Jig for protecting copper wire oxidation in semiconductor packaging

Abstract

The utility model provides a jig for protecting copper wire oxidation in semiconductor packaging, which comprises a pressing plate, a protruding part is fixedly connected to the middle of the bottom of the pressing plate, inclined plate parts inclining upwards are welded to the two ends of the pressing plate, and lug plate parts are installed at the ends, away from the pressing plate, of the inclined plate parts. Air inlet holes are formed in the faces, away from the inclined plate parts, of the lug plate parts, communicating holes communicating with the air inlet holes are formed in the inclined plate parts, first semicircular grooves are formed in the two side faces, close to the inclined plate parts, of the pressing plate correspondingly, and second semicircular grooves are formed in the faces, close to the pressing plate, of the two inclined plate parts correspondingly; the second semi-circular groove and the first semi-circular groove form a circular cavity, the inner surface of the first semi-circular groove is uniformly provided with a plurality of gas transmission holes, and the inner bottom of each gas transmission hole is uniformly provided with a plurality of exhaust holes. The copper wire utilization rate is effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of jigs for protecting copper wire oxidation of semiconductor packaging, belong to the field of semiconductor packaging. BACKGROUND

[0002] In addition to the design and manufacture of semiconductor, semiconductor packaging also bears indispensable responsibility, and plays an important role in the industry. And the pressure welding process is the core process of traditional packaging process, and becomes an important link that cannot be bypassed for semiconductor packaging. However, with the development of semiconductor upstream design, chip I / O interface has developed from a few or a dozen ten years ago to hundreds today. The packaging form is also more and more diversified. In order to meet the functional requirements of products, the pressure welding wire is also increasing. As we all know, in the pressure welding process, high-temperature copper welding efficiency is very high, but the oxidation problem that comes with it cannot be avoided. The more complex the process is, the longer the product stays on the heating track, and the higher the risk of oxidation. This phenomenon has become a hard problem that is difficult to solve in the pressure welding process. SUMMARY

[0003] In view of the deficiencies in the prior art, the utility model aims to provide a kind of jigs for protecting copper wire oxidation of semiconductor packaging to solve the problems raised in the above background art. The utility model greatly reduces the oxidation degree of copper coin caused by high temperature of equipment in pressure welding process, saves production cost, and effectively improves the utilization rate of copper wire.

[0004] In order to achieve the above-mentioned purpose, the utility model is implemented by the following technical scheme: a kind of jigs for protecting copper wire oxidation of semiconductor packaging, including pressing plate, the middle position of the upper surface of the pressing plate is recessed to form a soldering wire groove, the middle position of the bottom of the pressing plate is connected and fixed with the protruding part, the both ends of the pressing plate are welded with the inclined plate part that is inclined upward, the end of the inclined plate part away from the pressing plate is installed with the ear plate part, the side of the ear plate part away from the inclined plate part is provided with air inlet hole, the inclined plate part is provided with communication hole that is communicated with air inlet hole, the both sides of the pressing plate close to the inclined plate part are both provided with first semicircular groove, the first semicircular groove is arranged along the width direction of the pressing plate, the side of the both inclined plate parts close to the pressing plate is both provided with second semicircular groove, the second semicircular groove is communicated with communication hole, the second semicircular groove and first semicircular groove form circular cavity, the inner surface of the first semicircular groove is uniformly provided with a plurality of gas delivery holes, the gas delivery hole is arranged between soldering wire groove and first semicircular groove, the inner bottom of the gas delivery hole is uniformly provided with a plurality of exhaust holes.

[0005] Further, the inner bottom of the soldering wire groove is uniformly provided with a plurality of rectangular openings, and the plurality of rectangular openings are arranged along the length direction of the soldering wire groove.

[0006] Further, the convex part and the pressing plate are integrally formed, and the convex part is arranged along the length direction of the welding wire groove.

[0007] Further, a fixing hole is formed on the upper surface of the ear plate part, and the fixing hole is arranged on the side of the upper surface of the ear plate part close to the air inlet hole.

[0008] Further, the ear plate part and the inclined plate part are integrally formed, and the ear plate part is arranged in a horizontal shape.

[0009] Further, a first round corner is processed at the upper edge of the welding wire groove, and a second round corner is processed at the bottom edge of the welding wire groove.

[0010] The utility model discloses beneficial effects:

[0011] 1, the pressing plate is installed to the pressure welding platform, and the nitrogen hydrogen mixed gas is continuously introduced in the air inlet hole, and in the operation process, the nitrogen hydrogen mixed gas that continuously introduces is protected after being discharged through the exhaust hole, and the oxidation degree of copper coin is greatly reduced due to the high temperature of equipment, production cost is saved, and copper wire utilization is effectively improved.

[0012] 2, the first semicircular groove is processed on the pressing plate, and the second semicircular groove is processed on the inclined plate part, then the pressing plate and the inclined plate part are connected by welding, so that the air inlet hole, the first semicircular groove on the pressing plate, the communication hole, the second semicircular groove on the inclined plate part and the air inlet hole on the ear plate part are conveniently processed separately. BRIEF DESCRIPTION OF DRAWINGS

[0013] Other features, objects and advantages of the utility model will become more apparent through reading the following detailed description of non-restrictive embodiments with reference to the accompanying drawings:

[0014] Figure 1 It is the structure schematic drawing of the utility model kind semiconductor package protection copper line oxidation's fixture;

[0015] Figure 2 It is another perspective view of the utility model kind semiconductor package protection copper line oxidation's fixture;

[0016] Figure 3 It is the sectional view of the utility model kind semiconductor package protection copper line oxidation's fixture;

[0017] Figure 4 It is the assembly schematic drawing of the convex part and the pressing plate in the utility model kind semiconductor package protection copper line oxidation's fixture;

[0018] Figure 5 It is the assembly schematic drawing of the ear plate part and the inclined plate part in the utility model kind semiconductor package protection copper line oxidation's fixture;

[0019] In the figure: 1-pressing plate, 2-welding line groove, 3-ear plate part, 4-air inlet hole, 5-fixing hole, 6-inclined plate part, 7-protruding part, 8-air outlet hole, 9-communication hole, 10-first semicircular groove, 11-air conveying hole, 12-second semicircular groove. DETAILED DESCRIPTION

[0020] In order to make the technical means, creative features, purposes and effects of the utility model easy to understand, the utility model is further described below in combination with specific embodiments.

[0021] Please refer to Figures 1-4 The utility model provides a technical scheme: a jig for protecting copper wire oxidation of semiconductor packaging, which comprises a pressing plate 1, a welding line groove 2 is formed by recessing the middle position of the upper surface of the pressing plate 1 downwards, a first fillet is processed at the upper edge in the welding line groove 2, a second fillet is processed at the bottom edge in the welding line groove 2, a plurality of rectangular openings are evenly arranged in the bottom of the welding line groove 2, the plurality of rectangular openings are arranged along the length direction of the welding line groove 2, a protruding part 7 is connected and fixed to the middle position of the bottom of the pressing plate 1, the protruding part 7 is integrally formed with the pressing plate 1, the protruding part 7 is arranged along the length direction of the welding line groove 2, and under the support of the protruding part 7, there is a space between the bottom of the pressing plate 1 and the support carrier, so that the nitrogen-hydrogen mixed gas discharged from the air outlet hole 8 can diffuse to the surroundings of the pressing plate 1.

[0022] Please refer to Figures 1-5The both ends of the pressing plate 1 are welded with the upwardly inclined inclined plate part 6, the ear plate part 3 is installed at the end of the inclined plate part 6 away from the pressing plate 1, the ear plate part 3 is integrally formed with the inclined plate part 6, the ear plate part 3 is arranged in a horizontal state, the fixing hole 5 is arranged on the upper surface of the ear plate part 3 close to the air inlet hole 4, the air inlet hole 4 is arranged on the surface of the ear plate part 3 away from the inclined plate part 6, the communication hole 9 is arranged in the inclined plate part 6 and communicated with the air inlet hole 4, the first semicircular groove 10 is arranged on the two sides of the pressing plate 1 close to the inclined plate part 6, the first semicircular groove 10 is arranged along the width direction of the pressing plate 1, the second semicircular groove 12 is arranged on the surface of the two inclined plate parts 6 close to the pressing plate 1, the second semicircular groove 12 is communicated with the communication hole 9, the second semicircular groove 12 forms a circular cavity with the first semicircular groove 10, the gas inlet hole 11 is uniformly arranged on the inner surface of the first semicircular groove 10, the gas inlet hole 11 is arranged between the welding groove 2 and the first semicircular groove 10, the exhaust hole 8 is uniformly arranged on the inner bottom of the gas inlet hole 11, the first semicircular groove 10 is machined on the pressing plate 1, the second semicircular groove 12 is machined on the inclined plate part 6, then the pressing plate 1 and the inclined plate part 6 are connected by welding, so that the gas inlet hole 11 and the first semicircular groove 10 on the pressing plate 1, the communication hole 9 and the second semicircular groove 12 on the inclined plate part 6 and the air inlet hole 4 on the ear plate part 3 can be machined separately, after the pressing plate 1 is installed on the pressing and welding platform, the nitrogen-hydrogen mixed gas is continuously input into the air inlet hole 4, during the operation process, the nitrogen-hydrogen mixed gas continuously input is protected after being discharged through the exhaust hole 8, so that the oxidation degree of the copper coin caused by the high temperature of the equipment is greatly reduced, the production cost is saved, and the utilization rate of the copper wire is effectively improved.

[0023] Although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that those skilled in the art can understand.

Claims

1. A jig for protecting copper lines from oxidation in a semiconductor package, comprising a press plate (1), characterized in that: The upper surface of the pressing plate (1) is concave in the middle position to form a welding groove (2), the bottom of the pressing plate (1) is connected and fixed with a protruding part (7) in the middle position, the both ends of the pressing plate (1) are welded with an upward inclined inclined plate part (6), the end of the inclined plate part (6) away from the pressing plate (1) is installed with an ear plate part (3), the side of the ear plate part (3) away from the inclined plate part (6) is provided with an air inlet hole (4), the inclined plate part (6) is provided with a communication hole (9) communicated with the air inlet hole (4), the both sides of the pressing plate (1) close to the inclined plate part (6) are provided with a first semicircular groove (10), the first semicircular groove (10) is arranged along the width direction of the pressing plate (1), the side of the both inclined plate parts (6) close to the pressing plate (1) is provided with a second semicircular groove (12), the second semicircular groove (12) is communicated with the communication hole (9), the second semicircular groove (12) and the first semicircular groove (10) form a circular cavity, the inner surface of the first semicircular groove (10) is uniformly provided with a plurality of air supply holes (11), the air supply holes (11) are arranged between the welding groove (2) and the first semicircular groove (10), the inner bottom of the air supply hole (11) is uniformly provided with a plurality of air exhaust holes (8).

2. The apparatus for protecting copper lines from oxidation in a semiconductor package of claim 1, wherein: The inner bottom of the welding groove (2) is uniformly provided with a plurality of rectangular openings, and the plurality of rectangular openings are arranged along the length direction of the welding groove (2).

3. The fixture for protecting copper wire oxidation in semiconductor packaging according to claim 1, characterized in that: The protruding part (7) and the pressing plate (1) are an integral molding structure, and the protruding part (7) is arranged along the length direction of the welding groove (2).

4. The apparatus of claim 1, wherein: the apparatus further comprises a plurality of copper pads on the substrate; and the plurality of copper pads are configured to be electrically connected to the plurality of copper lines. The upper surface of the ear plate part (3) is provided with a fixing hole (5), and the fixing hole (5) is arranged on the upper surface of the ear plate part (3) close to the air inlet hole (4).

5. The fixture for protecting copper wire oxidation in semiconductor packaging according to claim 1, characterized in that: The ear plate part (3) and the inclined plate part (6) are an integral molding structure, and the ear plate part (3) is arranged in a horizontal state.

6. The apparatus of claim 1, wherein: the apparatus is a semiconductor package protection copper line oxidation fixture. The welding groove (2) is processed with a first round corner at the upper edge, and a second round corner is processed at the bottom edge of the welding groove (2).

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