Rapid cooling device for atomic layer deposition equipment

Abstract

The utility model belongs to the technical field of atomic layer deposition, and relates to a rapid cooling device for atomic layer deposition equipment, which comprises a heating component, a cooling component and a cooling component, the detection assembly is used for detecting the temperature of the heating assembly; the detection assembly is arranged on the heating assembly; the cooling fluid conveying assembly is used for conveying cooling fluid to the heating assembly; the cooling fluid conveying assembly is connected with the heating assembly; the control assembly is used for controlling the cooling fluid conveying assembly according to a detection value of the detection assembly; the control assembly is connected with the detection assembly and the cooling fluid conveying assembly. According to the rapid cooling device for the atomic layer deposition equipment, the sampling waiting time is greatly shortened, and the temperature can be controlled to be reduced to the sampling temperature within 2 hours. And the experiment efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to atomic layer deposition technical field especially relates to a kind of atomic layer deposition equipment rapid cooling device. BACKGROUND

[0002] Atomic Layer Deposition (ALD), also known as Atomic Layer Epitaxy (ALE) or Atomic Layer Chemical Vapor Deposition (ALCVD).

[0003] Atomic Layer Deposition was first proposed by Finnish scientists in 1974, has the advantages of single atomic layer deposition, deposition layer thickness extremely uniform, high three-dimensional conformality, and has become a key link in the development of advanced semiconductor process technology. In the atomic layer deposition process, the chemical reaction of the new atomic layer is directly related to the previous layer. Atomic Layer Deposition alternately passes two or more gas phase precursors into the reactor, and performs a chemical adsorption reaction on the surface of the deposited substrate to form a deposited film, and uses chemical bonds to alternately adsorb A and B two substances to realize surface reaction growth.

[0004] Atomic Layer Deposition has the characteristics of self-limitation, that is, in each pulse cycle, the gas phase precursor can only react at the atomic bonding site on the surface of the deposited substrate, and exactly covers the substrate surface with a saturated amount, which can repeat atomic layer growth in a very wide process window.

[0005] Using ALD equipment to prepare some high-temperature materials (such as TiN) requires a high-temperature atmosphere of 400 degrees. If the cavity is opened directly after preparation is completed, the oxygen in the air will also have an oxidation reaction with the sample surface at high temperature to generate TiO2, resulting in poor performance of the prepared sample. Therefore, the cavity needs to be naturally cooled after the experiment is completed, and the sample needs to be taken after the temperature is reduced to 100 degrees. The time required for the temperature to drop by 300 degrees is very long in a vacuum state, generally requiring 6-8 hours, which greatly prolongs the entire experimental time. Sometimes, the cooling time may be longer than the experimental process time. UTILITY MODEL CONTENT

[0006] Therefore, the utility model provides a kind of atomic layer deposition equipment rapid cooling device.

[0007] Specifically, the utility model is realized by the following technical solutions:

[0008] According to the first aspect of the utility model, a kind of atomic layer deposition equipment rapid cooling device is provided, comprising:

[0009] a heating assembly for heating a sample;

[0010] a detecting component arranged on the heating component for detecting the temperature of the heating component;

[0011] a cooling fluid delivery component connected with the heating component for delivering cooling fluid to the heating component;

[0012] a control component connected with the detecting component and the cooling fluid delivery component respectively for controlling the cooling fluid delivery component according to the detecting value of the detecting component.

[0013] Optionally, the heating component comprises a heating disc and a heating wire, wherein the heating wire is arranged in the inner layer of the heating disc, the detecting component is arranged on the heating disc, and the cooling fluid delivery component is connected with the heating disc.

[0014] Optionally, the detecting component comprises a temperature sensor arranged at the corner of the heating disc of the heating component, and the temperature sensor is connected with the control component.

[0015] Optionally, the cooling fluid delivery component comprises a heat exchanger, a delivery pipe, a first-level cooling fluid storage and a first switch valve, wherein the heat exchanger is arranged on the bottom wall of the heating disc in the heating component, the delivery pipe is connected with the heat exchanger and the first-level cooling fluid storage respectively, the first switch valve is arranged on the delivery pipe between the heat exchanger and the first-level cooling fluid storage, the first switch valve is connected with the control component, and the first-level cooling fluid storage stores a first cooling fluid.

[0016] Optionally, the cooling fluid delivery component further comprises a second-level cooling fluid storage and a second switch valve, wherein the second-level cooling fluid storage is connected with the delivery pipe, the second switch valve is arranged on the delivery pipe between the heat exchanger and the second-level cooling fluid storage, the second switch valve is connected with the control component, and the second-level cooling fluid storage stores a second cooling fluid.

[0017] Optionally, the cooling fluid delivery component further comprises a third-level cooling fluid storage and a third switch valve, wherein the third-level cooling fluid storage is connected with the delivery pipe, the third switch valve is arranged on the delivery pipe between the heat exchanger and the third-level cooling fluid storage, the third switch valve is connected with the control component, and the third-level cooling fluid storage stores a third cooling fluid.

[0018] Optionally, the control assembly comprises a controller connected with the temperature sensor in the detection assembly and the first, second and third switch valves in the cooling fluid delivery assembly respectively.

[0019] Optionally, the temperature of the first cooling fluid is 60-80 DEG C.

[0020] Optionally, the temperature of the second cooling fluid is 40-50 DEG C.

[0021] Optionally, the temperature of the third cooling fluid is 20-30 DEG C.

[0022] The technical scheme provided by the utility model has at least the following beneficial effects:

[0023] The application provides a kind of quick cooling device of atomic layer deposition equipment, greatly shorten the time of sampling waiting, can be controlled to reduce to the temperature of sampling within 2 hours.The efficiency of experiment is improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] The drawings incorporated into the specification and forming part of the specification, show embodiments consistent with the utility model, and together with the specification for explaining the principle of the utility model.

[0025] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiments or related technical description will be briefly introduced, and obviously, for those skilled in the art, other drawings can be obtained without creative labor.

[0026] Figure 1 The structure diagram of the quick cooling device of atomic layer deposition equipment provided by the utility model embodiment. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the utility model embodiments clearer, the technical scheme in the utility model embodiments will be clearly and completely described below in conjunction with the drawings in the utility model embodiments, obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0028] Figure 1 The quick cooling device of atomic layer deposition equipment suitable for the utility model embodiments is schematically shown.

[0029] REFERENCE Figure 1As shown, the present application provides a rapid cooling device for atomic layer deposition equipment, comprising:

[0030] A heating component 10 for heating the sample;

[0031] A detection component 20 for detecting the temperature of the heating component 10; the detection component 20 is arranged on the heating component 10;

[0032] A cooling fluid delivery component 30 for delivering cooling fluid to the heating component 10; the cooling fluid delivery component 30 is connected to the heating component 10;

[0033] A control component 40 for controlling the cooling fluid delivery component 30 according to the detection value of the detection component 20; the control component 40 is connected to the detection component 20 and the cooling fluid delivery component 30 respectively.

[0034] In the embodiment of the present application, the heating component 10 is used to heat the sample, after the sample is heated to a predetermined temperature, the heating is stopped, the detection component 20 detects the temperature of the heating component 10, the control component 40 receives the temperature detection value and controls the cooling fluid delivery component 30 to output cooling fluid to the heating component 10 for cooling, when the control component 40 receives the temperature detection value reaching the sampling temperature, the control component 40 controls the cooling fluid delivery component 30 to stop delivering cooling fluid to the heating component 10. The rapid cooling device for atomic layer deposition (ALD) equipment works cooperatively through a series of components, realizes the rapid cooling of the heated sample, and significantly shortens the sampling waiting time.

[0035] 1. Device components and working mechanism

[0036] Heating component: used to heat the sample to the required temperature for atomic layer deposition operation. The heating component needs to have stable heating performance and good temperature control ability to ensure the uniformity and consistency of the deposition process.

[0037] Detection component: real-time monitoring of the temperature of the heating component, and feedback of the detection value to the control component. High-precision, high-sensitivity temperature sensor is the key to realize rapid and accurate temperature detection.

[0038] Cooling fluid delivery component: delivering cooling fluid (such as water, coolant, etc.) to the heating component to rapidly reduce the sample temperature. The cooling fluid delivery component needs to have high-efficiency fluid delivery ability and precise flow control to ensure the uniformity and rapidity of the cooling process.

[0039] Control component: According to the temperature detection value provided by the detection component, control the working state of the cooling fluid delivery component to achieve rapid cooling. The control component needs to have the ability of fast response and precise control to ensure the efficiency and stability of the cooling process.

[0040] 2、Work flow

[0041] Heating phase: The heating component heats the sample to the required temperature for atomic layer deposition operation.

[0042] Temperature detection phase: The detection component monitors the temperature of the heating component in real time and feeds back the detection value to the control component.

[0043] Cooling phase: When the detection component detects that the temperature reaches the preset cooling threshold, the control component starts the cooling fluid delivery component to deliver cooling fluid to the heating component to rapidly reduce the sample temperature.

[0044] Sampling phase: When the sample temperature is reduced to the sampling temperature, stop the cooling fluid delivery and perform the sampling operation.

[0045] 3、Efficiency improvement

[0046] Shorten the sampling waiting time: Through the rapid cooling device, the sampling waiting time can be shortened from several hours or even several days to 2 hours, greatly improving the experimental efficiency. Improve experimental accuracy: Rapid cooling can reduce the structural changes or contamination that may be caused by long-term exposure of the sample to high temperature, thereby improving the accuracy of the experiment. Enhance the flexibility of the equipment: The rapid cooling device enables the atomic layer deposition equipment to complete multiple experimental batches in a shorter time, enhancing the flexibility and utilization of the equipment.

[0047] In summary, the rapid cooling device of the atomic layer deposition equipment realizes the rapid cooling of the sample after heating through accurate temperature detection, efficient cooling fluid delivery and fast control response, significantly improving the experimental efficiency and accuracy. This is of great significance for scientific research and production fields that require frequent sampling and rapid experimental result feedback.

[0048] Exemplarily, the heating component 10 comprises a heating disc 11 and a heating wire 12, wherein the heating wire 12 is arranged in the inner layer of the heating disc 11, the detection component 20 is arranged on the heating disc 11, and the cooling fluid delivery component 30 is connected with the heating disc 11.

[0049] In the embodiment of the present application, the heating disc 11 is used to carry the sample, and the heating wire 12 can generate heat after being electrified, and the heat acts on the sample on the heating disc 11 to heat it.

[0050] Exemplarily, the detection assembly 20 comprises a temperature sensor 21 arranged at a corner of the heating disc 11 of the heating assembly 10, and the temperature sensor 21 is connected with the control assembly 40.

[0051] In the embodiment of the present application, the temperature sensor 21 is arranged at a corner and a center position on the bottom wall of the heating disc 11, for detecting the temperature of the heating disc 11 and transmitting the detection value to the control assembly 40.

[0052] Exemplarily, the cooling fluid delivery assembly 30 comprises a heat exchanger 31, a delivery pipe 32, a first cooling fluid storage 33 and a first switch valve 34, wherein the heat exchanger 31 is arranged on the bottom wall of the heating disc 11 of the heating assembly 10, the delivery pipe 32 is connected with the heat exchanger 31 and the first cooling fluid storage 33 respectively, the first switch valve 34 is arranged on the delivery pipe 32 between the heat exchanger 31 and the first cooling fluid storage 33, the first switch valve 34 is connected with the control assembly 40, and the first cooling fluid storage 33 stores a first cooling fluid.

[0053] In the embodiment of the present application, after the control assembly 40 receives the stable detection value of the temperature sensor 21, the first switch valve 34 is controlled to be opened, and at this time, the first cooling fluid is delivered from the first cooling fluid storage 33 to the heat exchanger 31 through the delivery pipe 32, so as to perform the cooling operation on the heating disc 11.

[0054] Exemplarily, the cooling fluid delivery assembly 30 further comprises a second cooling fluid storage 35 and a second switch valve 36, wherein the second cooling fluid storage 35 is connected with the delivery pipe 32, the second switch valve 36 is arranged on the delivery pipe 32 between the heat exchanger 31 and the second cooling fluid storage 35, the second switch valve 36 is connected with the control assembly 40, and the second cooling fluid storage 35 stores a second cooling fluid.

[0055] In the embodiment of the present application, after the control assembly 40 receives the stable detection value of the temperature sensor 21, the second switch valve 36 is controlled to be opened, and at this time, the second cooling fluid is delivered from the second cooling fluid storage 35 to the heat exchanger 31 through the delivery pipe 32, so as to perform the cooling operation on the heating disc 11.

[0056] Exemplarily, the cooling fluid delivery assembly 30 further comprises a third cooling fluid reservoir 37 and a third switch valve 38, wherein the third cooling fluid reservoir 37 is connected with the delivery pipe 32, the third switch valve 38 is arranged on the delivery pipe 32 between the heat exchanger 31 and the third cooling fluid reservoir 37, the third switch valve 38 is connected with the control assembly 40, and the third cooling fluid reservoir 37 stores a third cooling fluid.

[0057] In the embodiment of the present application, after receiving the stable detection value of the temperature sensor 21, the control assembly 40 controls the third switch valve 38 to open, and at this time, the third cooling fluid is delivered from the third cooling fluid reservoir 37 to the heat exchanger 31 through the delivery pipe 32 to perform the cooling operation on the heating disc 11.

[0058] Exemplarily, the control assembly 40 comprises a controller 41, which is connected with the temperature sensor 21 in the detection assembly 20 and the first switch valve 34, the second switch valve 36 and the third switch valve 38 in the cooling fluid delivery assembly 30 respectively.

[0059] In the embodiment of the present application, the controller 41 can control any one of the first switch valve 34, the second switch valve 36 and the third switch valve 38 to open or close.

[0060] Exemplarily, the temperature of the first cooling fluid is 60-80℃.

[0061] Exemplarily, the temperature of the second cooling fluid is 40-50℃.

[0062] Exemplarily, the temperature of the third cooling fluid is 20-30℃.

[0063] In the embodiment of the present application, the temperature of the third cooling fluid is lower than that of the second cooling fluid, and the temperature of the second cooling fluid is lower than that of the first cooling fluid, and the controller 41 can selectively control any one of the first switch valve 34, the second switch valve 36 and the third switch valve 38 to open or close according to the difference between the temperature detection value and the target value and the requirement of the cooling time.

[0064] In the embodiments of the present application, taking the atomic layer deposition equipment for preparing 8-inch samples as an example, when the atomic layer deposition equipment is not configured with the atomic layer deposition equipment rapid cooling device provided in the present application, the temperature is reduced from 400 degrees after the process experiment is completed to 100 degrees, and the time required is 6 hours and 23 minutes. If the atomic layer deposition equipment rapid cooling device provided in the present application is used, the time required to reduce to 100 degrees is 1 hour and 24 minutes, and the waiting time is greatly shortened. From 350 degrees, the natural cooling time required to reduce to 100 degrees is 4 hours and 49 minutes, and the time required to use the atomic layer deposition equipment rapid cooling device provided in the present application is 54 minutes. From 300 degrees, the natural cooling time required to reduce to 100 degrees is 3 hours and 34 minutes, and the time required to use the atomic layer deposition equipment rapid cooling device provided in the present application is 35 minutes. The cooling efficiency is greatly improved, and it can be seen that the lower the experimental end temperature, the more obvious the heat reduction effect.

[0065] The atomic layer deposition equipment rapid cooling device provided in the present application greatly shortens the sampling waiting time and can be controlled to reduce to a sampleable temperature within 2 hours. The efficiency of the experiment is improved.

[0066] It should be noted that in the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0067] In addition, in addition to being used to indicate the orientation or positional relationship, the above-mentioned part of the terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the present application can be understood according to the specific situation.

[0068] In addition, the terms "mounting", "setting", "provided with", "connecting", "connected" should be broadly understood. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific situation.

[0069] In addition, the terms "first", "second", and the like, are used merely to distinguish different devices, elements or components (the specific kind and configuration can be the same or different), and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, the meaning of "a plurality" is two or more.

[0070] The above description is merely that of the specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but is to accord with the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An atomic layer deposition apparatus rapid cooling device, characterized by, The application relates to a heating device for a sample, which comprises the following components: a heating component for heating the sample; a detecting component for detecting the temperature of the heating component, which is arranged on the heating component; a cooling fluid conveying component for conveying cooling fluid to the heating component, which is connected with the heating component; and a control component for controlling the cooling fluid conveying component according to the detection value of the detecting component, which is connected with the detecting component and the cooling fluid conveying component respectively. The heating component comprises a heating disc and a heating wire, wherein the heating wire is arranged in the inner layer of the heating disc, the detecting component is arranged on the heating disc, and the cooling fluid conveying component is connected with the heating disc. The detecting component comprises a temperature sensor, which is arranged at the corner of the heating disc of the heating component and is connected with the control component. The cooling fluid conveying component comprises a heat exchanger, a liquid conveying pipe, a first-level cooling fluid storage and a first switch valve, wherein the heat exchanger is arranged on the bottom wall of the heating disc in the heating component, the liquid conveying pipe is connected with the heat exchanger and the first-level cooling fluid storage respectively, the first switch valve is arranged on the liquid conveying pipe between the heat exchanger and the first-level cooling fluid storage, the first switch valve is connected with the control component, and the first-level cooling fluid storage stores a first cooling fluid. The cooling fluid conveying component further comprises a second-level cooling fluid storage and a second switch valve, wherein the second-level cooling fluid storage is connected with the liquid conveying pipe, the second switch valve is arranged on the liquid conveying pipe between the heat exchanger and the second-level cooling fluid storage, the second switch valve is connected with the control component, and the second-level cooling fluid storage stores a second cooling fluid.

2. The rapid cooling device of an atomic layer deposition apparatus according to claim 1, characterized by, The cooling fluid conveying component further comprises a third-level cooling fluid storage and a third switch valve, wherein the third-level cooling fluid storage is connected with the liquid conveying pipe, the third switch valve is arranged on the liquid conveying pipe between the heat exchanger and the third-level cooling fluid storage, the third switch valve is connected with the control component, and the third-level cooling fluid storage stores a third cooling fluid.

3. The rapid cooling device for an atomic layer deposition apparatus according to claim 1, wherein The control component comprises a controller, which is connected with the temperature sensor in the detecting component and the first switch valve, the second switch valve and the third switch valve in the cooling fluid conveying component respectively.

4. The rapid cooling device for an atomic layer deposition apparatus according to claim 1, wherein The temperature of the first cooling fluid is 60-80 DEG C.

5. The rapid cooling device of an atomic layer deposition apparatus according to claim 4, wherein The temperature of the second cooling fluid is 40-50 DEG C.

6. The rapid cooling device of an atomic layer deposition apparatus according to claim 4, wherein The temperature of the third cooling fluid is 20-30 DEG C.

7. The rapid cooling device for an atomic layer deposition apparatus according to claim 1, wherein ​ 8. The rapid cooling device of an atomic layer deposition apparatus according to claim 4, wherein ​ 9. The rapid cooling device of an atomic layer deposition apparatus according to claim 4, wherein ​ 10. The rapid cooling device of an atomic layer deposition apparatus according to claim 4, wherein ​

Images