Copper wire coating device for copper wire processing
By designing adjustment and cleaning mechanisms suitable for copper wires of different diameters, the cleanliness and applicability issues of existing devices were solved, and the uniformity and conductivity of copper wire coating were improved.
Patent Information
- Application Number
- CN202520206628.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-02-10
AI Technical Summary
Existing copper wire coating conveying devices are not easy to clean when handling copper wires, resulting in the adhesion of impurities, which affects the coating effect. Furthermore, the coating racks are not suitable for copper wires of different diameters, and have low applicability.
A copper wire plating device was designed, comprising an electroplating tank, a motor, a feed roller, a take-up roller, an adjustment mechanism, and a cleaning mechanism. The adjustment mechanism adjusts the copper wire diameter, electroplating height, and guide position according to the electroplating requirements, enabling electroplating of copper wires of different sizes. The cleaning mechanism uses rubber wheels and guide wheels to clean the surface of the copper wire.
It enables effective guiding and cleaning of copper wires of different diameters, ensuring uniformity of coating, avoiding impurity adhesion, and improving the conductivity and electroplating effect of copper wires.
Smart Images
Figure CN223738185U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of copper wire production, specifically relates to copper wire coating device for copper wire processing. BACKGROUND
[0002] Copper wire tinning is mainly to prevent copper from being oxidized to form a film - patina (chemical formula CU2(OH)2CO3) exposed to air, and the conductivity of patina is very poor, which will increase the resistance, and the tinned copper wire can prevent oxidation-reduction reaction and produce patina; can increase the heat dissipation; can improve the conductivity and improve the wire performance.
[0003] The copper wire surface is treated by electroplating spraying silver plating, which can better resist oxidation and improve the conductivity of the copper wire. However, the existing spraying conveying device is not convenient for cleaning the surface of the copper wire when treating the copper wire, and when impurities adhere to the surface of the copper wire, it is not conducive to the smooth plating of the copper wire. The plating frame in the prior art is not suitable for guiding and tension adjustment of copper wires of various diameters, and has low applicability. SUMMARY
[0004] The utility model discloses a copper wire coating device for copper wire processing to solve the above-mentioned defects caused by the prior art.
[0005] The copper wire coating device for copper wire processing, the electroplating tank and the transverse support, the side of the electroplating tank is provided with a motor above, the output end of the motor is connected with a pay-off reel, the other side of the pay-off reel is provided with a take-up reel, the side of the take-up reel is provided with an adjusting mechanism, the adjusting mechanism adjusts the height and the guiding position of electroplating according to the diameter of the electroplated wire and the electroplating demand, and then the electroplating of different size wire rods is satisfied, the cleaning mechanism is arranged below the transverse support, the cleaning mechanism rubs the copper wire in the guiding process, so that the copper wire is better cleaned, and impurities are prevented from adhering to the surface.
[0006] Preferably, the adjusting mechanism comprises a transverse support, a transverse guide rail, a fastening hole, a side positioning seat and a guide groove, a plurality of groups of transverse guide rails with consistent sizes are arranged below the transverse support at equal intervals, the fastening holes are formed in the side of the transverse guide rail at equal intervals, the side positioning seats are distributed in a rectangular shape on the two sides of the electroplating tank, and the guide groove is formed in the side of the side positioning seat.
[0007] Preferably, the transverse guide rail is connected with the outer side of the sliding block through the fastening holes formed at equal intervals.
[0008] Preferably, the side positioning seat is connected with the two sides of the transverse support through the guide groove formed in the side.
[0009] Preferably, the cleaning mechanism includes a rubber wheel, a guide wheel, a slider, a rubber concave block, and a vertical support. The rubber wheels are symmetrically arranged on both sides of the vertical support, and a rubber concave block is arranged directly above the rubber wheel. A guide wheel is connected to the outer symmetrical axis of another set of the vertical support, and a slider is connected to the top of the vertical support. The rubber concave blocks are symmetrically arranged on both sides of the vertical support.
[0010] Preferably, the vertical support is connected to the bottom end of the horizontal guide rail via a slider at its top.
[0011] Preferably, the rubber wheel is connected to the bottom end of the transverse guide rail via a vertical bracket connected by a shaft.
[0012] Compared with the prior art, the present invention has the following advantages:
[0013] 1. Multiple sets of vertical supports are used to guide multiple sets of copper wires. The height of the horizontal supports is adjusted according to the depth and requirements of the electroplating tank to meet the electroplating needs of copper wires of different sizes. Two guide wheels straighten and flatten the copper wires, ensuring the orderly guidance of subsequent electroplating work.
[0014] 2. The horizontal guide rails are used to vertically position multiple sets of vertical supports. At the same time, the tension of the copper wire is adjusted by using vertical supports of different lengths. The height of the horizontal support is vertically adjusted by using guide grooves. This allows for the electroplating of copper wires of different diameters with different depths of electroplating solution, preventing the copper wires from being transported too loosely or too tightly, which would result in uneven silver plating on the surface of the copper wires. Attached Figure Description
[0015] Fig. 1 This is a three-dimensional structural diagram of the present invention.
[0016] Fig. 2 This is a schematic diagram of the overall side view structure of this utility model.
[0017] Fig. 3 This is a side view of the adjustment mechanism in this utility model.
[0018] Fig. 4 This is a top view schematic diagram of the overall structure of this utility model.
[0019] in:
[0020] 1. Electroplating tank; 2. Motor; 3. Take-up roller; 4. Horizontal support; 5. Adjustment mechanism; 6. Horizontal guide rail; 7. Fastening hole; 8. Cleaning mechanism; 9. Rubber wheel; 10. Guide wheel; 11. Side positioning seat; 12. Guide groove; 13. Pay-off roller; 14. Slider; 15. Rubber concave block; 16. Vertical support. Detailed Implementation
[0021] In order to make the technical means, creative features, purposes and effects of the utility model easy to understand, the utility model is further described below in combination with specific embodiments.
[0022] As shown in Figs. 1 to 4 The copper wire plating device for copper wire processing comprises an electroplating tank 1 and a horizontal support 4, a motor 2 is arranged on the side of the upper part of the electroplating tank 1, a pay-off reel 13 is connected to the output end of the motor 2, a take-up reel 3 is arranged on the other side of the pay-off reel 13, an adjusting mechanism 5 is arranged on the side of the take-up reel 3, the adjusting mechanism 5 adjusts the height and the guiding position of electroplating according to the diameter of the electroplated wire and the electroplating requirement, thereby satisfying the electroplating of wire rods of different sizes, a cleaning mechanism 8 is arranged below the horizontal support 4, and the cleaning mechanism 8 rubs the copper wire in the guiding process, so that the copper wire is better cleaned and impurities are prevented from adhering to the surface.
[0023] In the embodiment, the adjusting mechanism 5 comprises the horizontal support 4, horizontal guide rails 6, fastening holes 7, side positioning seats 11 and guide grooves 12, a plurality of groups of horizontal guide rails 6 with consistent sizes are arranged below the horizontal support 4 at equal intervals, the fastening holes 7 are arranged on the side of the horizontal guide rails 6 at equal intervals, the side positioning seats 11 are distributed in a rectangular shape on the two sides of the electroplating tank 1, the guide grooves 12 are arranged on the side of the side positioning seats 11, and the vertical supports 16 are vertically positioned by the horizontal guide rails 6.
[0024] In the embodiment, the horizontal guide rails 6 are connected to the outer side of the sliding blocks 14 through the fastening holes 7 arranged at equal intervals, and the distance between the wire guide wheels 10 is adjusted by the sliding blocks 14 arranged on the outer side of the horizontal guide rails 6.
[0025] In the embodiment, the side positioning seats 11 are connected to the two sides of the horizontal support 4 through the guide grooves 12 arranged on the side, and the height of the horizontal support 4 is dynamically adjusted by the guide grooves 12.
[0026] In the embodiment, the cleaning mechanism 8 comprises rubber wheels 9, wire guide wheels 10, sliding blocks 14, rubber concave blocks 15 and vertical supports 16, the rubber wheels 9 are symmetrically arranged on the two sides of the vertical supports 16, the rubber concave blocks 15 are arranged above the rubber wheels 9, the wire guide wheels 10 are symmetrically connected to the outer side of the other group of vertical supports 16, the sliding blocks 14 are connected to the top end of the vertical supports 16, the rubber concave blocks 15 are symmetrically arranged on the two sides of the vertical supports 16, and the surface of the copper wire is cleaned by the rubber concave blocks 15 and the rubber wheels 9.
[0027] In the embodiment, the vertical supports 16 are connected to the bottom end of the horizontal guide rails 6 through the sliding blocks 14 arranged at the top end, and the vertical supports 16 are guided and adjusted in distance by the sliding blocks 14. In the embodiment, the vertical supports 16 are connected to the bottom end of the horizontal guide rails 6 through the sliding blocks 14 arranged at the top end, and the vertical supports 16 are guided and adjusted in distance by the sliding blocks 14.
[0028] In the embodiment, the rubber wheel 9 is connected with the bottom end of the vertical support 16 through the shaft, and the rubber wheel 9 is used for guiding the copper wire and cleaning the surface of the copper wire.
[0029] The copper wire coating device for copper wire processing includes the following working contents in actual application.
[0030] Step 1: The operator first installs the wire guide wheel 10 and the rubber wheel 9 on the outer side of the vertical support 16, so that the sliding block 14 arranged at the top end of the vertical support 16 slides on the outer side of the horizontal guide rail 6, thereby guiding the copper wire for coating, and the screw is inserted into the fastening hole 7 to lock the sliding block 14 on the outer side of the horizontal guide rail 6, thereby completing the positioning of the multiple vertical supports 16 and the rubber wheels 9.
[0031] Step 2: The operator first pulls out the copper wire on the outer side of the take-up roller 3, guides the copper wire through the wire guide wheel 10 arranged at the bottom end of the vertical support 16, and guides the copper wire through the long vertical support 16 and the wire guide wheel 10 again through the gap between the rubber recess 15 and the rubber wheel 9, and winds the top end of the copper wire on the outer side of the pay-off roller 13.
[0032] Step 3: Then the operator turns on the motor 2 arranged on one side of the take-up roller 3, drives the take-up roller 3 to rotate, and stores the coated copper wire through the take-up roller 3, and pulls the horizontal support 4 to the guide groove 12 arranged on the outer side of the symmetrical side positioning seat 11, so that part of the copper wire is introduced into the internal electroplating solution of the electroplating tank 1, and the copper wire is electroplated through the electroplating solution.
[0033] Step 4: At the same time, when the motor 2 drives the take-up roller 3 to rotate to store the copper wire, the rubber wheel 9 and the rubber recess 15 arranged at the top end rub with the copper wire, so that the copper wire is better cleaned, and impurities are prevented from adhering to the surface. The length of one set of wire guide wheels 10 is greater than the height of the rubber wheel 9, so that the copper wire can be inserted into the electroplating solution after being cleaned for electroplating treatment.
[0034] Therefore, the above-mentioned disclosed embodiments are only examples and are not the only ones. All changes within the scope of the present application or within the scope equivalent to the present application are included in the present application.
Claims
1. A copper wire plating device for processing copper wire, characterized by: Including electroplating tank (1) and lateral support (4), the side of the electroplating tank (1) is provided with motor (2) directly above, the output end of motor (2) is connected with pay-off roller (13), the other side of pay-off roller (13) is provided with take-up roller (3), the side of take-up roller (3) is provided with adjusting mechanism (5), the height and guiding position of electroplating are adjusted according to the diameter of electroplated wire and electroplating demand, so as to meet the electroplating of wire of different sizes, the bottom of lateral support (4) is provided with cleaning mechanism (8), the copper wire in guiding process is rubbed, so that the copper wire is better cleaned, and impurities are avoided to adhere to the surface.
2. The copper wire plating device for copper wire processing according to claim 1, characterized in that: The adjusting mechanism (5) includes lateral support (4), lateral guide rail (6), fastening hole (7), side positioning seat (11), guide groove (12), a plurality of groups of lateral guide rails (6) with consistent size are arranged at equal intervals at the bottom of the lateral support (4), the fastening holes (7) are formed at equal intervals on one side of the lateral guide rail (6), the side positioning seats (11) are distributed in a rectangular shape on both sides of the electroplating tank (1), and the guide grooves (12) are formed on one side of the side positioning seat (11).
3. The copper wire plating device for copper wire processing according to claim 2, characterized in that: The lateral guide rail (6) is connected with the outer side of the sliding block (14) through the fastening holes (7) formed at equal intervals.
4. The copper wire plating device for copper wire processing according to claim 2, characterized in that: The side positioning seat (11) is connected with both sides of the lateral support (4) through the guide grooves (12) formed on one side.
5. The copper wire plating device for copper wire processing according to claim 1, characterized in that: The cleaning mechanism (8) includes rubber wheels (9), wire guide wheels (10), sliding blocks (14), rubber recessed blocks (15) and vertical supports (16), the rubber wheels (9) are symmetrically arranged on both sides of the vertical support (16), the rubber recessed blocks (15) are arranged above the rubber wheels (9), the wire guide wheels (10) are symmetrically connected to the outer side of the other vertical support (16), the sliding blocks (14) are connected to the top end of the vertical support (16), and the rubber recessed blocks (15) are symmetrically arranged on both sides of the vertical support (16).
6. The copper wire plating device for copper wire processing according to claim 5, characterized in that: The vertical support (16) is connected with the bottom end of the lateral guide rail (6) through the sliding block (14) arranged at the top end.
7. The copper wire plating device for copper wire processing according to claim 5, characterized in that: The rubber wheels (9) are connected with the bottom end of the lateral guide rail (6) through the vertical supports (16) connected by shafts.