Positioning mechanism, reaction chamber and semiconductor equipment

Abstract

The utility model belongs to the technical field of semiconductor processing equipment, and discloses a positioning mechanism, a reaction chamber and semiconductor equipment, the positioning mechanism comprises a support plate, a first positioning table, an adsorption assembly, a second positioning table and a driving member, the first positioning table is fixedly installed on the support plate in an insulation manner, the first positioning table is used for bearing a wafer or a blue film wafer, and the adsorption assembly is used for adsorbing the wafer or the blue film wafer. The adsorption assembly comprises a plurality of ejector pins, the ejector pins penetrate through the first positioning table and the supporting plate in a sliding mode, the second positioning table penetrates through the supporting plate in a sliding mode through supporting rods, and the second positioning table is located on the outer side of the first positioning table and used for bearing the blue film wafer; the maximum height of the second positioning table protruding out of the supporting plate is larger than or equal to the maximum height of the ejector pin protruding out of the supporting plate, and the driving piece is fixedly installed on the supporting plate through an installation frame, can drive the ejector pin to slide along the first positioning table and the supporting plate and can drive the supporting rod to slide along the supporting plate at the same time. According to the positioning mechanism, the cavity structure is effectively simplified, and the equipment cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, and in particular to a positioning mechanism, a reaction chamber, and a semiconductor device. Background Technology

[0002] In the semiconductor processing field, wafers exhibit two forms before and after dicing: before dicing, they are a single, unified unit; after dicing, they are divided into several smaller units. To maintain the original shape of the diced wafer, it must be attached to an adhesive blue film before dicing. This allows the smaller units formed after dicing to remain in their original positions. During this process, the wafer exists in two states: the wafer body before dicing and the blue film wafer after dicing. Due to the significant morphological differences between the wafer body and the blue film wafer, performing the same process requires two workstations or even two separate machines to process the wafer body and the blue film wafer, greatly increasing the complexity of the cavity structure and the manufacturing cost of the equipment.

[0003] Therefore, there is an urgent need for a positioning mechanism, a reaction chamber, and a semiconductor device to solve the above-mentioned technical problems. Utility Model Content

[0004] The purpose of this invention is to provide a positioning mechanism, a reaction chamber, and a semiconductor device, which aims to solve the problem that in the prior art, when performing the same process on wafers and blue film wafers, two stations or two devices are required to position the wafers and blue film wafers separately, resulting in complex cavity structures or high equipment costs. This positioning mechanism, reaction chamber, and semiconductor device can enable the use of the same device at the same station to position and process wafers or blue film wafers, effectively simplifying the cavity structure and reducing equipment costs.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A positioning mechanism, comprising:

[0007] Support plate;

[0008] The first positioning stage includes an electrode plate. The first positioning stage is insulated and fixedly mounted on the support plate. The first positioning stage is used to support the wafer or blue film wafer.

[0009] An adsorption assembly includes a plurality of pins, which are slidably disposed between the first positioning stage and the support plate, and are used to adsorb wafers;

[0010] The second positioning platform is slidably mounted on the support plate via a support rod. The second positioning platform is located outside the first positioning platform. The second positioning platform is used to support the blue film wafer. The maximum height of the second positioning platform protruding from the support plate is greater than or equal to the maximum height of the ejector pin protruding from the support plate.

[0011] The driving component is fixedly mounted on the support plate by a mounting bracket. The driving component can drive the ejector pin to slide along the first positioning platform and the support plate, and can also drive the support rod to slide along the support plate at the same time.

[0012] Preferably, the bottom of the support plate is sealed with a movable cavity, and the positioning mechanism further includes a connecting structure located in the movable cavity. The ejector pin and the support rod are connected through the connecting structure, and the driving member drives the connecting structure to slide up and down along the movable cavity.

[0013] Preferably, the connection structure includes a support tube, a connecting plate, and a floating block. The floating block is sleeved on the support tube, the connecting plate is movably sleeved on the floating block, the support rod is fixedly installed on the connecting plate, the ejector pin is installed on the floating block, the support tube slides through the movable cavity, and the driving member drives the support tube to slide up and down along the movable cavity.

[0014] Preferably, the adsorption assembly further includes a gas distribution block, a venting pipe, and a diaphragm valve. The gas distribution block is disposed on the floating contact block, and the ejector pin is connected to the floating contact block through the gas distribution block. The venting pipe passes through the support pipe, with one end of the venting pipe connected to the gas distribution block and the other end connected to the diaphragm valve. The gas distribution block is provided with a plurality of air channels, and the plurality of air channels are connected to a plurality of ejector pins in a one-to-one correspondence.

[0015] Preferably, the gas distribution block and the floating receiving block together form a limiting groove, and the connecting plate is movably sleeved within the limiting groove.

[0016] Preferably, the mounting bracket is disposed at the bottom of the movable cavity, the output end of the drive component is provided with a top block that is slidably connected to the side wall of the mounting bracket, and the support tube is fixedly mounted on the top block.

[0017] Preferably, there are two driving components, which are arranged side by side, and the output terminals of both driving components are connected to the top block.

[0018] Preferably, the second positioning platform includes an elongated support block and an directional block, with the two elongated support blocks symmetrically arranged on both sides of the first positioning platform, and the directional block disposed on one side of the two elongated support blocks.

[0019] This utility model also provides a reaction chamber, including a lower chamber wall ring, a chamber top cover, and a positioning mechanism as described in any of the above embodiments. The lower chamber wall ring and the positioning mechanism are sealed together, and the chamber top cover is sealed to the lower chamber wall ring.

[0020] This invention also provides a semiconductor device comprising a plurality of the above-described reaction chambers.

[0021] The beneficial effects of this utility model are as follows: The positioning mechanism provided by this utility model, by setting a first positioning stage, an adsorption component, a second positioning stage, and a driving component, allows for wafer positioning. When positioning a wafer, the driving component drives a pin to protrude above the first positioning stage, placing the wafer on the pin. The pin adsorbs the wafer, and the driving component drives the pin to descend, supporting the wafer on the first positioning stage. When positioning a blue film wafer, the driving component drives a support rod to rise, placing the blue film wafer on the second positioning stage. The driving component then drives the support rod to descend, making the second positioning stage flush with the first positioning stage, allowing the first positioning stage to also support the blue film wafer. When performing the same process, it is unnecessary to use two positioning components to support and position the wafer and the blue film wafer separately. This positioning mechanism can achieve both wafer and blue film wafer positioning and support, simplifying the structural complexity of the equipment and reducing manufacturing costs.

[0022] The reaction chamber provided by this utility model includes the above-mentioned positioning mechanism. The positioning mechanism, the lower cavity wall ring and the upper cavity cover together form a sealed reaction chamber. In this reaction chamber, both wafers and blue film wafers can be processed. There is no need to set up two workstations in the same chamber, and the structure is simple.

[0023] The semiconductor equipment provided by this utility model includes the above-mentioned reaction chamber. This semiconductor equipment can perform both wafer processing and blue film wafer processing, eliminating the need for two separate devices and effectively improving the utilization rate of the semiconductor equipment. Attached Figure Description

[0024] Figure 1 This is a longitudinal cross-sectional view of the blue film wafer placed in the reaction chamber (the chamber cover is not shown) according to an embodiment of the present invention;

[0025] Figure 2 This is a longitudinal cross-sectional view of the reaction chamber (chamber cover not shown) provided in an embodiment of the present invention;

[0026] Figure 3 This is a front view of the reaction chamber provided in an embodiment of the present invention;

[0027] Figure 4 This is a three-dimensional view of the reaction chamber provided in this embodiment of the present invention;

[0028] Figure 5 This is a top view of the reaction chamber provided in an embodiment of the present invention.

[0029] In the picture:

[0030] 10. Positioning mechanism; 20. Wafer; 30. Blue film wafer; 31. Blue film patch; 40. Lower cavity wall ring; 50. Second sealing ring; 60. Third sealing ring; 70. Vacuum tubing;

[0031] 100. Support plate; 200. First positioning stage;

[0032] 310. Ejector pin; 311. Suction cup; 320. Gas distributor; 330. Vent tube; 340. Diaphragm valve;

[0033] 410. Long strip support block; 420. Orientation block;

[0034] 500, Support rod; 600, Drive component; 700, Mounting bracket; 800, Movable cavity;

[0035] 910. Support tube; 920. Connecting plate; 930. Floating joint;

[0036] 1000, limiting groove; 1100, top block; 1200, insulating block; 1300, linear bearing; 1400, first sealing ring. Detailed Implementation

[0037] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0038] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0039] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0040] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0041] This embodiment provides a positioning mechanism designed to solve the problem that existing technologies require two workstations or two devices to position wafers and blue film wafers separately when performing the same process, resulting in complex cavity structures or high equipment costs. This positioning mechanism can achieve positioning of wafers and blue film wafers at the same workstation, effectively simplifying the cavity structure and reducing manufacturing costs.

[0042] like Figures 1 to 5As shown, the positioning mechanism 10 includes a support plate 100, a first positioning stage 200, an adsorption assembly, a second positioning stage, and a driving component 600. The first positioning stage 200 includes an electrode plate and is insulatedly and fixedly mounted on the support plate 100. The first positioning stage 200 is used to support the wafer 20 or the blue film wafer 30. Optionally, the first positioning stage 200 is connected to the support plate 100 through an insulating block 1200. The first positioning stage 200 can be used directly as an electrode plate, or the first positioning stage 200 is provided with an electrode plate. The adsorption assembly includes a plurality of pins 310, which slide through the first positioning stage 200 and the support plate 100. The pins 310 are used to adsorb the wafer 20. Preferably, the first positioning stage 200 is provided with a slot for positioning the wafer 20. The slot can be a circular slot that matches the shape of the wafer 20. The second positioning platform is slidably mounted on the support plate 100 via the support rod 500. The second positioning platform is located outside the first positioning platform 200 and is used to support the blue film wafer 30. The maximum height of the second positioning platform protruding from the support plate 100 is greater than or equal to the maximum height of the ejector pin 310 protruding from the support plate 100. In this embodiment, the support plate 100 is configured as a ring structure, the first positioning platform 200 overlaps the support plate 100, and the ejector pin 310 slidably passes through the first positioning platform 200. That is, the maximum height of the second positioning platform protruding from the upper surface of the support plate 100 is greater than or equal to the maximum height of the ejector pin 310 protruding from the upper surface of the support plate 100. The driving component 600 is fixedly mounted on the support plate 100 via the mounting bracket 700. The driving component 600 can drive the ejector pin 310 to slide along the first positioning platform 200 and the support plate 100, and can simultaneously drive the support rod 500 to slide along the support plate 100. Optionally, the driving component 600 is a cylinder. In other embodiments, the drive unit 600 can be configured as an electric actuator or other drive structure, which can be set as needed. It should be noted that in this embodiment, the wafer 20 is a whole wafer, and the blue film wafer 30 refers to a whole wafer attached to an adhesive film, after being cut, and the blue film is kept under tension by a rigid blue film ring.

[0043] The aforementioned positioning mechanism 10, by comprising a first positioning stage 200, an adsorption component, a second positioning stage, and a driving component 600, positions the wafer 20. When positioning the wafer 20, the driving component 600 drives the ejector pin 310 to protrude above the first positioning stage 200, placing the wafer 20 on the ejector pin 310. The ejector pin 310 adsorbs the wafer 20. The driving component 600 then drives the ejector pin 310 downwards, allowing the wafer 20 to be supported by the first positioning stage 200. After the wafer 20 has undergone processing, the driving component 600 drives the ejector pin 310 upwards. Once the wafer 20 is lifted, it can be transferred manually or by a robotic arm from the back of the wafer 20, avoiding damage to the wafer. Damage to the front side of wafer 20 is caused during the positioning of the blue film wafer 30. When positioning the blue film wafer 30, the drive unit 600 drives the support rod 500 to rise, placing the blue film wafer 30 on the second positioning platform. The drive unit 600 then drives the support rod 500 to descend, making the second positioning platform flush with the first positioning platform 200. The first positioning platform 200 also supports the blue film wafer 30. After the blue film wafer 30 is processed, the drive unit 600 drives the second positioning platform to rise. After the blue film wafer 30 is lifted, it can be transferred manually or by a robotic arm from the back side, avoiding damage to the front side. When performing the same process, it is unnecessary to use two positioning components to support and position wafer 20 and blue film wafer 30 separately. By using this positioning mechanism 10, both wafer 20 and blue film wafer 30 can be positioned and supported, simplifying the structural complexity of the equipment and reducing manufacturing costs.

[0044] Preferably, the bottom of the support plate 100 is sealed with a movable cavity 800. The positioning mechanism 10 also includes a connecting structure located within the movable cavity 800. The ejector pin 310 and the support rod 500 are connected through the connecting structure, and the driving member 600 drives the connecting structure to slide up and down along the movable cavity 800. The connecting structure, located within the movable cavity 800, protects the connecting structure from external environmental damage. The ejector pin 310 and the support rod 500 are connected through the connecting structure, and the driving member 600 can directly drive the connecting structure to slide up and down along the movable cavity 800. This allows the connecting structure to move the ejector pin 310 and the support rod 500, ensuring the synchronous movement of the ejector pin 310 and the support rod 500. For example, the support plate 100 and the movable cavity 800 are sealed together by a first sealing ring 1400.

[0045] Optionally, the connecting structure includes a support tube 910, a connecting plate 920, and a floating block 930. The floating block 930 is sleeved on the support tube 910, the connecting plate 920 is movably sleeved on the floating block 930, the support rod 500 is fixedly installed on the connecting plate 920, the ejector pin 310 is installed on the floating block 930, the support tube 910 slides through the movable cavity 800, and the driving member 600 drives the support tube 910 to slide up and down along the movable cavity 800. In this embodiment, the connecting plate 920 is movably sleeved on the floating block 930, and the connecting plate 920 can generate a certain displacement relative to the floating block 930 to eliminate over-positioning caused when the ejector pin 310 and the support rod 500 move simultaneously. Optionally, the support rod 500 is connected to the connecting plate 920 through a linear bearing 1300, which enables the support rod 500 to move smoothly with high precision.

[0046] In this embodiment, the adsorption assembly further includes a gas distribution block 320, a vent pipe 330, and a diaphragm valve 340. The gas distribution block 320 is disposed on the floating connector 930, and the ejector pins 310 are connected through the gas distribution block 320 and the floating connector 930. The vent pipe 330 passes through the support pipe 910, with one end connected to the gas distribution block 320 and the other end connected to the diaphragm valve 340. The gas distribution block 320 has several air channels, each corresponding to one of the ejector pins 310. The gas distribution block 320 is disposed on the floating connector 930, and the connecting plate 920 is movably sleeved on the floating connector 930. The connecting plate 920 and the gas distribution block 320 can move relative to each other to eliminate over-positioning caused by the fit. It is easy to understand that the vent pipe 330 is connected to the diaphragm valve 340 via a pipe, which passes through the support pipe 910, allowing the diaphragm valve 340 to be exposed outside the support pipe 910. In use, the diaphragm valve 340 opens, injecting negative pressure into the vent pipe 330. This negative pressure then enters several ejector pins 310 through several air channels in the gas distribution block 320, forming negative pressure chambers within the air channels and ejector pins 310, allowing the suction cups 311 of the ejector pins 310 to adhere to the wafer 20. Optionally, three ejector pins 310 are provided, evenly distributed along the circumference of the first positioning stage 200. Correspondingly, the gas distribution block 320 has three air channels. In other embodiments, the number of ejector pins 310 can be set to other values, such as four or five, depending on the requirements.

[0047] Preferably, the gas distribution block 320 and the floating receiving block 930 together form a limiting groove 1000, and the connecting plate 920 is movably sleeved within the limiting groove 1000. The limiting groove 1000 can effectively limit the movement range of the connecting plate 920, preventing it from deviating too much and affecting the movement stability of the ejector pin 310 and the support rod 500.

[0048] To improve the reliability of the support tube 910's movement, a mounting bracket 700 is disposed at the bottom of the movable cavity 800. The output end of the drive component 600 is provided with a top block 1100 that is slidably connected to the side wall of the mounting bracket 700. The support tube 910 is fixedly mounted on the top block 1100. The top block 1100 and the mounting bracket 700 are slidably connected, which can smoothly transmit the power of the drive component 600 to the support tube 910, improving the reliability of the support tube 910. Preferably, two drive components 600 are provided, arranged side-by-side, and the output ends of both drive components 600 are connected to the top block 1100. In other embodiments, the number of drive components 600 can be set to other values, such as three, as needed.

[0049] In this embodiment, the second positioning stage includes an elongated support block 410 and an orientation block 420. The two elongated support blocks 410 are symmetrically arranged on both sides of the first positioning stage 200, and the orientation block 420 is disposed on one side of the two elongated support blocks 410. The elongated support blocks 410 are matched with the shape of the blue film patch 31 of the blue film wafer 30 to facilitate its positioning and support. The elongated support blocks 410 can be configured as a stepped structure, and the blue film wafer 30 is supported on the stepped surface of the stepped structure. The orientation block 420 is disposed on one side of the two elongated support blocks 410, and it restricts the direction of the blue film wafer 30 entering the second positioning stage. The orientation block 420 can be configured as a channel steel structure, and the blue film patch 31 of the blue film wafer 30 extends into the groove of the channel steel structure.

[0050] This embodiment also provides a reaction chamber, which includes a lower chamber wall ring 40, a chamber top cover, and the aforementioned positioning mechanism 10. The lower chamber wall ring 40 and the positioning mechanism 10 are sealed together, and the chamber top cover is sealed to the lower chamber wall ring 40. In this reaction chamber, both wafer 20 and blue film wafer 30 can be processed. There is no need to set up two workstations in the same chamber, and the structure is simple.

[0051] Optionally, the lower cavity wall ring 40 and the support plate 100 of the positioning mechanism 10 are sealed together by a second sealing ring 50, and the upper cover of the cavity and the lower cavity wall ring 40 are sealed together by a third sealing ring 60.

[0052] The reaction chamber also includes a vacuum line 70, which can be located at the bottom of the movable chamber 800 to save space.

[0053] This embodiment also provides a semiconductor device including a plurality of the above-described reaction chambers. This semiconductor device can perform processing on both wafer 20 and blue film wafer 30, eliminating the need for two separate devices and effectively improving the utilization rate of the semiconductor device.

[0054] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A positioning mechanism, characterized by, The utility model relates to a wafer positioning device, which comprises the following parts: a support plate (100); a first positioning table (200) comprising an electrode plate, which is fixedly mounted on the support plate (100) in an insulating manner, and is used for supporting a wafer (20) or a blue film wafer (30); a suction assembly comprising a plurality of ejector pins (310), which are slidably arranged through the first positioning table (200) and the support plate (100), and are used for sucking the wafer (20); a second positioning table, which is slidably arranged through the support plate (100) by a support rod (500), is located outside the first positioning table (200), is used for supporting the blue film wafer (30), and has a maximum height protruding from the support plate (100) greater than or equal to a maximum height of the ejector pins (310) protruding from the support plate (100); a driving member (600), which is fixedly mounted on the support plate (100) by a mounting frame (700), can drive the ejector pins (310) to slide along the first positioning table (200) and the support plate (100), and can simultaneously drive the support rod (500) to slide along the support plate (100).

2. The positioning mechanism according to claim 1, characterized in that The bottom of the support plate (100) is sealingly mounted with a movable cavity (800), the positioning mechanism further comprises a connecting structure located in the movable cavity (800), the ejector pins (310) and the support rod (500) are connected by the connecting structure, and the driving member (600) drives the connecting structure to slide up and down along the movable cavity (800).

3. The positioning mechanism according to claim 2, characterized in that The connecting structure comprises a support tube (910), a connecting plate (920), and a floating block (930), the floating block (930) is sleeved on the support tube (910), the connecting plate (920) is movably sleeved on the floating block (930), the support rod (500) is fixedly mounted on the connecting plate (920), the ejector pins (310) are mounted on the floating block (930), the support tube (910) is slidably arranged through the movable cavity (800), and the driving member (600) drives the support tube (910) to slide up and down along the movable cavity (800).

4. The positioning mechanism according to claim 3, characterized in that The suction assembly further comprises a gas distribution block (320), an air pipe (330), and a diaphragm valve (340), the gas distribution block (320) is arranged on the floating block (930), the ejector pins (310) are connected by the gas distribution block (320) and the floating block (930), the air pipe (330) is arranged through the support tube (910), one end of the air pipe (330) is connected with the gas distribution block (320), the other end of the air pipe (330) is connected with the diaphragm valve (340), and a plurality of gas channels are arranged in the gas distribution block (320), and a plurality of the gas channels are in one-to-one correspondence with a plurality of the ejector pins (310).

5. The positioning mechanism according to claim 4, characterized in that The gas distribution block (320) and the floating block (930) form a limiting groove (1000) together, and the connecting plate (920) is movably sleeved in the limiting groove (1000).

6. The positioning mechanism of claim 3, wherein The mounting rack (700) is arranged at the bottom of the movable cavity (800), and the output end of the driving member (600) is provided with a top block (1100) which is in sliding connection with the side wall of the mounting rack (700), and the supporting pipe (910) is fixedly installed on the top block (1100).

7. The positioning mechanism of claim 6, wherein The driving member (600) is provided with two driving members (600) which are arranged side by side, and the output ends of the two driving members (600) are connected with the top block (1100).

8. The positioning mechanism of claim 1, wherein, The second positioning table comprises long-strip-shaped supporting blocks (410) and a directional block (420), two long-strip-shaped supporting blocks (410) are symmetrically arranged on the two sides of the first positioning table (200), and the directional block (420) is arranged on one side of the two long-strip-shaped supporting blocks (410).

9. A reaction chamber, characterized by It comprises a lower cavity wall ring (40), a cavity upper cover and a positioning mechanism as claimed in any one of claims 1-8, the lower cavity wall ring (40) and the positioning mechanism are sealingly connected, and the cavity upper cover is sealingly arranged on the lower cavity wall ring (40).

10. A semiconductor device, characterized by, It comprises a plurality of reaction cavities as claimed in claim 9.

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