Carbon film baking and drying device

Abstract

The utility model discloses a carbon film baking and drying device in the technical field of PCB (Printed Circuit Board) processing, and aims to solve the problem that the drying efficiency and the yield of a carbon film resistor are inconvenient to consider at the same time in the prior art. The PCB drying device comprises a workbench, a containing support is arranged on the workbench, the containing support is used for containing a PCB to be dried, a sealing cover is arranged on the workbench, the sealing cover is used for wrapping the workbench with the containing support and forming a closed space, and the outer side of the sealing cover is communicated with a circulation pipeline. A heater for heating airflow, a drying mechanism and an air pump are arranged on a communicating path of the circulating pipeline; according to the PCB drying device, the PCBs are placed in a stacked mode, hot air drying is carried out on the PCBs at the same time in a hot air circulation mode, water mist in the drying oven is removed in an external circulation mode, it is guaranteed that the water mist cannot be attached to the surfaces of the PCBs in the drying process, the drying efficiency is improved, and meanwhile the actual service life of the PCBs is prevented from being affected by the water mist.

Description

TECHNICAL FIELD

[0001] The utility model relates to a carbon film baking drying device belongs to PCB board processing technical field. BACKGROUND

[0002] PCB board processing often uses carbon film resistance, and the carbon film resistance is used as resistance on the PCB board and is convenient to etch to change the resistance value, in the actual use processing process, the carbon film resistance is coated in the slurry state on the corresponding position of the PCB board first and then is dried, realizes the stable adhesion of carbon film resistance, in order to avoid the carbon film fragmentation caused by rapid heating during drying or the poor processing yield caused by uneven temperature, the better way is to adopt the constant temperature control of hot air circulation, but this way usually only corresponds to the PCB board placed in single layer, and the actual drying efficiency needs to be improved. SUMMARY

[0003] The utility model discloses a carbon film baking drying device for improving the drying efficiency of PCB board, which adopts the hot air circulation mode to simultaneously dry multiple PCB boards by layering the PCB boards, and removes the water mist in the drying oven by external circulation, so that the water mist does not adhere to the surface of the PCB board during the drying process, which is beneficial to preventing the influence on the actual service life of the PCB board.

[0004] To achieve the above-mentioned purpose, the utility model is adopted The technical scheme is as follows:

[0005] The carbon film baking drying device provided by the utility model comprises a workbench, a placing support is arranged on the workbench, the placing support is used for placing a PCB board to be dried, a sealing cover is arranged on the workbench, the sealing cover is used for covering the placing support on the workbench and forming a closed space, a circulating pipeline is communicatively arranged on the outer side of the sealing cover, and a heater, a drying mechanism, and a gas pump for heating airflow are arranged on the communication path of the circulating pipeline.

[0006] Specifically, the placing support comprises support columns arranged opposite to each other, a plurality of sliding grooves are arranged on the opposite sides of the support columns in the vertical direction, and a PCB placing plate is slidingly arranged between every two opposite sliding grooves.

[0007] Specifically, the sealing cover is provided with openings on both sides, the two open ends of the circulating pipeline are communicatively arranged on the corresponding opening sides, the openings on each side are divided into upper and lower openings, a gas flow guide pipe is installed at each opening position, and the gas flow guide pipe is used for avoiding the hot airflow directly blowing on the surface of the PCB board.

[0008] Specifically, the blowing directions of the two gas guide pipes on the air inlet side of the sealing cover are opposite, and the blowing directions of the two gas guide pipes on the air outlet side of the sealing cover are opposite.

[0009] Specifically, the air passage section of the gas guide pipe is in a strip shape, and the drying device further comprises a main air inlet pipe and a transfer air chamber, the transfer air chamber is in a hollow cuboid shape and arranged outside the sealing cover, the transfer air chamber is in communication with the gas guide pipe, the main air inlet pipe and the transfer air chamber are in communication through a plurality of branch air pipes, and the two ends of the circulating pipeline are respectively arranged on the main air inlet pipes at the two ends.

[0010] Specifically, the drying mechanism comprises a drying box and a drying agent arranged in the drying box, the heater comprises at least a heating wire, the heater is arranged at the air outlet end of the air pump, and the drying mechanism is arranged at the air inlet end of the air pump.

[0011] Specifically, the upper surface of the workbench is provided with an annular sealing gasket around the position of the support, and the bottom of the sealing cover is provided with a turned-up edge capable of being in close contact with the sealing gasket to form a stable closed space in the sealing cover.

[0012] Specifically, the sealing cover and / or the circulating pipeline are provided with a heat preservation layer.

[0013] Compared with the prior art, the drying device provided by the utility model has the advantages that:

[0014] The utility model discloses a drying device which comprises a sealing cover, an air pump, a circulating pipeline and a drying mechanism, the sealing cover is arranged on the air pump, the circulating pipeline is arranged on the air pump and connected with the air pump, and the drying mechanism is arranged on the air pump. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is the overall structure schematic view of the drying device provided by the utility model embodiment;

[0016] Figure 2 is the partial structure schematic view of the drying device provided by the utility model embodiment;

[0017] Figure 3 is the side view of the drying device provided by the utility model embodiment;

[0018] Figure 4 is the A-A direction sectional view of the drying device provided by the utility model Figure 3 embodiment;

[0019] Reference signs: 1, workbench; 2, placing support; 201, support column; 202, sliding groove; 203, PCB placing plate; 3, sealing cover; 4, circulating pipeline; 5, main air inlet pipeline; 6, air transfer chamber; 7, gas flow guide pipe; 8, sealing gasket; 9, drying mechanism; 10, heater. DETAILED DESCRIPTION

[0020] The utility model will be described further below in conjunction with the drawings. The following examples are only used to make the technical scheme of the utility model more clear, and cannot be used to limit the protection scope of the utility model.

[0021] In the description of the utility model, it is understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the utility model. In addition, the terms "first", "second" and the like are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more features. In the description of the utility model, unless otherwise specified, the meaning of "multiple" is two or more.

[0022] In the description of the utility model, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between the two elements inside. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances. EMBODIMENT

[0023] The carbon film baking and drying device provided by the embodiment of the utility model carries out hot air drying to multiple PCBs at the same time by adopting the hot air circulation mode of stacking the PCBs, and removes the water mist in the oven by using the external circulation mode, so that the water mist in the drying process will not adhere to the surface of the PCB, which is beneficial to prevent the actual service life of the PCB from being affected. In order to realize the structure and function of the device, the device comprises a workbench 1, and a placing support 2 is arranged on the workbench 1, such as Figure 2As shown, the placing support 2 here is used for placing the PCB board to be dried, which can be preferably configured to place multiple layers of PCB boards in the space, so that the heat circulation airflow can uniformly pass through each PCB board and dry the carbon film layer above it, improving the actual drying efficiency, in order to be able to realize the drying effect while preventing the water mist generated by multiple PCB boards from affecting each other, here a sealing cover 3 is arranged on the workbench 1, the sealing cover 3 is arranged to cover the placing support 2 on the workbench 1 and form a closed space, as shown in Figure 1 As shown, and at the same time, the circulation pipeline 4 is arranged in communication on the outside of the sealing cover 3, and the heater 10, the drying mechanism 9 and the air pump for heating the airflow are arranged in communication on the communication path of the circulation pipeline 4, as shown in Figure 1 The device is in operation, first use the sealing cover 3 to cover the placing support 2 to form a closed space, start the air pump and the heater 10, so that the inside of the sealing cover 3 and the circulation pipeline 4 form a circulating airflow, and gradually heat the airflow, and stabilize the temperature in the sealing cover 3, during the heating process, the water mist generated by the slurry carbon film drying can be filtered and removed by the drying mechanism 3, ensuring that the drying process in the sealing cover 3 can maintain a certain degree of dryness, preventing the PCB board from being affected. In order to facilitate the multi-layer placement of the PCB board, improve the number of PCB boards that can be accommodated in the space, the placing support 2 can be arranged to include a pair of support columns 201, as shown in Figure 2 A plurality of sliding grooves 202 are arranged in vertical distribution on the opposite sides of the support column 201, and a plurality of PCB placing plates 203 are slidingly arranged between every two opposite sliding grooves 202. By slidingly drawing out the PCB placing plate 203, personnel can conveniently place the PCB board, and the PCB placing plate 203 can be designed in a hollow shape, as shown in Figure 2 The heat exchange capacity of the hot airflow can be improved, which is beneficial to quickly heat the PCB board.

[0024] The carbon film baking and drying device provided by the embodiment of the present application considers that the hot airflow directly blowing to the surface of the PCB board may cause the local temperature of the PCB board to rise too fast and affect the drying performance of the carbon film resistor, in order to improve the uniformity of heating, the sealing cover 3 is provided on both sides of the sealing cover 3, as shown in Figure 1 Two open ends of the circulation pipeline 4 are respectively arranged in communication on the corresponding opening side, and the openings on each side are divided into upper and lower openings, and a gas flow guide pipe 7 is installed at each opening position, as shown in Figure 4 The gas flow guide pipe 7 is used to avoid the hot airflow directly blowing on the surface of the PCB board, and the symmetrically arranged gas blowing can ensure that the temperature on the upper and lower sides is balanced, preventing poor local heating effect.

[0025] The utility model discloses a kind of carbon film baking drying devices, to balance the flow direction of hot airflow in seal cover 3, here can be set the blowing direction of two gas flow guide pipes 7 of seal cover 3 intake side is opposite, as shown in Fig. Figure 4 , and the blowing direction of two gas flow guide pipes 7 of the gas outlet side of seal cover 3 is opposite. By this way design, two opposite gas outlet directions can collide each other after hot airflow is sprayed, and it is beneficial to make hot airflow flow transversely from each height position, avoid hot airflow to move transversely in local height, and it is beneficial to improve the uniformity of hot airflow in seal cover 3, and by opposite setting of gas outlet end, it is beneficial to improve the time delay and flow capacity of hot airflow in seal cover 3 after hot airflow is fully flowed and heat exchanged, to ensure that heat is fully utilized.

[0026] The utility model discloses a kind of carbon film baking drying devices, to further improve the uniformity of gas diffusion, here gas flow guide pipe 7 is set as strip, as shown in Fig. Figure 2 , here setting device also includes main air inlet pipeline 5 and transfer gas chamber 6, wherein transfer gas chamber 6 is hollow cuboid and is set on the outside of seal cover 3, transfer gas chamber 6 is communicated with gas flow guide pipe 7, preferably can be connected by splicing mode, and it is beneficial to disassemble when seal cover 3 is removed, in addition, main air inlet pipeline 5 and transfer gas chamber 6 are communicated by multiple branch pipes, and two ends of circulation pipeline 4 are respectively communicated with main air inlet pipeline 5 set on both ends, as shown in Fig. Figure 1 , after communication, gas is dispersed to both sides by main air inlet pipeline and finally sprayed from gas flow guide pipe 7, that is, it can effectively prevent that carbon film resistance is not good due to uneven hot airflow dispersion, and it is beneficial to improve drying temperature uniformity and avoid that local drying quality difference is too large.

[0027] The utility model discloses a kind of carbon film baking drying devices, specifically provides the configuration mode of circulation pipeline 4, specifically, can set up drying mechanism 9 including drying box and drying agent arranged in drying box, preferably set the box body includes two sides of gas connection and the sealing plate for replacing drying agent, in addition to facilitate gas access, drying agent can also be conveniently replaced, to ensure that drying efficiency is improved, and heater 10 at least includes heat resistance silk, heater 10 is set to the gas outlet end of gas pump, drying mechanism 9 is set to the gas inlet end of gas pump, to avoid the influence of gas pump itself work by temperature supply and excessive humidity.

[0028] The utility model discloses a kind of carbon film baking drying devices, to ensure the sealing effect after buckling of sealing cover 3, here the position of bracket 2 that is placed around on the upper surface of workbench 1 is equipped with annular sealing pad 8, and the bottom of sealing cover 3 is provided with flanging, let flanging can be in close contact with sealing pad 8 and form stable closed space in sealing cover 3, i.e. it is enough.And the installation position accuracy of sealing cover 3 can be positioned by guide rod or bolt through flanging, prevent movable nut locking can be enough.In some other embodiments, electric push rod buckling mode can also be used to compress, other implementation ways are not further limited here.To improve the utilization of temperature, sealing cover 3 and / or circulation line 4 can be provided with heat preservation layer, temperature sensor is used to monitor its internal temperature during work, to control the power of heat resistance wire, avoid air circulation temperature substandard.

[0029] The above is only the preferred embodiment of the utility model, it should be pointed out, for ordinary skilled person in the art, without departing from the technical principle of the utility model, can make a number of improvements and deformation, these improvements and deformation also should be regarded as the protection scope of the utility model.

Claims

1. A carbon film baking drying apparatus characterized by comprising: The utility model provides a kind of PCB drying device, including workbench (1), the workbench (1) is provided with placing support (2), the placing support (2) is used to place the PCB to be dried, the workbench (1) is provided with sealing cover (3), the sealing cover (3) is used to cover the placing support (2) on workbench (1) and form closed space, the outside of sealing cover (3) is connected with circulation pipeline (4), and the circulation pipeline (4) is provided with heater (10) for heating airflow, drying mechanism (9) and air pump on the communication path.

2. The carbon film baking and drying apparatus according to claim 1, wherein The placing support (2) includes support column (201) arranged in pairs, and a plurality of sliding grooves (202) are arranged in the vertical direction on the opposite sides of the support column (201), and a PCB placing plate (203) is slidably arranged between every two opposite sliding grooves (202).

3. The carbon film baking and drying apparatus according to claim 1, wherein The sealing cover (3) is provided with openings on both sides, and the two open ends of the circulation pipeline (4) are respectively connected with the corresponding opening sides, and the openings on each side are divided into upper and lower openings, and a gas guide pipe (7) is installed at each opening position, which is used to avoid hot air flow directly blowing on the surface of the PCB.

4. The carbon film baking and drying apparatus according to claim 3, wherein The blowing directions of the two gas guide pipes (7) on the air inlet side of the sealing cover (3) are opposite, and the blowing directions of the two gas guide pipes (7) on the air outlet side of the sealing cover (3) are opposite.

5. The carbon film baking and drying apparatus according to claim 3, wherein The gas guide pipe (7) has a long strip-shaped air passage cross section, and further includes a main air inlet pipe (5) and a transfer air chamber (6), the transfer air chamber (6) is arranged outside the sealing cover (3) in the form of a hollow rectangular box, the transfer air chamber (6) is connected with the gas guide pipe (7), the main air inlet pipe (5) and the transfer air chamber (6) are connected through a plurality of branch air pipes, and the two ends of the circulation pipeline (4) are respectively connected with the main air inlet pipes (5) at the two ends.

6. The carbon film baking and drying apparatus according to claim 1, wherein The drying mechanism (9) includes a drying box and a drying agent arranged in the drying box, the heater (10) at least includes a heating resistance wire, the heater (10) is arranged at the air outlet end of the air pump, and the drying mechanism (9) is arranged at the air inlet end of the air pump.

7. The carbon film baking and drying apparatus according to claim 1, wherein The upper surface of the workbench (1) is provided with an annular sealing gasket (8) around the position of the placing support (2), the bottom of the sealing cover (3) is provided with a flange, and the flange can tightly contact with the sealing gasket (8) to form a stable closed space in the sealing cover (3).

8. The carbon film baking and drying apparatus according to claim 1, wherein The sealing cover (3) and / or the circulation pipeline (4) are provided with a heat preservation layer.

Images