Flow guide ring assembly and plasma etching equipment

Abstract

The utility model provides a flow guide ring assembly and a wafer plasma etching device.The flow guide ring assembly comprises a flow guide ring and an adjusting assembly, the flow guide ring is provided with a first flow guide hole, the adjusting assembly is rotationally connected with one axial side of the flow guide ring, and the adjusting assembly is provided with a second flow guide hole and a shielding part; the second flow guide hole and the shielding part are spaced in the rotating direction of the adjusting assembly, the hole diameter of the first flow guide hole is adjusted by adjusting the position of the adjusting assembly relative to the flow guide ring, then the hole diameter of the flow channel in the etching cavity is adjusted, the cavity does not need to be opened to replace the flow guide plate while the etching precision of the wafer is guaranteed, and the efficiency is improved. Therefore, the etching efficiency of the wafer plasma etching equipment on the wafer is ensured.

Description

Technical Field

[0001] This application belongs to the field of wafer manufacturing technology, and more specifically, relates to a current guide ring assembly and a wafer plasma etching device. Background Technology

[0002] In plasma etching of wafers, high cavity conductance allows for a higher gas flow rate at the same cavity pressure, significantly improving the loading effect and reducing particulate generation. High cavity conductance also accelerates the gas exchange efficiency between reactants and products within the cavity, mitigating both density-sparse loading and depth-saturation loading effects, thereby improving etching precision.

[0003] However, the flow conductance within the etching chamber is related to the chamber's vacuum volume, inner diameter, molecular pump orifice diameter, and molecular pump power. Once the chamber design is fixed and the molecular pump model is selected, it is very difficult to change the flow conductance directly within the chamber without replacing any components.

[0004] The plasma etching chamber contains a flow guide ring. This ring confines the plasma within the chamber, and its design determines the flow conductance. However, in current production applications, changing the flow conductance requires opening the chamber and replacing the flow guide ring.

[0005] In existing technologies, the flow conduction within the chamber is usually changed by replacing the flow guide ring with one of different apertures. However, since the component customization cycle is long and replacing the flow guide ring requires opening a cavity, it will affect the production schedule. Summary of the Invention

[0006] The purpose of this application is to provide a flow guide ring assembly and a wafer plasma etching apparatus to solve the technical problem that the aperture of the flow guide ring in the prior art plasma etching apparatus cannot be adjusted.

[0007] To achieve the above objectives, a first aspect of this application is to provide a flow guide ring assembly, comprising:

[0008] A flow guide ring, wherein the flow guide ring is provided with a first flow guide hole, the first flow guide hole penetrating the flow guide ring along the axial direction of the flow guide ring;

[0009] An adjustment assembly is rotatably connected to one side of the axial direction of the flow guide ring. The adjustment assembly is provided with a second flow guide hole and a blocking part, which are spaced apart along the rotation direction of the adjustment assembly.

[0010] The adjustment component has a first position and a second position relative to the flow guide ring;

[0011] When the adjusting component is in the first position, the position of the second guide hole is opposite to the position of the first guide hole to open the first guide hole;

[0012] When the adjustment component is in the second position, the position of the blocking part is opposite to the position of the first guide hole to close the first guide hole;

[0013] When the adjusting component is located at any position between the first position and the second position, the blocking part blocks part of the first guide hole to adjust the diameter of the first guide hole.

[0014] Optionally, the adjustment component includes:

[0015] An adjusting member is rotatably connected to the guide ring, and the second guide hole and the blocking part are disposed on the adjusting member;

[0016] A drive motor is connected to the adjusting member via a transmission assembly to drive the adjusting member to move between the first position and the second position.

[0017] Optionally, the number of the first guide holes is multiple, and the multiple first guide holes are spaced apart radially along the guide ring;

[0018] The number of the second guide holes is multiple, and the multiple second guide holes are radially spaced along the adjusting member, and the number of the multiple second guide holes corresponds one-to-one with the number of the multiple first guide holes.

[0019] Optionally, the plurality of first guide holes are evenly spaced along the radial direction of the guide ring;

[0020] The plurality of second guide holes are evenly spaced along the radial direction of the adjusting member.

[0021] Optionally, a plurality of the first guide holes form a first guide hole group, and the plurality of first guide groups are spaced apart along the circumference of the guide ring to form a first guide hole module. The number of the plurality of first guide hole modules is multiple, and the plurality of first guide hole modules are evenly spaced along the circumference of the guide ring.

[0022] Multiple second guide holes form a second guide hole group, and the multiple second guide hole groups are evenly spaced along the circumference of the adjusting member to form a second guide hole module. The number of multiple second guide hole modules is multiple, and the multiple second guide hole modules are evenly spaced along the circumference of the adjusting member, and the multiple second guide hole modules correspond one-to-one with the multiple first guide hole modules.

[0023] Optionally, there are multiple adjusting members, and each of the multiple adjusting members corresponds one-to-one with a multiple second guide hole group, with each second guide hole group respectively disposed on the corresponding adjusting member;

[0024] Along the rotation direction of the adjusting member, there is a clearance space between any two adjacent adjusting members, and the distance of the clearance space is equal to the distance between the first position and the second position;

[0025] The number of drive motors is multiple, and each drive motor corresponds to one of the multiple adjustment components. Each drive motor is connected to the adjustment component opposite to it. The multiple drive motors are used to simultaneously or separately drive the corresponding adjustment components to move between the first position and the second position.

[0026] Optionally, the transmission assembly includes:

[0027] A rack is connected to the adjusting member and is arranged in an arc shape, and the curvature of the rack is the same as the curvature of the adjusting member;

[0028] The gear is connected to the motor shaft of the drive motor and meshes with the rack.

[0029] Optionally, the adjustment component further includes:

[0030] The guide ring, and the plurality of the adjusting components are slidably connected to the guide ring.

[0031] Optionally, the guide ring has an annular guide rail on the side facing the flow guide ring, and each adjustment member has an arc-shaped groove, with the guide rail housed within the groove.

[0032] The beneficial effects of the flow guide ring assembly provided in this application are as follows: Compared with the prior art, the flow guide ring assembly provided in this application includes a flow guide ring and an adjustment component. The flow guide ring is provided with a first flow guide hole. The adjustment component is rotatably connected to one side of the axial direction of the flow guide ring. The adjustment component is provided with a second flow guide hole and a blocking part. The second flow guide hole and the blocking part are spaced apart along the rotation direction of the adjustment component. By adjusting the position of the adjustment component relative to the flow guide ring, the aperture of the first flow guide hole is adjusted, thereby realizing the adjustment of the flow channel aperture in the etching cavity. While ensuring the etching accuracy of the wafer, there is no need to open the cavity to replace the flow guide plate, thereby ensuring the etching efficiency of the wafer plasma etching equipment.

[0033] Secondly, this application provides a wafer plasma etching apparatus, comprising:

[0034] Etching cavity;

[0035] A wafer stage is mounted inside the etching cavity;

[0036] A flow guide ring assembly is disposed around the outside of the wafer stage, and the flow guide ring assembly is any one of the flow guide ring assemblies described above.

[0037] The beneficial effects of the wafer plasma etching apparatus provided in this application are as follows: Compared with the prior art, the wafer plasma etching apparatus provided in this application includes the flow guide ring assembly provided in any of the above-mentioned embodiments. The flow guide ring assembly includes a flow guide ring and an adjustment assembly. The flow guide ring is provided with a first flow guide hole. The adjustment assembly is rotatably connected to one side of the axial direction of the flow guide ring. The adjustment assembly is provided with a second flow guide hole and a blocking part. The second flow guide hole and the blocking part are spaced apart along the rotation direction of the adjustment assembly. By adjusting the position of the adjustment assembly relative to the flow guide ring, the aperture of the first flow guide hole is adjusted, thereby realizing the adjustment of the flow channel aperture in the etching cavity. While ensuring the etching accuracy of the wafer, there is no need to open the cavity to replace the flow guide plate, thereby ensuring the etching efficiency of the wafer plasma etching equipment. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of the structure of the flow guide ring assembly provided in the embodiments of this application;

[0040] Figure 2 This is a schematic diagram of the structure of the guide ring provided in the embodiments of this application;

[0041] Figure 3 This is a schematic diagram of the structure of the driving component provided in an embodiment of this application;

[0042] Figure 4 This is a schematic diagram of the structure of the adjusting member in the first position according to an embodiment of this application;

[0043] Figure 5 This is a schematic diagram of the structure of the adjusting member in the second position according to an embodiment of this application;

[0044] Figure 6 A schematic diagram of the structure of the adjusting member provided in the embodiment of this application when it is located between the first position and the second position;

[0045] Figure 7 This is a schematic diagram of the structure of the adjusting member provided in the embodiments of this application;

[0046] Figure 8 This is a schematic diagram of the structure of an adjusting member provided in another embodiment of this application;

[0047] Figure 9 for Figure 8 A sectional view;

[0048] Figure 10 for Figure 8 Enlarged view of the adjustment component;

[0049] Figure 11 This is a schematic diagram of the structure of an adjusting member provided in another embodiment of this application;

[0050] Figure 12 for Figure 9 A sectional view.

[0051] The following are the labeling elements in the figure:

[0052] 10. Guide ring; 11. First guide hole; 12. First guide hole group; 13. First guide hole module; 20. Adjustment component; 21. Adjustment piece; 211. Second guide hole; 212. Blocking part; 213. Second guide hole group; 214. Second guide hole module; 215. Slide groove; 22. Rotary connection part; 23. Drive motor; 24. Rack; 25. Gear; 26. Guide ring; 261. Guide rail. Detailed Implementation

[0053] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0054] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0055] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0056] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0057] Please refer to the following: Figures 1 to 12 The current flow guide ring 10 component, i.e., the wafer plasma etching equipment, provided in the embodiments of this application will now be described.

[0058] A first aspect of this application is to provide a flow guide ring 10 assembly, including a flow guide ring 10 and an adjustment assembly 20.

[0059] Please see Figures 1 to 1 to Figure 7 The guide ring 10 is provided with a first guide hole 11, which penetrates the guide ring 10 along the axial direction of the guide ring 10.

[0060] The adjusting assembly 20 includes a rotatable connecting portion 22, which extends radially along the adjusting assembly 20 and is rotatably connected to the inner hole of the guide ring 10. The adjusting assembly 20 is located on one side of the guide ring 10 along its axial direction. For example, along the flow direction of the plasma gas in the first guide hole 11, the adjusting assembly 20 is located at the inlet end of the first guide hole 11, or the adjusting assembly 20 is located at the outlet end of the first guide hole 11.

[0061] The adjustment assembly 20 is provided with a second guide hole 211 and a blocking part 212. The second guide hole 211 and the blocking part 212 are spaced apart along the rotation direction of the adjustment assembly 20, and the width of the blocking part 212 is greater than or equal to the diameter of the first guide hole 11. The adjustment assembly 20 has a first position and a second position relative to the guide ring 10. Initially, the adjustment assembly 20 is located in the second position.

[0062] Please see Figure 4 When the adjusting component 20 is in the first position, the position of the second guide hole 211 is opposite to the position of the first guide hole 11 to conduct the first guide hole 11 and make the first guide hole 11 fully open.

[0063] Please see Figure 5 When the adjusting component 20 is in the second position, the position of the blocking part 212 is opposite to the position of the first guide hole 11 to close the first guide hole 11.

[0064] Please see Figure 6 When the adjusting component 20 is in any position between the first position and the second position, the blocking part 212 blocks part of the diameter of the first guide hole 11 to adjust the diameter of the first guide hole 11, such as opening the first guide hole 11 by one-third, one-half or three-quarters.

[0065] Compared with the prior art, the flow guide ring 10 assembly provided in this application includes a flow guide ring 10 and an adjustment assembly 20. The flow guide ring 10 is provided with a first flow guide hole 11. The adjustment assembly 20 is rotatably connected to one side of the axial direction of the flow guide ring 10. The adjustment assembly 20 is provided with a second flow guide hole 211 and a blocking part 212. The second flow guide hole 211 and the blocking part 212 are spaced apart along the rotation direction of the adjustment assembly 20. By adjusting the position of the adjustment assembly 20 relative to the flow guide ring 10, the aperture of the first flow guide hole 11 can be adjusted, thereby realizing the adjustment of the flow channel aperture in the etching cavity. While ensuring the etching accuracy of the wafer, there is no need to open the cavity to replace the flow guide plate, thus ensuring the etching efficiency of the wafer plasma etching equipment.

[0066] In one embodiment of this application, the adjustment component 20 includes an adjustment element 21 and a drive motor 23.

[0067] Please see Figures 3 to 6 The adjusting member 21 has an annular structure, and the inner diameter of the adjusting member 21 is provided with a rotating connection part 22. The rotating connection part 22 extends into the inner diameter of the guide ring 10 and is rotatably connected to the side wall of the inner diameter of the guide ring 10, so that the adjusting member 21 is rotatably connected to the guide ring 10. The second guide hole 211 and the blocking part 212 are provided on the adjusting member 21, wherein the blocking part 212 is the position on the adjusting member 21 where the second guide hole 211 is not provided.

[0068] The drive motor 23 is a servo motor, which can be fixed to the inner wall of the etching cavity or the outer wall of the support platform via a connector. The drive motor 23 is connected to the adjustment component 21 via a transmission assembly, and is used to drive the adjustment component 21 to move between the first position and the second position.

[0069] Please see Figures 3 to 6 In this application, the transmission assembly includes a rack 24 and a gear 25. The rack 24 is arranged in an arc shape, and the curvature of the rack 24 is the same as the curvature of the adjusting member 21. The rack 24 is connected to the side of the adjusting member 21 opposite to the guide ring 10 and is offset from the second guide hole 211 to prevent the rack 24 from blocking the second guide hole 211. The gear 25 is connected to the motor shaft of the drive motor 23 and meshes with the rack 24.

[0070] When adjusting the diameter of the first adjusting hole, the number of rotations of the servo motor is adjusted to allow the adjusting member 21 to move between the first and second positions. For example, when the servo motor rotates forward a first preset number of times, it drives the adjusting member 21 to move from the second position to the first position; when the servo motor rotates backward a first preset number of times, it drives the adjusting member 21 to move from the first position to the second position; and when the servo motor rotates forward or backward a second preset number of times, a portion of the diameter of the second guide hole 211 on the adjusting member 21 is opposite to the first guide hole 11, and a portion of the blocking portion 212 is opposite to the first guide hole 11, so that a portion of the diameter of the first guide hole 11 is open. The second preset number of rotations is less than the first preset number of rotations.

[0071] In one embodiment of this application, please refer to Figures 1 to 2 The number of first guide holes 11 is multiple, and the multiple first guide holes 11 are spaced apart radially along the guide ring 10.

[0072] Please see Figure 3 and Figure 7 The number of second guide holes 211 is multiple, and the multiple second guide holes 211 are radially spaced along the adjusting member 21, and the number of multiple second guide holes 211 corresponds one-to-one with the number of multiple first guide holes 11. By providing multiple first guide holes 11 radially in the guide ring 10, the flow in the etching cavity can be adjusted at multiple radial positions of the guide ring 10.

[0073] Preferably, the plurality of first guide holes 11 are evenly spaced along the radial direction of the guide ring 10, and the plurality of second guide holes 211 are evenly spaced along the radial direction of the adjusting member 21.

[0074] In this application, a plurality of first guide holes 11 form a first guide hole group 12, and a plurality of second guide holes 211 form a second guide hole group 212.

[0075] For details, please refer to Figure 2 and Figure 7 Along the radial direction of the guide ring 10, every three first guide holes 11 form a guide hole group, and along the circumferential direction of the guide ring 10, every three columns of first guide hole groups 12 form a first guide hole module 13. That is, each first guide hole module 13 contains nine first guide holes 11. There are multiple first guide hole modules 13, and the multiple first guide hole modules 13 are evenly spaced along the circumferential direction of the guide ring 10.

[0076] Along the radial direction of the adjusting member 21, every three second guide holes 211 form a second guide hole group 212 on the adjusting member 21, and along the circumferential direction of the adjusting member 21, every three second guide hole groups 212 form a second guide hole module 213, that is, each second guide hole module 213 contains nine second guide holes 211. There are multiple second guide hole modules 213, which are evenly spaced along the circumferential direction of the adjusting member 21, and each of the multiple second guide hole modules 213 corresponds one-to-one with a multiple first guide hole module 13.

[0077] By providing multiple first flow guide hole modules 13 in the circumferential direction of the flow guide ring 10, the flow within the etching cavity can be adjusted at multiple positions in the radial and circumferential directions of the flow guide ring 10.

[0078] In one embodiment of this application, please refer to Figures 8 to 12 There are multiple adjusting elements 21, and each adjusting element 21 corresponds to a multiple second guide hole group 212. The multiple adjusting elements 21 form a ring structure, and each adjusting element 21 is provided with a second guide hole module 213.

[0079] Along the rotation direction of the adjusting member 21, there is a clearance space between any two adjacent adjusting members 21, and the distance between the clearance spaces is equal to the distance between the first position and the second position, so that when the drive motor 23 drives the corresponding adjusting member 21 to rotate, each adjusting member 21 can move between the first position and the second position.

[0080] There are multiple drive motors 23, and each drive motor 23 corresponds to one of multiple adjusting components 21. Each drive motor 23 is connected to the corresponding adjusting component 21. Each adjusting component 21 is connected to a rack 24, and each drive motor 23 is connected to the corresponding rack 24 through a gear 25 connected to it.

[0081] Multiple drive motors 23 are used to simultaneously or separately drive the corresponding adjustment members 21 to move between the first position and the second position.

[0082] When it is necessary to adjust the aperture of each first guide hole 11 in the multiple first guide hole groups 12, multiple drive motors 23 start simultaneously, and the rotation speed and direction of the multiple drive motors 23 are the same, so as to drive the corresponding adjustment member 21 to move between the first position and the second position relative to the adjustment ring, thereby realizing the simultaneous adjustment of the aperture of multiple first guide holes 11 in the multiple first guide hole groups 12.

[0083] When it is necessary to adjust the multiple first guide holes 11 in any first guide hole module 13, the adjustment member 21 opposite to the first guide hole module 13 is driven to rotate by the drive motor 23 corresponding to the adjustment member 21, so that the adjustment member 21 moves between the first position and the second position, thereby realizing the adjustment of the aperture of the multiple first guide holes 11 in the first guide hole module 13.

[0084] In one embodiment of this application, please refer to Figures 8 to 12 The transmission assembly also includes a guide ring 26.

[0085] Multiple adjusting components 21 are slidably connected to the guide ring 26. The guide ring 26 has an annular guide rail 261 on the side facing the guide ring 10, and each adjusting component 21 has an arc-shaped groove 215, in which the guide rail 261 is accommodated.

[0086] Secondly, this application provides a wafer plasma etching apparatus, including an etching chamber, a wafer stage, and a current guide ring 10 assembly.

[0087] The wafer stage is mounted inside the etching chamber to hold the wafer. The current guide ring 10 assembly is mounted inside the etching chamber and surrounds the outside of the etching stage. The current guide ring 10 assembly is any one of the current guide ring 10 assemblies mentioned above.

[0088] In one embodiment of this application, when the adjusting member 21 is an annular structure, the inner wall of the rotating connector on the adjusting member 21 is sleeved on the outer wall of the wafer stage.

[0089] In one embodiment of this application, when there are multiple adjusting members 21, the guide ring 26 is fixedly connected to the outer wall of the support platform, or the guide ring 26 is fixedly connected to the inner wall of the etching cavity.

[0090] Compared with the prior art, the wafer plasma etching apparatus provided in this application includes the flow guide ring 10 assembly provided in any of the above-mentioned claims. The flow guide ring 10 assembly includes a flow guide ring 10 and an adjustment assembly 20. The flow guide ring 10 is provided with a first flow guide hole 11. The adjustment assembly 20 is rotatably connected to one side of the axial direction of the flow guide ring 10. The adjustment assembly 20 is provided with a second flow guide hole 211 and a blocking part 212. The second flow guide hole 211 and the blocking part 212 are spaced apart along the rotation direction of the adjustment assembly 20. By adjusting the position of the adjustment assembly 20 relative to the flow guide ring 10, the aperture of the first flow guide hole 11 is adjusted, thereby realizing the adjustment of the flow channel aperture in the etching cavity, thereby ensuring the etching accuracy of the wafer.

[0091] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A shroud assembly, comprising: The guide ring is provided with a first guide hole penetrating the guide ring along the axial direction of the guide ring. An adjusting assembly is rotationally connected to one side of the guide ring in the axial direction, and is provided with a second guide hole and a shielding part, which are spaced apart along the rotation direction of the adjusting assembly. The adjusting assembly has a first position and a second position relative to the guide ring. When the adjusting assembly is in the first position, the position of the second guide hole is opposite to the position of the first guide hole to open the first guide hole. When the adjusting assembly is in the second position, the position of the shielding part is opposite to the position of the first guide hole to close the first guide hole. When the adjusting assembly is in any position between the first position and the second position, the shielding part shields part of the first guide hole to adjust the aperture of the first guide hole. The adjusting assembly comprises:

2. The shroud assembly of claim 1, wherein, An adjusting part rotationally connected to the guide ring, and the second guide hole and the shielding part are arranged on the adjusting part. A driving motor in transmission connection with the adjusting part through a transmission assembly, used to drive the adjusting part to move between the first position and the second position.

3. The guide ring assembly according to claim 2, wherein: The number of the first guide holes is multiple, and multiple first guide holes are spaced apart along the radial direction of the guide ring. The number of the second guide holes is multiple, and multiple second guide holes are spaced apart along the radial direction of the adjusting part, and the number of multiple second guide holes corresponds to the number of multiple first guide holes.

4. The guide ring assembly according to claim 3, wherein: Multiple first guide holes are uniformly spaced apart along the radial direction of the guide ring. Multiple second guide holes are uniformly spaced apart along the radial direction of the adjusting part.

5. The guide ring assembly according to claim 4, wherein: Multiple first guide holes form a first guide hole group, multiple first guide groups are spaced apart along the circumferential direction of the guide ring to form a first guide hole module, the number of multiple first guide hole modules is multiple, and multiple first guide hole modules are uniformly spaced apart along the circumferential direction of the guide ring. Multiple second guide holes form a second guide hole group, multiple second guide hole groups are uniformly spaced apart along the circumferential direction of the adjusting part to form a second guide hole module, the number of multiple second guide hole modules is multiple, and multiple second guide hole modules are uniformly spaced apart along the circumferential direction of the adjusting part, and multiple second guide hole modules correspond to multiple first guide hole modules.

6. The guide ring assembly according to claim 5, wherein: The number of the adjusting parts is multiple, and multiple adjusting parts correspond to multiple second guide hole groups, and each second guide hole group is arranged on the corresponding adjusting part. Along the rotation direction of the adjusting part, any two adjacent adjusting parts are provided with a clearance space, and the distance of the clearance space is equal to the distance between the first position and the second position. ​ The number of the driving motors is multiple, the multiple driving motors correspond to the multiple adjusting members one by one, each driving motor is respectively drivingly connected to the adjusting member opposite to it, and the multiple driving motors are used to simultaneously or respectively drive the adjusting members corresponding to them to move between the first position and the second position.

7. The shroud assembly of claim 5 or 6, wherein, The transmission assembly comprises: a rack connected to the adjusting member and arranged in an arc structure, and the curvature of the rack is the same as the curvature of the adjusting member; a gear connected to the motor shaft of the driving motor and engaged with the rack.

8. The flow ring assembly of claim 7, wherein, The adjusting assembly further comprises: a guide ring, and the multiple adjusting members are all slidingly connected to the guide ring.

9. The flow guide ring assembly of claim 8, wherein, a side of the guide ring towards the flow guide ring is provided with an annular guide rail, each adjusting member is provided with an arc-shaped sliding groove, and the guide rail is accommodated in the sliding groove.

10. A wafer plasma etching apparatus, characterized by comprising: It comprises: an etching cavity; a wafer stage installed in the etching cavity; a flow guide ring assembly annularly arranged outside the wafer stage, and the flow guide ring assembly is the flow guide ring assembly of any one of claims 1-9.

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