significantly reduce interference from human factors, not only better ensuring the cleanliness and integrity of wafers but also improving inspection efficiency.

[0007] However, existing fully automated wafer measurement equipment still has certain limitations. These devices typically consist of functional units such as loading / unloading modules, edge finder modules, wafer testing modules, and handling modules. The loading / unloading module is used for loading and unloading wafers; existing loading / unloading modules are usually only applicable to wafers of one size, resulting in poor versatility. Utility Model Content

[0008] Therefore, it is necessary to provide a fully automated wafer measurement equipment loading and unloading module that can be applied to wafers of various specifications, addressing the problems of existing technologies.

[0009] A loading and unloading module of a fully automated wafer measurement device, comprising an X-axis direction, a Y-axis perpendicular to the X-axis, and a Z-axis direction perpendicular to both the X-axis and Y-axis, including:

[0010] The base plate extends along the X and Y axes;

[0011] The outer cover is installed on the base and forms a closed loading and unloading chamber with the base plate to accommodate the wafer rack. The outer cover is provided with a loading and unloading port for picking up and putting in the wafer rack.

[0012] The door is used to open and close the loading / unloading port;

[0013] A positioning mechanism is disposed on the base plate. The positioning mechanism includes at least two front positioning blocks and at least one rear positioning block. The at least two front positioning blocks and at least one rear positioning block are arranged at intervals along the Y-axis direction, and each of the front positioning blocks has a left positioning step and a right positioning step arranged at intervals along the X-axis direction.

[0014] In one embodiment, the front-end positioning block includes a left front-end positioning block and a right front-end positioning block, which are respectively fixed on the base plate, and the left front-end positioning block and the right front-end positioning block are respectively provided with the left positioning step and the right positioning step.

[0015] In one embodiment, both the left front positioning block and the right front positioning block are provided with strip-shaped holes extending along the X-axis direction, and the base plate is provided with mounting holes corresponding to the strip-shaped holes. The left front positioning block and the right front positioning block are fixed to the base plate by nuts passing through the strip-shaped holes and mounting holes.

[0016] In one embodiment, there are two rear-end positioning blocks, which are arranged at intervals along the Y-axis.

[0017] In one embodiment, the loading and unloading module further includes a size detection mechanism, which includes a telescopic pin and a position detection sensor. The telescopic pin is installed in the mounting hole of the base plate and can move up and down along the Z-axis. The position detection sensor is used to detect the displacement state of the telescopic pin.

[0018] In one embodiment, the loading and unloading module further includes an alignment detection mechanism, which includes an alignment detection sensor and a reflector. The alignment detection sensor is mounted on the base plate, and the reflector is located above the alignment detection sensor for emitting detection light along the Z-axis.

[0019] In one embodiment, the loading and unloading module further includes a wafer inspection mechanism, which includes a reflective photoelectric sensor and a lifting mechanism. The reflective photoelectric sensor is used to detect whether the wafer in the wafer rack is placed in a designated position, and the lifting mechanism is used to drive the reflective photoelectric sensor to move up and down along the Z-axis.

[0020] In one embodiment, the lifting mechanism includes a mounting rod and a lead screw mechanism. The mounting rod is used to mount a reflective photoelectric sensor, and the lead screw mechanism includes a lead screw extending along the Z-axis and a slider threadedly engaged with the lead screw. The slider is connected to the mounting rod.

[0021] In one embodiment, one end of the door is pivotally connected to the outer cover, and the other end is provided with a lock between it and the base plate.

[0022] In one embodiment, a door detection mechanism is provided between the front end of the door and the base plate to detect whether the door is closed.

[0023] The loading and unloading module of the aforementioned fully automated wafer measurement equipment has a positioning mechanism that includes at least two front-end positioning blocks and at least one rear-end positioning block. The at least two front-end positioning blocks and at least one rear-end positioning block are arranged at intervals along the Y-axis. Each front-end positioning block has a left positioning step and a right positioning step arranged at intervals along the X-axis. Furthermore, along the front-to-back direction, the distance between the left and right positioning steps of the preceding front-end positioning block is greater than the distance between the left and right positioning steps of the following front-end positioning block. This design allows the positioning mechanism to adapt to wafers of different specifications, resulting in a wide range of adaptability. Attached Figure Description

[0024] Figure 1 This is a perspective view of a fully automated wafer measuring device according to one embodiment of the present invention;

[0025] Figure 2 for Figure 1 A 3D view of the fully automated wafer measurement equipment shown in the image, hidden behind its outer casing.

[0026] Figure 3 for Figure 1 A cross-sectional view of the fully automated wafer measurement equipment shown in the image;

[0027] Figure 4 for Figure 1 A cross-sectional view of the loading and unloading module of the fully automated wafer measurement equipment shown in the figure;

[0028] Figure 5 for Figure 4 A longitudinal sectional view of the loading and unloading module shown in the figure;

[0029] Figure 6 , 7 for Figure 4 The diagram shows the usage status of the loading and unloading module.

[0030] Figure 8 for Figure 1 The side view of the edge-finding and imaging module of the fully automated wafer measurement equipment shown.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1. Base;

[0033] 2. Outer cover; 201. Front opening; 202. Front side panel;

[0034] 3. Loading and unloading module; 301. Loading and unloading chamber; 302. Door; 303. Base plate; 304. First side plate; 305. Second side plate; 306. Crossbeam; 307. Electromagnetic lock; 308. Left front positioning block; 308a. Left positioning step; 309. Right front positioning block; 309a. Right positioning step; 310. Rear positioning block;

[0035] 311. Reflective photoelectric sensor; 312. Mounting rod; 313. Lead screw; 314. Slider;

[0036] 316. Telescopic pin; 317. Position detection sensor;

[0037] 320. Alignment detection sensor; 321. Reflector;

[0038] 4. Edge-finding and imaging module; 401. Edge finder; 402. Wafer holder; 403. Lens; 404. Camera; 405. Spacer; 406. Cylinder; 407. Light source;

[0039] 5. Measurement module;

[0040] 6. Handling module; 601. Robotic arm; 602. Base platform;

[0041] 8. Wafer rack;

[0042] 9. Wafer;

[0043] 10. Control box. Detailed Implementation

[0044] To make the above-mentioned objectives, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model are described clearly and completely below with reference to the accompanying drawings. Obviously, the specific details described below are only a part of the embodiments of this utility model, and this utility model can be implemented in many other embodiments different from those described herein. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0045] In this document, when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The directional terms such as "front," "back," "up," and "down" are defined based on the location of the components in the accompanying drawings and their relative positions, and are merely for clarity and convenience in expressing the technical solution. It should be understood that the use of these directional terms should not limit the scope of protection claimed by this utility model.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0047] See Figure 1 One embodiment of the wafer measurement device of this utility model includes: a base 1, a loading / unloading module 3, an edge-finding and imaging module 4, a measurement module 5, a handling module 6, a control box 10, and an outer cover 2. For ease of explanation, a three-dimensional coordinate system is defined in this embodiment, where the X-axis and Y-axis represent two orthogonal directions on the horizontal plane, and the Z-axis represents the vertical direction. This coordinate system is used to accurately describe the spatial positional relationship and movement direction of each component.

[0048] base

[0049] In this embodiment, the base 1 adopts a rectangular structure extending along the X and Y axes, and its main function is to provide a stable support platform for the entire wafer measurement equipment. The outer cover 2 is fixedly installed on the base 1, forming a closed inspection chamber through a tight fit. The edge-finding and imaging module 4, the measurement module 5, the handling module 6, and the control box 10 are all installed on the base 1 and located within this closed space. The front side plate 202 of the outer cover 2 has at least one front opening 201, which is mainly used for loading and unloading wafers 9.

[0050] Loading and unloading module

[0051] like Figure 1-3 As shown, the loading / unloading module 3 is located on the front side of the outer cover 2, opposite to the front opening 201 of the outer cover 2, and is mainly used for loading and unloading the wafer rack 8. The loading / unloading module 3 includes a base plate 303, an outer cover, and a door 302. The base plate 303 is a rectangular structure extending along the X and Y axes, serving as the foundation platform for the entire loading / unloading module 3 and supporting the installation of all other components. The rear end of the base plate 303 is fixed to the front side plate 202 of the outer cover 2, ensuring the stability of the entire loading / unloading module 3. The outer cover is mounted on the base, forming a closed loading / unloading chamber 301 with the base plate 303. The loading / unloading chamber 301 is connected to the front opening 201 and is used to accommodate the wafer rack. The outer cover has a loading / unloading port for loading and unloading the wafer rack 8. The door 302 is located at the loading / unloading port and is used to open and close the port, achieving a sealed loading / unloading chamber 301.

[0052] Specifically, such as Figure 3-7As shown, the outer cover includes a first side plate 304 and a second side plate 305. The first side plate 304 and the second side plate 305 are perpendicular to the bottom plate 303, arranged along the X-axis direction, and parallel to the plane defined by the Z-axis and Y-axis. The lower ends of the first side plate 304 and the second side plate 305 are fixed to the bottom plate 303, and the rear ends are fixed to the front side plate 202 of the outer cover 2, thereby ensuring the overall stability and structural rigidity of the loading and unloading module 3. Preferably, the loading and unloading module 3 also includes a crossbeam 306, which extends along the X-direction. The two ends of the crossbeam 306 are respectively fixed to the upper ends of the first side plate 304 and the second side plate 305, forming an upper support structure. The design of the crossbeam 306 strengthens the rigidity of the loading and unloading module 3 in the X-axis direction, effectively supporting the door 302 and other components. The rear end of the door 302 is pivotally connected to the crossbeam 306, which facilitates opening and closing the door 302.

[0053] In one embodiment, an electromagnetic lock 307 is provided at the front end of the door 302 to ensure the door 302 is locked during equipment operation, preventing accidental opening and disruption of normal operation. In another embodiment, a door detection mechanism is provided between the front end of the door 302 and the base plate 303 to detect whether the door is closed. The door detection mechanism includes a door detection sensor, which can be a photoelectric sensor, magnetic sensor, proximity sensor, etc., capable of accurately sensing changes in the position of the door 302. When the door 302 is fully closed, the door detection sensor detects a corresponding signal and feeds back the status of the door 302 to the control system.

[0054] In one embodiment, the loading / unloading module 3 further includes a positioning mechanism for precisely fixing the wafer carrier 8. The positioning mechanism ensures that the wafer carrier 8 is stably and accurately positioned in the X and Y axes for subsequent measurement or handling operations. As an example, the positioning mechanism includes front positioning blocks 308 and 309 and a rear positioning block 310, which are spaced apart along the Y-axis. The front positioning blocks 308 and 309 have a left positioning step 308a and a right positioning step 309a spaced apart along the X-axis. The lower end of the wafer carrier 8 has a bottom groove (not shown) extending along the Y-axis. The left positioning step 308a and the right positioning step 309a are inserted into the front end of the bottom groove and respectively engage with the steps on the left and right sides of the bottom groove opening. The front end face of the rear positioning block 310 contacts the rear side face of the lower end of the wafer carrier 8. The wafer rack 8 is positioned in the X and Y axes by the front positioning block and the rear positioning block 310 to prevent the wafer rack 8 from shifting or shaking.

[0055] As an example, the front positioning blocks 308 and 309 include a left front positioning block 308 and a right front positioning block 309. The left front positioning block 308 and the right front positioning block 309 are fixed on the base plate 303, and the left front positioning block 308 and the right front positioning block 309 are respectively provided with a left positioning step 308a and a right positioning step 309a. In this way, the front positioning blocks require less material and are easy to process.

[0056] As an example, there are multiple front-end positioning blocks 308 and 309, which are arranged at intervals along the Y-axis. Furthermore, from front to back, the distance between the left positioning step 308a and right positioning step 309a of the preceding front-end positioning block is greater than the distance between the left positioning step 308a and right positioning step 309a of the following front-end positioning block. This design allows the positioning mechanism to adapt to wafer racks of different sizes, such as 2-inch, 4-inch, and 6-inch wafers, providing a wide range of compatibility.

[0057] In one embodiment, both the left front positioning block 308 and the right front positioning block 309 are provided with strip-shaped holes extending along the X-axis direction. The base plate is provided with mounting holes corresponding to the strip-shaped holes. The left front positioning block and the right front positioning block are fixed to the base plate by nuts passing through the strip-shaped holes and mounting holes, which facilitates the adjustment of the positions of the left front positioning block 308 and the right front positioning block 309.

[0058] The working principle of the positioning mechanism in this embodiment is as follows:

[0059] like Figure 5 , 6 As shown, during equipment operation, the wafer rack 8 is placed into the loading / unloading module 3. The front end of the bottom groove of the wafer rack 8 precisely engages with the left positioning step 308a of the left front positioning block 308 and the right positioning step 309a of the right front positioning block 309. The rear side of the lower end of the wafer rack 8 mates with the front side of the rear positioning block 310, thereby achieving positioning of the wafer rack 8 in the X and Y axis directions. Moreover, it can adapt to wafer racks 8 of different specifications such as 2-inch, 4-inch, and 6-inch.

[0060] In one embodiment, the loading / unloading module 3 further includes a wafer inspection mechanism for detecting whether the wafer placement position in the wafer rack 8 is empty, i.e., confirming whether the wafer rack 8 is correctly placed with wafers. The wafer inspection mechanism includes a reflective photoelectric sensor 311 and a lifting mechanism. The reflective photoelectric sensor 311 is used to detect whether the wafer in the wafer rack 8 is placed in a designated position. The working principle is that the reflective photoelectric sensor 311 emits a light signal. If a wafer 9 is correctly placed in the wafer rack 8, the surface of the wafer 9 will reflect the light signal back to the sensor. The intensity or change of the reflected signal can indicate the position of the wafer 9. If there is no wafer 9 in the wafer rack 8, the sensor will not receive the reflected signal, thus determining that the wafer rack 8 is empty. The lifting mechanism is used to drive the reflective photoelectric sensor 311 to move up and down along the Z-axis, thereby enabling detection of each placement position in the wafer rack 8. As an example, the lifting mechanism includes a mounting rod 312 and a lead screw mechanism. The mounting rod 312 is used to mount the reflective photoelectric sensor 311. The lead screw mechanism 313 includes a lead screw 313 extending along the Z-axis direction and a slider 314 threadedly engaged with the lead screw. The slider 314 is connected to the mounting rod 312.

[0061] In one embodiment, the loading / unloading module 3 further includes at least two size detection mechanisms for detecting the size specifications of the wafer rack. Each size detection mechanism includes a telescopic pin 316 and a position detection sensor 317. The telescopic pin 316 is installed in a mounting hole in the base plate 303 and can move up and down along the Z-axis. When a wafer rack 8 of a specific size is placed, the bottom of the wafer rack 8 contacts the telescopic pin 316 of the corresponding size detection mechanism and compresses it downward. The position detection sensor 317 is used to detect the displacement state of the telescopic pin 316 and transmits the signal to the control box, thereby enabling the control box to accurately identify the size specifications of the currently placed wafer rack 8. The position detection sensor 317 can be a photoelectric sensor, which detects the movement of the telescopic pin 316 by emitting and receiving light signals. The photoelectric sensor can accurately capture the up and down movement of the telescopic pin 316 and emit a signal when the telescopic pin 316 moves downward to confirm that the wafer rack 8 is in place. When the telescopic pin 316 is pressed down by the wafer rack 8, the photoelectric sensor detects the change and sends a signal to the control system to indicate that the wafer rack 8 has been installed in place.

[0062] In one embodiment, the loading / unloading module 3 further includes an alignment detection mechanism for detecting whether the wafers 9 in the wafer rack 8 are aligned. The alignment detection mechanism includes an alignment detection sensor 320 and a reflector 321. The alignment detection sensor 320 is mounted on the base plate 303 and emits detection light along the Z-axis. The reflector 321 is mounted at the upper edge of the front opening 201 and opposite to the alignment detection sensor 320, reflecting the detection signal emitted by the alignment detection sensor 320. When the wafers 9 in the wafer rack 8 are correctly aligned, the signal is reflected back to the alignment detection sensor 320 via the reflector 321, forming a complete signal path. The reflector 321 is typically made of an optical reflective material to ensure effective reflection of the signal emitted by the sensor. Its position and angle are designed to ensure that it reflects all valid signals within the detection range. When all wafers 9 are correctly aligned, the signal emitted by the alignment detection sensor 320 is reflected back via the reflector 321 and accurately returns to the alignment detection sensor 320. At this point, the sensor can detect the reflected signal and confirm that all wafers 9 are aligned. When one or more wafers 9 are misaligned, the misaligned wafers 9 will protrude or deviate from their original positions, causing them to lie on the path between the alignment detection sensor 320 and the reflector 321. Due to this deviation, the detection signal cannot be correctly reflected back to the alignment detection sensor 320 via the reflector 321, or the intensity and direction of the reflected signal change and cannot be received by the sensor. In this case, the system will not be able to receive a complete reflected signal, thus determining that the wafers 9 in the wafer rack 8 are misaligned.

[0063] like Figure 5 , 6 As shown, the working principle of the loading and unloading module 3 is as follows:

[0064] 1. Wafer rack positioning (8 positions):

[0065] When the wafer carrier 8 is placed into the loading / unloading module 3, the left front positioning block 308, the right front positioning block 309, and the rear positioning block 310 work together to ensure the position of the wafer carrier 8 in the X and Y axis directions. The left front positioning block 308 and the right front positioning block 309 come in three types, each corresponding to different sizes of wafer carrier 8 (e.g., 2-inch, 4-inch, and 6-inch wafer carrier 8). The front positioning blocks use different spacing and positioning steps to adapt to different sizes of wafer carrier 8, ensuring the wafer carrier 8 is stably positioned.

[0066] The bottom of the wafer rack 8 presses against the telescopic pin 316, triggering the position detection sensor 317 to confirm that the wafer rack 8 has been correctly placed.

[0067] 2. Operation and locking of door 302:

[0068] During equipment operation, to ensure operational safety, door 302 needs to be closed and locked via electromagnetic lock 307. Once door 302 is locked and position detection sensor 317 is triggered, the system enters the working state.

[0069] 3. Alignment inspection and wafer 9-factor inspection startup:

[0070] After the positioning detection sensor 317 is triggered, the alignment detection sensor 320 starts working to perform alignment detection on the wafer rack 8 to ensure that the wafers 9 in the wafer rack 8 are correctly aligned.

[0071] The lead screw mechanism drives the mounting rod 312 upward along the Z-axis to ensure that the sensor reaches the correct height. The movement of the mounting rod 312 is precisely controlled to ensure that the reflective photoelectric sensor 311 can perform wafer 9 inspection at the correct height.

[0072] When the reflective photoelectric sensor 311 is triggered, it begins to detect whether the wafer 9 in the wafer rack 8 is correctly placed. By detecting the reflected signal, the system can determine whether the wafer 9 exists and confirm whether it is aligned.

[0073] 4. Post-wafer 9 inspection processing:

[0074] After completing the wafer 9 inspection, the system confirms the placement of wafer 9 in wafer rack 8 (whether it is placed and aligned). If wafer 9 is detected to be correctly placed and aligned, the device will automatically prepare to proceed to the next step.

[0075] Transport module

[0076] As shown in the figure, the handling module 6 in this embodiment is fixedly mounted on the base 1 behind the loading / unloading module 3. This handling module 6 is used to perform the automated handling process of the wafer 9, specifically including the following workflow:

[0077] 1. Grab the wafer 9 to be tested from the loading / unloading chamber 301 of the loading / unloading module 3;

[0078] 2. Move wafer 9 to edge-finding and imaging module 4 for edge positioning and character code imaging;

[0079] 3. After edge-finding and photographing, wafer 9 is moved to measurement module 5 for relevant parameter measurement;

[0080] 4. After the measurement process is completed, the wafer 9 is transported back to the loading and unloading chamber 301.

[0081] In a preferred embodiment, the handling module 6 includes a base 602 and a robotic arm 601. The robotic arm 601 adopts a multi-degree-of-freedom robotic arm structure, which can accurately grasp, transport, and place the wafer 9 in three-dimensional space. The motion trajectory and positional accuracy of the robotic arm 601 are controlled in real time by the control system to ensure the safety and reliability of the wafer 9 during the handling process.

[0082] Edge-finding photography module

[0083] The edge-finding and imaging module 4 is located on one side of the handling module 6, and is mainly used to realize automatic edge-finding and positioning of the wafer 9 and optical character recognition (OCR) imaging and storage of its back-side character codes. For example... Figure 8 As shown, the edge-finding and photography module 4 mainly includes an edge finder 401 and an OCR photography component.

[0084] The edge finder 401 is used to realize the automatic edge finding and positioning function of wafer 9. The edge finder 401 includes a wafer carrier 402. Specifically, the edge finder 401 can automatically scan and identify the edge contour of wafer 9 through a built-in high-precision sensor array or machine vision system, thereby accurately determining the spatial position of wafer 9. The edge finder 401 also includes a precision motion control system, which can adjust the position and orientation of wafer 9 in real time according to the identification results to ensure that wafer 9 can be accurately aligned with the subsequent imaging area. Since the edge finder 401 adopts existing mature technology, its specific structure will not be described in detail here.

[0085] After the edge-finding and positioning of wafer 9 is completed, the OCR imaging component is responsible for taking high-resolution images of the character codes on the back of wafer 9. For example... Figure 7 As shown, the OCR imaging component includes a light source 407 and a camera 404. The light source 407 is positioned below the wafer carrier 402 to provide stable and uniform illumination, ensuring clear character code image imaging. The camera 404 is also positioned below the wafer carrier 402 and its function is to capture the character code image on the back of the wafer 9 and transmit the captured image data to the control box 10 in real time. The control box 10, through its built-in image processing algorithm, can convert the acquired image into recognizable character information. This character information can be applied to various subsequent stages such as product quality inspection, production traceability, and product identification.

[0086] In a preferred embodiment of this invention, the OCR imaging component further includes a lens 403, which is used to provide good image quality.

[0087] In another preferred embodiment, the OCR imaging component is further provided with an imaging drive device. The main function of this imaging drive device is to drive the light source 407, camera 404, and lens 403 to move along the radial direction of the wafer carrier 402 to accommodate the imaging needs of wafers 9 with different diameters. Specifically, the imaging drive device includes a pad 405 and a cylinder 406, wherein the camera 404 is fixedly mounted on the pad 405, and the telescopic rod of the cylinder 406 is connected to the pad 405. The telescopic movement of the cylinder 406 drives the entire imaging component to adjust its position.

[0088] Measurement module

[0089] As shown in the figure, in this embodiment, the measurement module 5 is located on the opposite side of the transport module 6 relative to the edge-finding and imaging module 4. This measurement module 5 is mainly used for precise measurement of various geometric parameters of the wafer 9, including but not limited to: the flatness, warpage, thickness uniformity, and surface morphology of the wafer 9. The measurement module 5 is prior art and will not be described in detail here.

[0090] control box

[0091] The control box 10 is located on the side of the measuring module 5 away from the arm of the conveying module 6. As the control center of the entire system, the control box 10 mainly includes the following functional units:

[0092] 1. Industrial control computer, used for overall system control and human-machine interface display;

[0093] 2. Electrical control unit, responsible for power management and signal control of each module;

[0094] 3. Motion control unit, used for precise control of the conveying module 6 and each moving part;

[0095] 4. Image processing unit, used to process the character code image acquired by the edge-finding and image-taking module 4;

[0096] 5. Data acquisition unit, used to acquire and store the measurement data of measurement module 5.

[0097] The fully automated wafer measurement equipment of this application has the following advantages:

[0098] 1. The linear design is compact and simple, easy to maintain, occupies little space, and is easy to operate;

[0099] 2. It integrates fully automated, high-cleanliness, and high-precision leveling.

[0100] 3. Compatible with automatic feeding of 2, 4, and 6-inch wafers, and can perform character code photography after edge finding of 2, 4, and 6-inch wafers.

[0101] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. A full-automatic wafer measurement equipment loading and unloading module having an X-axis direction, a Y-axis direction perpendicular to the X-axis, and a Z-axis direction perpendicular to both the X-axis and the Y-axis, characterized in that, The application relates to a wafer loading and unloading module. The wafer loading and unloading module comprises a base plate extending along the X-axis and Y-axis directions, an outer cover installed on the base plate and forming a closed loading and unloading chamber with the base plate, the outer cover being provided with a loading and unloading opening for loading and unloading a wafer rack, a door for opening and closing the loading and unloading opening, and a positioning mechanism arranged on the base plate. The positioning mechanism comprises at least two front positioning blocks and at least one rear positioning block, the at least two front positioning blocks and the at least one rear positioning block being arranged at intervals along the Y-axis direction, each of the front positioning blocks being provided with left and right positioning steps arranged at intervals along the X-axis direction, and the interval between the left and right positioning steps of a front positioning block being greater than the interval between the left and right positioning steps of a rear positioning block along a direction from front to back. The front positioning blocks comprise a left front positioning block and a right front positioning block, the left front positioning block and the right front positioning block being respectively fixed on the base plate, and the left front positioning block and the right front positioning block being respectively provided with the left and right positioning steps. The left front positioning block and the right front positioning block are respectively provided with strip-shaped holes extending along the X-axis direction, the base plate is provided with mounting holes corresponding to the strip-shaped holes, and the left front positioning block and the right front positioning block are fixed on the base plate through nuts penetrating the strip-shaped holes and the mounting holes.

2. The automatic wafer measurement device loading and unloading module according to claim 1, wherein, The rear positioning block is two, and the two rear positioning blocks are arranged at intervals along the Y-axis direction.

3. The automatic wafer measurement device loading and unloading module according to claim 2, wherein, The loading and unloading module further comprises a size detection mechanism, the size detection mechanism comprising a telescopic pin and a position detection sensor, the telescopic pin being installed in a mounting hole of the base plate and being capable of extending and retracting along the Z-axis direction, and the position detection sensor being used for detecting the displacement state of the telescopic pin.

4. The automatic wafer measurement device loading and unloading module of claim 1, wherein, The loading and unloading module further comprises an alignment detection mechanism, the alignment detection mechanism comprising an alignment detection sensor and a reflecting member, the alignment detection sensor being installed on the base plate, and the reflecting member being located above the alignment detection sensor and being used for emitting detection light along the Z-axis direction.

5. The automatic wafer measurement device loading and unloading module according to any one of claims 1 to 4, characterized in that, The loading and unloading module further comprises a wafer detection mechanism, the wafer detection mechanism comprising a reflecting photoelectric sensor and a lifting mechanism, the reflecting photoelectric sensor being used for detecting whether a wafer in the wafer rack is placed at a specified position, and the lifting mechanism being used for driving the reflecting photoelectric sensor to move up and down along the Z-axis direction.

6. The automatic wafer measurement device loading and unloading module according to any one of claims 1 to 4, characterized in that, The lifting mechanism comprises a mounting rod and a lead screw mechanism, the mounting rod being used for mounting the reflecting photoelectric sensor, and the lead screw mechanism comprising a lead screw extending along the Z-axis direction and a sliding block threadedly matched with the lead screw, the sliding block being connected with the mounting rod.

7. The automatic wafer measurement device loading and unloading module according to any one of claims 1 to 4, characterized in that, One end of the door is pivotally connected with the outer cover, and a lock is arranged between the other end of the door and the base plate.

8. The automatic wafer measurement device loading and unloading module according to claim 7, wherein, A door detection mechanism is arranged between the front end of the door and the base plate, and is used for detecting whether the door is closed.

9. The automatic wafer measurement device loading and unloading module according to any one of claims 1 to 4, characterized in that, ​ 10. The automatic wafer measurement device loading and unloading module of claim 9, wherein, ​

Images