Integrated heat dissipation module and edge computing device

Abstract

The utility model discloses an integrated heat dissipation module and an edge computing device.The integrated heat dissipation module comprises a heat conduction substrate and a heat pipe, a positioning part used for containing the heat pipe is arranged on the upper portion of the heat conduction substrate, the positioning part comprises a heat absorption area and a heat transfer area, the heat absorption area is of a through structure, and the heat transfer area is of a groove-shaped structure; the heat pipe comprises an evaporation end for absorbing heat and a condensation end for releasing heat, the condensation end is fixedly arranged in the heat transfer area, and the evaporation end is arranged in the heat absorption area; a radiator is attached to the upper portion of the heat pipe, and a fan is fixedly arranged on one side of the radiator. The heat conduction substrate is used as a carrier, the radiator and the fan are integrated into an integrated structure, the formed module is small in size, subsequent assembly with other electronic equipment is facilitated, when the module is applied to the edge computing equipment, assembly is easy, the assembly efficiency is high, and the size of the edge computing equipment cannot be increased.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of edge computing device, and particularly relates to an integrated heat dissipation module and an edge computing device. BACKGROUND

[0002] With the rapid development of science and technology, edge computing technology is increasingly widely concerned and applied. As one of the core hardware of edge computing, the edge computing device has the ability to process and analyze data near the device, thereby effectively reducing network transmission delay and improving real-time response speed. However, with the increasing processing capacity of the edge computing device, its power consumption also rises, resulting in increasingly prominent heat problems. Therefore, how to effectively solve the heat dissipation problem of the edge computing device while ensuring its high performance has become a research hotspot in the current field.

[0003] The current edge computing device has certain limitations in heat dissipation design. Some edge computing devices rely on their own metal parts for heat conduction, but when the power consumption of the mainboard is high, the heat dissipation area of the metal parts needed increases, resulting in an increase in the overall size, which is not conducive to the miniaturization and portability of the device. CONTENT OF THE INVENTION

[0004] The purpose of the present application is to provide an integrated heat dissipation module and an edge computing device to solve the technical problems existing in the prior art. The technical effects produced by the optional technical solutions in the many technical solutions provided by the present application are described in detail below.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0006] In a first aspect, the present application provides an integrated heat dissipation module, comprising a heat-conducting base plate and a heat pipe; a positioning part for accommodating the heat pipe is arranged on the upper part of the heat-conducting base plate, the positioning part comprises a heat absorption zone and a heat transfer zone, the heat absorption zone is a through structure, and the heat transfer zone is a groove structure; the heat pipe comprises an evaporation end for heat absorption and a condensation end for heat release, the evaporation end is arranged in the heat absorption zone, and the condensation end is fixedly arranged in the heat transfer zone; a heat sink is attached to the upper part of the heat pipe, and a fan is fixedly arranged on one side of the heat sink.

[0007] In some embodiments, the heat pipe and the heat-conducting base plate are fixedly connected in a welded manner, and the heat-conducting base plate and the heat sink are fixedly connected in a welded manner.

[0008] In some embodiments, the upper surface of the heat pipe is flush with the upper surface of the heat-conducting base plate.

[0009] In some embodiments, the shape of the heat pipe is any one of U-shaped, M-shaped, and N-shaped.

[0010] In some embodiments, the heat-conducting substrate is provided with a receiving groove for accommodating a heat source, and the receiving groove and the heat-absorbing area are through.

[0011] In some embodiments, the back surface of the heat sink is fixedly attached to the upper surface of the heat pipe, and the front surface of the heat sink is provided with a closed heat dissipation channel corresponding to the air outlet of the fan.

[0012] In some embodiments, the closed heat dissipation channel comprises a plurality of spaced apart meandering channels corresponding to the air outlet of the fan.

[0013] In the second aspect, the application further provides an edge computing device, comprising a housing, a PCBA board arranged in the housing, and an integrated heat dissipation module as described in any one of the first aspect, one side of the housing is provided with a side window, and the side window is provided with a heat dissipation grille; the housing comprises an upper housing and a lower housing fixedly connected, and the PCBA board is fixedly connected to the upper part of the lower housing; the PCBA board is provided with a computing power unit, and the upper part of the computing power unit is connected to the integrated heat dissipation module; the upper housing is provided with an air inlet, and the air inlet is arranged above the fan of the integrated heat dissipation module.

[0014] In some embodiments, the PCBA board is further provided with a secondary computing power unit, and the integrated heat dissipation module is attached to the upper part of the secondary computing power unit.

[0015] In some embodiments, a heat-conducting interface material is arranged between the integrated heat dissipation module and the computing power unit, and between the integrated heat dissipation module and the secondary computing power unit.

[0016] The integrated heat dissipation module of the application is provided with a positioning part for accommodating a heat pipe on the upper part of the heat-conducting substrate, a heat sink is attached to the upper part of the heat pipe, and a fan is fixed to one side of the heat sink. The fan can blow air on the heat sink to carry away the heat of the heat sink. The heat source can be arranged below the heat-conducting substrate, so that the heat of the heat source can be conducted to the condensing end of the heat pipe in the heat-absorbing area of the through structure, and then to the condensing end of the heat pipe. The heat pipe conducts the heat to the heat sink. At the same time, the heat of the heat source can also be transmitted to the heat-conducting substrate and then to the heat sink, achieving heat dissipation of the heat source. The integrated heat dissipation module combines the heat-conducting substrate, the heat pipe and the fan, so that the heat of the heat source can be efficiently and quickly conducted to the heat-conducting substrate and the heat pipe, and then to the heat sink, achieving efficient heat dissipation.

[0017] Meanwhile, the heat sink, the fan and the like are integrated into an integrated structure with the heat-conducting substrate as the carrier, forming a module with small volume, which is convenient for subsequent assembly with other electronic devices. When applied to an edge computing device, the assembly is simple and efficient, and the volume of the edge computing device is not increased.

[0018] The edge computing device of the present application, the side window of the shell is provided with a heat dissipation grille, the shell is provided with a computing power unit of the edge computing device, and the upper part of the computing power unit is provided with an integrated heat dissipation module. The integrated heat dissipation module can efficiently cool the computing power unit, and the volume of the integrated heat dissipation module is small, which can be directly installed in the shell of the edge computing device, without the need for additional installation of other heat dissipation modules. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor. In the drawings:

[0020] Figure 1 is a structural schematic view of the back of the heat-conducting substrate involved in the integrated heat dissipation module of the embodiments of the present application;

[0021] Figure 2 is an exploded view of the integrated heat dissipation module involved in the embodiments of the present application;

[0022] Figure 3 is a structural schematic view of the back of the heat-conducting substrate involved in the integrated heat dissipation module of the embodiments of the present application;

[0023] Figure 4 is a partial schematic view of the meandering channel involved in the embodiments of the present application;

[0024] Figure 5 is a structural schematic view of the edge computing device involved in the embodiments of the present application;

[0025] Figure 6 is an exploded view of the edge computing device involved in the embodiments of the present application;

[0026] In the drawings: 1, heat-conducting substrate; 11, accommodating groove; 12, positioning portion; 121, heat absorption area; 122, heat transfer area; 2, heat sink; 21, meandering channel; 3, fan; 4, heat pipe; 41, evaporation end; 42, condensation end; 6, heat-conducting interface material; 7, shell; 71, upper shell; 711, air inlet; 72, lower shell; 73, side window; 731, heat dissipation grille; 8, PCBA board; 81, computing power unit; 82, auxiliary computing power unit. DETAILED DESCRIPTION

[0027] In order to make the purposes, technical solutions and advantages of the present application clearer, the various exemplary embodiments to be described below will be described with reference to the corresponding drawings, which form part of the exemplary embodiments, and in which various exemplary embodiments that can be employed to implement the present application are described. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present disclosure. It should be understood that they are only examples of processes, methods and apparatuses, etc. consistent with some aspects of the present disclosure as detailed in the appended claims, and other implementations can be used or structural and functional modifications can be made to the implementations listed herein without departing from the scope and spirit of the present application.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the elements referred to must have a specific orientation, be constructed and operated in a specific orientation. The terms "first", "second" and the like are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. The term "a plurality of" means two or more. The terms "connected", "connected" should be interpreted broadly, for example, it can be fixed connection, detachable connection, integral connection, mechanical connection, electrical connection, communication connection, direct connection, indirect connection through intermediate medium, internal communication of two elements or interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more related listed items. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0029] In order to illustrate the technical solutions described in the present application, the following will be described by specific embodiments, only showing the parts related to the embodiments of the present application.

[0030] As shown in Figures 1 to 4 The present application provides an integrated heat dissipation module, which comprises a heat-conducting substrate 1, a heat pipe 4 and a fan 3.

[0031] The upper part of the heat-conducting substrate 1 is provided with a positioning part 12 for accommodating the heat pipe 4, the positioning part 12 comprises a heat absorption area 121 and a heat transfer area 122, the heat absorption area 121 is a through structure, and the heat transfer area 122 is a groove structure; the heat pipe 4 comprises an evaporation end 41 for heat absorption and a condensation end 42 for heat dissipation, the evaporation end 41 is arranged in the heat absorption area 121, and the condensation end 42 is fixedly arranged in the heat transfer area 122; a heat sink 2 is attached to the upper part of the heat pipe 4, and a fan 3 is fixedly arranged on one side of the heat sink 2.

[0032] Specifically, the material of the heat-conducting substrate 1 is a heat-conducting material such as aluminum or copper, which has good heat-conducting ability. The heat pipe 4 is a high-efficiency heat transfer element, which has high heat conductivity, simple structure, and reliable operation, and has excellent heat-conducting ability.

[0033] The heat-absorbing area 121 of the through structure is a through structure penetrating the upper and lower surfaces of the heat-conducting substrate 1, and the heat transfer area 122 of the groove structure is a groove structure with an opening facing the upper surface of the heat-conducting substrate 1.

[0034] The heat pipe 4 is an integrally formed structure, which includes an evaporation end 41 and a condensation end 42. When the upper part of the heat pipe 4 is attached to the heat sink 2, the lower surface of the heat sink 2 is fixedly attached to and covers the evaporation end 41 and the condensation end 42. When there is a heat source below the heat-conducting substrate 1 that needs to be cooled, the heat of the heat source is transferred to the evaporation end 41 of the heat pipe 4 in the heat-absorbing area 121 of the through structure, and then the heat is transferred from the evaporation end 41 to the condensation end 42, so that the heat can be quickly and efficiently uniformly transferred to the heat sink 2.

[0035] In some embodiments, the fan 3 can be a centrifugal fan, and the air outlet of the fan 3 faces the heat sink 2 and is fixed to one side of the heat sink 2. The fan 3 blows air to carry away the heat of the heat sink 2.

[0036] The integrated heat dissipation module of the embodiment of the present application is provided with a positioning portion 12 on the upper part of the heat-conducting substrate 1 for accommodating the heat pipe 4, the upper part of the heat pipe 4 is attached to the heat sink 2, one side of the heat sink 2 is fixedly provided with the fan 3, the fan 3 can blow air to the heat sink 2 to carry away the heat of the heat sink 2. The heat source can be arranged below the heat-conducting substrate 1, so that the heat of the heat source can be conducted to the evaporation end 41 of the heat pipe 4 in the heat-absorbing area 121 of the through structure, and then to the condensation end 42 of the heat pipe 4, and the heat pipe 4 conducts the heat to the heat sink 2; at the same time, the heat of the heat source can also be transferred to the heat-conducting substrate 1 and then to the heat sink 2 through the heat-conducting substrate 1, so as to achieve heat dissipation of the heat source. The integrated heat dissipation module, through the combination of the heat-conducting substrate 1, the heat pipe 4 and the fan 3, can efficiently and quickly conduct the heat of the heat source to the heat-conducting substrate 1 and the heat pipe 4, and then to the heat sink 2, so as to achieve efficient heat dissipation.

[0037] At the same time, the heat-conducting substrate 1 is used as a carrier to integrate the heat sink 2 and the fan 3 into an integrated structure, so that the module has a small volume and is convenient for subsequent assembly with other electronic devices. When applied to an edge computing device, the assembly is simple and efficient, and the volume of the edge computing device is not increased.

[0038] In some embodiments, as shown in Figure 3 the heat-conducting substrate 1 is provided with a receiving groove 11 for accommodating the heat source, and the receiving groove 11 and the heat-absorbing area 121 are through.

[0039] Specifically, the shape of the accommodating groove 11 can be adapted to the shape of the heat source. If the heat source is square, the accommodating groove 11 is also square in size. The accommodating groove 11 is arranged on the lower surface of the heat-conducting base plate 1. Since the accommodating groove 11 is through the heat-absorbing area 121, after the heat source is installed in the accommodating groove 11, the heat source can be in contact with the evaporation end 41 of the heat pipe 4, so that the heat of the heat source can be directly conducted to the evaporation end 41 of the heat pipe 4.

[0040] In some embodiments, the shape of the positioning portion 12 corresponds to the shape of the heat pipe 4. The heat pipe 4 can be in any one of U-shaped, M-shaped, and N-shaped, and the shape of the positioning portion 12 also corresponds to any one of U-shaped, M-shaped, and N-shaped. Figure 2 As shown in the figure, the heat pipe 4 is U-shaped, and the shape of the positioning portion 12 is also U-shaped. Of course, the shape of the heat pipe 4 and the shape of the positioning portion 12 can also be M-shaped, N-shaped, etc., which are not limited here.

[0041] In some embodiments, the heat pipe 4 and the heat-conducting base plate 1 are fixedly connected by welding, and the heat-conducting base plate 1 and the heat sink 2 are also fixedly connected by welding.

[0042] Specifically, when the condensation end 42 of the heat pipe 4 is fixed in the heat transfer area 122 of the positioning portion 12, the condensation end 42 of the heat pipe 4 can be fixed in the heat transfer area 122 by welding, such as high-temperature soldering technology.

[0043] The upper surface of the heat-conducting base plate 1 and the reverse surface of the heat sink 2 are also fixed by welding, and the welding method can be high-temperature soldering.

[0044] In some embodiments, the upper surface of the heat pipe 4 is flush with the upper surface of the heat-conducting base plate 1.

[0045] Specifically, after the condensation end 42 of the heat pipe 4 is fixedly arranged in the heat transfer area 122 of the positioning portion 12, the evaporation end 41 is arranged in the heat-absorbing area 121 of the positioning portion 12. The upper surfaces of the condensation end 42 and the evaporation end 41 are in the same plane, the upper surface of the heat pipe 4 is flush with the upper surface of the heat-conducting base plate 1, so that the reverse surface of the heat sink 2 and the upper surface of the heat-conducting base plate 1 can be attached and fixed by high-temperature soldering. When the heat source is located below the heat-conducting base plate 1, the heat pipe 4 can conduct the heat of the heat source to the heat sink 2.

[0046] In some embodiments, the reverse surface of the heat sink 2 is fixedly attached to the upper surface of the heat pipe 4, the front surface of the heat sink 2 is provided with a closed heat dissipation channel, and the closed heat dissipation channel is arranged corresponding to the air outlet of the fan 3.

[0047] Specifically, the fan 3 generates airflow by rotating at high speed, blowing the surrounding cold air into the radiator 2. The cold air absorbs heat as it flows through the radiator 2. The closed heat dissipation channel of the radiator 2 can efficiently discharge the airflow without it dissipating, which helps to improve heat dissipation efficiency.

[0048] In some embodiments, the enclosed heat dissipation channel includes a plurality of spaced-apart loop channels 21, which are arranged corresponding to the air outlet of the fan 3.

[0049] like Figure 4 As shown, the enclosed heat dissipation channel includes multiple spaced loop channels 21, which can increase the heat dissipation area of ​​the radiator 2 and increase the contact area between the airflow and the radiator 2, thereby enhancing the heat dissipation capacity.

[0050] In some embodiments, the plurality of loop channels 21 can be a snap-fit ​​fin group. The loop channels 21 adopt the snap-fit ​​method of fins, which simplifies the manufacturing process and results in a closed heat dissipation channel with high heat dissipation efficiency.

[0051] like Figures 5-6 As shown, this utility model also provides an edge computing device, including a housing 7, a PCBA board 8 disposed within the housing 7, and an integrated heat dissipation module as described above. A side window 73 is provided on one side of the housing 7, and a heat dissipation grille 731 is provided on the side window 73. The housing 7 includes an upper housing 71 and a lower housing 72 fixedly connected. The PCBA board 8 is fixedly connected to the upper part of the lower housing 72. A computing unit 81 is disposed on the PCBA board 8, and the upper part of the computing unit 81 is connected to the integrated heat dissipation module. The upper housing 71 is provided with an air inlet 711, which is located above the fan 3 of the integrated heat dissipation module.

[0052] It should be noted that the integrated heat dissipation module has already been described in detail above, and will not be repeated here.

[0053] The computing unit 81 is one of the heat sources mentioned in the integrated heat dissipation module. The computing unit 81 is aligned with the heat pipe 4 of the integrated heat dissipation module, and the computing unit 81 achieves efficient heat dissipation through the integrated heat dissipation module.

[0054] In some embodiments, the PCBA board 8 is further provided with a secondary computing unit 82, and the integrated heat dissipation module is attached to the upper part of the secondary computing unit 82.

[0055] The secondary computing unit 82 is one of the heat sources mentioned in the integrated heat dissipation module. The secondary computing unit 82 can be arranged side by side with the computing unit 81. The bottom of the heat-conducting substrate 1 of the integrated heat dissipation module completely covers the secondary computing unit 82 and the computing unit 81. The heat from the computing unit 81 can be conducted to the heat sink 2 through the heat pipe 4, and the heat from the secondary computing unit 82 can be conducted to the heat sink 2 through the heat-conducting substrate 1.

[0056] In some embodiments, a thermally conductive interface material 6 is arranged between the integrated heat dissipation module and the computing unit 81 and between the integrated heat dissipation module and the auxiliary computing unit 82.

[0057] Specifically, the thermally conductive interface material 6 between the integrated heat dissipation module and the computing unit 81 is used to improve the tightness between the computing unit 81 and the contact between the thermally conductive substrate 1 and the heat pipe 4. The tighter the contact among the three, the higher the heat conduction efficiency. The thermally conductive interface material 6 between the integrated heat dissipation module and the auxiliary computing unit 82 is used to improve the tightness between the auxiliary computing unit 82 and the contact between the thermally conductive substrate 1.

[0058] In some embodiments, the thermally conductive interface material 6 can be a thermally conductive silicone gasket or a thermally conductive silicone grease. There are some differences in physical form and the like between the two, but both are used to enable the computing unit 81 and the thermally conductive substrate 1 and the heat pipe 4 to be in close contact, and the auxiliary computing unit 82 and the thermally conductive substrate 1 to be in close contact, thereby improving the heat conduction efficiency. Of course, the thermally conductive interface material 6 is not limited to a thermally conductive silicone gasket or a thermally conductive silicone grease, but can also be other materials that can improve close contact and high heat conduction efficiency, which are not limited here.

[0059] The edge computing device of the present application, the side window 73 of the shell 7 is provided with a heat dissipation grille 731, the shell 7 is provided with the computing unit 81 of the edge computing device, and the upper part of the computing unit 81 is provided with an integrated heat dissipation module. The integrated heat dissipation module can efficiently dissipate heat for the computing unit 81, and the volume of the integrated heat dissipation module is relatively small, which can be directly installed in the shell 7 of the edge computing device, without the need for additional installation of other heat dissipation modules.

[0060] The above only describes the preferred embodiments of the present application, and those skilled in the art know that various changes or equivalent replacements can be made to the features and embodiments without departing from the spirit and scope of the present application. In addition, under the guidance of the present application, the features and embodiments can be modified to adapt to specific conditions and materials without departing from the spirit and scope of the present application. Therefore, the present application is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are within the protection scope of the present application.

Claims

1. An integrated heat dissipation module, characterized in that, The device includes a thermally conductive substrate and a heat pipe. The upper part of the thermally conductive substrate is provided with a positioning portion for accommodating the heat pipe. The positioning portion includes a heat absorption area and a heat transfer area. The heat absorption area has a through-type structure, and the heat transfer area has a groove-shaped structure. The heat pipe includes an evaporation end for heat absorption and a condensation end for heat release. The evaporation end is located in the heat absorption area, and the condensation end is fixedly located in the heat transfer area. A radiator is attached to the upper part of the heat pipe, and a fan is fixedly mounted on one side of the radiator.

2. The integrated heat dissipation module of claim 1, wherein, The heat pipe and the heat-conducting substrate, as well as the heat-conducting substrate and the heat sink, are fixedly connected by welding.

3. The integrated heat dissipation module of claim 2, wherein, The upper surface of the heat pipe is flush with the upper surface of the thermally conductive substrate.

4. The integrated heat dissipation module of claim 1, wherein, The heat pipe can be any of the following shapes: U-shaped, M-shaped, or N-shaped.

5. The integrated heat dissipation module of claim 1, wherein, The thermally conductive substrate is provided with a receiving groove for accommodating a heat source, and the receiving groove and the heat absorption area are connected.

6. The integrated heat dissipation module of claim 1, wherein, The back of the radiator is fixedly attached to the upper surface of the heat pipe, and the front of the radiator is provided with a closed heat dissipation channel, which is arranged corresponding to the air outlet of the fan.

7. The integrated heat dissipation module of claim 6, wherein, The enclosed heat dissipation channel includes multiple spaced-apart loop channels, which are arranged corresponding to the air outlet of the fan.

8. An edge computing device, characterized by, The device includes a housing, a PCBA board disposed within the housing, and an integrated heat dissipation module as described in any one of claims 1-7. A side window with a heat dissipation grille is provided on one side of the housing. The housing comprises an upper housing and a lower housing fixedly connected together. The PCBA board is fixedly connected to the upper part of the lower housing. A computing unit is disposed on the PCBA board, and the upper part of the computing unit is connected to the integrated heat dissipation module. An air inlet is provided on the upper housing, positioned above the fan of the integrated heat dissipation module.

9. The edge computing device of claim 8, wherein, The PCBA board is also provided with a secondary computing unit, and the integrated heat dissipation module is attached to the upper part of the secondary computing unit.

10. The edge computing device of claim 9, wherein, Thermally conductive interface materials are provided between the integrated heat dissipation module and the computing unit, and between the integrated heat dissipation module and the secondary computing unit.

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