Atomic layer deposition coating chamber

Abstract

The utility model belongs to the technical field of atomic layer deposition, and relates to an atomic layer deposition coating chamber, which comprises a shell used for coating a sample; an accommodating cavity is formed in the shell; the gas inlet hole is used for inputting reaction gas into the accommodating cavity; the air inlet hole is formed in the shell and connected with the containing cavity. The air outlet hole is used for exhausting air in the accommodating cavity; the air outlet hole is formed in the shell and connected with the containing cavity. According to the atomic layer deposition coating chamber, the inner wall of the containing cavity is arranged to be the curved surface, smooth transition can be achieved, airflow can be diffused into the whole chamber more softly and evenly, and the uniformity of a thin film coated on the surface of a sample is improved.

Description

Technical Field

[0001] This utility model relates to the field of atomic layer deposition technology, and in particular to an atomic layer deposition coating chamber. Background Technology

[0002] Atomic layer deposition (ALD) is a method for precisely controlling the thickness and composition of thin films at the micro- and nanoscale, and its temperature has a significant impact on the deposition process and film performance.

[0003] In atomic layer deposition (ALD), the chemical reaction of a new atomic layer is directly related to the previous layer. This method allows only one atomic layer to be deposited per reaction, hence it is also called single-atom layer deposition. ALD involves the continuous introduction of at least two gaseous precursor species onto a substrate in a heated reactor. The chemisorption process automatically terminates when the surface becomes saturated. However, inappropriate airflow direction can hinder the formation of coating molecules on the surface. Utility Model Content

[0004] In view of this, the present invention provides an atomic layer deposition coating chamber.

[0005] Specifically, this utility model is achieved through the following technical solution:

[0006] According to a first aspect of the present invention, an atomic layer deposition (ALD) chamber is provided, comprising:

[0007] A housing for sample coating; the housing has a receiving cavity.

[0008] An air inlet is provided for introducing reactive gas into the receiving cavity; the air inlet is disposed on the housing and connected to the receiving cavity;

[0009] An air vent is provided for discharging gas from the receiving cavity; the air vent is located on the housing and connected to the receiving cavity.

[0010] Optionally, the air inlet is located on the bottom wall of the housing.

[0011] Optionally, the vent is located on the bottom wall of the housing.

[0012] Optionally, the air inlet and the air outlet are respectively located on both sides of the receiving cavity.

[0013] Optionally, the interior of the receiving cavity is provided with a groove.

[0014] Optionally, the inner bottom wall of the receiving cavity is recessed inward to form the groove.

[0015] Optionally, the sidewall of the receiving cavity near the air inlet is configured as a curved surface.

[0016] Optionally, the sidewall of the receiving cavity near the air outlet is configured as a curved surface.

[0017] Optionally, the side wall corners of the groove near the air inlet are set as rounded curved surfaces.

[0018] Optionally, the side wall corners of the groove near the air outlet are set as rounded curved surfaces.

[0019] The technical solution provided by this utility model brings at least the following beneficial effects:

[0020] The atomic layer deposition (ALD) chamber provided in this application has a curved inner wall, which allows for a smooth transition and facilitates a more gentle and uniform diffusion of airflow throughout the chamber, thereby improving the uniformity of the thin film deposited on the sample surface. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A top view of an atomic layer deposition coating chamber provided for an embodiment of this utility model;

[0024] Figure 2 A side view of an atomic layer deposition coating chamber provided for an embodiment of this utility model. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0026] Figure 1 An atomic layer deposition coating chamber suitable for an embodiment of the present invention is illustrated schematically.

[0027] Reference Figure 1-2 As shown, this application provides an atomic layer deposition (ALD) chamber, comprising:

[0028] Housing 1, used for sample coating; housing 1 is provided with a receiving cavity 2;

[0029] An air inlet 3 is used to input the reaction gas into the receiving cavity 2; the air inlet 3 is disposed on the housing 1 and connected to the receiving cavity 2;

[0030] The vent 4 is used to discharge the gas in the receiving cavity 2; the vent 4 is provided on the housing 1 and connected to the receiving cavity 2.

[0031] In this embodiment, the reactant gas enters the receiving cavity 2 through the inlet 3 and reacts with the raw material under suitable conditions to form a coating. Unreacted gas is discharged through the outlet 4. A key feature of this design is that the inner wall of the receiving cavity is curved, designed to optimize gas flow and thus improve coating uniformity.

[0032] 1. Analysis of the structure of the coating chamber

[0033] Shell: As the main structure of the coating chamber, the shell provides a closed environment for the sample to perform atomic layer deposition coating.

[0034] Reception cavity: Located inside the shell, it is the actual operating space for sample coating.

[0035] Gas inlet: Located on the housing and connected to the receiving cavity, it is used to introduce reactive gases into the receiving cavity. These gases react chemically with the sample surface inside the cavity to form the desired thin film.

[0036] Vent: Also located on the housing and connected to the receiving cavity, it is used to discharge gas from the cavity. By controlling the opening and closing of the vent and the flow rate of the vent, the gas concentration and flow state within the cavity can be adjusted.

[0037] 2. Curved inner wall design and its advantages

[0038] Smooth transition: Compared with traditional straight or corner wall designs, curved inner walls can achieve a smoother transition, reducing airflow collisions and turbulence within the chamber.

[0039] Airflow optimization: The curved design helps the airflow diffuse more gently and evenly throughout the chamber. This not only improves coating efficiency but also reduces problems such as uneven coating thickness caused by uneven airflow.

[0040] Improved coating uniformity: Due to the more uniform distribution of airflow within the chamber, the uniformity of the thin film deposited on the sample surface is significantly improved. This is particularly important for applications requiring high precision and high-quality coatings.

[0041] 3. Application Areas: This coating chamber design is suitable for various fields requiring high-precision coating, such as semiconductor manufacturing, optical component manufacturing, and biomedical devices. Potential Improvements: To further improve coating quality and efficiency, airflow guiding devices can be added to the chamber, or the position and number of air inlets and outlets can be adjusted. Furthermore, advanced sensors and control systems can be employed to monitor and regulate the gas concentration and flow state within the chamber in real time.

[0042] For example, the air inlet 3 is disposed on the bottom wall of the housing 1.

[0043] In this embodiment, the air inlet 3 is provided on the outer bottom wall of the housing 1 to facilitate air intake.

[0044] For example, the vent 4 is provided on the bottom wall of the housing 1.

[0045] In this embodiment, the vent 4 is located on the outer bottom wall of the housing 1 to facilitate the discharge of gas.

[0046] For example, the air inlet 3 and the air outlet 4 are respectively disposed on both sides of the receiving cavity 2.

[0047] In this embodiment, the air inlet 3 and the air outlet 4 are respectively disposed on both sides of the receiving cavity 2, which can guide the gas from the air inlet 3 through the entire receiving cavity 2 and reach the air outlet 4, so that the gas fills the entire receiving cavity 2 and controls the direction of gas movement.

[0048] For example, the cavity 2 is provided with a groove 5 inside.

[0049] In this embodiment, the groove 5 is used to hold the sample.

[0050] For example, the inner bottom wall of the receiving cavity 2 is recessed inward to form the groove 5.

[0051] In this embodiment, the groove 5 is formed by the inward indentation of the inner bottom wall of the receiving cavity 2, and is used to hold the sample.

[0052] For example, the sidewall of the receiving cavity 2 near the air inlet 3 is configured as an arc surface.

[0053] In this embodiment, the curved sidewalls facilitate a more gentle and uniform diffusion of gas into the entire cavity 2 as it enters from the air inlet 3, thereby improving the uniformity of the thin film deposited on the sample surface.

[0054] For example, the sidewall of the receiving cavity 2 near the air outlet 4 is configured as an arc surface.

[0055] In this embodiment, the curved sidewalls facilitate a smoother and more even discharge of gas from the outlet 4 into the receiving cavity 2, preventing the gas from moving in a disordered direction.

[0056] For example, the side wall corner of the groove 5 near the air inlet 3 is set as a rounded curved surface.

[0057] In this embodiment, the groove 5 with its arc-shaped surface can facilitate a more gentle and uniform diffusion of gas into the entire receiving cavity 2 when it enters from the air inlet 3, thereby improving the uniformity of the thin film deposited on the sample surface.

[0058] For example, the side wall corner of the groove 5 near the air outlet 4 is set as a rounded curved surface.

[0059] In this embodiment, the curved sidewalls facilitate a smoother and more even discharge of gas from the cavity 2 as it exits the groove 5, preventing the gas from moving in a disordered direction.

[0060] The following is a further interpretation and refinement of the atomic layer deposition (ALD) chamber design:

[0061] 1. Shell and Receiving Cavity

[0062] Shell 1: As the main structure of the coating chamber, it provides a closed environment.

[0063] Reception cavity 2: Located inside the shell, it is used to place samples and perform coating operations.

[0064] 2. Air inlet and outlet design

[0065] Air inlet 3: Located on the bottom wall of housing 1 for easy air intake. Function: To introduce reaction gas into the receiving cavity 2. Layout: Located on both sides of the receiving cavity 2, along with the air outlet 4, to guide the gas through the entire receiving cavity.

[0066] Vent 4: Also located on the bottom wall of housing 1 for easy gas discharge. Function: To discharge gas from the receiving cavity 2 and maintain the balance of gas concentration within the cavity. Layout: Positioned opposite to vent 3 to ensure that gas fills the entire receiving cavity.

[0067] 3. Groove design

[0068] Recess 5: Located inside the receiving cavity 2, used to hold the sample. Shape: Formed by an inward indentation from the inner bottom wall of the receiving cavity 2. Function: Provides a stable sample placement platform, ensuring the stability of the coating process.

[0069] 4. Arc-shaped surface design

[0070] The sidewall of the receiving cavity: The sidewall near the air inlet 3 is designed with a curved surface, which facilitates a more gentle and even diffusion of gas into the entire receiving cavity when it enters from the air inlet. The sidewall near the air outlet 4 is also designed with a curved surface, which facilitates a more gentle and even discharge of gas from the receiving cavity when it exits from the air outlet, and prevents the gas movement direction from becoming chaotic.

[0071] The sidewall corners of the groove: The sidewall corners near the air inlet 3 are set as rounded surfaces to further promote the gentle and uniform diffusion of gas as it enters from the air inlet. The sidewall corners near the air outlet 4 are also set as rounded surfaces to ensure the gentle and uniform discharge of gas as it leaves the groove.

[0072] 5. Improved Coating Uniformity: The arc-shaped surface design optimizes the gas flow path and distribution, significantly improving the uniformity of the thin film deposited on the sample surface. Enhanced Coating Efficiency: The rational layout of the inlet and outlet ports, along with the groove design, ensures that the gas can fully contact the sample surface, improving coating efficiency. Wide Range of Applications: This coating chamber design is suitable for various fields requiring high-precision coating, such as semiconductor manufacturing, optical component manufacturing, and biomedical devices.

[0073] The atomic layer deposition (ALD) chamber provided in this application has a curved inner wall, which allows for a smooth transition and facilitates a more gentle and uniform diffusion of airflow throughout the chamber, thereby improving the uniformity of the thin film deposited on the sample surface.

[0074] It should be noted that in this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0075] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0076] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0077] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0078] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. An atomic layer deposition plating chamber, comprising: The application relates to a sample coating device, which comprises: a shell for sample coating, wherein a containing cavity is arranged in the shell; an air inlet hole for inputting reaction gas into the containing cavity, wherein the air inlet hole is arranged on the shell and connected with the containing cavity; an air outlet hole for discharging gas in the containing cavity, wherein the air outlet hole is arranged on the shell and connected with the containing cavity.

2. The atomic layer deposition coating chamber of claim 1, wherein, The air inlet hole is arranged on the bottom wall of the shell.

3. The atomic layer deposition coating chamber of claim 1, wherein, The air outlet hole is arranged on the bottom wall of the shell.

4. The atomic layer deposition coating chamber of claim 1, wherein, The air inlet hole and the air outlet hole are respectively arranged on two sides of the containing cavity.

5. The atomic layer deposition coating chamber of claim 1, wherein, The containing cavity is internally provided with a groove.

6. The atomic layer deposition coating chamber of claim 5, wherein, The inner bottom wall of the containing cavity is inwardly recessed to form the groove.

7. The atomic layer deposition coating chamber of claim 1, wherein, The side wall of the containing cavity close to the air inlet hole is arranged as a circular arc curved surface.

8. The atomic layer deposition coating chamber of claim 1, wherein, The side wall of the containing cavity close to the air outlet hole is arranged as a circular arc curved surface.

9. The atomic layer deposition coating chamber of claim 6, wherein, The side wall corner of the groove close to the air inlet hole is arranged as a circular arc curved surface.

10. The atomic layer deposition coating chamber of claim 6, wherein, The side wall corner of the groove close to the air outlet hole is arranged as a circular arc curved surface.

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