Thickness measuring tool and thickness measuring system

Abstract

The utility model provides a thickness measuring tool and a thickness measuring system. The thickness measuring tool comprises a pedestal, a first jack, a second jack and a locking member. The base comprises a plurality of first supporting parts and at least one second supporting part, and the connecting positions of the first supporting parts form a central area. The multiple layers of first insertion holes are arranged at intervals from inside to outside, the number of the first insertion holes in each layer is multiple, and the multiple first insertion holes are formed in the multiple first supporting parts in a one-to-one correspondence mode in the circumferential direction of the central area; the plurality of second insertion holes are formed in the second supporting part at intervals and are used for inserting dial indicators; and the locking pieces are selectively inserted into any layer of the first inserting holes, and the locking pieces have elasticity and are used for being deformed when the locking pieces are stressed so as to be detachably connected with the first supporting parts. The thickness measuring tool solves the technical problems that a traditional thickness measuring tool is low in measuring efficiency, low in precision and poor in applicability.

Description

TECHNICAL FIELD

[0001] The utility model relates to sapphire substrate surface processing technical field especially, it relates to thickness measurement frock and thickness measurement system. BACKGROUND

[0002] In the semiconductor material and optical element manufacturing process, the surface quality of sapphire substrate is crucial to the performance of the final product. DMP (Diamond Machining Process) and CMP (Chemical Mechanical Polishing) are two commonly used surface treatment technologies for improving the surface flatness and smoothness of sapphire substrate. In the process of processing its surface, the thickness (Thickness) and total thickness variation (Total Thickness Variation, TTV) of the wafer are two very important indicators.

[0003] In the prior art, the operator needs to manually place the measuring tool (such as a micrometer) at different positions of the wafer for measurement, which is prone to introduce human error; especially in the case of measuring multiple points, each repositioning will increase the cumulative error. In addition, in order to obtain accurate TTV values, multiple measurements of the same position or multiple positions are often required, which not only consumes time but also increases the operation complexity, and each slight change may affect the accuracy of the measurement. SUMMARY

[0004] In view of the deficiencies in the prior art, the utility model provides thickness measurement frock and thickness measurement system to solve the technical problems of low measurement efficiency, low precision and poor applicability of the traditional thickness measurement frock in related technologies.

[0005] The utility model provides thickness measurement frock, including:

[0006] The base includes a plurality of first support parts and at least one second support part, one end of each first support part converges into a central region, the other end of each first support part is arranged at intervals along the circumference of the central region, and the second support part is arranged between any two adjacent first support parts;

[0007] The plurality of first insertion holes are arranged at intervals from inside to outside, and the number of first insertion holes in each layer is set to be multiple. The plurality of first insertion holes are one-to-one corresponding to the plurality of first support parts along the circumference of the central region.

[0008] The plurality of second insertion holes are arranged at intervals in the second support part for inserting a micrometer.

[0009] And

[0010] A plurality of locking members are selectively inserted into any one of the first insertion holes, and the locking members are elastic and deformed when subjected to force to be separably connected with the first support portions.

[0011] Further, the first support portions are equidistantly spaced.

[0012] Further, the two adjacent first support portions are symmetrically arranged with the central axis of the second support portion as the axis of symmetry.

[0013] Further, the base is an integrally formed member.

[0014] Further, the first insertion holes and the second insertion holes are one-to-one corresponding.

[0015] Further, the central region is provided with a through hole, and the axis of the through hole coincides with the axis of the central region.

[0016] Further, the locking member comprises an elastic clamping portion forming a semi-closed structure, and a first connecting portion and a second connecting portion extending from both ends of the elastic clamping portion, and when the elastic clamping portion extends into the first insertion hole, the first connecting portion and the second connecting portion are arranged outside the first insertion hole.

[0017] Further, at least one of the first connecting portion and the second connecting portion is arranged in a curved manner relative to the elastic clamping portion.

[0018] The utility model also provides a thickness measurement system, including above described thickness measurement frock.

[0019] Further, the thickness measurement system further comprises a ceramic disc, the base is separably arranged on the ceramic disc, and a containing cavity is formed between the base and the ceramic disc.

[0020] Compared with the prior art, the utility model has the beneficial effects that: the first support portions are arranged outwardly with the central region as the center, and extend along the radial direction of the wafer; meanwhile, the locking members are inserted into the corresponding first insertion holes through the first insertion holes arranged thereon, on the one hand, the base can be fixed in a multi-point form, and on the other hand, the frock can be fixed above different wafers; in addition, the micrometer is selectively inserted into any one of the second insertion holes to measure the same position or multiple positions, and the position of the base remains unchanged during the measurement process, so that different points can be measured at one time, and the measurement points and the measurement shape can be switched at will, which not only improves the measurement efficiency, but also improves the measurement accuracy, and is suitable for the measurement requirement of wafers of different shapes. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1The utility model discloses a structure schematic drawing of thickness measurement tool in one embodiment of the utility model.

[0022] Figure 2 The utility model discloses a part explosion schematic drawing of thickness measurement tool in one embodiment of the utility model.

[0023] Figure 3 The utility model discloses a part structure schematic drawing of thickness measurement system in one embodiment of the utility model.

[0024] Explanation of reference numerals:

[0025] 1, base; 101, first support part; 102, second support part; 2, first jack; 3, second jack; 4, locking piece; 401, elastic clamping part; 402, first connecting part; 403, second connecting part; 5, micrometer; 6, ceramic disc; 7, wafer.

[0026] The utility model discloses the realization, functional characteristics and advantages will be further explained with reference to the embodiment. Specific implementation

[0027] In order to make the utility model's purpose, technical scheme and beneficial effect more clear and distinct, the technical scheme in the utility model is further explained below with reference to the drawings and examples. It should be understood that the specific examples described here are only used to explain the utility model, and are not used to limit the utility model.

[0028] In the utility model embodiment, as shown in Figure 1 , Figure 2 The utility model discloses a structure schematic drawing of thickness measurement tool in one embodiment of the utility model. The thickness measurement tool includes base 1, first jack 2, second jack 3 and locking piece 4. The base 1 includes multiple first support parts 101 and at least one second support part 102. One end of each first support part 101 converges into a center area. The other end of each first support part 101 is arranged along the circumference of the center area. The second support part 102 is arranged between any two adjacent first support parts 101. Multiple layers of first jacks 2 are arranged in intervals from inside to outside. The number of first jacks 2 in each layer is multiple. Multiple first jacks 2 are arranged in one-to-one correspondence with multiple first support parts 101 along the circumference of the center area. Multiple second jacks 3 are arranged in intervals in the second support part 102 for inserting micrometers 5. Multiple locking pieces 4 can be selectively inserted into any layer of first jacks 2. The locking piece 4 has elasticity and can deform when subjected to force to be connected with the first support part 101 in a detachable manner.

[0029] Specifically, in the embodiment of the utility model, base 1 is made of three first support parts 101 and a second support part 102, the three first support parts 101 are connected to form a Y-shaped structure, and the second support part 102 is arranged at the opening of the Y-shaped structure and located in the extension direction of the vertical end thereof; in this way, a central area can be formed at the connection between the first support part 101 and the second support part 102, and the support parts spread outward from the central area, so that each support part is located in a different direction. Of course, in other embodiments, the number of support parts can be other, which is not limited herein.

[0030] In order to adapt the above-mentioned base 1 to wafers (wafers) of different sizes and shapes, a plurality of first jacks 2 are arranged on the base 1 in a spaced manner from inside to outside, each layer of first jacks 2 includes a plurality of first jacks 2, that is, a plurality of first jacks 2 are arranged at each first support part 101 in a spaced manner from one end of the first support part 101 to the other end thereof (as shown in Figure 1 、 Figure 2 , this embodiment takes three layers, each layer including three first jacks 2 as an example); in addition, the locking member 4 can be selectively inserted into any layer of first jacks 2, and the insertion position depends on the size of the wafer; in this way, the locking member 4 is inserted into the corresponding first jack 2, so as to arbitrarily switch the measurement point and the measurement shape. Furthermore, the above-mentioned locking member 4 is elastic, so that it can be deformed under external force, and the deformed locking member 4 can be separated from the first jack 2 by continuing to pull, and the deformed locking member 4 has a restoring deformation trend, so that the locking member 4 is clamped into the first jack 2 after the external force disappears, realizing the separable connection of the locking member 4 and the first support part 101, making the disassembly and assembly faster, and enabling the base 1 to remain at the same position during measurement.

[0031] In the embodiment of the utility model, a plurality of second jacks 3 are arranged in a spaced manner on the second support part 102, for inserting the micrometer 5, so as to realize the purpose of multi-point measurement by using the same base 1, without moving the base 1 to measure different points at one time, preventing cumulative error caused by movement, thereby improving the measurement accuracy. Of course, the first jacks 2 left empty can also be used as the installation position of the micrometer 5, so as to expand the measurement points of the micrometer 5.

[0032] The first jacks 2 arranged at multiple points in the embodiment, and the separable connection of the locking member 4 and the corresponding first jack 2 realize the purpose that the tooling can arbitrarily switch the measurement point and the measurement shape; at the same time, the second jacks 3 arranged at multiple points facilitate the insertion of the micrometer 5 to measure different points, avoiding the base 1 at different positions when measuring different points, thereby affecting the measurement accuracy, and the entire measurement process only disassembles and assembles the tooling once, improving the measurement efficiency.

[0033] As shown in Figure 1 ,Figure 2 As shown, in an embodiment, the plurality of first support portions 101 are equidistantly spaced. The equidistantly spaced first support portions 101 can ensure that the support points on the base 1 are evenly distributed, thereby providing more stable support during the measurement process. Moreover, such consistent spacing facilitates easier discovery and correction of any bias during data analysis, improving the reliability and comparability of the data. In addition, regardless of the size of the diameter of the wafer, the locking member 4 can be fixed by selecting a suitable first receptacle 2, ensuring accurate positioning of the measurement points; so that the operator can more easily select and position the measurement points, reducing the complexity of the operation and the possibility of errors.

[0034] Preferably, the two adjacent first support portions 101 are symmetrically arranged with the central axis of the second support portion 102 as the axis of symmetry. That is, the second support portion 102 is located at the axis of symmetry of the two adjacent first support portions 101, which can ensure that the stress on the base 1 is evenly distributed in all directions, improving the overall stability and balance. Not only does this improve the stability of the base 1 and the accuracy of the measurement, but it also simplifies the operation process, improves the measurement efficiency and the reliability of the data, and is suitable for the measurement needs of various wafers.

[0035] The base 1 is a one-piece molded part. The one-piece molded base 1 has no spliced or welded interfaces, and the overall structure is more robust and less prone to deformation. This helps to improve the stability and reliability of the base 1 during the measurement process, reducing measurement errors caused by loose or deformed structures. During the manufacturing process, the size and shape can be more accurately controlled, ensuring that the positions and spacings of the various support portions and receptacles are more accurate. Compared to a split design, the one-piece molded base 1 does not require additional assembly steps, avoiding errors caused by improper assembly; this not only simplifies the production process, but also improves the quality control level of the product.

[0036] In an embodiment, the plurality of first receptacles 2 and the plurality of second receptacles 3 are one-to-one corresponding.

[0037] In an embodiment, the central region is provided with a through hole, and the axis of the through hole coincides with the axis of the central region. The through hole can serve as the basis for processing each receptacle, with its axis spreading outward for processing; in addition, the through hole can also be inserted into the dial gauge 5 for measuring the wafer.

[0038] As Figure 2As shown, in one embodiment, the locking member 4 includes an elastic clamping portion 401 forming a semi-closed structure, and a first connecting portion 402 and a second connecting portion 403 extending from both ends of the elastic clamping portion 401. When the elastic clamping portion 401 is inserted into the first insertion hole 2, the first connecting portion 402 and the second connecting portion 403 are positioned outside the first insertion hole 2. Specifically, to make the locking member 4 elastic, this embodiment provides an elastic clamping portion 401, which is U-shaped, with the first connecting portion 402 and the second connecting portion 403 extending from its opening ends respectively. Pinching the two connecting portions inward will deform the elastic clamping portion 401, and pulling the locking member 4 will disengage it from the insertion hole. Similarly, after pinching the two connecting portions, inserting the elastic clamping portion 401 into the insertion hole and then releasing the two connecting portions will allow the elastic clamping portion 401 to suspend inside the insertion hole, making installation and removal simpler and faster than with screws. In addition, the locking component 4 can be suspended at any height in the socket to prevent the locking component 4 from being lost after the tooling is disassembled.

[0039] Preferably, at least one of the first connecting portion 402 and the second connecting portion 403 is bent relative to the elastic clamping portion 401. In this embodiment, the first connecting portion 402 is bent downwards, which not only facilitates the deformation of the elastic clamping portion 401, but also serves as a gripping point.

[0040] like Figure 3 As shown, this embodiment also provides a thickness measurement system, including a ceramic disk and the thickness measurement fixture described above. The base is detachably disposed on the ceramic disk 6, and a receiving cavity is formed between the two for accommodating the wafer 7. The specific structure of the thickness measurement fixture is the same as described in the above embodiment. Since this thickness measurement system adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A gauge for measuring thickness, characterized by, The application relates to a thickness measuring system, comprising: a base, comprising a plurality of first supporting parts and at least one second supporting part, one end of each of the first supporting parts converging into a central area, the other end of each of the first supporting parts being arranged at intervals along the circumference of the central area, and the second supporting part being arranged between any two adjacent first supporting parts; a plurality of first insertion holes arranged at intervals from inside to outside, the number of first insertion holes in each layer being multiple, and the first insertion holes corresponding to the first supporting parts being arranged one by one along the circumference of the central area; a plurality of second insertion holes arranged at intervals in the second supporting part, used for inserting a micrometer; and a plurality of locking members, which can be selectively inserted into any layer of the first insertion holes, the locking members being elastic and used for being deformed when the locking members are stressed to be connected with the first supporting parts in a separable mode.

2. The thickness measuring tool of claim 1, wherein, The first supporting parts are arranged at equal intervals.

3. The thickness measuring tool of claim 2, wherein, The two adjacent first supporting parts are symmetrically arranged with the central axis of the second supporting part as the axis of symmetry.

4. The thickness measuring tool of claim 1 wherein, The base is an integral forming part.

5. The thickness measuring tool of claim 1 wherein, The first insertion holes and the second insertion holes are arranged one by one.

6. The thickness measuring tool of claim 1 wherein, The central area is provided with a through hole, and the axis of the through hole coincides with the axis of the central area.

7. The thickness measuring tool of any one of claims 1-6, wherein, The locking member comprises an elastic clamping part forming a semi-closed structure, and a first connecting part and a second connecting part extending from both ends of the elastic clamping part, when the elastic clamping part is inserted into the first insertion hole, the first connecting part and the second connecting part are arranged outside the first insertion hole.

8. The thickness measuring tool of claim 7 wherein, At least one of the first connecting part and the second connecting part is arranged in a bent mode relative to the elastic clamping part.

9. A thickness measurement system characterized by, The application further relates to a thickness measuring tool comprising the thickness measuring system as claimed in any one of claims 1-8.

10. The thickness measurement system of claim 9, wherein, The thickness measuring system further comprises a ceramic disc, the base is arranged in a separable mode in the ceramic disc, and a containing cavity is formed between the base and the ceramic disc.

Images