High-temperature and high-humidity test device for testing circuit board
By designing a high-temperature and high-humidity testing device that includes a placement board and a clamping structure, the problem that existing equipment cannot simulate the vertical state of circuit boards has been solved, and more accurate testing results have been achieved.
Patent Information
- Application Number
- CN202423246238.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2034-12-27
AI Technical Summary
Existing high temperature and humidity test benches cannot simulate the vertical state that circuit boards may be in during actual use, which makes it easy for integrated chips and other structures to fall off under the influence of gravity, resulting in inaccurate testing.
A high temperature and high humidity test device for circuit board testing was designed, comprising a rectangular device frame, a placement plate and a clamping structure. The circuit board can be placed horizontally on one side of the placement plate, and the circuit board is clamped and fixed on the other side by a movable clamping block and a fixed clamping block to simulate the actual use state.
It improves the accuracy of circuit board testing, can more realistically simulate the working state of circuit boards in actual equipment, and enhances the stability and reliability of testing.
Smart Images

Figure CN223742662U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of circuit board test, especially relates to a high temperature and high humidity test device for circuit board test. BACKGROUND
[0002] Circuit board makes circuit miniaturization, intuition, and plays an important role in the batch production of fixed circuit and the optimization of electric appliance layout, is mainly used for connecting various electronic components in electronic equipment, and plays the role of structural support, the long time operation of circuit board needs to have certain high temperature resistance and humidity resistance, therefore, when producing circuit board, a high temperature and high humidity test table for circuit board is needed to test the heat resistance of circuit board.
[0003] The high temperature and high humidity test table in the prior art is directly placed on the placing net of the test table when being used, and then the test operation is carried out, but this mode cannot simulate the actual working state of the circuit board, and the circuit board installed in various devices cannot be horizontally placed, and can be vertically placed, and under the condition of high temperature and high humidity, the integrated chip and other structures on the surface of the vertically placed circuit board can be more easily detached under the action of gravity, and the general test equipment cannot simulate this condition. UTILITY MODEL CONTENTS
[0004] The utility model provides a kind of high temperature and high humidity test device for circuit board test, to solve the problem that general circuit board high temperature and high humidity test equipment cannot truly simulate the actual working state of circuit board.
[0005] The utility model is realized as follows: a kind of high temperature and high humidity test device for circuit board test, including the device frame of rectangle, the upper portion of the front side surface of the device frame is transversely provided with through opening and forms test cavity, the both sides surface in the test cavity is transversely provided with installation slot, multiple the installation slot of two sides is respectively corresponding, corresponding two installation slots are transversely provided with placing plate with detachable;
[0006] The upper surface of multiple placing plate is vertically provided with through opening on one side, the inside of through opening is fixedly connected with network board, and the other side of the upper surface of multiple placing plate is provided with multiple clamping structures;
[0007] The plurality of clamping structures are identical in structure, one of the clamping structures comprises a fixed clamping block fixedly connected to the upper surface of the placing plate, a fixed seat is fixedly connected to the upper surface of the placing plate and located at one side of the fixed clamping block, a transverse through hole is horizontally and longitudinally formed in one end surface of the fixed seat, a transverse sliding rod is horizontally and longitudinally slidably connected in the transverse through hole, and the transverse sliding rod is fixedly connected with a movable clamping block at one end of the fixed clamping block, and a spring is fixedly connected between the movable clamping block and the fixed seat.
[0008] Preferably, an electric heating wire is fixedly connected to the rear end of the test cavity, and the test cavity is provided with an atomizing humidifier.
[0009] Preferably, the test cavity is provided with a temperature sensor and a humidity sensor.
[0010] Preferably, a box door corresponding to the front view contour of the test cavity is rotatably connected to one side of the upper end of the front end surface of the device frame through a hinge, and the box door is provided with an observation glass plate.
[0011] Preferably, the control cabinet is formed by extending the lower part of the front end surface of the device frame forward, and the control cabinet is provided with a control structure.
[0012] Preferably, a plurality of supporting pads are fixedly connected to the bottom end of the device frame. Beneficial effects
[0013] Compared with the prior art, the beneficial effects of the high-temperature and high-humidity test device for the circuit board are as follows: the placing plate of the device is divided into two structures, one side of which is provided with a network board, and the other side is provided with a plurality of clamping structures, so that the circuit board can be directly and horizontally placed, and the clamping structures can clamp and fix the circuit board through the movable clamping block and the fixed clamping block, so that the circuit board can maintain a numerical state during testing, thereby simulating the actual use condition, and improving the accuracy of the test structure. BRIEF DESCRIPTION OF DRAWINGS
[0014] Fig. 1 It is a structural schematic view of the test cavity of the utility model;
[0015] Fig. 2 It is a structural schematic view of the placing plate in the utility model;
[0016] Fig. 3 It is a structural schematic view of the whole front view of the utility model.
[0017] In the diagram: 1-device frame, 2-test chamber, 3-heating wire, 4-mounting groove, 5-placement plate, 6-through opening, 7-fixed clamping block, 8-fixed seat, 9-horizontal slide bar, 10-spring, 11-movable clamping block, 12-atomizing humidifier, 13-temperature sensor, 14-humidity sensor, 15-control cabinet, 16-support pad, 17-box door, 18-observation glass plate. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0019] Please see Figs. 1-3 This utility model provides a technical solution: a high temperature and high humidity test device for circuit board testing, including a rectangular device frame 1. A through opening is provided on the upper part of the front surface of the device frame 1 to form a test cavity 2. The two sides of the test cavity 2 are provided with mounting grooves 4. Multiple mounting grooves 4 on both sides correspond to each other. A placement plate 5 is detachably arranged horizontally between two corresponding mounting grooves 4.
[0020] A through-hole 6 is vertically opened on one side of the upper surface of multiple placement plates 5. A network plate is fixedly connected inside the through-hole 6. Multiple clamping structures are provided on the other side of the upper surface of multiple placement plates 5.
[0021] The multiple clamping structures are all identical. One of the clamping structures includes a fixed clamping block 7 fixedly connected to the upper surface of the placement plate 5. A fixed seat 8 is fixedly connected to the upper surface of the placement plate 5 and to one side of the fixed clamping block 7. A transverse through hole is opened on one end surface of the fixed seat 8. A transverse sliding rod 9 is slidably connected inside the transverse through hole. A movable clamping block 11 is fixedly connected to one end of the transverse sliding rod 9 at the fixed clamping block 7. A spring 10 is fixedly connected between the movable clamping block 11 and the fixed seat 8.
[0022] In this embodiment, the placement plate 5 of the device is divided into two structures. One side is provided with a network plate 6, which can directly place the circuit board horizontally, while the other side is provided with multiple clamping structures. The clamping structures can clamp and fix the circuit board through the movable clamping block 11 and the fixed clamping block 7, so that the circuit board maintains its numerical state during the test, thereby simulating the real situation during actual use and improving the accuracy of the test structure.
[0023] When using the clamping structure to fix the circuit board, first push the movable clamping block 11 towards the fixing base 8 until the distance between the movable clamping block 11 and the fixed clamping block 7 is greater than the thickness of the circuit board. At this time, place the circuit board between the two and then slowly move the movable clamping block 11 closer to the fixed clamping block 7 until the two clamp and fix the circuit board. The stability of the clamping structure can be ensured by the spring 10. In this structure, the horizontal slide bar 9 plays a guiding role to ensure that there is no positional displacement between the movable clamping block 11 and the fixed clamping block 7.
[0024] After all the circuit boards have been placed and fixed, multiple placement boards 5 can be sent into the test chamber 2 for testing.
[0025] Furthermore, a heating wire 3 is fixedly connected to the rear end of the test chamber 2, and an atomizing humidifier 12 is installed inside the test chamber 2.
[0026] The test chamber 2 is equipped with a temperature sensor 13 and a humidity sensor 14.
[0027] In this embodiment, the heating wire 3 can heat the air to simulate a high-temperature environment, and the atomizing humidifier 12 can increase the humidity of the air inside the test chamber 2. Both of these are existing technologies and will not be described in detail here.
[0028] Temperature sensor 13 and humidity sensor 14 can monitor the temperature and humidity inside test chamber 2 in real time.
[0029] Furthermore, one side of the upper part of the front surface of the device frame 1 is rotatably connected by a hinge to a door 17 that is adapted to and corresponds to the frontal outline of the test chamber 2, and an observation glass plate 18 is provided on the door 17.
[0030] In this embodiment, the door 17 is used to seal the test chamber 2, ensuring that the internal environment is not disturbed by the outside world, and the staff can observe the status of the circuit board being tested inside the device through the observation glass plate 18.
[0031] Furthermore, the lower part of the front surface of the device frame 1 extends forward to form a control cabinet 15, on which a control structure is provided.
[0032] In this embodiment, the control cabinet 15 is equipped with all the control components, and the test temperature and test humidity can be adjusted through the control structure when using the device.
[0033] Furthermore, a plurality of support pads 16 are fixedly connected to the bottom end of the device frame 1.
[0034] In this embodiment, the support pad 16 provides support.
[0035] The working principle and usage process of this utility model: After the utility model is installed, the placement plate 5 of the device is divided into two structures. One side is provided with a network plate, which can directly place the circuit board horizontally, while the other side is provided with multiple clamping structures. The clamping structures can clamp and fix the circuit board through the movable clamping block 11 and the fixed clamping block 7, so that the circuit board maintains its numerical state during the test, thereby simulating the real situation during actual use and improving the accuracy of the test structure. When using the clamping structure to fix the circuit board, first push the movable clamping block 11 towards the fixed base 8 until the distance between the movable clamping block 11 and the fixed clamping block 7 is greater than the thickness of the circuit board. At this time, place the circuit board between the two, and then slowly move the movable clamping block 11 closer to the fixed clamping block 7 until the two clamp and fix the circuit board. The stability of the clamping structure can be ensured by the spring 10. The horizontal slide bar 9 in this structure plays a guiding role to ensure that there is no positional displacement between the movable clamping block 11 and the fixed clamping block 7.
[0036] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A high-temperature and high-humidity testing device for circuit board testing, characterized in that: Including the device frame (1) of rectangle, the upper part of front side surface of device frame (1) is provided with through hole and forms test cavity (2), the both sides of the inside of test cavity (2) are provided with installation slot (4), multiple installation slots (4) of both sides correspond to each other respectively, and the corresponding two installation slots (4) are provided with placing plate (5) detachably laterally between two installation slots (4). The upper surface of multiple placing plates (5) is provided with through hole (6) on one side, the inside of through hole (6) is fixedly connected with network board, and the other side of the upper surface of multiple placing plates (5) is provided with multiple clamping structures. The structure of multiple clamping structures is same, one clamping structure includes fixed clamping block (7) fixedly connected to the upper surface of placing plate (5), the upper surface of placing plate (5) and one side of fixed clamping block (7) are fixedly connected with fixed seat (8), one end surface of fixed seat (8) is provided with transverse through hole, the inside of transverse through hole is slidably connected with transverse sliding rod (9), one end of transverse sliding rod (9) is fixedly connected with movable clamping block (11), and movable clamping block (11) and fixed seat (8) are fixedly connected with spring (10).
2. The high-temperature high-humidity test device for a line-up test according to claim 1, characterized by: The rear end of the inside of test cavity (2) is fixedly connected with electric heating wire (3), and the inside of test cavity (2) is provided with atomizing humidifier (12).
3. The high-temperature high-humidity test device for testing a circuit board according to Claim 1, wherein: The inside of test cavity (2) is provided with temperature sensor (13) and humidity sensor (14).
4. The high-temperature high-humidity test device for testing a circuit board according to Claim 1, wherein: The upper surface of device frame (1) is provided with box door (17) corresponding to the front view contour of test cavity (2) and corresponding to the upper surface of device frame (1) through hinge rotation, and the box door (17) is provided with observation glass plate (18).
5. The high temperature and high humidity test device for testing a circuit board according to claim 1, wherein: The lower part of front end surface of device frame (1) is extended forward to form control cabinet (15), and the control cabinet (15) is provided with control structure.
6. The high temperature and high humidity test device for testing a circuit board according to claim 1, wherein: The bottom end of device frame (1) is fixedly connected with multiple supporting pads (16).