Source bottle heating device for atomic layer deposition equipment

Abstract

The utility model belongs to the technical field of precursor source bottle heating, and relates to a source bottle heating device for atomic layer deposition equipment, which comprises a shell assembly used for loading a source bottle; a closed space is arranged in the shell assembly, and the closed space is used for loading the source bottle; the heating assembly is used for heating the source bottle; the heating assembly is arranged in the closed space and at least partially wraps the source bottle; the heating assembly at least partially extends out of the shell assembly. According to the source bottle heating device for the atomic layer deposition equipment, a precursor can be evenly heated, and the source bottle heating device has the excellent characteristics of being high in temperature control precision, easy to disassemble, good in heat preservation performance and good in durability.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of precursor source bottle heating, and particularly relates to a source bottle heating device for atomic layer deposition equipment. BACKGROUND

[0002] Atomic layer deposition (ALD) is a special chemical vapor deposition technology, which is a method for forming a thin film in the form of a single atomic layer by alternately passing gas-phase precursors into a reaction chamber in the form of pulses and causing a chemical adsorption reaction on the surface of the deposited material. The heating uniformity and temperature control precision of the precursor source bottle heating device can affect the stability of the gas-phase precursor pulse, and further affect the thickness control precision of the thin film in the atomic layer deposition technology.

[0003] Generally, the conventional source bottle heating device uses alkali-free glass fiber as an insulating material, and first makes Cr20Ni80 alloy wire into an insulating heating rope, and then makes a flexible heating sleeve by knitting. However, this heating device has many shortcomings, such as poor adhesion to the heated source bottle, poor heat uniformity of the source bottle, low temperature control precision, poor heat preservation performance, and internal glass fiber leakage caused by repeated disassembly, which poses a safety hazard. SUMMARY

[0004] Therefore, the utility model provides a source bottle heating device for atomic layer deposition equipment.

[0005] Specifically, the utility model is realized by the following technical solutions:

[0006] According to the first aspect of the utility model, a source bottle heating device for atomic layer deposition equipment is provided, which comprises:

[0007] A housing assembly is used to load a source bottle. A closed space is provided in the housing assembly, and the closed space is used to load the source bottle.

[0008] A heating assembly is used to heat the source bottle. The heating assembly is arranged in the closed space and at least partially wraps the source bottle. The heating assembly at least partially extends out of the housing assembly.

[0009] Optionally, the housing assembly comprises a heat preservation and insulation sleeve. An internal cavity of the heat preservation and insulation sleeve at least partially forms the closed space. The heating assembly is arranged in the heat preservation and insulation sleeve, and the heating assembly at least partially extends out of the heat preservation and insulation sleeve.

[0010] Optionally, the housing assembly further comprises a cover plate. The cover plate is in sealed connection with an opening of the heat preservation and insulation sleeve. The heat preservation and insulation sleeve and the cover plate jointly form the closed space.

[0011] Optionally, the heat insulation sleeve is provided with a through hole for the heating assembly to at least partially extend out.

[0012] Optionally, the cover plate is provided with a through hole.

[0013] Optionally, the heating assembly comprises a heating wire, a heat-conducting medium and a thermocouple, wherein the heat-conducting medium is arranged in a circular ring shape, an inner cavity of the heat-conducting medium is used for carrying the source bottle, the heating wire is arranged on an outer wall of the heat-conducting medium, a first end of the thermocouple is arranged on the outer wall of the heat-conducting medium and connected with the heating wire, and a second end of the thermocouple extends out of the through hole of the heat insulation sleeve in the outer shell assembly.

[0014] Optionally, the outer wall of the heat-conducting medium is provided with a threaded groove, and the heating wire is arranged in the threaded groove.

[0015] Optionally, the bottom wall of the heat-conducting medium is provided with a mounting groove, and the thermocouple is arranged in the mounting groove.

[0016] Optionally, the heating assembly further comprises a fixing plate, the fixing plate is arranged on the bottom wall of the heat-conducting medium, and the first end of the thermocouple is arranged on the fixing plate.

[0017] Optionally, the bottom wall of the heat-conducting medium is provided with a fixing groove, and the fixing plate is embedded in the fixing groove.

[0018] The technical scheme provided by the utility model has at least the following beneficial effects:

[0019] The source bottle heating device for atomic layer deposition equipment provided by the application can make the precursor evenly heated, has the excellent characteristics of high temperature control precision, easy disassembly, good heat preservation performance and good durability. BRIEF DESCRIPTION OF DRAWINGS

[0020] The drawings incorporated into the specification and forming a part thereof show, in accordance with the embodiments of the utility model, and together with the specification, serve to explain the principle of the utility model.

[0021] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiments or related technical description will be briefly introduced as follows, and obviously, other drawings can also be obtained by the ordinary skilled in the art without any creative labor.

[0022] Figure 1 The structure schematic view of the source bottle heating device for atomic layer deposition equipment provided by the embodiments of the utility model;

[0023] Figure 2 A sectional view of a source bottle heating device for an atomic layer deposition equipment is provided in the embodiments of the present application.

[0024] Figure 3 A structural schematic diagram of a heating assembly in a source bottle heating device for an atomic layer deposition equipment is provided in the embodiments of the present application. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] Figure 1 A source bottle heating device for an atomic layer deposition equipment is schematically shown, which is applicable to the embodiments of the present application.

[0027] REFERENCE Figures 1-3 As shown in the reference, the present application provides a source bottle heating device for an atomic layer deposition equipment, which comprises:

[0028] A housing assembly for loading a source bottle; a closed space is provided in the housing assembly, and the closed space is used for loading the source bottle 100;

[0029] A heating assembly 101 for heating the source bottle; the heating assembly 101 is provided in the closed space, and at least partially wraps the source bottle; the heating assembly 101 at least partially extends out of the housing assembly.

[0030] In the embodiments of the present application, the housing assembly is used for providing a closed space for the heating assembly 101 and the source bottle 100. The heating assembly 101 is connected with a power supply and generates heat by itself, which is used for heating the source bottle 100. The device aims to optimize the heating process of the source bottle. The following is a detailed description of the device and its characteristics:

[0031] Housing assembly: used for loading the source bottle and providing a closed space for it. Closed space: ensures that the heating process is carried out in a closed environment, which helps to maintain the stability and safety of the temperature.

[0032] Heating assembly 101: used for heating the source bottle, ensuring that the source bottle reaches the required temperature during atomic layer deposition. Layout: The heating assembly is arranged in a closed space and at least partially wraps the source bottle to maximize heat transfer efficiency. External connection: The heating assembly at least partially protrudes from the shell assembly to be externally connected to a power source for power supply.

[0033] Compared with traditional source bottle heating devices, the design provided by the present application has the following significant advantages:

[0034] Improved thermal uniformity: By optimizing the fit of the heating assembly and the source bottle, the device can significantly improve the thermal uniformity of the source bottle, thereby ensuring the stability and consistency of the deposition process. Improved temperature control accuracy: The improved design of the heating assembly helps to more accurately control the temperature of the source bottle, which is crucial for atomic layer deposition, which is sensitive to temperature. Enhanced heat preservation performance: The closed shell assembly and the optimized heating assembly together improve the heat preservation performance of the device, reducing energy loss and improving energy utilization efficiency. Enhanced safety: Avoids the safety hazards of glass fiber leakage in traditional heating devices, and through more advanced material and structure design, ensures the safety and reliability of the heating process.

[0035] Exemplarily, the shell assembly comprises: a heat preservation sleeve 102, the internal cavity of the heat preservation sleeve 102 at least partially forms the closed space, the heating assembly 101 is arranged in the heat preservation sleeve 102, and the heating assembly 101 at least partially protrudes from the heat preservation sleeve 102.

[0036] In the embodiments of the present application, the heat preservation sleeve 102 can reduce the proportion of heat leakage generated by the heating assembly 101, and can be used to carry the heating assembly 101 and the source bottle 100.

[0037] Exemplarily, the shell assembly further comprises: a cover plate 204, the cover plate 204 is in closed connection with the opening of the heat preservation sleeve 102, and the heat preservation sleeve 102 and the cover plate 204 jointly form the closed space.

[0038] In the embodiments of the present application, the cover plate 204 is arranged at the opening of the heat preservation sleeve 102, and the heat preservation sleeve 102 and the cover plate 204 jointly form a closed space therebetween.

[0039] Exemplarily, the heat preservation sleeve 102 is provided with a perforation for the heating assembly 101 to at least partially protrude.

[0040] In the embodiments of the present application, part of the structure of the heating assembly 101 is connected with the external power source through the perforation.

[0041] Exemplarily, the cover plate 204 is provided with a through hole.

[0042] In the embodiment of the present application, the through hole is used for the partial structure of the source bottle 100 to pass through.

[0043] Exemplarily, the heating assembly 101 comprises a heating wire 200, a heat-conducting medium 201 and a thermocouple 202, wherein the heat-conducting medium 201 is arranged in a circular ring shape, the inside cavity of the heat-conducting medium 201 is used for bearing the source bottle, the heating wire 200 is arranged on the outer wall of the heat-conducting medium 201, the first end of the thermocouple 202 is arranged on the outer wall of the heat-conducting medium 201 and connected with the heating wire 200, and the second end of the thermocouple 202 extends out of the through hole of the heat-insulating sleeve 102 in the shell assembly.

[0044] In the embodiment of the present application, the thermocouple 202 is connected with the power supply, and the power supply delivers electric energy to the heating wire 200 under the action of the power supply, the heating wire 200 generates heat, the heat is transmitted to the heat-conducting medium 201, the heat-conducting medium 201 directly contacts the source bottle 100, and the heat is directly transmitted to the source bottle 100.

[0045] Exemplarily, the outer wall of the heat-conducting medium 201 is provided with a threaded groove, and the heating wire 200 is arranged in the threaded groove.

[0046] In the embodiment of the present application, the threaded groove is arranged in a spiral shape on the outer wall of the heat-conducting medium 201, and the heating wire 200 is arranged along the threaded groove, so that the heat can be uniformly transmitted to the heat-conducting medium 201.

[0047] Exemplarily, the bottom wall of the heat-conducting medium 201 is provided with a mounting groove, and the thermocouple 202 is arranged in the mounting groove.

[0048] In the embodiment of the present application, the mounting groove is used for mounting and fixing the thermocouple 202.

[0049] Exemplarily, the heating assembly 101 further comprises a fixing plate 203, the fixing plate 203 is arranged on the bottom wall of the heat-conducting medium 201, and the first end of the thermocouple 202 is arranged on the fixing plate 203.

[0050] In the embodiment of the present application, the fixing plate 203 and the bottom wall of the heat-conducting medium 201 jointly clamp the first end of the thermocouple 202, so that the first end of the thermocouple 202 is prevented from shaking.

[0051] Exemplarily, the bottom wall of the heat-conducting medium 201 is provided with a fixing groove, and the fixing plate 203 is embedded in the fixing groove.

[0052] In the embodiment of the present application, the size of the fixing plate 203 is consistent with the size of the fixing groove, and the fixing plate 203 is completely embedded in the fixing groove.

[0053] In the embodiment, the heating wire 200 and the thermocouple 202 are embedded in the heat-conducting medium 201 to uniformly heat and accurately control the temperature of the precursor source bottle. The fixing plate 203 fixes the thermocouple 202 at the bottom of the heat-conducting medium 201. The cover plate 204 is placed above the precursor source bottle 100 and directly contacts the precursor source bottle. The precursor source bottle 100 directly contacts the heat-conducting medium 201. In addition, the heating wire 200 is embedded in the heat-conducting medium 201, and the thermocouple 202 is fixed at the bottom of the heat-conducting medium 201 through the fixing plate 203 and screws, which ensures the integrity of the heat-conducting medium 201 and the uniformity of heating, while meeting the requirements of easy disassembly and replacement, thereby reducing maintenance costs.

[0054] In the embodiment, the heat-insulating sleeve 102 is made of heat-conducting fiber and tightly covers the heating assembly 101 through magic tape to play the role of internal heat preservation, preventing the temperature of the outside of the source bottle body from being too high, and preventing burns.

[0055] In the embodiment, the heat-conducting medium 201 and the cover plate 204 are both made of aluminum alloy material and are processed by CNC cutting. The surface is treated by anodic oxidation and polishing.

[0056] In the embodiment, the heating wire 200 is made of Cr20Ni80 alloy wire with a length of 2-3 meters and a diameter of 8-10 mm. It is embedded on the outside of the heat-conducting medium 201 and directly contacts the heat-conducting medium 201 by winding 9-10 times.

[0057] In the embodiment, the heating wire 200 and the thermocouple 202 are controlled by PID technology. The heating wire can be heated to 300℃, and the heating control accuracy is ±1℃, and the temperature rising time is less than 10 minutes.

[0058] In the embodiment, the thermocouple 202 is located at the center of the bottom of the heat-conducting medium 201 and is fixed by a fixing plate and M5 screws.

[0059] In the embodiment, the thermocouple 202 is a K-type thermocouple with a temperature measurement range of -10℃-500℃, which is used to monitor the temperature of the precursor source bottle in real time, thereby providing temperature feedback and adjusting the temperature of the heating rod in real time to achieve accurate temperature control.

[0060] During operation, the precursor source bottle 100 is installed inside the heating assembly 101, and the heat-insulating sleeve 102 is fixed outside the heating assembly 101. The heating assembly 101 heats the precursor source bottle 100 at a constant and uniform high temperature. The heat-insulating sleeve 102 covers the outside of the heating assembly 101 to play the role of internal heat preservation and external anti-scalding. The temperature generated by the heating wire 200 is uniformly conducted to the precursor source bottle through the heat-conducting medium 201.

[0061] The following is a more detailed description and analysis of the source bottle heating device of the atomic layer deposition equipment:

[0062] 1. Housing assembly

[0063] Heat-insulating cover 102: As a main part of the housing assembly, the internal cavity of the heat-insulating cover 102 at least partially forms a sealed space for loading the heating assembly 101 and the source bottle 100. The heat-insulating cover 102 is made of high-efficiency heat-insulating material to reduce the proportion of heat generated by the heating assembly 101 from leaking out, thereby improving energy utilization efficiency. Structure: The heat-insulating cover 102 is provided with perforations for the heating assembly 101 (especially the connecting part of the heating wire 200 and the thermocouple 202) to at least partially extend out to connect with the external power source.

[0064] Cover plate 204: The cover plate 204 is in sealed connection with the opening of the heat-insulating cover 102 to jointly form a sealed space to ensure the stability and safety of the heating process. Structure: The cover plate 204 is provided with a through hole for the partial structure (such as the bottle neck or connecting part) of the source bottle 100 to pass through to fix the source bottle 100 on the heating assembly 101.

[0065] 2. Heating assembly 101

[0066] Heating wire 200: The heating wire 200 is the main element for generating heat, which generates heat after being powered by the external power source. Layout: The heating wire 200 is wound on the outer wall of the heat-conducting medium 201, especially in the threaded groove on the outer wall of the heat-conducting medium 201, to ensure that the heat can be uniformly transferred to the heat-conducting medium 201.

[0067] Heat-conducting medium 201: The heat-conducting medium 201 is arranged in a circular ring shape, and its internal cavity is used to carry the source bottle 100. The heat-conducting medium 201 directly contacts the source bottle 100 to transfer the heat generated by the heating wire 200 to the source bottle 100. Structure: The outer wall of the heat-conducting medium 201 is provided with a threaded groove for accommodating the heating wire 200; the bottom wall is provided with a mounting groove and a fixing groove for mounting and fixing the thermocouple 202 and the fixing plate 203, respectively.

[0068] Thermocouple 202: The thermocouple 202 is used to monitor the temperature of the heat-conducting medium 201 (indirectly monitor the source bottle 100) and feed back the temperature signal to the control system to realize accurate temperature control. Layout: The first end of the thermocouple 202 is arranged on the outer wall of the heat-conducting medium 201 (fixed by the fixing plate 203) and connected with the heating wire 200; the second end extends out of the perforation of the heat-insulating cover 102 and is connected with the external power source and the control system.

[0069] The fixed plate 203 is arranged on the bottom wall of the heat-conducting medium 201 and clamps the first end of the thermocouple 202 together with the bottom wall of the heat-conducting medium 201 to prevent the first end of the thermocouple 202 from shaking and ensure the accuracy of measurement. Structure: The fixed plate 203 is embedded in the fixed groove on the bottom wall of the heat-conducting medium 201 to achieve stable fixation.

[0070] 3. Technical advantages

[0071] Efficient heating: The heating wire 200 is wound in the threaded groove of the heat-conducting medium 201 to ensure uniform heat transfer and improve heating efficiency. Precise temperature control: The thermocouple 202 monitors the temperature of the heat-conducting medium 201 in real time and feeds back to the control system to achieve precise control of the temperature of the source bottle 100. Excellent heat preservation performance: The heat preservation sleeve 102 is made of high-efficiency heat preservation material, which reduces the proportion of heat leakage and improves the energy utilization efficiency. Compact structure: The entire heating device has a compact structure, which is easy to install and maintain, and at the same time ensures the stability and safety of the heating process.

[0072] In summary, the source bottle heating device of the atomic layer deposition equipment has significant advantages in structure design and function implementation, providing an efficient, stable and safe heating solution for the atomic layer deposition process. The source bottle heating device provided by the present application can uniformly heat the precursor, has the excellent characteristics of high temperature control precision, easy disassembly, good heat preservation performance and good durability.

[0073] It should be noted that in the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not intended to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0074] In addition, in addition to indicating the orientation or positional relationship, the above-mentioned terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the present application can be understood according to the specific circumstances.

[0075] In addition, the terms "mount", "set", "provided with", "connected", "linked" should be interpreted broadly. For example, it can be fixed connection, detachable connection, or integral structure; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0076] In addition, the terms "first", "second" and the like are mainly used to distinguish different devices, elements or components (the specific type and structure can be the same or different), and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "a plurality of" is two or more.

[0077] The above is only a specific embodiment of the present application, so that those skilled in the art can understand or implement the present application. Various modifications of these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features applied herein.

Claims

1. A source bottle heating arrangement for an atomic layer deposition apparatus, characterized by The application relates to a source bottle heating device. The shell assembly comprises a heat insulation sleeve, an inner cavity of the heat insulation sleeve at least partially forming the sealed space, the heating assembly being arranged in the heat insulation sleeve and at least partially extending out of the heat insulation sleeve. The shell assembly further comprises a cover plate, the cover plate being in sealed connection with an opening of the heat insulation sleeve, the heat insulation sleeve and the cover plate jointly forming the sealed space.

2. A source bottle heating arrangement for an atomic layer deposition apparatus according to claim 1, characterized in that, The heat insulation sleeve is provided with a through hole for the heating assembly to at least partially extend out of the heat insulation sleeve.

3. A source bottle heating arrangement for an atomic layer deposition apparatus according to claim 2, characterized in that, The cover plate is provided with a through hole.

4. The source bottle heating arrangement for an atomic layer deposition apparatus according to claim 2, characterized by The heating assembly comprises a heating wire, a heat conducting medium and a thermocouple, the heat conducting medium being arranged in a circular ring shape, an inner cavity of the heat conducting medium being used for carrying the source bottle, the heating wire being wound around an outer wall of the heat conducting medium, a first end of the thermocouple being arranged on the outer wall of the heat conducting medium and being connected with the heating wire, and a second end of the thermocouple extending out of the through hole of the heat insulation sleeve in the shell assembly.

5. The source bottle heating arrangement for an atomic layer deposition apparatus according to claim 3, characterized by The outer wall of the heat conducting medium is provided with a threaded groove, and the heating wire is arranged in the threaded groove.

6. The source bottle heating apparatus for an atomic layer deposition apparatus according to claim 1, characterized by, The bottom wall of the heat conducting medium is provided with a mounting groove, and the thermocouple is arranged in the mounting groove.

7. A source bottle heating arrangement for an atomic layer deposition apparatus according to claim 6, characterized in that, The heating assembly further comprises a fixing plate, the fixing plate being arranged on the bottom wall of the heat conducting medium, and the first end of the thermocouple being arranged on the fixing plate.

8. The source bottle heating arrangement for an atomic layer deposition apparatus according to claim 6, characterized by The bottom wall of the heat conducting medium is provided with a fixing groove, and the fixing plate is embedded in the fixing groove.

9. The source bottle heating arrangement for an atomic layer deposition apparatus according to claim 6, characterized by ​ 10. A source bottle heating arrangement for an atomic layer deposition apparatus according to claim 9, characterized in that, ​

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