Wafer brushing device

Abstract

The utility model provides a wafer brushing device, which comprises a base, a rotating shaft mechanism arranged on the base, a driving mechanism for driving the rotating shaft mechanism to drive a brush head to rotate, and a balance mechanism, the rotating shaft mechanism comprises a rotating shaft and an elastic unit, the end, extending out of the base in the axial direction, of the rotating shaft is provided with a brush head, and the elastic unit is arranged on the outer side of the rotating shaft in a sleeving mode and stretches out and draws back along with movement of the brush head in the vertical direction. The balance mechanism comprises a vertical limiting piece which is nested in the elastic unit to limit the telescopic range of the elastic unit, and a limiting bearing set which sleeves the outer side of the rotating shaft and is close to the brush head, and the limiting bearing set abuts against the base in the circumferential direction to limit horizontal deflection of the rotating shaft. According to the wafer brushing device disclosed by the invention, the unstable phenomena that the brush head swings and shakes in the horizontal direction, jumps and vibrates in the vertical direction and the like are inhibited.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field especially relates to a wafer brush piece device. BACKGROUND

[0002] In the wafer cleaning process, the brush piece type wafer cleaning machine in the prior art sprays the chemical liquid on the wafer surface through the chemical liquid spray head of the wafer cleaning equipment, and then adopts the brush head to brush and wash the wafer.

[0003] Because the wafer specifications are inconsistent, the wafer warping rates are also inconsistent, and the wafer may exist positive warping and negative warping. In the process of cleaning the wafer surface by the brush head in the wafer cleaning machine, when the brush head moves to the position of the positive warping of the wafer, the cleaning force generated by the air film or water film formed between the brush head and the wafer will have the effect of lifting the brush head upward, so that the brush head and the driving shaft will be gradually moved upward under the influence of the force, and when the brush head moves to the position of the negative warping of the wafer, the bottom surface of the brush head will be away from the negative warping surface of the wafer.

[0004] However, the brush piece type wafer cleaning machine in the prior art usually adopts the counterweight or the air cylinder to realize the control of the distance between the bottom surface of the brush head and the wafer surface, so as to keep the distance between the bottom surface of the brush head and the wafer surface constant, but this will cause the upper half (the end away from the wafer surface) of the brush head assembly to be heavy, and the weight of the brush head end to be small. In the process of rotating the brush to clean the wafer surface, the brush head may swing, shake and other unstable phenomena in the horizontal direction, and jump, vibrate and other unstable phenomena in the vertical direction due to the centrifugal force or the warping change of the wafer surface, so as to cause the wafer cleaning to be incomplete or the wafer to be damaged.

[0005] It should be noted that the above introduction to the background art is only for the convenience of clearly and completely describing the technical scheme of the present application, and for the convenience of understanding by those skilled in the art. The above technical scheme cannot be considered as known to those skilled in the art only because it is described in the background art part of the present application. CONTENT OF THE UTILITY MODEL

[0006] The utility model discloses a wafer brush piece device for solving the many defects existing in the brush piece type wafer cleaning machine in the prior art, especially for realizing the suppression of the swing, shake and other unstable phenomena of the brush head in the horizontal direction, and the jump, vibration and other unstable phenomena of the brush head in the vertical direction.

[0007] To achieve the above object, the utility model provides a wafer brush piece device, which comprises a base, a rotating shaft mechanism arranged on the base, a driving mechanism for driving the rotating shaft mechanism to rotate the brush head, and a balancing mechanism.

[0008] The rotating shaft mechanism comprises a rotating shaft, which extends from one end of the base in the axial direction and is configured with the brush head, and an elastic unit, which is sleeved outside the rotating shaft and is stretched and contracted along with the vertical movement of the brush head.

[0009] The balancing mechanism comprises a vertical limiting part, which is nested inside the elastic unit to limit the stretching and contracting range of the elastic unit, and a limiting bearing group, which is sleeved outside the rotating shaft and is close to the brush head, and the limiting bearing group is circumferentially abutted on the base to limit the horizontal deflection of the rotating shaft.

[0010] As a further improvement of the utility model, the outer diameter of the vertical limiting part matches the inner diameter of the buffer spring contained in the elastic unit.

[0011] As a further improvement of the utility model, the vertical limiting part is configured as a supporting bearing, which is constructed with a transmission part, which is axially sleeved outside the rotating shaft, and a limiting part, which is formed outside the transmission part and is nested inside the elastic unit, the transmission part is relatively rotated with the limiting part, and the outer diameter of the limiting part matches the inner diameter of the buffer spring.

[0012] As a further improvement of the utility model, the elastic unit comprises a mounting seat, which is sleeved outside the transmission part, the buffer spring is fixed at one end of the mounting seat in the axial direction, and a mounting cover is configured at the end of the buffer spring away from the mounting seat.

[0013] The rotating shaft axially penetrates the mounting cover, and the rotating shaft is configured with a limiting block, which is abutted on the mounting cover in the axial direction.

[0014] As a further improvement of the utility model, the rotating shaft mechanism further comprises a transmission cylinder, which is coaxially configured between the rotating shaft and the limiting bearing group, a driven wheel, which is sleeved outside the transmission part and is connected with the transmission cylinder, a transmission ring, which is coaxially configured between the transmission cylinder and the rotating shaft, and a positioning block, which is configured on the transmission cylinder and is abutted on the limiting bearing group and the transmission ring in the axial direction.

[0015] As a further improvement of the utility model, the limiting bearing group comprises at least two rotating bearings.

[0016] As a further improvement of the utility model, the driving mechanism comprises a driving motor, which is configured on the base, a driving wheel, which is configured on the driving end of the driving motor, and a transmission belt, which is connected between the driving wheel and the driven wheel.

[0017] As a further improvement of the utility model, the wafer brushing device further comprises: a support arranged on the base and formed on the outside of the rotating shaft mechanism, a guide column arranged vertically on the support, and a guide plate movably connected to the guide column and arranged on the rotating shaft.

[0018] The top end of the rotating shaft is rotationally connected with the guide plate in the axial direction.

[0019] As a further improvement of the utility model, the wafer brushing device further comprises: an air bearing arranged on the support, and a top cover arranged vertically corresponding to the central axis of the air bearing on the guide plate.

[0020] As a further improvement of the utility model, the wafer brushing device further comprises: a gravity sensor for monitoring the downward pressure of the brush head on the wafer surface.

[0021] Compared with the prior art, the utility model has the beneficial effects that:

[0022] The vertical limiting piece limits the stretching and compression range of the elastic unit, so as to limit the vertical movement range of the brush head, thereby inhibiting the unstable phenomena such as jumping and vibration of the brush head in the vertical direction; the limiting bearing set provides circumferential support for the rotating shaft, so as to limit the deflection of the rotating shaft in the horizontal direction, and prevent the brush head from swinging and shaking in the horizontal direction due to centrifugal force; and the brush head always maintains appropriate contact pressure with the wafer surface during the cleaning process, so that the distance between the brush head and the wafer surface is stable, and the incomplete brushing or wafer damage is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 The utility model discloses a wafer brushing device's whole schematic view is disclosed.

[0024] Figure 2 The utility model discloses a schematic view of the connection of the rotating shaft mechanism and the driving mechanism.

[0025] Figure 3 The utility model discloses a sectional view of the connection of the rotating shaft mechanism and the base. DETAILED DESCRIPTION

[0026] The utility model will be explained in detail in combination with each embodiment shown in the drawings, and it should be explained that these embodiments are not the limitation of the utility model, and the equivalent transformation or replacement of function, method or structure made by the ordinary skill in the art according to these embodiments all belong to the protection scope of the utility model.

[0027] It should be noted that the positive warping and negative warping mentioned in this embodiment are both defined based on the wafer being face up. Moreover, the positive warping and negative warping are defined by the relative position of the edge of the wafer and the horizontal plane where the center of the circle is located. Positive warping refers to the edge of the wafer being above the plane where the center of the circle is located, forming a concave deformation; negative warping refers to the edge of the wafer being below the plane where the center of the circle is located, forming a convex deformation. The planar part of the wafer refers to the part located on the plane where the center of the wafer circle is located.

[0028] Please refer Figures 1 to 3 to a specific embodiment of a wafer brushing device 100 disclosed.

[0029] Refer Figures 1 to 3 As shown, in this embodiment, the wafer brushing device 100 includes: a base 10, a rotating shaft mechanism 20 disposed on the base 10, a driving mechanism 30 for driving the rotating shaft mechanism 20 to drive the brush head 50 to rotate, and a balancing mechanism 40; the driving mechanism 30 drives the rotating shaft mechanism 20 to drive the brush head 50 to rotate, so as to uniformly brush the surface of the wafer and remove the contaminants on the surface of the wafer. The rotating shaft mechanism 20 includes: a rotating shaft 21, one end of the rotating shaft 21 extending out of the base 10 along the axial direction ( Figure 3 as shown by the axis Q of the rotating shaft 21 in the figure) is configured with the brush head 50, and an elastic unit 22 sleeved outside the rotating shaft 21 and telescoping as the brush head 50 moves in the vertical direction; the balancing mechanism 40 includes: a vertical limiting member 41 nested inside the elastic unit 22 to limit the telescoping range of the elastic unit 22, and a limiting bearing group 42 sleeved outside the rotating shaft 21 and close to the brush head 50, and the limiting bearing group 42 circumferentially abuts against the base 10 to limit the horizontal deflection of the rotating shaft 21.

[0030] It should be noted that due to the inconsistent wafer specifications and the inconsistent wafer warpage rates, the wafer may have positive warping and negative warping. Therefore, before the brush head 50 cleans the wafer, it is necessary to adjust the distance between the bottom surface of the brush head 50 and the surface of the wafer, so that the bottom surface of the brush head 50 and the surface of the wafer maintain the closest distance, so that during the process of the brush head 50 moving from the planar part of the wafer to the warped part or from the warped part to the planar part, there can always be a gap with a constant distance between the bottom surface of the brush head 50 and the surface of the wafer, so as to form an air film or water film for cleaning the wafer between the brush head 50 and the wafer. Since the debugging process of having a gap with a constant distance between the bottom surface of the brush head 50 and the surface of the wafer is a prior art, it will not be elaborated in this application.

[0031] The wafer brush device 100 disclosed in the present application drives the rotating shaft 21 to rotate the brush head 50 by the driving mechanism 30 during the cleaning process of the wafer surface. When the brush head 50 moves from the wafer flat part to the wafer positive warping part or from the wafer negative warping part to the wafer flat part, the air film or water film formed between the brush head 50 and the wafer will generate a cleaning force on the brush head 50 to push the brush head 50 upward, and the brush head 50 drives the rotating shaft 21 to move upward along the axial direction, and at the same time, the elastic unit 22 is stretched to release its accumulated elastic potential energy, forming an elastic force to assist the upward movement of the rotating shaft 21. When the brush head 50 moves from the wafer flat part to the wafer negative warping part or from the wafer positive warping part to the wafer flat part, the rotating shaft 21 moves downward along the axial direction, synchronously driving the brush head 50 to move downward, and compressing the elastic unit 22.

[0032] The vertical limiting part 41 is nested inside the elastic unit 22 to limit the stretching and compression range of the elastic unit 22. When the brush head 50 moves upward, the vertical limiting part 41 limits the stretching range of the elastic unit 22 to prevent the elastic unit 22 from overstretching and avoid the brush head 50 from lifting too high. When the brush head 50 moves downward, the vertical limiting part 41 limits the compression range of the elastic unit 22 to avoid the brush head 50 from pressing too much. During the movement of the brush head 50 from the wafer flat part to the wafer warping part or from the wafer warping part to the wafer flat part, the vertical limiting part 41 limits the stretching and compression range of the elastic unit 22 to limit the vertical movement range of the brush head 50, thereby suppressing the unstable phenomena such as jumping and vibration of the brush head 50 in the vertical direction, ensuring that the brush head 50 always maintains appropriate contact pressure with the wafer surface during the cleaning process, stabilizing the distance between the brush head 50 and the wafer surface, and avoiding incomplete cleaning or wafer damage caused by the jumping of the brush head 50 in the vertical direction.

[0033] The limiting bearing set 42 provides circumferential support for the rotating shaft 21 to limit the deflection of the rotating shaft 21 in the horizontal direction, prevent the brush head 50 from swinging, shaking and other unstable phenomena in the horizontal direction due to centrifugal force, and ensure that the brush head 50 is centered with the axis Q of the rotating shaft 21 during rotation, so that the brush head 50 remains axial rotation during rotation. Moreover, during the movement of the brush head 50 from the wafer flat part to the wafer warping part or from the wafer warping part to the wafer flat part, the limiting bearing set 42 suppresses the swinging, shaking and other unstable phenomena of the brush head 50 in the horizontal direction due to force changes through its rigid support, ensuring that the contact pressure between the brush head 50 and the wafer surface is always uniform, and avoiding incomplete cleaning or wafer damage caused by the swinging of the brush head 50 in the horizontal direction.

[0034] In some examples, the brush head 50 is a cylindrical brush head, and the rotating shaft 21 is a cylindrical rotating shaft. Figure 3As shown, the outer diameter of the vertical limiting member 41 matches the inner diameter of the buffer spring 221 included in the elastic unit 22. The matching of the outer diameter of the vertical limiting member 41 with the inner diameter of the buffer spring 221 ensures that the vertical limiting member 41 can be tightly nested inside the buffer spring 221. When the buffer spring 221 is compressed under pressure, the vertical limiting member 41 abuts against the inner wall of the buffer spring 221, preventing further compression; when the buffer spring 221 is stretched under tension, the vertical limiting member 41 abuts against the inner wall of the buffer spring 221, preventing further stretching. Thus, the vertical limiting member 41 can limit the stretching and compression range of the buffer spring 221, thereby suppressing unstable phenomena such as jumping and vibration of the brush head 50 in the vertical direction.

[0035] In some examples, the parameter Figure 3 As shown, the vertical limiting member 41 is configured as a support bearing. The support bearing is constructed with a transmission part 411 axially sleeved on the outside of the rotating shaft 21, and a limiting part 412 formed on the outside of the transmission part 411 and nested inside the elastic unit 22. The transmission part 411 and the limiting part 412 rotate relative to each other, and the outer diameter of the limiting part 412 matches the inner diameter of the buffer spring 221. The transmission part 411 cooperates with the rotating shaft 21 to transmit the power of the drive mechanism 30 to the rotating shaft 21, driving the brush head 50 to rotate. The limiting part 412 remains stationary, while the transmission part 411 rotates with the rotating shaft 21 to adapt to the dynamic changes of the brush head 50 during the cleaning process (such as vertical lifting and pressing). The limiting part 412, by matching its outer diameter with the inner diameter of the buffer spring 221, limits the extension and compression range of the buffer spring 221, thereby suppressing unstable phenomena such as jumping and vibration of the brush head 50 in the vertical direction.

[0036] In some examples, the parameter Figure 2 and Figure 3As shown, the elastic unit 22 comprises a mounting base 222 sleeved outside the transmission part 411, a buffer spring 221 fixed to one end of the mounting base 222 in the axial direction, and a mounting cover 223 arranged at the end of the buffer spring 221 away from the mounting base 222, the rotating shaft 21 axially penetrates the mounting cover 223, and the rotating shaft 21 is arranged with a limiting block 211 axially abutting against the mounting cover 223. In the process of moving the rotating shaft 21 downward in the axial direction, the rotating shaft 21 drives the limiting block 211 to push the mounting cover 223 to move downward synchronously, so that the mounting cover 223 drives the buffer spring 221 to be compressed, the buffer spring 221 deforms to accumulate elastic potential energy; when the cleaning effect force generated by the air film or the water film has an upward lifting effect on the brush head 50, the brush head 50 drives the rotating shaft 21 to move upward synchronously in the axial direction, so that the rotating shaft 21 synchronously drives the limiting block 211 to move upward, the buffer spring 221 is stretched to release the accumulated elastic potential energy to form an elastic force, and the elastic force is applied to the limiting block 211 to assist the rotating shaft 21 to be lifted upward, so that the rotating shaft 21 moves upward.

[0037] In some examples, the method further comprises Figure 2 The method further comprises Figure 3 As shown, the rotating shaft mechanism 20 further comprises a transmission cylinder 23 coaxially arranged between the rotating shaft 21 and the limiting bearing set 42, a driven wheel 24 sleeved outside the transmission part 411 and connected to the transmission cylinder 23, a transmission ring 25 coaxially arranged between the transmission cylinder 23 and the rotating shaft 21, and a positioning block 26 arranged on the transmission cylinder 23 and abutting against the limiting bearing set 42 and the transmission ring 25 in the axial direction. The driving mechanism 30 drives the driven wheel 24 to drive the transmission cylinder 23 to rotate synchronously, and the transmission cylinder 23 drives the rotating shaft 21 and the brush head 50 to rotate through the transmission ring 25. The rotating shaft 21 can axially slide in the transmission part 411, the transmission cylinder 23 and the transmission ring 25 to adapt to the movement of the brush head 50 in the vertical direction. The transmission part 411 guides the axial sliding of the rotating shaft 21 to ensure the smooth movement of the rotating shaft 21 in the vertical direction. The transmission cylinder 23 radially supports the rotating shaft 21 to keep the brush head 50 rotating in the axial direction during rotation. The positioning block 26 abuts against the limiting bearing set 42 and the transmission ring 25 to ensure the relative fixation of the transmission cylinder 23, the rotating shaft 21 and the limiting bearing set 42 in the axial position, preventing axial deviation during movement.

[0038] In some examples, the method further comprises Figure 1 The method further comprises Figure 2As shown, the drive mechanism 30 includes: a drive motor 31 disposed on the base 10, a drive wheel 32 disposed on the drive end of the drive motor 31, and a transmission belt 33 connecting the drive wheel 32 and the driven wheel 24. The drive motor 31 drives the drive wheel 32 to rotate, which in turn drives the driven wheel 24 to rotate via the transmission belt 33, so that the driven wheel 24 can drive the transmission cylinder 23 to rotate synchronously, thereby enabling the transmission cylinder 23 to drive the rotating shaft 21 and the brush head 50 to rotate via the positioning block 26.

[0039] In some examples, the parameter Figure 3 As shown, the limiting bearing assembly 42 includes at least two rotary bearings 421. The outer peripheral wall of the rotary bearing 421 abuts against the base 10, and the inner peripheral wall of the rotary bearing 421 abuts against the transmission cylinder 23, providing radial support for the transmission cylinder 23, limiting the horizontal deflection of the transmission cylinder 23, preventing the brush head 50 from horizontally swaying due to centrifugal force or wafer surface warping, ensuring that the brush head 50 remains aligned with the axis Q during rotation, and avoiding radial displacement of the transmission cylinder 23 due to uneven force, thereby improving the rotational accuracy of the brush head 50. Furthermore, the at least two rotary bearings 421 form a multi-point support structure, enhancing the support and limiting effect on the transmission cylinder 23, and improving the rotational stability and accuracy of the brush head 50.

[0040] In some examples, the parameter Figure 2 and Figure 3 As shown, the wafer brushing device 100 further includes: a bracket 61 disposed on the base 10 and formed outside the rotating shaft mechanism 20; a guide post 62 vertically (parallel to axis Q) disposed on the bracket 61; and a guide plate 63 movably connected to the guide post 62 and disposed on the rotating shaft 21; the top end of the rotating shaft 21 is rotatably connected to the guide plate 63 along the axial direction. During the vertical movement of the rotating shaft 21, the guide plate 63 will be synchronously driven to slide up and down along the guide post 62. The guide post 62 can provide precise guidance for the vertical movement of the rotating shaft 21, further limiting the deflection of the rotating shaft 21 in the horizontal direction and preventing the brush head 50 from swinging horizontally.

[0041] In some examples, the parameter Figure 2 and Figure 3 As shown, the wafer brush assembly 100 further includes: an air bearing 64 disposed on the support 61, and a top cover 65 disposed on the guide plate 63 and vertically corresponding to the central axis 641 of the air bearing 64. The top cover 65, by corresponding to the central axis 641 of the air bearing 64, limits the maximum vertical rise of the rotating shaft 21, preventing excessive rise of the rotating shaft 21. The air bearing 64 utilizes high-pressure gas to form an air film, which, together with the top cover 65, provides contactless support and restraint for the rotating shaft 21.

[0042] In some examples, the wafer brush piece device 100 further comprises a gravity sensor 70 for monitoring the downward pressure of the brush head 50 on the wafer surface. The gravity sensor 70 is used to monitor the downward pressure of the brush head 50 on the wafer surface in real time, ensuring that the pressure is accurately controllable, avoiding incomplete brushing or wafer damage.

[0043] The above series of detailed descriptions are only specific descriptions of the feasible embodiments of the present application, and are not intended to limit the protection scope of the present application. Any equivalent embodiments or changes made without departing from the spirit of the present application shall be included in the protection scope of the present application.

[0044] It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be realized in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0045] In addition, it should be understood that although the present application is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be properly combined to form other embodiments that those skilled in the art can understand.

Claims

1. A wafer brushing device, characterized in that, The application relates to a wafer cleaning device. The device comprises a base, a rotating shaft mechanism arranged on the base, a driving mechanism for driving the rotating shaft mechanism to rotate the brush head, and a balancing mechanism. The rotating shaft mechanism comprises a rotating shaft, which extends out of one end of the base in an axial direction and is arranged with the brush head, and an elastic unit, which is sleeved outside the rotating shaft and is stretched and contracted along with the vertical movement of the brush head. The balancing mechanism comprises a vertical limiting piece arranged in the elastic unit to limit the stretching and contracting range of the elastic unit, and a limiting bearing set sleeved outside the rotating shaft and close to the brush head, which is circumferentially abutted on the base to limit the horizontal deflection of the rotating shaft.

2. The wafer de-flashing apparatus of claim 1, wherein, The outer diameter of the vertical limiting piece matches the inner diameter of a buffer spring contained in the elastic unit.

3. The wafer de-flashing apparatus of claim 2, wherein, The vertical limiting piece is arranged as a support bearing, which is configured with a transmission part axially sleeved outside the rotating shaft, and a limiting part formed outside the transmission part and arranged in the elastic unit, the transmission part and the limiting part are opposite in rotation, and the outer diameter of the limiting part matches the inner diameter of the buffer spring.

4. The wafer de-flashing apparatus of claim 3, wherein, The elastic unit comprises a mounting seat sleeved outside the transmission part, one end of the buffer spring in the axial direction is fixed to the mounting seat, and a mounting cover is arranged at the end of the buffer spring away from the mounting seat. The rotating shaft axially penetrates the mounting cover, and the rotating shaft is arranged with a limiting block axially abutted on the mounting cover.

5. The wafer de-flashing apparatus of claim 4, wherein, The rotating shaft mechanism further comprises a transmission cylinder coaxially arranged between the rotating shaft and the limiting bearing set, a driven wheel sleeved outside the transmission part and connected to the transmission cylinder, a transmission ring coaxially arranged between the transmission cylinder and the rotating shaft, and a positioning block arranged on the transmission cylinder and axially abutted on the limiting bearing set and the transmission ring.

6. The wafer de-flashing device of claim 1, wherein, The limiting bearing set comprises at least two rotating bearings.

7. The wafer de-flashing device of claim 4, wherein, The driving mechanism comprises a driving motor arranged on the base, a driving wheel arranged on the driving end of the driving motor, and a transmission belt connected between the driving wheel and the driven wheel.

8. The wafer de-flashing device of claim 1, wherein, The wafer cleaning device further comprises a support arranged on the base and outside the rotating shaft mechanism, a guide column vertically arranged on the support, and a guide plate movably connected to the guide column and arranged on the rotating shaft. The top end of the rotating shaft in the axial direction is rotationally connected to the guide plate.

9. The wafer de-flashing device of claim 8, wherein, The wafer cleaning device further comprises an air bearing arranged on the support, and a top cover arranged on the guide plate and vertically corresponding to the central shaft of the air bearing.

10. The wafer de-flashing device of claim 1, wherein, The wafer cleaning device further comprises a gravity sensor for monitoring the downward pressure of the brush head on the wafer surface.

Images