Double-pulse dynamic testing device of power semiconductor module
By designing a dual-pulse dynamic testing device with fixed components, support components, and connecting components, the problem of low reliability of existing devices was solved, the accuracy of test results and the stability of the device were achieved, and maintenance costs were reduced.
Patent Information
- Application Number
- CN202520314935.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-02-25
AI Technical Summary
Existing dual-pulse test devices for power semiconductor modules have low reliability and cannot meet the requirements of small stray inductance, easy disassembly and assembly, and reliable electrical connection, resulting in inaccurate test results or device damage.
A dual-pulse dynamic testing device was designed, comprising a fixing component, a support component, a connecting component, and a test circuit board. The support component supports the pins of the device under test, and the connecting component is soldered to the test circuit board to ensure the stability of the connection. An explosion-proof plate is used to protect the circuit board. The connecting component is made of high-purity copper and the explosion-proof plate material with high hardness reduces the risk of poor connection.
It improves the accuracy of test results and the reliability of the device, reduces maintenance costs, and ensures connection stability and electrical connection reliability during the testing process.
Smart Images
Figure CN223742661U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to power semiconductor module test technical field especially relates to a power semiconductor module's double pulse dynamic testing device. BACKGROUND
[0002] Power semiconductor module is the important component in power electronics equipment, and its quality and performance are directly related to the stability and reliability of the whole equipment. Therefore, it is very necessary to test the power semiconductor module during the production process or after the production is completed. For example, dynamic testing of power semiconductor module is an important process in IGBT / MOSFET power module packaging production process, which is used to test the dynamic parameters (turn-on loss Eon, turn-off loss Eoff, diode reverse recovery loss Erec, etc.) of each power chip packaging in the module, to ensure product qualification.
[0003] At present, double pulse method is used for dynamic testing of power semiconductor module, and the corresponding double pulse testing device (including connecting structure and testing circuit for testing) needs to be designed. Specifically, the double pulse testing circuit in the double pulse testing device requires small stray inductance of the test loop, and the gate loop and the load loop should not be parallel. Moreover, for IGBT / MOSFET high-power module, the testing device also needs to meet the requirements of convenient disassembly and assembly and reliable electrical connection, otherwise the contact resistance of the electrical connection part will be large during testing, which will affect the test result, and even the testing device will be damaged. The existing double pulse testing device cannot meet the above multiple testing requirements, and the reliability is low.
[0004] In the process of realizing the utility model, the inventor finds that there are at least the following problems in the prior art:
[0005] The existing double pulse testing device for power semiconductor module has low reliability. UTILITY MODEL CONTENTS
[0006] The utility model aims at providing a double pulse dynamic testing device for power semiconductor module to solve the technical problem of low reliability of the double pulse testing device for power semiconductor module in the prior art. The preferred technical scheme in the many technical schemes provided by the utility model can produce many technical effects, which are described in detail below.
[0007] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:
[0008] The utility model provides a kind of double-pulse dynamic testing device of power semiconductor module, comprising: fixed component and support component matched connection in turn, and connection component and test circuit board matched connection in turn;
[0009] The fixed component is used to fix the support component and the measured device.
[0010] The support component is used to connect with the lower surface of the pin of the measured device, and support the pin of the measured device.
[0011] One end of the connection component is connected with the upper surface of the pin of the measured device, and the other end is welded with the test circuit board.
[0012] The test circuit board is used to test the measured device through the connection component.
[0013] Optionally, the test circuit board is provided with an explosion-proof plate; the explosion-proof plate is used to protect the test circuit board.
[0014] Optionally, the test circuit board is provided with an electrode connection site, and the connection component is connected with the test circuit board through the electrode connection site.
[0015] Optionally, the support component is a U-shaped spring, one end of the U-shaped spring abuts against the lower surface of the pin of the measured device, and the other end of the U-shaped spring is fixedly connected with the fixed component.
[0016] Optionally, the fixed component includes a fixed seat and a mounting seat, the mounting seat is fixedly arranged on the fixed seat, and the mounting seat is used to limit the support component and the measured device.
[0017] Optionally, the fixed seat is provided with a clamping groove, one end of the support component is fixedly connected with the fixed seat through the clamping groove, and the clamping groove is used to limit the support component in the first direction.
[0018] Optionally, the mounting seat includes a limiting groove and a taking-and-placing groove.
[0019] The limiting groove is located in the middle of the mounting seat and is used to limit the measured device.
[0020] The taking-and-placing groove is located on both sides of the limiting groove and is communicated with the limiting groove.
[0021] Optionally, the mounting seat further includes a supporting groove, the supporting groove is used to support the support component and limit the support component in the second direction.
[0022] Optionally, the fixing base is provided with a plurality of positioning holes, the mounting base is provided with a plurality of connecting holes, and the mounting base is connected with the fixing base through the connecting holes and the positioning holes.
[0023] Optionally, the material of the connecting assembly is metal.
[0024] The above technical solutions of the utility model have the following advantages or beneficial effects:
[0025] The double-pulse dynamic testing device comprises a fixing assembly, a supporting assembly, a connecting assembly and a testing circuit board, the fixing assembly and the supporting assembly are matched and connected and are located below the measured device, the fixing assembly is used for supporting the measured device and the supporting assembly, the supporting assembly is used for abutting against the lower surface of the pin of the measured device, and the pin of the measured device is provided with an upward force, and the pin of the measured device is supported; the connecting assembly and the testing circuit board are matched and connected and are located above the measured device, the connecting assembly is used for abutting against the lower surface of the pin of the measured device, and the measured device is tested by cooperation of the testing circuit board. During the testing process, the pin of the measured device is supported by the supporting assembly, and the connecting assembly and the pin of the measured device are always in the connected state, so that the stability of the connection between the connecting assembly and the pin of the measured device during the testing process is ensured, and the accuracy of the testing result is improved. BRIEF DESCRIPTION OF DRAWINGS
[0026] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor, and the drawings are as follows:
[0027] Figure 1 It is the connection schematic diagram of the supporting assembly, the measured device, the connecting assembly and the testing circuit board in the embodiment of the utility model;
[0028] Figure 2 It is the connection schematic diagram of the fixing assembly, the supporting assembly and the measured device in the embodiment of the utility model;
[0029] Figure 3 It is the structure disassembly schematic diagram of the fixing assembly, the supporting assembly and the measured device in the embodiment of the utility model;
[0030] Figure 4 It is the structure schematic diagram of the mounting base in the embodiment of the utility model;
[0031] Figure 5 It is the structure schematic diagram of the supporting assembly in the embodiment of the utility model.
[0032] Fig. 1, fixed assembly; 11, fixed seat; 111, clamping groove; 112, positioning hole; 12, mounting seat; 121, limiting groove; 122, taking and placing groove; 123, supporting groove; 124, connecting hole; 2, supporting assembly; 3, connecting assembly; 4, test circuit board; 41, electrode connecting position; 42, explosion-proof plate; 5, device under test; 51, pin. DETAILED DESCRIPTION
[0033] In order to make the purpose, technical scheme and advantages of the utility model clearer and more apparent, various exemplary embodiments to be described below will be referred to the corresponding drawings, which constitute a part of the exemplary embodiments. The same numerals in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all the embodiments consistent with the present disclosure. It should be understood that they are only examples of processes, methods and devices, etc. consistent with some aspects of the utility model disclosed in the appended claims, and other embodiments can be used, or structural and functional modifications can be made to the embodiments listed herein, without departing from the scope and essence of the utility model.
[0034] In the description of the utility model, it is understood that the terms "center", "longitudinal", "transverse" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated elements must have a specific orientation, structure and operation. The terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. The term "a plurality of" means two or more. The terms "connected", "connected" should be understood broadly, for example, it can be fixed connection, detachable connection, integral connection, mechanical connection, electrical connection, communication connection, direct connection, indirect connection through intermediate medium, internal communication of two elements or interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more related listed items. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0035] In order to illustrate the technical scheme described in the utility model, the following will be described by specific embodiments, only the part related to the embodiment of the utility model is shown.
[0036] Embodiment one:
[0037] As Figures 1-2As shown, this utility model provides a dual-pulse dynamic testing device for a power semiconductor module, comprising: a fixing component 1 and a support component 2 connected in sequence, and a connecting component 3 and a test circuit board 4 connected in sequence; the fixing component 1 is used to fix the support component 2 and the device under test 5; the support component 2 is used to connect to the lower surface of the pin 51 of the device under test 5 and support the pin 51 of the device under test 5; the connecting component 3 is connected at one end to the upper surface of the pin 51 of the device under test 5 and soldered at the other end to the test circuit board 4; the test circuit board 4 is used to test the device under test 5 through the connecting component 3.
[0038] The dual-pulse dynamic testing device in this embodiment is used to perform dual-pulse testing on the power semiconductor module to verify the performance of the power semiconductor module under actual working conditions and ensure the reliability and stability of the power semiconductor module in actual operation.
[0039] Below, we will combine Figures 1-5 This document provides a detailed introduction to the structure and working principle of a dual-pulse dynamic testing device for power semiconductor modules.
[0040] like Figures 1-2 As shown, the dual-pulse dynamic testing device includes a fixing component 1, a support component 2, a connecting component 3, and a test circuit board 4. The fixing component 1 and the support component 2 are matched and connected, and are located below the device under test (DUT) 5. The fixing component 1 supports the DUT 5 and the support component 2, and the support component 2 abuts against the lower surface of the pin 51 of the DUT 5, providing an upward force to support the pin 51. The connecting component 3 is matched and connected to the test circuit board 4, and is located above the DUT 5. The connecting component 3 abuts against the lower surface of the pin 51 of the DUT 5, and cooperates with the test circuit board 4 to perform dual-pulse dynamic testing on the DUT 5. During the test, because the support component 2 supports the pin 51 of the DUT 5, the connecting component 3 and the pin 51 of the DUT 5 remain connected, ensuring the stability of the connection between the connecting component 3 and the pin 51 of the DUT 5 during the test, thus improving the accuracy of the test results.
[0041] It should be noted that the surface of the support component 2 that abuts against the pin 51 of the device under test 5, and the surface of the connecting component 3 that abuts against the pin 51 of the device under test 5, are both in contact with the pin 51 of the device under test 5.
[0042] In this embodiment, the device under test 5 is an IGBT power semiconductor module or a MOSFET power semiconductor module. More specifically, the device under test 5 can be a DPIM power semiconductor module.
[0043] like Figure 3As shown, the fixing assembly 1 comprises a fixing base 11 and a mounting base 12, the mounting base 12 is fixedly arranged on the fixing base 11, and the mounting base 12 is used for limiting the support assembly 2 and the measured device 5.
[0044] As shown in the figure, Figure 3 As shown, the fixing base 11 is provided with a clamping groove 111, one end of the support assembly 2 is fixedly connected with the fixing base 11 through the clamping groove 111, and the clamping groove 111 limits the support assembly 2 in the first direction. It should be noted that the first direction is the transverse direction, and the support assembly 2 is limited in the transverse direction to avoid transverse displacement of the support assembly 2 in the transverse direction. Among them, because the number of support assemblies 2 needs to be the same as the number of pins 51 of the measured device 5 in the test process, the length of the clamping groove 111 needs to be adjusted according to the actual situation.
[0045] As shown in the figure, Figure 4 As shown, the mounting base 12 comprises a limiting groove 121 and a taking and placing groove 122; the limiting groove 121 is located in the middle of the mounting base 12 and is used for limiting the measured device 5; and the taking and placing groove 122 is located on both sides of the limiting groove 121 and is communicated with the limiting groove 121. Specifically, the limiting groove 121 is used for placing and limiting the measured device 5. In this embodiment, the limiting groove 121 and the taking and placing groove 122 are actually grooves downwardly formed on the mounting base 12. The shape and size of the limiting groove 121 are matched with the measured device 5, which facilitates the placement of the measured device 5. At the same time, limiting the measured device by the limiting groove 121 can avoid the displacement of the measured device in the test process, which affects the stability of the measured device 5 in the test process. The taking and placing groove 122 is located on the two sides corresponding to the limiting groove 121, and the taking and placing groove 122 is arranged to facilitate manual placement and removal of the measured device 5, which facilitates the placement and removal of the measured device 5 and improves the placement efficiency.
[0046] Further, as shown in the figure, Figure 4As shown, the mounting base 12 further comprises a support groove 123 for supporting the support assembly 2 and limiting the support assembly 2 in the second direction. Specifically, the mounting base 12 further comprises the support groove 123, which is located on the other two sides of the limiting groove 121. The support groove 123 supports the support assembly 2 and limits the support assembly 2 in the second direction. The support groove 123 needs to be arranged according to the shape of the support assembly 2. In this embodiment, if the support assembly 2 is U-shaped, the support groove 123 needs to be arranged on different surfaces of the mounting base 12, so that the support groove 123 matches the shape of the support assembly 2, and the support assembly 2 is fixed in the support groove 123 to correctly and stably support the support assembly 2 without occupying the space of the pins 51 in the arrangement direction. In addition, the number of the support grooves 123 needs to be the same as the number of the support assemblies 2, and the spacing between each support groove 123 needs to be the same as the spacing between the pins 51 on the device under test 5. It should be noted that the second direction in this embodiment is the longitudinal direction.
[0047] As shown in FIG. 1, Figure 3 As shown in FIG. 1, Figure 4 As shown in FIG. 1, the mounting base 12 comprises a plurality of connecting holes 124, and the mounting base 12 is connected with the fixing base 11 through the connecting holes 124 and the positioning holes 112. Specifically, the fixing base 11 and the mounting base 12 are fixedly connected, so that a plurality of positioning holes 112 are arranged on the fixing base 11, and a plurality of connecting holes 124 are arranged on the mounting base 12. The mounting base 12 and the fixing base 11 are connected through the connecting holes 124 and the positioning holes 112, so as to limit the device under test 5 and the support assembly 2. In addition, the fixing base 11 or the mounting base 12 can further comprise a mounting hole. During testing, the test circuit board 4 is fixed on the fixing base 11 or the mounting base 12, so as to ensure the accurate connection between the support assembly 2, the device under test 5, the connecting assembly 3 and the test circuit board 4 during testing, and ensure the stability during testing and the accuracy of the test result.
[0048] It should be noted that the fixing assembly 1 can be made of an insulating material with high machining precision, and specifically can be made of acrylic.
[0049] In this embodiment, as shown in FIG. 1, Figure 5As shown, the support assembly 2 is a U-shaped spring, one end of the U-shaped spring abuts with the lower surface of the pin 51 of the device under test 5, and the other end of the U-shaped spring is fixedly connected with the fixed assembly 1. In this embodiment, the support assembly 2 functions to provide an upward pushing force to the pin 51 of the device under test 5 when pressure is applied to the bottom of the fixed assembly 1, so that the pin 51 of the device under test 5 is always in a connected state with the connecting assembly 3, ensuring the reliability and stability of the connection between the pin 51 of the device under test 5 and the connecting assembly 3. It should be noted that the spring with a large structure size is used in this embodiment to provide contact pressure, which can provide reliable electrical connection between the device under test 5 and the connecting assembly 3, avoiding virtual connection and burning of the contact position. At the same time, the support assembly 2 in this embodiment can be made of spring steel and heat treated to be shaped, and the support assembly supported in the above manner has a longer service life than the support assembly supported by rubber, and can also reduce the subsequent maintenance cost and use cost. In this embodiment, the spring steel can be selected as 60Si2Mn.
[0050] The test circuit board 4 includes a PCB board on which test circuits are printed and various components mounted thereon. As shown, Figure 1 Various components are mounted on one side of the PCB board, and an electrode connection site 41 is arranged on the other side of the PCB board, and the connecting assembly 3 is connected with the test circuit board 4 through the electrode connection site 41. Specifically, the electrode connection site 41 is actually a copper layer arranged on the PCB board, facilitating connection with the connecting assembly 3, and the connecting assembly 3 is connected with the electrode connection site 41 by tin soldering, thereby avoiding damage of the PCB board due to virtual connection and protecting the PCB board while ensuring the stability of the connection between the connecting assembly 3 and the test circuit board 4 during the test.
[0051] The test tool further includes an explosion-proof plate 42, which is electrically connected with the test circuit board 4 and used to protect the test circuit board 4. As shown, Figure 1 The explosion-proof plate 42 is arranged on the PCB board and located on the same side as the electrode connection site 41, and is used to protect the PCB board from damage due to product explosion, thereby protecting the test circuit board 4. If the explosion-proof plate 42 is damaged during the test, it can be removed and replaced without the need to repair the test circuit board 4, thereby reducing the use cost and maintenance cost of the entire test device. It should be noted that the explosion-proof plate 42 is made of a material with high hardness and insulation, and the material of the explosion-proof plate 42 in this embodiment can be selected as phenolic resin.
[0052] One end of the connecting assembly 3 is connected with the device under test 5, and the other end is fixedly connected with the electrode connecting position 41 on the test circuit board 4. The connecting assembly 3 is actually a connecting electrode, which is made of metal with good conductivity, and in this embodiment, high-purity copper can be selected for manufacturing, and the surface is treated with nickel / silver plating. The upper end of the connecting assembly 3 is welded with the electrode connecting position 41 by soldering, the middle section is bent downward, the height of the bent section is the same as the height of the explosion-proof plate 42, and then it is bent again to fit the pin 51 of the device under test 5 in the covered area of the explosion-proof plate 42. In the actual test process, if the connecting assembly 3 is ablated and fused due to accidental circumstances, the connecting assembly 3 can be removed using an electric soldering iron and replaced with a new electrode. In this embodiment, the overall length of the connecting assembly 3 is relatively short, which will not bring high test loop parasitic inductance, at the same time, the gate level loop and the load loop have a short parallel distance, which will not produce large mutual inductance and interference test, and can ensure the accuracy of the test.
[0053] The embodiment is only one specific example, and does not mean that the utility model is only in this implementation manner.
[0054] The above is only the preferred embodiment of the utility model, and those skilled in the art know that various changes or equivalent replacements can be made to these features and embodiments without departing from the spirit and scope of the utility model. In addition, under the guidance of the utility model, these features and embodiments can be modified to adapt to specific conditions and materials without departing from the spirit and scope of the utility model. Therefore, the utility model is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application belong to the protection scope of the utility model.
Claims
1. A double-pulse dynamic testing device for a power semiconductor module, characterized by, The utility model relates to a kind of test fixture, including: Fixed component (1) and support component (2) are sequentially matched and connected, and connection component (3) and test circuit board (4) are sequentially matched and connected; The fixed component (1) is used to fix the support component (2) and the device under test (5); The support component (2) is used to connect with the lower surface of the pin (51) of the device under test (5), and support the pin (51) of the device under test (5); The connection component (3) is connected with the upper surface of the pin (51) of the device under test (5) at one end, and is welded with the test circuit board (4) at the other end; The test circuit board (4) is used to test the device under test (5) through the connection component (3).
2. The dual pulse dynamic testing device of claim 1, wherein, An explosion-proof plate (42) is arranged on the test circuit board (4); the explosion-proof plate (42) is used to protect the test circuit board (4).
3. The dual pulse dynamic testing device of claim 1, wherein, An electrode connecting position (41) is arranged on the test circuit board (4), and the connection component (3) is connected with the test circuit board (4) through the electrode connecting position (41).
4. The dual pulse dynamic testing device of claim 1, wherein, The support component (2) is a U-shaped spring, one end of the U-shaped spring is abutted with the lower surface of the pin (51) of the device under test (5), and the other end of the U-shaped spring is fixedly connected with the fixed component (1).
5. The dual pulse dynamic testing device of claim 1, wherein, The fixed component (1) includes a fixed seat (11) and a mounting seat (12), the mounting seat (12) is fixedly arranged on the fixed seat (11), and the mounting seat (12) is used to limit the support component (2) and the device under test (5).
6. The dual pulse dynamic testing device of claim 5, wherein, A clamping groove (111) is arranged on the fixed seat (11), one end of the support component (2) is fixedly connected with the fixed seat (11) through the clamping groove (111), and the clamping groove (111) is used to limit the support component (2) in a first direction.
7. The dual pulse dynamic testing device of claim 5, wherein, The mounting seat (12) includes a limiting groove (121) and a taking-and-placing groove (122). The limiting groove (121) is located in the middle of the mounting seat (12) and is used to limit the device under test (5). The taking-and-placing groove (122) is located on both sides of the limiting groove (121) and is communicated with the limiting groove (121).
8. The dual pulse dynamic testing device of claim 5, wherein, The mounting seat (12) further includes a supporting groove (123), which is used to support the support component (2) and limit the support component (2) in a second direction.
9. The dual pulse dynamic testing device of claim 5, wherein, A plurality of positioning holes (112) are arranged on the fixed seat (11), a plurality of connecting holes (124) are arranged on the mounting seat (12), and the mounting seat (12) is connected with the fixed seat (11) through the connecting holes (124) and the positioning holes (112).
10. The dual pulse dynamic testing device of any of claims 1-9, wherein, The material of the connection component (3) is metal.